Anti-shaking tray jig

By setting up a buffer mechanism on the infrared sensor chip pallet, the shaking and shaking problems caused by deformation and unflush bottom surface during transportation are solved, and the stability of pallet transmission and packaging accuracy are improved.

CN222713979UActive Publication Date: 2025-04-04JIANGSU PROSPER SEMICON INC
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Patent Information

Application Number
CN202421345816.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-13
Publication Date
2025-04-04
Estimated Expiration
2034-06-13

AI Technical Summary

Technical Problem

During the mechanical transportation of infrared sensor chips, the pallet is prone to shake and shake due to deformation of the conveyor rod and uneven bottom surface, which affects the packaging accuracy.

Method used

An anti-shake pallet fixture is designed. The tray body is provided with a load-bearing surface and a mounting surface. A buffer mechanism is provided on the mounting surface. The buffer mechanism contacts first before the tray comes into contact with the conveying mechanism, thereby cushioning.

Benefits of technology

Through the design of the buffer mechanism, the pallet achieves progressive contact during the transmission process, avoiding jitter and shaking caused by direct drop, ensuring the stability of the pallet transmission and packaging accuracy.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to an anti-shaking tray jig which comprises a tray body, a supporting plate, a clamping plate, a clamping plate, a clamping plate, a clamping plate, a clamping plate, a clamping plate, a clamping plate and a clamping plate, the tray body is provided with a bearing surface and a mounting surface, and the bearing surface and the mounting surface are oppositely arranged on the front and back surfaces of the tray body; the bearing surface is used for bearing materials to be welded, the mounting surface can be placed on a conveying mechanism and moves on the conveying mechanism, the mounting surface is provided with a buffer mechanism, the buffer mechanism is in contact with the conveying mechanism before the mounting surface is in contact with the conveying mechanism, the buffer mechanism is in a conical shape, and the buffer mechanism is in contact with the conveying mechanism. The surface area of the end, close to the conveying mechanism, of the buffering mechanism is smaller than that of the end, away from the conveying mechanism, of the buffering mechanism.
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Description

Technical Field

[0001] The present application relates to the field of infrared semiconductor packaging technology, and in particular to an anti-shake tray fixture. Background Art

[0002] At present, the performance requirements of infrared sensor chips are getting higher and higher, and each sensor chip is becoming more and more miniaturized and refined. The operating environment and machine requirements for the products that manufacture infrared sensor chips are also becoming more and more stringent. How to prevent the displacement and jitter of the product during mechanical transportation so that it can be accurately aligned has become an urgent problem to be overcome.

[0003] The packaging of infrared sensor chips needs to be carried out in a vacuum environment. In the prior art, in a heat-activated vacuum environment, materials need to be transported by mechanical rods, and the material transfer is achieved by transporting the carrying tray by the transport rod. Currently, the carrying tray is mainly flat. This type of transport carrying tray is directly installed on the transport rod with screws through the assembly mounting hole at the rear end. In a high temperature and high vacuum environment, the transport device inside the machine will be deformed, causing the position of the transport rod to be lower than the guide wheel, resulting in jitter during transportation. In addition, the lower end surfaces of the transport guide rod and the carrying tray are not flush. The transport guide rod is located below the carrying tray. Therefore, during the movement of the transport guide rod and the carrying tray on the guide wheel, the carrying tray will shake downward, thereby affecting the packaging accuracy. Utility Model Content

[0004] Based on this, in order to ensure that the product runs smoothly during transportation, the utility model proposes an anti-shake pallet fixture.

[0005] To achieve the above-mentioned purpose, the embodiment of the present application provides an anti-shake tray fixture, comprising:

[0006] A tray body, wherein the tray body is provided with a bearing surface and a mounting surface, and the bearing surface and the mounting surface are arranged on the front and back sides of the tray body opposite to each other;

[0007] The bearing surface is used to bear the material to be welded.

[0008] The installation surface may be placed on a conveying mechanism and moved on the conveying mechanism, and the installation surface is provided with a buffer mechanism, which contacts the conveying mechanism before the installation surface contacts the conveying mechanism.

[0009] Preferably, the buffer mechanism is a conical buffer mechanism, and the surface area of ​​the conical buffer mechanism at one end close to the conveying mechanism is larger than the surface area of ​​the conical buffer mechanism at one end away from the conveying mechanism.

[0010] Preferably, the pallet body is driven by a transport guide rod, the pallet body is provided with a mounting hole, an end of the transport guide rod close to the pallet body is provided with a pin shaft, and the transport guide rod is inserted into the mounting hole through the pin shaft to connect with the pallet body.

[0011] Preferably, the contact surface of the transport guide rod connected to the pallet body is a plane.

[0012] Preferably, an end surface of the transport guide rod close to one end of the tray body contacts the bottom surface of the conical buffer mechanism.

[0013] Preferably, the buffer mechanism is a hemispherical buffer mechanism, and one end of the hemispherical buffer mechanism away from the mounting surface is arc-shaped.

