A semiconductor pipeline heating device

Abstract

The utility model discloses a semiconductor pipeline heating device, including a shell one and a shell two, the shell one and the shell two are connected by a sealing component, and the shell one and the shell two are also fixedly connected by a fixing mechanism, a heating chamber is provided inside the shell one and the shell two, a heating component is provided inside the heating chamber, a heat exchange component is provided inside the heating chamber, and a circulation component matching the heating chamber is symmetrically provided on the shell one. The utility model can conveniently assemble and fix the shell one and the shell two, ensure firmness during use, and not affect normal heating use, and can also be conveniently disassembled after being used for a period of time, and then conveniently clean the inside of the heating chamber, remove the internal dirt, and ensure the efficiency of heating and heat exchange, and at the same time, the circulation component can ensure uniform internal heating, and is also convenient to disassemble and clean.

Description

Technical Field

[0001] The utility model relates to the technical field of pipeline heating, in particular to a semiconductor pipeline heating device. Background Art

[0002] In the petroleum industry or chemical production, the pipeline heating device is a commonly used device to directly heat the material. The pipeline heating device is divided into two modes: one is to use the flange-type tubular electric heating element inside the pipeline heater to insert it invertedly into the jacket of the reactor in the pipeline heater to heat the heat transfer oil, and transfer the heat energy in the pipeline heater to the oil or chemical raw materials in the reactor inside the pipeline heater. Another way is to directly insert the tubular electric heating element in the pipeline heater into the reactor in the pipeline heater or evenly distribute the electric heating tubes around the wall of the pipeline heater. This mode is called the internal heating type of the pipeline heater. The internal heating type of the pipeline heater heats up quickly and has high efficiency, but it is not suitable for use in oil or flammable chemical raw materials. Another way is that the pipeline is heated by water or heat transfer oil, and in order to ensure the efficiency and safety of heating, a semiconductor pipeline heating device is proposed.

[0003] However, existing semiconductor pipeline heating equipment has certain defects when in use. Most of them use water as the heat transfer medium. Although it can avoid internal scaling to a certain extent and can be regularly drained and replaced through the drain valve, after long-term use, there will be more or less residual dirt adhered inside, which is inconvenient to clean, thus affecting the heating and heat exchange efficiency. Utility Model Content

[0004] The purpose of the utility model is to provide a semiconductor pipeline heating device to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor pipeline heating device, comprising a shell one and a shell two, the shell one and the shell two are connected by a sealing component, and the shell one and the shell two are also fixedly connected by a fixing mechanism, a heating chamber is opened inside the shell one and the shell two, a heating component is arranged in the heating chamber, a heat exchange component is arranged in the heating chamber, and a circulation component matching the heating chamber is symmetrically arranged on the shell one.

[0006] Preferably, in order to ensure the sealing performance during use, the sealing assembly includes a sealing strip arranged on one side wall of the shell, and sealing grooves which are interference fit with the sealing strip are opened on both side walls of the shell.

[0007] Preferably, in order to facilitate assembly and fixation, as well as subsequent disassembly for cleaning the interior, the fixing mechanism includes fixing blocks equidistantly arranged on shell one and shell two, a fixing rod is provided in the middle of the fixing block on shell two, the fixing block on shell one is provided with a fixing hole matching the fixing rod, and a limiting assembly matching the fixing hole is provided on the fixing rod.

[0008] Preferably, in order to facilitate assembly and fixation, as well as subsequent disassembly for cleaning the interior, the limit assembly includes a sliding cavity opened inside the fixed rod, and movable plates are symmetrically arranged in the sliding cavity through springs. Limit blocks are fixedly arranged at the ends of the movable plates away from each other, so that the limit blocks slide out of the sliding cavity, and a limit groove matching the limit block is opened on the fixed hole.

[0009] Preferably, in order to facilitate heating of the heat-conducting liquid and then exchange heat with the heat exchange component through the heat-conducting liquid, the heating component includes semiconductor heating strips equidistantly arranged in the heating chamber, and mica sheets are provided at both ends of the semiconductor heating strips.

[0010] Preferably, the time that the heated gas or liquid stays in the heating chamber can be increased to ensure the heating effect. The heat exchange component includes a heat exchange pipeline arranged in the heating chamber, a liquid inlet pipe is provided at the bottom end of the heat exchange pipeline, and a liquid outlet pipe is provided at the top end of the heat exchange pipeline.

