Wafer blocking structure

Abstract

The utility model provides a wafer blocking structure, comprising a box body and a blocking assembly and a connecting assembly respectively arranged on both sides of the top of the box body, a plurality of partitions arranged in sequence and spaced apart along the width direction of the box body are arranged on both sides of the inner cavity of the box body, a wafer placement groove is arranged between two adjacent partitions, the blocking assembly comprises a bottom plate arranged on one side of the top of the box body and a plurality of blocking nails arranged in sequence and spaced apart along the width direction of the box body corresponding to the wafer placement grooves, the blocking nails are movably connected to the inside of the bottom plate, and the blocking nails penetrate into the wafer placement groove toward one end of the box body.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a wafer blocking structure. Background Art

[0002] In the semiconductor manufacturing process, wafers need to complete a variety of different processes, so they need to be frequently transferred to different cartridges for cleaning with strong acids and alkalis. The cartridges for this part are generally made of expensive Teflon materials, while ordinary plastic cartridges are usually used for transportation. For some abnormal situations, we need to pick out the abnormal wafers in the cartridges, disassemble them, or rework or perform appearance inspection, etc.

[0003] Among the prior art, the currently used card box can only meet the needs of whole box transfer. When abnormal wafers appear in the card box, they need to be picked out manually, which is not flexible and manual operation can easily damage the wafers. In addition, the card boxes cannot be fixed to each other, and the wafers often slip out of the card box during the inversion process. Utility Model Content

[0004] Based on this, the purpose of the utility model is to provide a wafer blocking structure, which can effectively solve the deficiencies in the above-mentioned prior art.

[0005] A wafer blocking structure comprises a box body and a blocking assembly and a connecting assembly respectively arranged on both sides of the top of the box body, a plurality of partitions arranged in sequence along the width direction of the box body are arranged on both sides of the inner cavity of the box body, and a wafer placement groove is arranged between two adjacent partitions, the blocking assembly comprises a bottom plate arranged on one side of the top of the box body and a plurality of blocking pins arranged in sequence along the width direction of the box body corresponding to the wafer placement grooves, the blocking pins are movably connected to the inside of the bottom plate, and the blocking pins penetrate into the wafer placement groove toward one end of the box body.

[0006] Furthermore, a tensioning structure is sleeved on the blocking nail, and a first limiting member for compressing the tensioning structure is provided on a side of the tensioning structure facing the box body.

[0007] Furthermore, a second limiting member for stopping the blocking nail is provided on a side of the tensioning structure away from the box body.

[0008] Furthermore, an elastic structure is connected to one end of the blocking nail facing the box body.

[0009] Furthermore, the inner cavity of the box body is a concave structure.

[0010] Furthermore, the wafer placement groove is a concave structure.

[0011] Furthermore, the partition is a conical structure.

[0012] Furthermore, a through hole for drainage is provided at the bottom of the box body.

[0013] Furthermore, positioning posts are provided at both ends of the bottom plate, and positioning holes matched with the positioning posts are provided at both ends of the connecting assembly.

[0014] Compared with the prior art, the utility model has the following beneficial effects: by setting a blocking component, when the wafers are transferred in a whole box, the abnormal wafers can be locked in the plug box by the blocking component; specifically, by setting a plurality of partitions arranged in sequence along the width direction of the box body on both sides of the inner cavity of the box body, and by setting a wafer placement groove between two adjacent partitions, the wafers can be placed individually in the wafer placement groove, and by movably setting a plurality of blocking nails arranged in sequence along the width direction of the box body in the bottom plate corresponding to the wafer placement groove, and the blocking nails are movably connected to the inside of the bottom plate, and the blocking nails penetrate into the wafer placement groove towards one end of the box body, so that when the wafers are found to have abnormal wafers in the wafer placement groove during the whole box transfer, by moving the blocking nail corresponding to the wafer placement groove containing the abnormal wafer toward the box body until the blocking nail penetrates into the wafer placement groove towards one end of the box body, the abnormal wafer can be locked in the wafer placement groove, and the wafer to be transferred can be poured out into another plug box. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A top view of a wafer blocking structure in an embodiment of the utility model;

