Capacitors

By using metal material in the capacitor and the cooling chamber with U-shaped cross-section, combined with two IGBT modules installed on the outer surface and the lead electrode buried in the packaging material, the problem of poor heat dissipation effect of traditional capacitors is solved, and higher power density and better heat dissipation effect are achieved.

CN222720236UActive Publication Date: 2025-04-04XIAMEN FARATRONIC
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Patent Information

Application Number
CN202420748010.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-11
Publication Date
2025-04-04
Estimated Expiration
2034-04-11

AI Technical Summary

Technical Problem

The heat dissipation effect of traditional film capacitors is poor, which makes it difficult for the power density to meet the increasing demand.

Method used

A capacitor is designed, a shell made of metal material, and a cooling chamber with a U-shaped cross-section is set inside it, two IGBT modules are installed on the outer surface of the capacitor shell, and the lead electrode is buried in the packaging material, and the outer end is electrically connected to the IGBT module.

Benefits of technology

Through the improved heat dissipation structure, the heat dissipation effect and power density of the capacitor are improved, so that one capacitor can be equipped with two IGBT modules, reducing the volume of the controller and reducing the thermal resistance of the capacitor.

✦ Generated by Eureka AI based on patent content.

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    Figure CN222720236U_ABST
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Abstract

The utility model discloses a capacitor, which can improve the heat dissipation effect and power density. The capacitor comprises a capacitor shell, a capacitor core, a packaging material, an IGBT module, a first lead-out electrode and a second lead-out electrode. The capacitor shell is made of a metal material and is provided with a cavity. A cooling cavity with a U-shaped cross-section is provided between the inner wall of the cavity and the outer surface of the capacitor shell, and the cooling cavity is provided with an inlet and an outlet connected to the outer surface of the capacitor shell. The capacitor core is arranged in the cavity. The packaging material is filled between the capacitor core and the inner wall of the cavity. Two IGBT modules are installed on the outer surface of the capacitor shell, and the two IGBT modules are respectively located on opposite sides of an opening of the cavity and overlap with the cooling cavity. The first lead-out electrode and the second lead-out electrode are both buried in the packaging material, and the inner ends of the two are respectively electrically connected to the two ends of the capacitor core, and the outer ends of the two are both exposed from the packaging material and are respectively electrically connected to the two IGBT modules.
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Description

Technical Field

[0001] The utility model relates to the technical field of capacitors, in particular to a capacitor with improved heat dissipation effect. Background Art

[0002] With the rapid development of power electronics technology, metallized film capacitors have been widely used in the field of new energy vehicles. However, with the continuous improvement of power density requirements in the automotive field, the power density requirements for film capacitors are also increasing.

[0003] The traditional film capacitor structure is generally composed of a capacitor core (including plates, dielectrics and metal layers sprayed on the two end faces), lead electrodes (usually leads, welding pieces or busbars), a package shell (usually a plastic shell), and a filling resin (such as epoxy resin). Since the metal layer of the capacitor core is sprayed on its two end faces, the typical structure of the lead electrodes is also to be led out from the two end faces of the capacitor core respectively. This conventional structure design can generally only overlap one IGBT module. Since one of the lead electrodes is far away from the heat dissipation surface where the IGBT module is installed, and the thermal conductivity of the plastic shell is relatively low (about 0.3W / MK), the heat dissipation effect of the lead electrode is poor; in addition, there is no stacking area between the two lead electrodes, and the loop inductance is large. Utility Model Content

[0004] The purpose of the utility model is to provide a capacitor to solve the problems existing in the prior art and improve the heat dissipation effect and power density of the capacitor.