[0011] Preferably, in order to ensure uniform internal heating, the circulation component includes a circulation pipe symmetrically arranged on a side wall of the shell, both ends of the circulation pipe are connected to the heating chamber, and a machine pump is provided on the circulation pipe through a connecting flange.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] (1) The fixing mechanism provided can facilitate the assembly and fixing of the shell 1 and the shell 2, ensuring that they are firm during use and do not affect normal heating. They can also be easily disassembled after a period of use, so that the inside of the heating chamber can be easily cleaned to remove the internal dirt and ensure the efficiency of heating and heat exchange. At the same time, the circulation component provided can ensure uniform heating inside, and is also convenient for disassembly and cleaning;

[0014] (2) The sealing component can ensure the sealing of the connection during assembly, prevent the heat transfer liquid in the heating chamber from flowing out, and do not affect normal use. The heating component is combined with the heat exchange component to heat the heat transfer liquid in the heating chamber. The heat transfer liquid and the heat exchange component are then exchanged to complete the heating. Direct contact can be avoided, preventing the boiling of the pipeline liquid caused by high temperature and the increase of pipeline pressure, while reducing scaling. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the structure of a semiconductor pipeline heating device proposed by the utility model when it is turned on;

[0016] Figure 2 This is a structural schematic diagram of a semiconductor pipeline heating device proposed by the utility model;

[0017] Figure 3 This is a schematic diagram of the internal structure of a shell 2 in a semiconductor pipeline heating device proposed by the utility model;

[0018] Figure 4 This is a schematic diagram of the internal structure of a shell 1 in a semiconductor pipeline heating device proposed by the utility model;

[0019] Figure 5 This is a partial structural schematic diagram of a limit assembly in a semiconductor pipeline heating device proposed by the utility model;

[0020] Figure 6 The present invention is a partial structural schematic diagram of a heating component in a semiconductor pipeline heating device proposed by the present invention.

[0021] In the figure: 1. Shell 1; 2. Shell 2; 3. Heat exchange pipeline; 4. Fixing block; 5. Pump; 6. Fixing hole; 7. Connecting flange; 8. Liquid inlet pipe; 9. Circulation pipe; 10. Heating chamber; 11. Liquid outlet pipe; 12. Fixing rod; 13. Sealing strip; 14. Moving plate; 15. Sliding chamber; 16. Spring; 17. Mica sheet; 18. Semiconductor heating strip; 19. Limiting block; 20. Limiting groove; 21. Sealing groove. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] See also Figure 1-Figure 6The utility model provides an embodiment: a semiconductor pipeline heating device, comprising a shell 1 and a shell 2 for providing protection for the heating device, the cavity between the two constitutes a heating chamber 10, which can be provided with a liquid filling pipe and a sewage pipe, which can facilitate the addition of heat-conducting liquid (such as water or heat-conducting oil, etc.) and regular discharge and replacement operations, which is a relatively mature technology and will not be described in detail here. In order to ensure the heating effect, semiconductor heating strips 18 of the heating component are equidistantly arranged in the heating chamber 10 (which can adopt a graphene heating film, which is a relatively mature technology and will not be described here). No further elaboration is given), and mica sheets 17 are provided at both ends of the semiconductor heating strip 18, which have the characteristics of good thermal conductivity and high insulation. In order to ensure the heating effect, thermal insulation cotton can also be provided, and its material can be aluminum silicate fiber cotton, which can reduce heat exchange with the outside world. The heating chamber 10 is surrounded by a heat exchange pipeline 3 with a heat exchange component, which can be heated by the heated heat-conducting liquid, and the bottom end of the heat exchange pipeline 3 is connected to a liquid inlet pipe 8 (for convenient introduction of heated liquid or gas, etc.), and the top end is connected to a liquid outlet pipe 11 (for convenient transportation of the heated liquid or gas for subsequent use).

[0024] See also Figure 1-Figure 6 In order to ensure the sealing effect during use and ensure uniform heating, and to facilitate subsequent regular cleaning and replacement to avoid internal scaling and other factors that affect the heating efficiency, a sealing strip 13 of a sealing component is bonded to the side wall of the shell 1, and a sealing groove 21 corresponding to the sealing strip 13 is provided on the side wall of the shell 2. The two are interference fit, which can ensure sealing during assembly and prevent the internal heat transfer liquid from flowing out. In order to ensure uniform heating, two groups of circulation pipes 9 (whose shape is U-shaped) of circulation components are installed on the side wall of the shell 1, and the two ends are respectively located at the top and bottom ends of the shell 1 and extend into the heating chamber 10. A connecting flange 7 is provided on the external part of the circulation pipe 9, and is connected to the machine pump 5 (the bottom end is connected to the input end of the machine pump 5, and the top end is connected to the output end), which can facilitate the circulation of the heat transfer liquid, ensure uniform internal heating, and thus ensure the heating effect. In addition, since the connecting flange 7 is connected, it is detachable and can be conveniently cleaned regularly.

[0025] See also Figure 1-Figure 6In order to ensure the firmness of the equipment during use and facilitate subsequent disassembly operations, the interior is cleaned to ensure the cleanliness of the heating chamber 10, thereby ensuring the efficiency of heating and heat exchange. The top and bottom ends of the shell 1 and the shell 2 are welded with fixing blocks 4 of the fixing mechanism, and the middle of the fixing block 4 on the shell 2 is welded with a fixing rod 12, and the fixing block 4 on the shell 1 is provided with a fixing hole 6 for convenient insertion of the fixing rod 12. In order to ensure the firmness after insertion, a sliding cavity 15 of a limiting assembly is provided inside the fixing rod 12, and two groups of moving plates 14 are symmetrically slid by springs 16 inside the sliding cavity 15. The ends of the two groups of moving plates 14 that are away from each other are welded with limiting blocks 19, which slide out of the sliding cavity 15 and extend to the outside, and the fixing hole 6 is provided with a limiting groove 20 that engages with the limiting block 19 to limit the position, which can be convenient for limiting and fixing after insertion, and also facilitates subsequent disassembly operations.