[0014] Preferably, the conveying mechanism is located at one end of the tray body close to the mounting surface, and the conveying mechanism is a guide wheel.

[0015] Preferably, a groove is provided on the delivery wheel.

[0016] Compared with the prior art, the advantages of this application are:

[0017] (1) A buffer mechanism is provided on the pallet body. Through the provision of the buffer mechanism, the pallet body can first contact the conveying mechanism before contacting the conveying mechanism. At the same time, the pallet body gradually contacts the conveying mechanism, thereby avoiding the shaking and swaying caused by the pallet body directly falling onto the conveying mechanism during the conveying process in the traditional mechanism.

[0018] (2) The lower end of the tapered buffer mechanism contacts the conveying mechanism first, and the tray body is gradually guided during the conveying process, thereby ensuring the stability of the tray body during the transmission process.

[0019] (3) The arc surface of the hemispherical buffer mechanism acts on the guide wheel, which can achieve buffering during the guiding process. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present application is further described below in conjunction with the accompanying drawings and embodiments:

[0021] Figure 1 This is a schematic diagram of the overall structure of an anti-shake tray fixture for this application;

[0022] Figure 2 This is a top view of the overall structure of an anti-shake tray fixture for this application;

[0023] Figure 3 This is a side view of the overall structure of an anti-shake tray fixture for this application;

[0024] Figure 4This is a schematic diagram of an overall conical buffer structure of an anti-shake tray fixture for this application;

[0025] Figure 5 A side view of an anti-shake tray fixture for this application.

[0026] Wherein: 1. tray body, 11. bearing surface, 12. mounting surface, 13. mounting hole;

[0027] 2. Carrying guide rod, 3. Guide wheel, 4. Buffer mechanism. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical scheme and advantages of the present application clearer, the embodiments of the present application will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiment is only one embodiment of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0029] "Embodiment" referred to herein refers to a specific feature, structure or characteristic that may be included in at least one implementation of the present application. In the description of the embodiment of the present application, it should be understood that the terms "first", "second" and "third" etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second" and "third" etc. may include one or more of the features explicitly or implicitly. Moreover, the terms "first", "second" and "third" etc. are used to distinguish similar objects, and do not have to be used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiment of the present application described here can be implemented in an order other than illustrated or described here. In addition, the terms "including" and "for" and any of their variations are intended to cover non-exclusive inclusions.

[0030] like Figure 1-2As shown, it is a schematic diagram of an anti-shake tray fixture provided in an embodiment of the present application, including: a tray body 1, the tray body 1 is provided with a bearing surface 11 and a mounting surface 12, the bearing surface 11 is used to place the items to be processed, in this embodiment, the tray body 1 is used in the process of infrared semiconductor chip packaging, the bearing surface 11 of the tray body 1 is generally used to carry the infrared chip to be packaged, and the tray body 1 is used in a heat-activated vacuum environment, the mounting surface 12 is arranged on the front and back sides of the tray body 1 opposite to the bearing surface 11, and a mounting hole 13 is provided on one side of the mounting surface, and the mounting hole 13 can be connected to the transport guide rod 2 through a pin shaft, the transport guide rod 2 is generally a cylindrical guide rod, one end of which is connected to the driving mechanism, and the other end is connected to the tray body 1 through a pin shaft, in this embodiment, the driving mechanism is a driving motor, and the driving motor provides power, and the transport guide rod 2 can drive the tray body 1 to reciprocate in the horizontal direction.

[0031] like Figure 3 As shown, during the process in which the transport guide rod 2 drives the pallet body 1 to move in the horizontal direction, due to the deadweight of the pallet body 1, the transport guide rod 2 will be deformed during the process of extending and retracting, resulting in position deviation of the pallet body when it reaches the designated workstation. This situation is more likely to occur in a vacuum and high-temperature environment. The present application provides a conveying mechanism below the pallet body 1 to support and transport the pallet body 1 during the process in which the transport guide rod 2 drives the pallet body 1 to move. In the present embodiment, the conveying mechanism is a guide wheel 3. Due to the design of the guide wheel 3, the pallet body 1 is gradually located above the guide wheel 3 after the transport guide rod 2 is pulled. In the present embodiment, The pallet body 1 needs to be placed on the guide wheel 3 and transported by the guide wheel 3. When the transport guide rod 2 drives the pallet body 1 to move above the guide wheel 3, the pallet body 1 has not yet contacted the guide wheel 3. Since the lower end surface of the transport guide rod 2 is closer to the guide wheel 3, when the transport guide rod is separated from the space above the guide wheel, the pallet body 1 contacts the guide wheel. This top-down contact will directly fall on the guide wheel 3 in the absence of a buffer mechanism. When contacting the guide wheel 3, there will often be obvious shaking or swaying, which will cause the product loaded on the pallet body 1 to have a position deviation.

