A water tank tooling for wafer turnover

Abstract

The utility model provides a water tank tooling for wafer turnover, including a water tank and a base, wherein a material frame is provided inside the water tank for loading a wafer box with wafers inserted therein, wherein the base is arranged below the water tank and is arranged separately from the water tank, wherein a positioning plate is provided on the base, and the positioning plate is arranged along the circumference of the water tank. The beneficial effects of the utility model are that the wafers are ensured not to be oxidized during the turnover process, the number of wafer handling times is effectively reduced, the risk of wafer bumping is reduced, the operation is simplified, the work efficiency is improved, and the two turnover modes of manual turnover and AGV automatic turnover are compatible at the same time.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer production, in particular to a water tank tooling for wafer turnover. Background Art

[0002] During the wafer production process, between the grinding process and the grinding cleaning process, in order to prevent the wafer from being oxidized, the wafer needs to be placed in a pure water environment for transportation. In the prior art, the personnel of the grinding process usually insert the wafer into a wafer box, and then put the wafer box into a water tank for transportation to the grinding cleaning process. The personnel of the grinding cleaning process then insert the wafer box into the material frame, and then send the material frame into the cleaning machine for cleaning. The wafer box that holds the wafer needs to be moved multiple times, which is cumbersome and easy to cause bumps to the wafer. Utility Model Content

[0003] In order to solve the above technical problems, the utility model provides a water tank tooling for wafer turnover, which effectively solves the problem that wafer turnover requires multiple handling, the operation is cumbersome, and it is easy to cause bumps to the wafer, thus overcoming the shortcomings of the prior art.

[0004] The technical solution adopted by the utility model is: a water tank tooling for wafer turnover, comprising:

[0005] A water tank, with a material frame inside, for loading a wafer box with wafers inserted;

[0006] The base is arranged below the water tank and is separate from the water tank. A positioning plate is arranged on the base and the positioning plate is arranged along the circumference of the water tank.

[0007] Furthermore, a positioning baffle is provided at the bottom of the water tank, and the positioning baffle is arranged along the circumference of the material frame.

[0008] Furthermore, a guide plate is provided above the positioning baffle, and the top of the guide plate is inclined toward the inner wall of the water tank.

[0009] Furthermore, a fixing block is provided at the bottom of the positioning baffle, and the fixing block is connected to the bottom of the water tank.

[0010] Furthermore, a drain valve is provided at the bottom of the water tank.

[0011] Furthermore, water retaining bends are provided on opposite sides of the top opening of the water tank, and the water retaining bends are arranged inside the water tank.

[0012] Furthermore, the side of the water retaining bend away from the inner wall of the water tank is inclined downward.

[0013] Furthermore, reinforcement strips are provided on both sides of the top opening of the water tank where the water retaining bend is not provided, and the reinforcement strips are arranged outside the water tank.

[0014] Furthermore, a positioning boss is provided at the bottom of the base, and a positioning groove is provided on the positioning boss.

[0015] Furthermore, a leveling pad is provided at the bottom of the base, and the leveling pad is at the same height as the positioning boss.

[0016] The advantages and positive effects of the utility model are: ensuring that the wafer will not be oxidized during the turnover process, effectively reducing the number of wafer handling times, reducing the risk of wafer bumping, simplifying the operation, improving work efficiency, and being compatible with both manual turnover and AGV automatic turnover modes. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of a water tank tooling for wafer turnover according to an embodiment of the utility model.

[0018] Figure 2 This is a top structural diagram of a water tank tooling base for wafer turnover in an embodiment of the utility model.

[0019] Figure 3 It is a schematic diagram of the connection of a water tank tooling drain valve for wafer turnover in an embodiment of the utility model.

[0020] Figure 4 This is a bottom structural diagram of a water tank tooling base for wafer turnover in an embodiment of the utility model.

[0021] In the figure:

[0022] 1. Water tank 2. Base 3. Positioning plate

[0023] 4. Positioning baffle 5. Guide plate 6. Fixed block

[0024] 7. Drain valve 8. Elbow 9. Water retaining bend

[0025] 10. Reinforcement strip 11. Positioning boss 12. Positioning groove

[0026] 13. Leveling pad DETAILED DESCRIPTION

[0027] An embodiment of the utility model provides a water tank tooling for wafer turnover, and the embodiment of the utility model is described below in conjunction with the accompanying drawings.

[0028] In the description of the embodiments of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "top", "bottom", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "set" and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood by specific circumstances.

