A cooling device for molding die

Abstract

The utility model discloses a cooling device for a compression mold, comprising: a compression mold; the compression mold is placed on the inner side of a cooling mechanism, and the upper and lower end surfaces of the compression mold are cooled by pressing down the cooling mechanism; the cooling mechanism comprises an upper cooling plate and a lower cooling plate, the upper cooling plate and the lower cooling plate are connected in series or in parallel, and at least one end surface of the upper cooling plate and the lower cooling plate is connected to an external device; a control mechanism is also provided between the cooling mechanism and the external device, and the control mechanism switches working conditions according to the cooling medium flowing into the cooling mechanism; the device connects the upper cooling plate and the lower cooling plate in series or in parallel, and is connected to an external device at the same time, cools the end surfaces of the compression mold on both sides, and can cool compression molds of different types by pulling the upper cooling plate and the lower cooling plate to separate and press them together.

Description

Technical Field

[0001] The utility model relates to the technical field of material forming auxiliary devices, in particular to a molding die cooling device. Background Art

[0002] Resin-based composite materials have the advantages of high specific strength, good structural designability, and good fatigue resistance. They are widely used in the fields of aerospace, communications, transportation, and shipbuilding. The composite material molding process is a molding process in which a certain amount of powder or fiber reinforcement impregnated with resin is placed in a mold, and after heating and pressurization, a composite material product is obtained. In the production of molded composite materials, the product needs to be cooled from the molding temperature to the mold opening temperature before it can be taken out. During this cooling process, the crystallinity of the thermoplastic resin matrix changes, and the cross-linking network morphology inside the thermosetting resin matrix changes. These changes will affect the mechanical properties, aging resistance, and electrical properties of the product. Therefore, it is necessary to control this cooling process.

[0003] The cooling of composite material compression molds is currently mainly achieved through the following two methods: one is that a cold press extrude the mold and cool the mold at the same time, and the other is to set a cooling system on the compression mold. The existing Chinese patent with publication number CN217671206U discloses a thermoplastic composite compression molding mold and its cooling system, including a mold body and a cooling system, including upper and lower steel plates, partitions, cooling pipes, valves, flow meters, and the mold and the cooling system cooperate to achieve control of the cooling rate. However, this cooling system is only suitable for a single compression mold, and cannot achieve free switching of different molds, and cannot cool multiple sets of molds at the same time. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and proposes a cooling device for a molding die.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solution: a molding die cooling device, comprising:

[0006] Molding dies;

[0007] The compression mold is placed inside the cooling mechanism, and the upper and lower end surfaces of the compression mold are cooled by pressing down the cooling mechanism;

[0008] The cooling mechanism comprises an upper cooling plate and a lower cooling plate, wherein the upper cooling plate and the lower cooling plate are connected in series or in parallel, and at least one end surface of the upper cooling plate and the lower cooling plate is connected to an external device;

[0009] A control mechanism is also provided between the cooling mechanism and the external device, and the control mechanism switches the working mode according to the cooling medium flowing into the cooling mechanism.

[0010] As a further description of the above technical solution: the upper cooling plate is provided with a first connection port, the first connection port is connected to the control mechanism, so that the cooling medium enters the inner side of the upper cooling plate, and the upper cooling plate is also provided with a second connection port, which transports the cooling medium on the inner side of the upper cooling plate back to the external device for flow cooling.

[0011] As a further description of the above technical solution: the lower cooling plate is provided with a third connecting port and a fourth connecting port, so that the cooling medium inside the lower cooling plate can flow and cool down.

[0012] As a further description of the above technical solution: in the parallel state, the third connection port is connected to the control mechanism, so that the cooling medium flows into the lower cooling plate, and the fourth connection port transports the cooling medium back to the external device.

[0013] As a further description of the above technical solution: in the series state, the second connection port is connected to the fourth connection port through a pipeline, the fourth connection port allows the cooling medium to flow into the lower cooling plate, and the third connection port transports the cooling medium back to the external device.

[0014] As a further description of the above technical solution: a positioning block is arranged on the lower cooling plate, and the molding die is positioned by the positioning block.

[0015] As a further description of the above technical solution: handles are provided on both sides of the upper cooling plate, and the upper cooling plate is pulled to separate from the lower cooling plate.