[0026] Working principle: When the utility model is in use, when assembling the shell 1 and the shell 2, first press the limit block 19, and slide the movable plate 14 in the sliding cavity 15 to approach each other. The spring 16 is forced to shrink and store potential energy, and then the limit block 19 enters the sliding cavity 15. At this time, by inserting the fixing rod 12 into the fixing hole 6, after the insertion is completed, the limit of the limit block 19 is lost, and it is reset under the action of the potential energy of the spring 16, and then enters the limit groove 20, so that the fixing rod 12 can be limited and fixed. At the same time, during the plug-in process, the sealing strip 13 enters the sealing groove 21, and the shell 1 and the shell 2 can be sealed to ensure the sealing effect. The heat-conducting liquid is introduced into the heating cavity 10 through the liquid-adding pipe network, and then the semiconductor heating strip 18 is heated to heat the heat-conducting liquid. At the same time, the machine pump 5 is working, The heat-conducting liquid at the bottom of the heating chamber 10 is passed to the top through the circulation pipe 9 to complete the circulation, ensuring uniform heating inside, and then the liquid or gas to be heated in the heat exchange pipeline 3 can be heated, and discharged through the liquid outlet pipe 11 after heating. When the inside of the heating chamber 10 needs to be cleaned, the heat-conducting liquid is discharged from the drain pipe, the shell 1 1 and the shell 2 2 can be removed, and by pressing the limit block 19, it can be away from the limit groove 20, and the limit is lost. The fixing rod 12 can be taken out from the fixing hole 6, and the sealing strip 13 leaves the sealing groove 21 to complete the disassembly operation, and then the inside of the heating chamber 10 can be cleaned conveniently. When the pipeline of the circulation pipe 9 needs to be cleaned, the connecting flange 7 can be disassembled and the middle pipeline can be removed to facilitate the cleaning operation, thereby avoiding internal scaling after long-term use and affecting the heating and heat exchange efficiency.

[0027] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A semiconductor pipeline heating device, comprising a housing 1 (1) and a housing 2 (2), characterized in that: The shell one (1) and the shell two (2) are connected via a sealing component, and the shell one (1) and the shell two (2) are also fixedly connected via a fixing mechanism. A heating chamber (10) is provided inside the shell one (1) and the shell two (2), a heating component is provided inside the heating chamber (10), a heat exchange component is provided inside the heating chamber (10), and a circulation component matching the heating chamber (10) is symmetrically provided on the shell one (1).

2. A semiconductor pipeline heating device according to claim 1, characterized in that: The sealing assembly comprises a sealing strip (13) arranged on the side wall of the first shell (1), and a sealing groove (21) which is interference-fitted with the sealing strip (13) is provided on the side wall of the second shell (2).

3. A semiconductor pipeline heating device according to claim 2, characterized in that: The fixing mechanism comprises fixing blocks (4) equidistantly arranged on the first shell (1) and the second shell (2); a fixing rod (12) is provided in the middle of the fixing block (4) on the second shell (2); a fixing hole (6) matching the fixing rod (12) is provided on the fixing block (4) on the first shell (1); and a limit assembly matching the fixing hole (6) is provided on the fixing rod (12).

4. The semiconductor pipeline heating device according to claim 3, characterized in that: The limit assembly comprises a sliding cavity (15) opened inside the fixed rod (12), and a movable plate (14) is symmetrically arranged in the sliding cavity (15) through a spring (16), and a limit block (19) is fixedly arranged at one end of the movable plate (14) away from each other, so that the limit block (19) slides out of the sliding cavity (15), and a limit groove (20) matching the limit block (19) is opened on the fixed hole (6).

5. The semiconductor pipeline heating device according to claim 4, characterized in that: The heating assembly comprises semiconductor heating bars (18) which are arranged at equal distances in the heating chamber (10), and mica sheets (17) are provided at both ends of the semiconductor heating bars (18).

6. The semiconductor pipeline heating device according to claim 5, characterized in that: The heat exchange assembly comprises a heat exchange pipeline (3) arranged in a heating chamber (10), a liquid inlet pipe (8) being provided at the bottom end of the heat exchange pipeline (3), and a liquid outlet pipe (11) being provided at the top end of the heat exchange pipeline (3).

7. The semiconductor pipeline heating device according to claim 6, characterized in that: The circulation assembly comprises a circulation pipe (9) symmetrically arranged on the side wall of the shell (1), the two ends of the circulation pipe (9) are connected to the heating chamber (10), and a pump (5) is arranged on the circulation pipe (9) via a connecting flange (7).

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