[0029] like Figure 1 and 2 As shown, the utility model embodiment is a water tank tooling for wafer turnover, including a water tank 1 and a base 2. A material frame is provided inside the water tank 1, and the material frame is used to load a wafer box with wafers inserted, and the material frame is not shown in the figure. The material frame is directly set in the water tank 1. After the wafer grinding is completed, the wafer box filled with wafers is directly placed in the material frame immersed in water. After being transported to the cleaning machine, the material frame can be directly placed in the cleaning machine, which simplifies the steps of placing the wafer box into the water tank 1, taking it out of the water tank 1 and placing it in the material frame, and then placing the material frame in the cleaning machine. The base 2 is arranged below the water tank 1 and is separated from the water tank 1, so that the water tank 1 can be placed on a manual cart without the base 2 for turnover, and can also be combined with the base 2 to realize AGV automatic turnover, and is compatible with both manual turnover and AGV automatic turnover. A positioning plate 3 is provided on the base 2, and the positioning plate 3 is arranged along the circumference of the water tank 1. In this embodiment, the base 2 is welded from square steel, and right-angled positioning plates 3 are provided at the four corners of the base 2. The positioning plates 3 are engaged with the four corners of the bottom of the water tank 1 to prevent the water tank 1 from moving horizontally.

[0030] Preferably, in order to prevent the wafer from being bumped by the movement of the material frame during transportation, a positioning baffle 4 is provided at the bottom of the water tank 1, and the positioning baffle 4 is arranged along the circumference of the material frame. In this embodiment, the positioning baffle 4 is arranged in an L shape, with the horizontal end placed at the bottom of the water tank 1 and fixedly connected to the bottom of the water tank 1, and the vertical end is arranged along the circumference of the material frame. Two positioning baffles 4 are arranged at each corner of the water tank 1 to limit the position of the water tank 1.

[0031] Preferably, in order to facilitate placing the material frame at the bottom of the water tank 1 and positioning it with the positioning baffle 4, a guide plate 5 is provided above the positioning baffle 4, and the top of the guide plate 5 is inclined toward the inner wall of the water tank 1, and the inclination angle is not limited. The material frame can move downward along the guide plate 5 to a rectangular frame formed by the positioning baffles 4 at the four corners. The guide plate 5 and the positioning baffle 4 can be provided as one piece, or they can be provided separately and fixedly connected.

[0032] Preferably, in order to prevent the positioning baffle 4 from deforming and make the installation of the positioning baffle 4 more secure, a fixing block 6 is provided at the bottom of the positioning baffle 4, and the fixing block 6 is connected to the bottom of the water tank 1. In this embodiment, a long strip-shaped fixing block 6 is placed above the horizontal end of the positioning baffle 4, and both ends of the fixing block 6 are fixedly connected to the bottom of the water tank 1 by bolts.

[0033] Preferably, Figure 3 As shown, a drain valve 7 is provided at the bottom of the water tank 1. In order to clean the water tank 1, the liquid in the water tank 1 needs to be drained. By providing the drain valve 7, it is more convenient to drain the liquid in the tank and clean the water tank 1. In this embodiment, a drain port is provided at the bottom of the water tank 1, and a bend 8 is connected to the outside of the drain port, and the drain valve 7 is installed on the bend 8.

[0034] Preferably, Figure 1 As shown, water retaining bends 9 are provided on opposite sides of the top opening of the water tank 1. The water retaining bends 9 are provided inside the water tank 1. During the turnover process, it is necessary to ensure that the wafer box is immersed in pure water, so the liquid level is high and the liquid in the water tank 1 is easily overflowed and spilled to the outside. By providing the water retaining bends 9, the liquid can be prevented from overflowing and spilling to the outside.

[0035] Preferably, in order to ensure the water-blocking effect, the side of the water-blocking bend 9 away from the inner wall of the water tank 1 is tilted downward, and the tilting angle is not limited.

[0036] Preferably, in order to ensure the firmness of the water tank 1 and facilitate manual handling of the water tank 1, reinforcement strips 10 are provided on both sides of the top opening of the water tank 1 where the water retaining bend 9 is not provided. The reinforcement strips 10 are arranged outside the water tank 1. The number and shape of the reinforcement strips 10 are not limited. In this embodiment, the cross-section of the reinforcement strips 10 is a quadrilateral, and is symmetrically welded on both sides of the top opening of the water tank 1 where the water retaining bend 9 is not provided.