[0016] Figure 2 It is a side view of the wafer blocking structure in the embodiment of the utility model;

[0017] Figure 3 It is a front view of the wafer blocking structure in the embodiment of the utility model;

[0018] Figure 4 for Figure 1 A magnified schematic diagram of the local A in the middle;

[0019] Figure 5 for Figure 2 A magnified schematic diagram of the part B in the middle;

[0020] Description of main component symbols:

[0021]

[0022]

[0023] The following specific implementation manner will further illustrate the present utility model in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0024] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0025] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0027] See also Figures 1 to 3 , shown is a wafer blocking structure in an embodiment of the utility model, including a box body 10 and a blocking assembly 20 and a connecting assembly 30 respectively arranged on both sides of the top of the box body 10, eleven partitions 11 arranged in sequence along the width direction of the box body 10 are provided on both sides of the inner cavity of the box body 10, a wafer placement groove 12 is provided between two adjacent partitions 11, and a through hole 13 for drainage is opened at the bottom of the box body 10, the blocking assembly 20 includes a bottom plate 21 arranged on one side of the top of the box body 10 and a plurality of blocking nails 22 arranged corresponding to the wafer placement grooves 12 and spaced in sequence along the width direction of the box body 10.

[0028] Furthermore, the inner cavity of the box body 10 is a concave structure.

[0029] It can be understood that by setting the inner cavity of the box body 10 as a concave structure, the structural stability of the present invention can be increased.

[0030] Furthermore, the partition 11 is a conical structure.

[0031] It can be understood that by making the partition 11 into a conical structure, the distance between two adjacent partitions gradually decreases from top to bottom, so that when the wafer is transferred into the utility model, the partition 11 can play a guiding and buffering role.

[0032] Furthermore, the wafer placement groove 12 is a concave structure.

[0033] It can be understood that by setting the wafer placement groove 12 as a concave structure, the flow rate of the liquid remaining on the wafer on the wafer placement groove 12 can be accelerated, and when the wafer is transferred into the utility model, the wafer placement groove 12 can position and protect the wafer.

[0034] See also Figures 4 to 5 The blocking nail 22 in the embodiment of the utility model is movably connected to the inside of the bottom plate 21, and the blocking nail 22 is inserted into the wafer placement groove 12 at one end facing the box body 10, and a tensioning structure 23 is sleeved on the blocking nail 22, and a first limiting member 24 for compressing the tensioning structure 23 is provided on the side of the tensioning structure 23 facing the box body 10, and the first limiting member 24 is provided on the blocking nail 22, and a tensioning member 24 is provided on the outer side of the first limiting member 24 and the tensioning structure 23. There is a second limiting groove 41, which is a cylindrical groove. The cross-sectional area of ​​the second limiting groove 41 is larger than the first limiting member 24 and larger than the tensioning structure 23. A second limiting member 25 for stopping the blocking nail 22 is provided on the side of the tensioning structure 23 away from the box body 10, and the second limiting member 25 is arranged on the blocking nail 22. A first limiting groove 40 adapted to the second limiting member 25 is opened on the side of the bottom plate 21 away from the box body 10, and the first limiting groove is a square groove.

[0035] It can be understood that by moving the blocking nail 22 away from the box body 10, the first limiting member 24 contracts the tensioning structure 23 until the second limiting member 25 slides out of the first limiting groove 40, and then the blocking nail 22 is rotated so that the second limiting member 25 abuts against the side of the bottom plate 21, thereby making the blocking nail 22 meet the release condition.

[0036] It can be understood that by rotating the blocking nail 22 until the second limiting member 25 is aligned with the first positioning groove 40, the compressed tensioning structure 23 releases the tension, abuts against the first positioning member 24 to drive the blocking nail 22 to move toward the box body 10, so that the second limiting member 25 abuts against the bottom of the first limiting groove 40, thereby making the blocking nail 22 reach the interception condition.

