Wafer film coating equipment

Abstract

The utility model discloses wafer laminating equipment, which comprises a base and an upper cover, a plurality of supporting rods are arranged in a mounting groove in the base, and a positioning disc is arranged in the middle of the upper end of each supporting rod above the mounting groove in the base. A first positioning ring and a second positioning ring are sequentially arranged at the position, located on the outer side of the positioning disc, of the upper end of the supporting rod in a sleeving mode, a trimming assembly is further movably arranged in the mounting groove in the base, and a lifting mechanism is further arranged between the trimming assembly and the base. The wafer edge trimming device is simple in structure and reasonable in design, achieves the effect of rapidly trimming the edge of a laminated wafer, simplifies the edge trimming process, improves the operation convenience and the edge trimming efficiency, is smooth in edge treatment and better in edge trimming quality, and simultaneously performs independent lifting control on each edge trimming disc, so that the production efficiency is improved. Therefore, the effect of driving the trimming discs with the corresponding sizes to trim according to the wafers with the different sizes is achieved, and the trimming quality and efficiency of the wafers are further guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer production equipment, in particular to a wafer coating device. Background Art

[0002] With the rapid development of semiconductor technology, wafers are the core components of integrated circuits, and every link in their manufacturing process is crucial. Wafer lamination is an important step to protect wafers and enhance their functionality. Its quality and efficiency directly affect the performance and market competitiveness of the final product. In the wafer lamination process, trimming technology plays a vital role. It not only removes excess film materials, but also ensures the flatness and smoothness of the wafer edge, thereby improving the overall quality of the product.

[0003] Deficiencies of existing technology:

[0004] The common wafer laminating equipment on the market usually uses a circular cutting method on the upper cover to trim the edges after lamination. Although this trimming method can guarantee the basic trimming function, it has many shortcomings in actual operation. First, the circular trimming of the cutter requires the operator to accurately control the movement trajectory and force of the cutter, and the operation process is complicated and time-consuming. Secondly, due to the physical cutting action of the cutter, it is easy to cause the cut edge of the film to be uneven, affecting the product performance and aesthetics. In addition, the cutter is prone to wear after long-term use and needs to be replaced regularly, which also increases the maintenance cost during actual use. Utility Model Content

[0005] The purpose of the utility model is to provide a wafer coating device to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer coating device, comprising a base and an upper cover, a plurality of support rods are arranged in the mounting groove inside the base, the upper ends of the support rods are located above the mounting groove inside the base, a positioning plate is arranged in the center, the upper ends of the support rods are located on the outer side of the positioning plate, and a first positioning ring and a second positioning ring are sequentially sleeved, a trimming assembly is also movably arranged in the mounting groove inside the base, and a lifting mechanism is also arranged between the trimming assembly and the base;

[0007] The trimming assembly comprises:

[0008] A first trimming plate, wherein the first trimming plate is movably disposed in a mounting groove inside the base, and an upper end of the first trimming plate is slidably connected to an outer ring wall of the second positioning ring;

[0009] A second trimming plate, wherein the second trimming plate is movably arranged above the first trimming plate, and an upper end of the second trimming plate is slidably connected to an inner ring wall of the second positioning ring and an outer ring wall of the first positioning ring respectively;

[0010] A third trimming disk, the third trimming disk is movably arranged above the second trimming disk, and the upper end of the third trimming disk is slidably connected to the inner ring wall of the first positioning ring and the outer wall of the positioning disk respectively;

[0011] The thermal fuses are respectively arranged at the upper ends of the first trimming disc, the second trimming disc and the third trimming disc for thermally melting and cutting the film.

[0012] Preferably, the lifting mechanism comprises:

[0013] A motor, wherein the motor is arranged at the lower end of the base;

[0014] A screw rod, the screw rod passes through the through holes on the first trimming disk, the second trimming disk and the third trimming disk and is movably arranged between the positioning disk and the base, and the lower end of the screw rod passes through the mounting hole at the lower end of the base and is connected to the output end of the motor;

[0015] A cavity, wherein the cavity is symmetrically arranged on both sides of the through hole on the first trimming disk, the second trimming disk and the third trimming disk;

[0016] A threaded block, the threaded block is movably arranged in the cavity, and one side of the threaded block is provided with a thread matching the screw rod;

[0017] The electromagnet is arranged on both sides of the cavity in the first trimming disk, the second trimming disk and the third trimming disk, and a permanent magnet matching the electromagnet is arranged in the threaded block.