[0016] As a further description of the above technical solution: the control mechanism is provided with a first circuit and a second circuit connected in parallel, the first circuit is an air circuit, the second circuit is a water circuit, and the circuit is switched by a three-way valve group, and the three-way valve group is provided with at least one.

[0017] As a further description of the above technical solution: the first circuit includes an air inlet, the input end of the air inlet is connected to the three-way valve group, and the output end is connected to the air valve, air flow meter, air check valve and air circuit temperature display in sequence.

[0018] As a further description of the above technical solution: the second circuit includes a water inlet, the input end of the water inlet is connected to the three-way valve group, and the output end is connected to a water valve, a water flow meter, a water check valve and a water circuit temperature display in sequence.

[0019] The above technical solution has the following advantages or beneficial effects:

[0020] 1. Connect the upper cooling plate and the lower cooling plate in series or in parallel, and connect them to external equipment at the same time to cool the end faces of the compression mold. By pulling the upper cooling plate and the lower cooling plate apart and pressing them together, different types of compression molds can be cooled. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the parallel structure of the cooling device proposed by the utility model;

[0022] Figure 2 A schematic diagram of the series structure of the cooling device proposed by the utility model;

[0023] Figure 3 It is a structural schematic diagram of the control mechanism in the utility model.

[0024] Legend:

[0025] 1. Molding die; 2. Upper cooling plate; 21. First connection port; 22. Second connection port; 23. Handle; 3. Lower cooling plate; 31. Third connection port; 32. Fourth connection port; 33. Positioning block; 4. Control mechanism; 5. Pipeline; 6. Air inlet; 7. Air valve; 8. Air flow meter; 9. Air check valve; 10. Air circuit temperature display; 11. Water inlet; 12. Water valve; 13. Water flow meter; 14. Water check valve; 15. Water circuit temperature display; 16. Three-way valve group. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] Reference Figure 1-Figure 3 The utility model provides an embodiment: a molding die cooling device, comprising: a molding die 1; the molding die 1 is placed inside a cooling mechanism, and the upper and lower end surfaces of the molding die 1 are cooled by pressing the cooling mechanism downward; the cooling mechanism comprises an upper cooling plate 2 and a lower cooling plate 3, the upper cooling plate 2 and the lower cooling plate 3 are connected in series or in parallel, and at least one end surface of the upper cooling plate 2 and the lower cooling plate 3 is connected to an external device; a control mechanism 4 is also provided between the cooling mechanism and the external device, and the control mechanism 4 switches the working state according to the cooling medium flowing into the cooling mechanism.

[0028] In this embodiment, the molding die 1 is placed on the lower cooling plate 3, and the lower cooling plate 3 and the upper cooling plate 2 cool the upper and lower end faces of the molding die 1. The inner side of the upper cooling plate 2 and the lower cooling plate 3 is a volume tube cavity, so that the cooling medium is transported inside. The cooling mechanism is connected to an external device, and the external device is a chiller or a compressor, which transports the cooling medium. The cooling medium can be water or air. The transport is determined by the control mechanism 4, and the cooling medium is transported to the cooling mechanism. Multiple sets of molding die 1 can be placed between the upper cooling plate 1 and the lower cooling plate 2. Compared with the cooling of a single mold, this solution can improve the production efficiency of composite materials.

[0029] The upper cooling plate 2 is provided with a first connection port 21, which is connected to the control mechanism 4 so that the cooling medium enters the inner side of the upper cooling plate 2. The upper cooling plate 2 is also provided with a second connection port 22 so that the cooling medium on the inner side of the upper cooling plate 2 is transported back to the external equipment for flow cooling. The lower cooling plate 3 is provided with a third connection port 31 and a fourth connection port 32 so that the cooling medium on the inner side of the lower cooling plate 3 is flow cooled.

[0030] In this embodiment, the first connection port 21 is connected to the gas path temperature display 10 or the water path temperature display 15 in the control mechanism 4 to transport the low-temperature cooling medium to the upper cooling plate 2. In the parallel state, the second connection port 22 transports the inner cooling medium back to the external device.

[0031] At this time, the third connection port 31 on the lower cooling plate 3 is connected to the control mechanism 4, so that the cooling medium flows into the lower cooling plate 3, and the fourth connection port 32 transports the cooling medium in the lower cooling plate 3 back to the external device.