[0005] In order to achieve the above purpose, the solution of the utility model is:

[0006] A capacitor comprises a capacitor housing, a capacitor core, a packaging material, an IGBT module, a first lead-out electrode and a second lead-out electrode; the capacitor housing is made of a metal material and is provided with a cavity; a cooling cavity with a U-shaped cross-section is provided between the inner wall of the cavity and the outer surface of the capacitor housing, and the cooling cavity is provided with an inlet and an outlet connected to the outer surface of the capacitor housing; the capacitor core is arranged in the cavity; the packaging material is filled between the capacitor core and the inner wall of the cavity; two IGBT modules are installed on the outer surface of the capacitor housing, and the two IGBT modules are respectively located on opposite sides of the cavity opening and overlap with the cooling cavity; the first lead-out electrode and the second lead-out electrode are both buried in the packaging material, and the inner ends of the two are respectively electrically connected to the two ends of the capacitor core, and the outer ends of the two are exposed from the packaging material and are respectively electrically connected to the two IGBT modules.

[0007] Two positioning parts are protruded and formed on the mounting surface of the capacitor housing for mounting the IGBT module, and the distance between the two positioning parts is equal to the length or width of the IGBT module.

[0008] Preferably, a pair of connecting parts are provided on two opposite sides of the IGBT module, and the connecting parts and the positioning parts are fixed by screws.

[0009] Preferably, the connecting portion is provided with a through hole for the screw to pass through, and the positioning portion is provided with a screw hole for the screw to be threadedly connected.

[0010] Preferably, a positioning hole is provided on the connecting portion, and a positioning pin matching the positioning hole is provided on the positioning portion.

[0011] The opening of the cavity faces the side of the capacitor housing, two IGBT modules are respectively mounted on the upper and lower surfaces of the capacitor housing, the inlet is arranged on the upper surface of the capacitor housing, and the outlet is arranged on the lower surface of the capacitor housing.

[0012] The outer ends of the first lead-out electrode and the second lead-out electrode are respectively provided with a first connecting ear and a second connecting ear, and the first connecting ear and the second connecting ear are both U-shaped structures and are arranged in a stacked manner.

[0013] The main body shape of one of the first lead-out electrode and the second lead-out electrode matches the shape of the cooling cavity to form a U-shaped structure, and is arranged parallel to the cooling cavity and stacked on the outside of the other lead-out electrode.

[0014] After adopting the above technical solution, the utility model has the following technical effects:

[0015] The utility model can improve the heat dissipation effect of the capacitor shell itself by using metal materials to make the capacitor shell, and a cooling cavity is arranged therein. The cooling cavity with a U-shaped cross-section can allow the coolant to flow to three larger surfaces of the capacitor shell except the opening of the cavity, thereby taking away the heat generated by the capacitor core, the IGBT module and the two lead-out electrodes, and allowing one capacitor to carry two IGBT modules, thereby achieving the purpose of reducing the volume of the controller, reducing the thermal resistance of the capacitor and improving the power density; the two IGBT modules are directly mounted on the outer surface of the capacitor shell to form an integral structure, which is convenient for installation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional diagram of a specific embodiment of the utility model;

[0017] Figure 2 It is an exploded view of a specific embodiment of the utility model;

[0018] Figure 3A bottom view of a specific embodiment of the utility model;

[0019] Figure 4 for Figure 3 Sectional view in the AA direction;

[0020] Figure 5 for Figure 3 Cross-sectional view in the BB direction;

[0021] Description of Figure Numbers:

[0022] 1-capacitor housing; 11-capacitor cavity; 12-cooling cavity; 121-inlet; 122-outlet; 13-positioning portion; 131-screw hole; 132-positioning pin;

[0023] 2-Capacitor core;

[0024] 3- Packaging materials;

[0025] 4-IGBT module; 41-connecting portion; 411-perforation; 412-positioning hole;

[0026] 5-first lead electrode; 51-first connecting ear;

[0027] 6 - second lead-out electrode; 61 - second connecting ear; 62 - electrode body. DETAILED DESCRIPTION

[0028] In order to further explain the technical solution of the present invention, the present invention is described in detail below through specific embodiments.