[0018] Preferably, a plurality of buffer blocks are arranged on the inner sides of the first trimming disc, the second trimming disc and the third trimming disc.

[0019] Preferably, the first trimming disc, the second trimming disc and the third trimming disc are slidably connected to the support rod by providing sliding holes.

[0020] Preferably, the height of the first trimming disk is greater than that of the second trimming disk, and the height of the second trimming disk is greater than that of the third trimming disk.

[0021] Preferably, a sliding bar is provided on the outer wall of the threaded block, and the sliding bar is slidably connected to a sliding groove on the cavity wall.

[0022] Preferably, a mounting cover for mounting the motor is provided on the lower end surface of the base.

[0023] Compared with the prior art, the beneficial effects of the utility model are:

[0024] The wafer laminating device is provided with a trimming assembly, which includes a first trimming disc, a second trimming disc, a third trimming disc and a hot fuse, so as to achieve the effect of fast trimming of the wafer after lamination. Compared with the traditional trimming by cutting knife, the trimming process is simplified, the operation convenience and trimming efficiency are improved, and the trimming is smooth by hot melting, and the trimming quality is better. In addition, compared with the cutting knife, the hot fuse generally does not wear, has a longer service life and a lower maintenance cost.

[0025] The wafer coating device is provided with a lifting mechanism, which includes a motor, a lead screw, a cavity, a threaded block, an electromagnet and a permanent magnet. Each trimming disk is independently lifted and lowered, thereby achieving the effect of driving the trimming disks of corresponding sizes according to wafers of different sizes to perform trimming, further ensuring the trimming quality and efficiency of the wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is the overall front view of the utility model;

[0027] Figure 2 This is a top view of the base of the utility model;

[0028] Figure 3 It is a top view of the connection between the third trimming disc and the lifting mechanism of the utility model;

[0029] Figure 4 This is a schematic diagram of trimming with a first trimming disc of the utility model;

[0030] Figure 5 This is a schematic diagram of trimming with a second trimming disc of the utility model;

[0031] Figure 6 This is a schematic diagram of trimming of a third trimming disc of the utility model;

[0032] Figure 7 For the utility model Figure 1 An enlarged schematic diagram at A in FIG.

[0033] Figure 8 For the utility model Figure 1 The enlarged schematic diagram at B in FIG.

[0034] Fig. 9 For the utility model Figure 2 A magnified schematic diagram at C in FIG.

[0035] In the figure: 1. base; 2. upper cover; 3. support rod; 4. positioning plate; 5. first positioning ring; 6. second positioning ring; 7. trimming assembly; 701. first trimming plate; 702. second trimming plate; 703. third trimming plate; 704. thermal fuse; 8. lifting mechanism; 801. motor; 802. lead screw; 803. cavity; 804. threaded block; 8041. slide bar; 805. electromagnet; 806. permanent magnet; 9. buffer block; 10. mounting cover. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0037] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0038] In the description of this patent, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "setting" should be understood in a broad sense, for example, it can be fixed connection, setting, or detachable connection, setting, or integrated connection, setting. For ordinary technicians in this field, the specific meanings of the above terms in this patent can be understood according to specific circumstances.

[0039] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "several" is two or more, unless otherwise clearly and specifically defined. Example