[0032] When different molding dies 1 need to be cooled, different molding dies 1 can be adapted directly by changing the model of the connected upper cooling plate 2 or lower cooling plate 3. The external device can use one or more devices to control the upper cooling plate 2 and the lower cooling plate 3 respectively, so that the cooling temperatures of the upper cooling plate 2 and the lower cooling plate 3 can be the same or different.

[0033] In the series state, the second connection port 22 is connected to the fourth connection port 32 through the pipeline 5, the fourth connection port 32 allows the cooling medium to flow into the lower cooling plate 3, and the third connection port 31 transports the cooling medium back to the external device.

[0034] In this embodiment, the first connection port 21 is connected to the control mechanism 4, and the second connection port 22 is connected to the fourth connection port 32 through the pipeline 5, so that the cooling medium in the upper cooling plate 2 is transported to the lower cooling plate 3. At this time, the flow direction of the cooling medium in the inner tube cavity of the lower cooling plate 3 is opposite to the direction when connected in series. After cooling the lower end surface of the molding die 1, the cooling medium is transported back to the external equipment from the third connection port 31. The cooling process can be completed using only one external equipment (chiller or compressor).

[0035] A positioning block 33 is provided on the lower cooling plate 3 , and the molding die 1 is positioned by the positioning block 33 .

[0036] In this embodiment, the positioning block 33 is arranged on the upper end surface of the lower cooling plate 3. The positioning block 33 is L-shaped and limits the right-angle side end surface of the molding die 1, so as to facilitate the rapid alignment of the molding die 1.

[0037] Handles 23 are provided on both sides of the upper cooling plate 2 to pull the upper cooling plate 2 and the lower cooling plate 3 apart.

[0038] In this embodiment, handles 23 are provided on both side end surfaces of the upper cooling plate 2. After the operator lifts the upper cooling plate 2 by the handles 23, the molding mold 1 is placed, and then the upper cooling plate 2 is placed on the upper end surface of the molding mold 1 for cooling, which is convenient for cleaning the cooling mechanism and the molding mold 1.

[0039] The control mechanism 4 is provided with a first circuit and a second circuit connected in parallel. The first circuit is an air circuit and the second circuit is a water circuit. The circuits are switched by a three-way valve group 16 , and at least one three-way valve group 16 is provided.

[0040] In this embodiment, the control mechanism 4 selects different circuits according to the cooling medium, the first circuit is an air circuit, the second circuit is a water circuit, and the three-way valve group 16 is provided with a port on one side connected to an external device, and the other two side ports are respectively connected to the first circuit and the second circuit to control the switching of the cooling medium.

[0041] The first circuit includes an air inlet 6, the input end of the air inlet 6 is connected to the three-way valve group 16, and the output end is connected to the air valve 7, the air flow meter 8, the air check valve 9 and the air circuit temperature display 10 in sequence; the second circuit includes a water inlet 11, the input end of the water inlet 11 is connected to the three-way valve group 16, and the output end is connected to the water valve 12, the water flow meter 13, the water check valve 14 and the water circuit temperature display 15 in sequence.

[0042] In this embodiment, when the cooling medium is air, the three-way valve group 16 controls the connection of the first circuit, the cooling medium enters from the air inlet 6, the air valve 7 is opened, the flow of the cooling medium is monitored by the air flow meter 8, the air check valve 9 prevents the cooling medium from flowing back, and the current cooling medium temperature is monitored by the air path temperature display 10; when the cooling medium is water, the three-way valve group 16 controls the connection of the second circuit, the cooling medium enters from the water inlet 11, and the flow and temperature are monitored through the water flow meter 13 and the water path temperature display 15. After the cooling medium is switched, the check valve of the corresponding medium is opened, and the check valve corresponding to the other medium is closed.

[0043] Preferably, when the molding temperature does not exceed 200°C, water is selected as the cooling medium; when the molding temperature is 200-400°C, air is selected as the cooling medium.