[0037] Furthermore, an elastic structure 26 is connected to one end of the blocking nail 22 facing the box body 10 .

[0038] It should be noted that the length of the elastic structure 26 is equal to the depth of the first positioning groove 40 .

[0039] It can be understood that by providing the elastic structure 26 , the elastic structure 26 can protect the wafer when the wafer is intercepted.

[0040] Furthermore, positioning posts 27 are provided at both ends of the bottom plate 21 , and positioning holes 31 which are interference-fitted with the positioning posts 27 are provided at both ends of the connecting assembly 30 .

[0041] It can be understood that by providing the positioning column 27 and the positioning hole 31 matched with the positioning column 27, when the wafer is transferred, the positioning column 27 of the plug structure of the bottom wafer can be inserted into the positioning hole 31 of the plug structure of the top wafer, and the positioning column 27 of the plug structure of the top wafer can be inserted into the positioning hole 31 of the plug structure of the bottom wafer, thereby realizing the fixation between the plug boxes when they are inverted, and solving the problem of the wafer slipping out of the plug box during the inverting process.

[0042] In summary, the wafer blocking structure in the above-mentioned embodiments of the utility model can lock abnormal wafers in the blocking box by setting a blocking component when the wafers are transferred in the whole box; specifically, a plurality of partitions are arranged in sequence along the width direction of the box body in the inner cavity of the box body, and a wafer placement groove is arranged between two adjacent partitions, so that the wafers can be placed individually in the wafer placement groove, and a plurality of blocking nails are movably arranged in sequence along the width direction of the box body in the bottom plate corresponding to the wafer placement groove, and the blocking nails are movably connected to the inside of the bottom plate, and the blocking nails penetrate into the wafer placement groove towards one end of the box body, so that when abnormal wafers are found in the wafer placement groove during the whole box transfer, the blocking nails corresponding to the wafer placement groove containing the abnormal wafer are moved toward the box body until the blocking nails penetrate into the wafer placement groove towards one end of the box body, thereby locking the abnormal wafer in the wafer placement groove, and pouring the wafer to be transferred into another blocking box.

[0043] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0044] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A wafer blocking structure, characterized in that: The invention comprises a box body and a blocking assembly and a connecting assembly respectively arranged on both sides of the top of the box body; a plurality of partitions arranged in sequence along the width direction of the box body are arranged on both sides of the inner cavity of the box body; a wafer placement groove is arranged between two adjacent partitions; the blocking assembly comprises a bottom plate arranged on one side of the top of the box body and a plurality of blocking nails arranged in sequence along the width direction of the box body corresponding to the wafer placement grooves; the blocking nails are movably connected to the inside of the bottom plate, and the blocking nails penetrate into the wafer placement groove toward one end of the box body.

2. The wafer blocking structure according to claim 1, characterized in that: A tensioning structure is sleeved on the blocking nail, and a first limiting member for compressing the tensioning structure is provided on a side of the tensioning structure facing the box body.

3. The wafer blocking structure according to claim 2, characterized in that: A second limiting member for stopping the blocking nail is provided on a side of the tensioning structure away from the box body.

4. The wafer blocking structure according to claim 1, characterized in that: An elastic structure is connected to one end of the blocking nail facing the box body.

5. The wafer blocking structure according to claim 1, characterized in that: The inner cavity of the box body is a concave structure.

6. The wafer blocking structure according to claim 1, characterized in that: The wafer placement groove is a concave structure.

7. The wafer blocking structure according to claim 1, characterized in that: The partition is a conical structure.

8. The wafer blocking structure according to claim 1, characterized in that: A through hole for drainage is provided at the bottom of the box body.

9. The wafer blocking structure according to claim 1, characterized in that: Positioning posts are arranged at both ends of the bottom plate, and positioning holes matched with the positioning posts are arranged at both ends of the connecting assembly.

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