Positionable tight mold for electronic packaging

Abstract

The utility model relates to the technical field of electronic packaging, in particular to a locatable tight mould for electronic packaging, which comprises a base, a pushing component and a lifting component, a chip placing groove and a base groove are arranged on the base at intervals, the base groove is arranged at the rear end of the chip placing groove, the pushing component comprises a sliding block, a fixed block, a driving block and a spring, and the lifting component is arranged on the sliding block. The fixed block is fixed in the base groove, the driving block is arranged in the sliding block and the fixed block in a sliding mode through an inclined face, the front end of the sliding block is connected with the pressing block through the guide rod, the guide rod penetrates through the base to enter the chip containing groove, and the pressing block is fixed to the front end of the guide rod and located in the chip containing groove. And the spring is arranged on the guide rod in a sleeving mode and located in the base groove, the lifting assembly is connected with the driving blocks, it is guaranteed that the chip is stably clamped, no gap exists in later injection molding, and the production quality is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic packaging, in particular to a positionable and compact mold for electronic packaging. Background Art

[0002] Electronic packaging is the tube shell used to install the built-in chip of the integrated circuit. It plays the role of placing, fixing and sealing, protecting the built-in chip of the integrated circuit, and enhancing its ability to adapt to the environment. The rivet points on the integrated circuit chip, that is, the contact points, are welded to the pins of the packaging tube shell. Generally, the chip is injection molded and packaged using an electronic packaging mold.

[0003] The patent number is CN218535417U, which discloses a tightly positioned mold for electronic packaging, and relates to the field of electronic packaging technology. In order to solve the problem that the electronic packaging mold in the prior art needs a positioning structure to position the upper mold and the lower mold when moving up and down, most of them use mechanical structures for positioning. This structure is prone to friction loss, and after a period of use, the positioning will be inaccurate and unreliable. A laser receiving panel is installed above the lower mold, and the laser receiving panel is fixedly connected to the lower mold. A laser positioning transmitter is installed inside the upper mold, and the laser positioning transmitter is fixedly connected to the upper mold. A condenser is installed inside the upper mold, and the condenser is fixedly connected to the upper mold. The laser positioning transmitter, condenser and laser receiving panel are coaxially arranged, and there are several laser positioning transmitters, condensers and laser receiving panels.

[0004] The above patent has the following shortcomings: due to processing errors, there is a gap between the chip and the groove when the chip is placed inside the groove, which makes the subsequent injection molding uneven, affecting product quality. Therefore, in order to solve the shortcomings of the prior art, it is necessary to design a simple structure electronic packaging positioning and compact mold. Utility Model Content

[0005] The utility model solves the problems of the prior art and provides a tightly positioned mold for electronic packaging.

[0006] The purpose of the utility model can be achieved through the following technical solutions: A positionable and tight mold for electronic packaging comprises: a base, a pushing assembly and a lifting assembly, the base is provided with a chip placement groove and a base groove at intervals, the base groove is arranged at the rear end of the chip placement groove, the pushing assembly comprises a sliding block, a fixed block, a driving block and a spring, the fixed block is fixed in the base groove, the driving block is arranged inside the sliding block and the fixed block through an inclined sliding surface, the front end of the sliding block is connected to the pressing block through a guide rod, the guide rod passes through the base to the chip placement groove, the pressing block is fixed to the front end of the guide rod and is located in the chip placement groove, the spring is sleeved on the guide rod and is located in the base groove, and the lifting assembly connects each group of driving blocks.

[0007] A further improvement is that the lifting assembly includes a lower guide plate, an upper guide plate, a guide column and a cylinder, the lower guide plate is connected to the driving block by bolts, the lower end of the guide column is fixed to the lower guide plate, the upper end of the guide column is slidably set on the upper guide plate, and the cylinder is set on the upper guide plate and the lower end is connected to the lower guide plate.

[0008] As a further improvement, matching grooves are provided on the inner sides of the sliding block and the fixed block, and both ends of the driving block are slidably arranged in the matching grooves, and the cross section of the driving block is a trapezoidal cross section.

[0009] As a further improvement, the guide pillars and springs are symmetrically arranged in two groups.

[0010] As a further improvement, the fixing block is fixed to the bottom of the base groove by bolts.

[0011] Compared with the prior art, the utility model has the following beneficial effects:

[0012] After the chip is placed in the chip placement groove of the base, the driving block is controlled to move downward through the driving control of the lifting assembly. Since the driving block is set inside the sliding block and the fixed block through the inclined sliding, and the fixed block is fixed, the sliding block moves toward the chip placement groove, and then drives the guide rod to make the pressing block move in the chip placement groove to clamp the chip, ensuring that the chip is stably clamped, so that there is no gap in the later injection molding, and the production quality is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the structure of the utility model

[0014] Figure 2 This is a structural diagram of a partially enlarged view of the utility model

[0015] Figure 3 This is a structural schematic diagram of a partial cross-sectional view of the utility model

[0016] Figure 4 This is a schematic diagram of the structure inside the push-tightening component of the utility model.

[0017] In the figure, 1-base, 11-chip placement groove, 12-base groove, 2-pushing assembly, 21-sliding block, 211-guide rod, 212-pressing block, 22-fixing block, 23-driving block, 24-spring, 25-matching slide groove, 3-lifting assembly, 31-lower guide plate, 32-upper guide plate, 33-guide column, 34-cylinder. DETAILED DESCRIPTION

[0018] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0019] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0020] Below is a combination of the embodiments and the attached Figures 1 to 4 , the technical solution of the utility model is further elaborated.