[0044] When the molding temperature of the composite material is in the range of 200℃-400℃, the preferred cooling medium is compressed air. The cooling mechanism 4 is connected to the compressor, the three-way valve 16 is turned to the first circuit, the air inlet 6 is opened, and the air valve 7 can be adjusted in the range of one-sixth opening to full opening. At this time, the air check valve 9 is opened and the water check valve 14 is closed until the degree of the air path temperature display 10 reaches the molding process setting value. The air valve 7 is adjusted until the reading of the air flow meter 8 is stable. After the product is cooled to the process requirements, the mold can be opened and taken out.

[0045] When the molding temperature of the composite material does not exceed 200°C, the preferred cooling medium is water. The cooling mechanism 4 is connected to the chiller, the three-way valve group 16 is turned to the second circuit, the water inlet 11 is opened, and the water valve 12 can be adjusted in the full range from one-sixth opening to full opening. At this time, the air check valve 7 is closed and the water check valve 14 is opened. Other process requirements and device operations are the same as air cooling.

[0046] Selecting a suitable cooling medium, setting the cooling temperature, and adjusting the cooling medium flow rate can speed up the cooling process. In actual production, the cooling time can be shortened from 3 hours to 1 hour through process adjustment or cooling of multiple molding dies 1.

[0047] By adjusting the flow rate of the cooling medium and changing the connection method of the cooling plate, the cooling rate can be adjusted between 0.5°C / min and 5°C / min.

[0048] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A molding die cooling device, characterized in that: include: Molding die (1); The compression mold (1) is placed inside a cooling mechanism, and the upper and lower end surfaces of the compression mold (1) are cooled by pressing down the cooling mechanism; The cooling mechanism comprises an upper cooling plate (2) and a lower cooling plate (3), wherein the upper cooling plate (2) and the lower cooling plate (3) are connected in series or in parallel, and at least one end surface of the upper cooling plate (2) and the lower cooling plate (3) is connected to an external device; A control mechanism (4) is also provided between the cooling mechanism and the external device, and the control mechanism (4) switches the working state according to the cooling medium flowing into the cooling mechanism.

2. The cooling device according to claim 1, characterized in that: The upper cooling plate (2) is provided with a first connection port (21), and the first connection port (21) is connected to the control mechanism (4) so ​​that the cooling medium enters the inner side of the upper cooling plate (2). The upper cooling plate (2) is also provided with a second connection port (22) so that the cooling medium on the inner side of the upper cooling plate (2) is transported back to the external device for flow cooling.

3. The cooling device according to claim 2, characterized in that: The lower cooling plate (3) is provided with a third connecting port (31) and a fourth connecting port (32) to allow the cooling medium inside the lower cooling plate (3) to flow and cool down.

4. The cooling device according to claim 3, characterized in that: In the parallel state, the third connection port (31) is connected to the control mechanism (4) so ​​that the cooling medium flows into the lower cooling plate (3), and the fourth connection port (32) transports the cooling medium back to the external device.

5. The cooling device according to claim 3, characterized in that: In a series state, the second connection port (22) is connected to the fourth connection port (32) via a pipeline (5); the fourth connection port (32) allows the cooling medium to flow into the lower cooling plate (3); and the third connection port (31) transports the cooling medium back to the external device.

6. The cooling device according to claim 3, characterized in that: A positioning block (33) is provided on the lower cooling plate (3), and the molding die (1) is positioned by means of the positioning block (33).

7. The cooling device according to claim 2, characterized in that: Handles (23) are provided on both sides of the upper cooling plate (2) for pulling the upper cooling plate (2) to separate from the lower cooling plate (3).

8. The cooling device according to claim 1, characterized in that: The control mechanism (4) is provided with a first circuit and a second circuit connected in parallel, the first circuit is an air circuit, and the second circuit is a water circuit. The circuits are switched by a three-way valve group (16), and the three-way valve group (16) is provided with at least one.

9. The cooling device according to claim 8, characterized in that: The first circuit comprises an air inlet (6), the input end of the air inlet (6) is connected to the three-way valve group (16), and the output end is connected in sequence to an air valve (7), an air flow meter (8), an air check valve (9) and an air circuit temperature display (10).

10. The cooling device according to claim 9, characterized in that: The second circuit comprises a water inlet (11), the input end of the water inlet (11) is connected to the three-way valve group (16), and the output end is connected in sequence to a water valve (12), a water flow meter (13), a water check valve (14) and a water circuit temperature display (15).

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