[0037] Preferably, Figure 4 As shown, in order to facilitate positioning during transportation, a positioning boss 11 is provided at the bottom of the base 2, and a positioning groove 12 is provided on the positioning boss 11. Positioning blocks are provided on the docking platforms of the AGV and the cleaning machine. The shape of the positioning groove 12 is adapted to the shape of the positioning block. In this embodiment, four positioning grooves 12 are provided at the bottom of the base 2, the two positioning grooves 12 located at the diagonal angles are used for positioning with the docking platform of the cleaning machine, and the two positioning grooves 12 located in the middle are used for positioning with the AGV.

[0038] Preferably, in order to ensure the stability of the entire device, a leveling pad 13 is provided at the bottom of the base 2, and the leveling pad 13 has the same height as the positioning boss 11. The leveling pad 13 is fixedly connected to the bottom of the base 2. The number and shape of the leveling pad 13 are not limited, as long as the stability of the entire device is ensured.

[0039] Instructions for use: The grinding personnel fill the wafer box with the polished wafers, put the wafer box into the material frame, and put the material frame into the water tank 1 as a whole. The positioning baffle 4 in the water tank 1 positions the material frame. The entire water tank 1 tooling is placed on the AGV trolley, and the positioning groove 12 adapted to the AGV positions the entire tooling. The AGV automatically docks with the loading docking station of the cleaning machine, places the entire water tank 1 tooling on the docking station, and positions the entire tooling with the positioning groove 12 adapted to the docking station. The cleaning machine removes the internal material frame, and the cleaned wafer box is taken out of the material frame and enters the next process. The AGV delivers the empty water tank 1 to the unloading port of the cleaning machine, and the cleaning machine puts the empty material frame into the water tank 1. The AGV returns the entire water tank 1 tooling to the grinding machine docking station.

[0040] The advantages and positive effects of the utility model are:

[0041] 1. The wafer is always in the water tank during the turnover process, ensuring that the wafer will not be oxidized during the turnover process;

[0042] 2. Effectively reduce the number of wafer handling times and reduce the risk of wafer bumping;

[0043] 3. Simplified the operation and improved the work efficiency.

[0044] 4. The base and the water tank are set separately. The water tank can be placed on a manual cart for turnover alone, or it can be combined with the base to realize AGV automatic turnover. It is compatible with both manual turnover and AGV automatic turnover modes.

[0045] The above is a detailed description of the embodiments of the utility model, but the contents are only preferred embodiments of the utility model and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.

Claims

1. A water tank tooling for wafer turnover, characterized in that: include: A water tank, with a material frame inside, for loading a wafer box with wafers inserted; The base is arranged below the water tank and is separate from the water tank. A positioning plate is arranged on the base and the positioning plate is arranged along the circumference of the water tank.

2. The water tank tooling for wafer turnover according to claim 1, characterized in that: A positioning baffle is provided at the bottom of the water tank, and the positioning baffle is arranged along the circumference of the material frame.

3. The water tank tooling for wafer turnover according to claim 2, characterized in that: A guide plate is arranged above the positioning baffle, and the top of the guide plate is inclined toward the inner wall of the water tank.

4. The water tank tooling for wafer turnover according to claim 3 is characterized by: A fixing block is provided at the bottom of the positioning baffle, and the fixing block is connected to the bottom of the water tank.

5. A water tank tooling for wafer turnover according to any one of claims 1 to 4, characterized in that: A drain valve is provided at the bottom of the water tank.

6. A water tank tooling for wafer turnover according to any one of claims 1-4, characterized in that: Water retaining bends are arranged on opposite sides of the top opening of the water tank, and the water retaining bends are arranged inside the water tank.

7. The water tank tooling for wafer turnover according to claim 6, characterized in that: The side of the water retaining bend away from the inner wall of the water tank is inclined downward.

8. The water tank tooling for wafer turnover according to claim 6, characterized in that: Reinforcement strips are provided on both sides of the top opening of the water tank where the water retaining bend is not provided, and the reinforcement strips are arranged outside the water tank.

9. A water tank tooling for wafer turnover according to any one of claims 1-4 and 7-8, characterized in that: A positioning boss is provided at the bottom of the base, and a positioning groove is provided on the positioning boss.

10. The water tank tooling for wafer turnover according to claim 9, characterized in that: A leveling pad is provided at the bottom of the base, and the leveling pad is at the same height as the positioning boss.

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