[0040] See also Figure 1-9As shown, the utility model provides a technical solution for a wafer coating device: a wafer coating device, including a base 1 and an upper cover 2, a plurality of support rods 3 are installed in the mounting groove inside the base 1, the upper end of the support rod 3 is located above the mounting groove inside the base 1, and a positioning plate 4 is installed in the center for positioning a 6-inch wafer, the upper end of the support rod 3 is located on the outer side of the positioning plate 4, and a first positioning ring 5 and a second positioning ring 6 are sequentially sleeved thereon for positioning 8-inch and 12-inch wafers respectively, a trimming assembly 7 is also movably installed in the mounting groove inside the base 1, and a lifting mechanism 8 is also installed between the trimming assembly 7 and the base 1; the trimming assembly 7 includes a first trimming plate 701, a second trimming plate 702, a third trimming plate 703 and a hot fuse 704, the first trimming plate 701 is movably mounted It is movably installed in the mounting groove inside the base 1 for trimming 12-inch wafers, the upper end of the first trimming disk 701 is slidably connected to the outer ring wall of the second positioning ring 6, the second trimming disk 702 is movably installed above the first trimming disk 701 for trimming 8-inch wafers, the upper end of the second trimming disk 702 is slidably connected to the inner ring wall of the second positioning ring 6 and the outer ring wall of the first positioning ring 5, the third trimming disk 703 is movably installed above the second trimming disk 702 for trimming 6-inch wafers, the upper end of the third trimming disk 703 is slidably connected to the inner ring wall of the first positioning ring 5 and the outer wall of the positioning disk 4, the hot fuse 704 is respectively installed on the upper top of the first trimming disk 701, the second trimming disk 702 and the third trimming disk 703 for hot melting cutting film. When the wafer is coated, the external control system first energizes and heats the corresponding thermal fuse 704 on the trimming disk according to the size of the wafer, and then the external control system starts the lifting mechanism 8, and the trimming disk and the thermal fuse 704 above are driven to rise by the lifting mechanism 8 until they contact the film around the wafer to complete the trimming, and then the trimming disk and the thermal fuse 704 are driven by the lifting mechanism 8 to fall and reset. The trimming assembly 7 can achieve the effect of fast trimming of the wafer after the film is coated. Compared with the traditional trimming by cutting knife, the trimming process is simplified, the operation convenience and trimming efficiency are improved, and the trimming method of hot melting is adopted, the edge processing is smooth, and the trimming quality is better. In addition, compared with the cutting knife, the thermal fuse 704 generally does not wear, has a longer service life, and has a lower maintenance cost.

[0041] The lifting mechanism 8 includes a motor 801, a screw rod 802, a cavity 803, a threaded block 804 and an electromagnet 805. The motor 801 is installed at the lower end of the base 1. The screw rod 802 passes through the through holes on the first trimming disk 701, the second trimming disk 702 and the third trimming disk 703 and is movably installed between the positioning disk 4 and the base 1. The two ends of the screw rod 802 are rotatably connected to the positioning disk 4 and the base 1 respectively. The lower end of the screw rod 802 passes through the mounting hole at the lower end of the base 1 and is connected to the output end of the motor 801. Then, the cavity 803 is symmetrically opened on both sides of the through holes on the first trimming disk 701, the second trimming disk 702 and the third trimming disk 703, the threaded block 804 is slidably connected in the cavity 803, and one side of the threaded block 804 is opened with a thread matching the screw rod 802, the electromagnet 805 is installed in the first trimming disk 701, the second trimming disk 702 and the third trimming disk 703 on both sides of the cavity 803, and a permanent magnet 806 matching the electromagnet 805 is installed in the threaded block 804. After the laminating device is started, the external control system controls all the electromagnets 805 to be energized, generating attraction to the permanent magnets 806, so that all the threaded blocks 804 are located on the side of the cavity 803 away from the screw rod 802. When it is necessary to drive the trimming disk of the corresponding size and its thermal fuse 704 to rise, the external control system is first used to control the change of the current direction of the electromagnet 805 on the trimming disk. The electromagnet 805 will generate a repulsive force on the inner permanent magnet 806, so that the inner threaded block 804 moves toward the direction of the screw rod 802 and engages with the screw rod 802. Then the motor 801 is started, and the motor 801 drives the screw rod 802 to rotate. The screw rod 802 drives the trimming disk and the thermal fuse 704 to rise through the threaded block 804 to complete the wafer trimming. After the trimming is completed, the external control system controls the motor 801 to reverse the screw rod 802 to reset the trimming disk. Through the lifting mechanism 8, each trimming disk is independently lifted and controlled, so that the trimming disks of corresponding sizes are driven to perform trimming according to wafers of different sizes, further ensuring the trimming quality and efficiency of the wafers.

[0042] Several buffer blocks 9 are installed on the inner sides of the first trimming disc 701 , the second trimming disc 702 and the third trimming disc 703 . The buffer blocks 9 can keep a certain gap between the trimming discs to prevent friction and collision.

[0043] The first trimming disc 701, the second trimming disc 702 and the third trimming disc 703 are slidably connected to the support rod 3 by providing sliding holes, and the support rod 3 can also prevent the trimming discs from rotating.