[0029] refer to Figures 1 to 5 As shown, the utility model discloses a capacitor, including a capacitor housing 1, a capacitor core 2, a packaging material 3, an IGBT module 4, a first lead-out electrode 5 and a second lead-out electrode 6;

[0030] The capacitor housing 1 is made of metal material and is provided with a cavity 11; a cooling cavity 12 with a U-shaped cross-section is provided between the inner wall of the cavity 11 and the outer surface of the capacitor housing 1, and the cooling cavity 12 is provided with an inlet 121 and an outlet 122 connected to the outer surface of the capacitor housing 1, so that a coolant flows in the cooling cavity 12;

[0031] The capacitor core 2 is arranged in the cavity 11;

[0032] The packaging material 3 is filled between the capacitor core 2 and the inner wall of the cavity 11;

[0033] Two IGBT modules 4 are installed on the outer surface of the capacitor housing 1. The two IGBT modules 4 are located at opposite sides of the opening of the cavity 11 and overlap with the cooling cavity 12.

[0034] The first lead electrode 5 and the second lead electrode 6 are both buried in the packaging material 3 , and their inner ends are electrically connected to the two ends of the capacitor core 2 , respectively. Their outer ends are exposed from the packaging material 3 and are electrically connected to the two IGBT modules 4 , respectively.

[0035] Through the above scheme, the utility model can improve the heat dissipation effect of the capacitor housing 1 itself by using metal materials to make the capacitor housing 1, and set a cooling cavity 12 therein. The U-shaped cross-section of the cooling cavity 12 can allow the coolant to flow to the three larger surfaces of the capacitor housing 1 except the opening of the cavity 11, thereby taking away the heat generated by the capacitor core 2, the IGBT module 4 and the two lead-out electrodes, and allowing one capacitor to carry two IGBT modules 4, thereby achieving the purpose of reducing the volume of the controller, reducing the thermal resistance of the capacitor, and improving the power density; the two IGBT modules 4 are directly installed on the outer surface of the capacitor housing 1 to form an integral structure for easy installation.

[0036] Specific embodiments of the present utility model are shown below.

[0037] In this embodiment, the metal material of the capacitor housing 1 is aluminum, but not limited to this material. The thermal conductivity of aluminum is about 120W / MK, which has a significantly improved heat dissipation effect compared to the plastic housing.

[0038] The capacitor housing 1 has two positioning portions 13 protruding from the mounting surface for the IGBT module 4. The spacing between the two positioning portions 13 is equal to the length or width of the IGBT module 4, so that the IGBT module 4 is positioned and installed between the two positioning portions 13, ensuring the overlapping area between the IGBT module 4 and the cooling cavity 12, thereby ensuring the heat dissipation effect.

[0039] Furthermore, a pair of connecting parts 41 are disposed on opposite sides of the IGBT module 4 , and the connecting parts 41 and the positioning parts 13 are fixed by screws.

[0040] Secondly, the connecting portion 41 is provided with a through hole 411 for the screw to pass through, and the positioning portion 13 is provided with a screw hole 131 for the screw to threadably connect.

[0041] Furthermore, the connection part 41 is provided with a positioning hole 412, and the positioning part 13 is provided with a positioning pin 132 matching the positioning hole 412, so as to realize the positioning installation between the connection part 41 and the positioning part 13, so as to ensure that the through hole 411 can be coaxial with the screw hole 131, so as to facilitate screwing.

[0042] In this embodiment, the opening of the above-mentioned cavity 11 is toward the side of the capacitor housing 1 (i.e., one of the front, back, left, and right directions), and the two IGBT modules 4 are respectively installed on the upper and lower surfaces of the capacitor housing 1, wherein the inlet 121 is arranged on the upper surface of the capacitor housing 1 and the outlet 122 is arranged on the lower surface of the capacitor housing 1 to facilitate the flow of coolant.

[0043] Furthermore, the capacitor core 2 is arranged in the up-down direction, with its two ends facing upward and downward respectively.