[0021] Example 1

[0022] A positionable and tight mold for electronic packaging, comprising: a base 1, a pushing assembly 2 and a lifting assembly 3, wherein the base 1 is provided with a chip placement groove 11 and a base groove 12 at intervals, and the base groove 12 is arranged at the rear end of the chip placement groove 11, the pushing assembly 2 comprises a sliding block 21, a fixed block 22, a driving block 23 and a spring 24, the fixed block 22 is fixed in the base groove 12, the driving block 23 is arranged inside the sliding block 21 and the fixed block 22 by sliding on an inclined surface, the front end of the sliding block 21 is connected to the pressing block 212 through a guide rod 211, the guide rod 211 passes through the base 1 to the chip placement groove 11, the pressing block 212 is fixed to the front end of the guide rod 211 and is located in the chip placement groove 11, the spring 24 is sleeved on the guide rod 211 and is located in the base groove 12, and the lifting assembly 3 connects each group of driving blocks 23.

[0023] like Figure 1 to Figure 4 As shown, the use principle of the utility model is: after the chip is placed in the chip placement groove 11 of the base 1, the driving block 23 is controlled to move downward through the driving control of the lifting component 3. Since the driving block 23 is set inside the sliding block 21 and the fixed block 22 through the inclined sliding, and the fixed block 22 is fixed, the sliding block 21 moves toward the chip placement groove 11, and then drives the guide rod 211 to make the pressing block 212 move in the chip placement groove 11 to clamp the chip, ensuring that the chip is stably clamped, so that there is no gap in the later injection molding, and the production quality is improved; after the work is completed, the lifting component 3 controls the driving block 23 to move, and the pressing block 212 moves in the opposite direction under the action of the spring 24 to release the clamping of the chip.

[0024] As a further preferred embodiment, the lifting assembly 3 includes a lower guide plate 31, an upper guide plate 32, a guide column 33 and a cylinder 34. The lower guide plate 31 is connected to the drive block 23 by bolts, the lower end of the guide column 33 is fixed to the lower guide plate 31, the upper end of the guide column 33 is slidably arranged on the upper guide plate 32, and the cylinder 34 is arranged on the upper guide plate 32 and the lower end is connected to the lower guide plate 31. The multiple guide columns 33 improve the stability of the lower guide plate 31 in the process of connecting the drive block 23 to move upward.

[0025] As a further preferred embodiment, the inner sides of the sliding block 21 and the fixed block 22 are provided with matching grooves 25, and the two ends of the driving block 23 are slidably arranged in the matching grooves 25. The cross-section of the driving block 23 is a trapezoidal cross-section, thereby ensuring the sliding stability of the cooperation between the driving block 23 and the sliding block 21 and the fixed block 22.

[0026] As a further preferred embodiment, the guide pillars 211 and the springs 24 are symmetrically arranged in two groups to increase the stability of the movement of the pressing block 212 .

[0027] As a further preferred embodiment, the fixing block 22 is fixed to the bottom of the base groove 12 by bolts, which is convenient for assembly and disassembly and has a stable connection.

[0028] The preferred specific embodiments of the utility model are described in detail above. It should be understood that ordinary technicians in this field can make many modifications and changes based on the concept of the utility model without creative work. Therefore, all technical solutions that can be obtained by technicians in this technical field based on the concept of the utility model through logical analysis, reasoning or limited experiments on the basis of the existing technology should be within the scope of protection determined by the claims.

Claims

1. A positionable and compact mold for electronic packaging, characterized in that: include: A base, a pushing assembly and a lifting assembly, wherein the base is provided with a chip placement groove and a base groove at intervals, the base groove is arranged at the rear end of the chip placement groove, the pushing assembly comprises a sliding block, a fixed block, a driving block and a spring, the fixed block is fixed in the base groove, the driving block is arranged inside the sliding block and the fixed block through an inclined sliding surface, the front end of the sliding block is connected to the pressing block through a guide rod, the guide rod passes through the base to the chip placement groove, the pressing block is fixed to the front end of the guide rod and is located in the chip placement groove, the spring is sleeved on the guide rod and is located in the base groove, and the lifting assembly connects each group of driving blocks.

2. The positionable and compact mold for electronic packaging according to claim 1, characterized in that: The lifting assembly includes a lower guide plate, an upper guide plate, a guide column and a cylinder. The lower guide plate is connected to a driving block by bolts. The lower end of the guide column is fixed to the lower guide plate. The upper end of the guide column is slidably arranged on the upper guide plate. The cylinder is arranged on the upper guide plate and the lower end is connected to the lower guide plate.

3. The positionable and compact mold for electronic packaging according to claim 1, characterized in that: The sliding block and the fixed block are provided with matching sliding grooves on their inner sides, and the two ends of the driving block are slidably arranged in the matching sliding grooves. The cross section of the driving block is a trapezoidal cross section.

4. The positionable and compact mold for electronic packaging according to claim 1, characterized in that: The guide rods and springs are symmetrically arranged in two groups.

5. The positionable and compact mold for electronic packaging according to claim 1, characterized in that: The fixing block is fixed to the bottom of the base groove by bolts.

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