[0032] like Figure 4As shown, in another embodiment of the present application, a buffer mechanism 4 is provided on the mounting surface 12, and the buffer mechanism 4 can contact the guide wheel, so that the process of the pallet body 1 contacting the guide wheel is gradual, and the buffer mechanism 4 is a cone as a whole, and the end of the conical buffer mechanism 4 close to the transport guide rod 2 is the cone bottom surface, and the end away from the transport guide rod 2 is the cone apex, and the surface area of ​​the end farther away from the transport guide rod 2 is smaller. In the process of the transport guide rod 2 driving the pallet body 1 to move toward the guide wheel 3, the conical buffer mechanism 4 located below the pallet body 1 first contacts the guide wheel 3, and the position where the conical buffer mechanism 4 first contacts the guide wheel 3 is the conical bottom surface with a larger surface area. As the transport guide rod 2 continues to move to the next workstation, the gradually smaller contact surface of the conical buffer mechanism 4 begins to contact the guide wheel 3, thereby achieving stable transmission of the pallet body 1 on the guide wheel 3, thereby ensuring the accuracy of the position of the material on the pallet body 1.

[0033] At the same time, the end of the transport guide rod 2 close to the pallet body 1 is a plane, and the end contacts the conical bottom surface of the conical buffer mechanism 4. In one embodiment of the present application, the area of ​​the conical bottom surface can be the same as the end surface of the transport guide rod 2 close to the pallet body 1. Therefore, in the process of the transport guide rod 2 driving the pallet body 1 to move, the transport process transition of the transport guide rod 2 and the conical buffer mechanism 4 on the guide wheel 3 is smoother.

[0034] In another embodiment of the present application, a groove is provided on the guide wheel, and the cone buffer mechanism 4 is arranged in the groove during the movement on the guide wheel 3, further ensuring the stability of the pallet body 1 in transporting materials.

[0035] like Figure 5 As shown, in other embodiments of the present application, the buffer mechanism 4 is hemispherical, and the hemispherical buffer mechanism 4 is installed on the mounting surface 12, and its end away from the mounting surface 12 is arc-shaped. When the tray body 1 moves toward the guide wheel 3, the hemispherical buffer mechanism 4 gradually contacts the guide wheel 3. Since the contacting part is arc-shaped, progressive contact can also be achieved.

[0036] By adopting the solution of the present application, in the process of vacuum sealing the infrared sensor chip, the shaking and jittering problems of the material to be welded located on the tray body 1 during the movement can be overcome, and a buffer mechanism is added without changing the layout of the original equipment, thereby improving the stability of material transmission.

[0037] The above embodiments are only for illustrating the technical concept and features of the present application, and their purpose is to enable people familiar with this technology to understand the content of the present application and implement it accordingly, and they cannot be used to limit the scope of protection of the present application. For those skilled in the art, it is obvious that the present application is not limited to the details of the above exemplary embodiments, and the present application can be implemented in other specific forms without departing from the spirit or basic features of the present application. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present application is limited by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims in the present application.

Claims

1. An anti-shake tray fixture, characterized in that: include: A tray body, wherein the tray body is provided with a bearing surface and a mounting surface, and the bearing surface and the mounting surface are arranged on the front and back sides of the tray body opposite to each other; The bearing surface is used to bear the material to be welded. The mounting surface can be placed on a conveying mechanism and moved on the conveying mechanism, The mounting surface is provided with a buffer mechanism, and the buffer mechanism contacts the conveying mechanism before the mounting surface contacts the conveying mechanism.

2. The anti-shake tray fixture according to claim 1, characterized in that: The buffer mechanism is a conical buffer mechanism, and the surface area of ​​the conical buffer mechanism at one end close to the conveying mechanism is larger than the surface area of ​​the conical buffer mechanism at one end away from the conveying mechanism.

3. The anti-shake tray fixture according to claim 2, characterized in that: The pallet body is driven by a transport guide rod, the pallet body is provided with a mounting hole, one end of the transport guide rod close to the pallet body is provided with a pin shaft, and the transport guide rod is inserted into the mounting hole through the pin shaft to connect with the pallet body.

4. The anti-shake tray fixture according to claim 3, characterized in that: The contact surface of the transport guide rod connected to the tray body is a plane.

5. The anti-shake tray fixture according to claim 3, characterized in that: An end surface of the conveying guide rod close to one end of the tray body contacts the bottom surface of the conical buffer mechanism.

6. The anti-shake tray fixture according to claim 1, characterized in that: The buffer mechanism is a hemispherical buffer mechanism, and one end of the hemispherical buffer mechanism away from the mounting surface is arc-shaped.

7. The anti-shake tray fixture according to any one of claims 1 to 6, characterized in that: The conveying mechanism is located at one end of the tray body close to the mounting surface, and the conveying mechanism is a guide wheel.

8. The anti-shake tray fixture according to claim 7, characterized in that: The guide wheel is provided with a groove.