[0044] The outer ends of the first extraction electrode 5 and the second extraction electrode 6 are respectively provided with a first connection ear 51 and a second connection ear 61. The first connection ear 51 and the second connection ear 61 are both U-shaped structures and are stacked, which increases the stacking area between the first extraction electrode 5 and the second extraction electrode 6, and effectively reduces the inductance of the entire capacitor loop. The stacking area between the first connection ear 51 and the second connection ear 61 can be separated by insulating paper.

[0045] The main body shape of one of the first extraction electrode 5 and the second extraction electrode 6 matches the shape of the cooling cavity 12 to form a U-shaped structure (such as the electrode main body 62 of the second extraction electrode 6 in this embodiment), and is arranged parallel to the cooling cavity 12 and stacked on the outside of the other extraction electrode without affecting the connection between the other extraction electrode and the capacitor core (such as Figure 5 The right part of the electrode body 62 of the second lead-out electrode 6 is stacked on the right side of the first lead-out electrode 5), so that the part of the lead-out electrode located inside the cavity 11 can use the cooling cavity 12 for heat dissipation. At the same time, the stacking area between the two lead-out electrodes is increased, thereby reducing the inductance of the loop, and the area of ​​the capacitor core 2 wrapped by the lead-out electrode is larger, and the heat dissipation effect of the capacitor core 2 can be improved by using structures such as the two lead-out electrodes and the cooling cavity 12.

[0046] The above embodiments and drawings do not limit the product form and style of the present utility model. Any appropriate changes or modifications made by ordinary technicians in the relevant technical field should be deemed to be within the patent scope of the present utility model.

Claims

1. A capacitor, characterized in that: It includes a capacitor housing, a capacitor core, a packaging material, an IGBT module, a first lead-out electrode and a second lead-out electrode; The capacitor housing is made of metal material and is provided with a cavity; a cooling cavity with a U-shaped cross-section is provided between the inner wall of the cavity and the outer surface of the capacitor housing, and the cooling cavity is provided with an inlet and an outlet connected to the outer surface of the capacitor housing; The capacitor core is arranged in the cavity; The packaging material is filled between the capacitor core and the inner wall of the cavity; Two IGBT modules are installed on the outer surface of the capacitor housing, and the two IGBT modules are respectively located on opposite sides of the opening of the cavity and overlap with the cooling cavity; The first lead electrode and the second lead electrode are both buried in the packaging material, and their inner ends are electrically connected to the two ends of the capacitor core respectively, and their outer ends are exposed from the packaging material and are electrically connected to the two IGBT modules respectively.

2. The capacitor according to claim 1, wherein: Two positioning parts are protruded and formed on the mounting surface of the capacitor housing for mounting the IGBT module, and the distance between the two positioning parts is equal to the length or width of the IGBT module.

3. The capacitor according to claim 2, wherein: A pair of connecting parts are arranged on opposite sides of the IGBT module, and the connecting parts are fixed to the positioning parts by screws.

4. The capacitor according to claim 3, wherein: The connecting portion is provided with a through hole for the screw to pass through, and the positioning portion is provided with a screw hole for the screw to be threadedly connected.

5. The capacitor according to claim 4, wherein: The connecting portion is provided with a positioning hole, and the positioning portion is provided with a positioning pin matching the positioning hole.

6. The capacitor according to claim 1, wherein: The opening of the cavity faces the side of the capacitor housing, two IGBT modules are respectively mounted on the upper and lower surfaces of the capacitor housing, the inlet is arranged on the upper surface of the capacitor housing, and the outlet is arranged on the lower surface of the capacitor housing.

7. The capacitor according to claim 1, wherein: The outer ends of the first lead-out electrode and the second lead-out electrode are respectively provided with a first connecting ear and a second connecting ear, and the first connecting ear and the second connecting ear are both U-shaped structures and are arranged in a stacked manner.

8. The capacitor according to claim 1, wherein: The main body shape of one of the first lead-out electrode and the second lead-out electrode matches the shape of the cooling cavity to form a U-shaped structure, and is arranged parallel to the cooling cavity and stacked on the outside of the other lead-out electrode.