[0044] The height of the first trimming disk 701 is greater than that of the second trimming disk 702, and the height of the second trimming disk 702 is greater than that of the third trimming disk 703. As each trimming disk rises, it drives the trimming disk above it to rise synchronously, such a height setting can ensure that the outermost trimming disk contacts the upper film first for trimming.

[0045] A slide bar 8041 is provided on the outer wall of the threaded block 804 , and the slide bar 8041 is slidably connected to a slide groove on the wall of the cavity 803 . The sliding connection between the slide bar 8041 and the slide groove can improve the stability of the threaded block 804 when moving.

[0046] A mounting cover 10 for mounting the motor 801 is mounted on the lower end surface of the base 1 . The mounting cover 10 can provide certain support for the motor 801 and also protect the motor 801 .

[0047] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A wafer coating device, comprising a base (1) and an upper cover (2), characterized in that: A plurality of support rods (3) are arranged in the mounting groove inside the base (1); the upper ends of the support rods (3) are located above the mounting groove inside the base (1) and a positioning plate (4) is arranged in the center; the upper ends of the support rods (3) are located outside the positioning plate (4) and are sequentially sleeved with a first positioning ring (5) and a second positioning ring (6); a trimming assembly (7) is also movably arranged in the mounting groove inside the base (1); and a lifting mechanism (8) is also arranged between the trimming assembly (7) and the base (1); The trimming assembly (7) comprises: a first trimming plate (701), the first trimming plate (701) being movably arranged in a mounting groove inside the base (1), the upper end of the first trimming plate (701) being slidably connected to the outer ring wall of the second positioning ring (6); a second trimming plate (702), the second trimming plate (702) being movably arranged above the first trimming plate (701), the upper end of the second trimming plate (702) being slidably connected to the inner ring wall of the second positioning ring (6) and the outer ring wall of the first positioning ring (5); a third trimming plate (703), the third trimming plate (703) being movably arranged above the second trimming plate (702), the upper end of the third trimming plate (703) being slidably connected to the inner ring wall of the first positioning ring (5) and the outer wall of the positioning plate (4); The hot fuse (704) is respectively arranged at the upper ends of the first trimming disc (701), the second trimming disc (702) and the third trimming disc (703) for hot-melt cutting of the film.

2. The wafer coating device according to claim 1, characterized in that: The lifting mechanism (8) comprises: A motor (801), wherein the motor (801) is arranged at the lower end of the base (1); a screw rod (802), the screw rod (802) passing through the through holes on the first trimming disc (701), the second trimming disc (702) and the third trimming disc (703), and being movably arranged between the positioning disc (4) and the base (1); the lower end of the screw rod (802) passing through the mounting hole at the lower end of the base (1) and being connected to the output end of the motor (801); A cavity (803), wherein the cavity (803) is symmetrically arranged on both sides of the through holes on the first trimming disk (701), the second trimming disk (702) and the third trimming disk (703); A threaded block (804), the threaded block (804) being movably disposed in the cavity (803), and a thread matching the screw rod (802) being formed on one side of the threaded block (804); An electromagnet (805) is arranged in the first trimming disk (701), the second trimming disk (702) and the third trimming disk (703) on both sides of the cavity (803), and a permanent magnet (806) matching the electromagnet (805) is arranged in the threaded block (804).

3. The wafer coating device according to claim 1, characterized in that: A plurality of buffer blocks (9) are arranged on the inner sides of the first trimming disc (701), the second trimming disc (702) and the third trimming disc (703).

4. The wafer coating device according to claim 1, characterized in that: The first trimming plate (701), the second trimming plate (702) and the third trimming plate (703) are slidably connected to the support rod (3) by providing sliding holes.

5. The wafer coating device according to claim 1, characterized in that: The height of the first trimming disk (701) is greater than that of the second trimming disk (702), and the height of the second trimming disk (702) is greater than that of the third trimming disk (703).

6. The wafer coating device according to claim 2, characterized in that: A sliding bar (8041) is provided on the outer wall of the threaded block (804), and the sliding bar (8041) is slidably connected to a sliding groove on the wall of the cavity (803).

7. The wafer coating device according to claim 2, characterized in that: A mounting cover (10) for mounting a motor (801) is provided on the lower end surface of the base (1).

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