Wafer cleaning device

Abstract

The utility model relates to the technical field of semiconductor processing, and discloses a wafer cleaning device which comprises a cleaning box, a filter screen is arranged in the cleaning box, fixing frames are fixedly installed on the two sides of the upper end of the cleaning box, cleaning mechanisms are arranged in the fixing frames, and each cleaning mechanism comprises a device cavity, a screw rod, a sleeve, a connecting rod, a cleaning frame, a supporting plate, a motor and a spray head. Meanwhile, a user can start spray heads to perform water spraying cleaning work, water is sprayed through multiple groups of spray heads to clean multiple groups of wafers on the surface of a filter screen, then the user can rotate a motor in the reverse direction, so that a sleeve on the surface of a screw rod moves rightwards to be aligned, and then the cleaning rack moves from left to right, so that the cleaning efficiency is improved. According to the wafer cleaning device, the filter screen is arranged, so that all wafers on the surface of the filter screen are slightly cleaned, dust on the surfaces of the wafers is removed, impurities on the surfaces of the wafers are filtered through the filter screen, the impurities on the surfaces of the wafers can fall off, and the cleaning effect of the device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a wafer cleaning device. Background Art

[0002] A wafer refers to the silicon chip used to make silicon semiconductor integrated circuits. Due to its round shape, it is called a wafer. Various circuit component structures can be processed on the silicon wafer to become IC products with specific electrical functions. The original material of the wafer is silicon, and there is an inexhaustible supply of silicon dioxide on the surface of the earth's crust.

[0003] Existing wafers are cleaned manually, or the wafers are placed directly in a cleaning cylinder, and then a filter is placed inside the cleaning cylinder to store the wafers, and then water is sprayed through a nozzle at the lower end of the cleaning rack to perform cleaning work.

[0004] However, the cleaning structure is less practical when in use. Since the position of the nozzle is fixed when cleaning inside the cleaning cylinder, the cleaning range is smaller, thereby reducing the practicality of the device. In view of this, we propose a wafer cleaning device. Utility Model Content

[0005] The purpose of the utility model is to provide a wafer cleaning device to solve the problems raised in the above background technology.

[0006] To achieve the above object, the utility model provides the following technical solution: a wafer cleaning device, comprising a cleaning box, a filter screen is arranged inside the cleaning box, a fixing frame is fixedly installed on both sides of the upper end of the cleaning box, and a cleaning mechanism is arranged inside the fixing frame, and the cleaning mechanism comprises:

[0007] The device cavity is opened inside the fixed frame, the inner wall of the device cavity is rotatably connected with a screw through a shaft sleeve, the surface of the screw is threadedly connected with a sleeve, one end of a connecting rod is fixedly installed on the side wall of the sleeve, the other end of the connecting rod is provided with a cleaning frame, and a support plate is fixedly installed on the side wall of the fixed frame;

[0008] The motor is fixedly mounted on the upper end of the support plate, the motor output shaft passes through the device cavity and is fixedly connected to the end of the screw, a plurality of groups of nozzles are arranged at the lower end of the cleaning frame, and a moving structure is arranged at the connecting rod.

[0009] Preferably, the movable structure includes a U-shaped frame fixedly mounted on the side wall of the connecting rod, the U-shaped frame is hinged to the side wall of the cleaning rack through a hinge, a fixed plate is fixedly mounted on the lower end of the U-shaped frame, a sliding groove is opened on the side wall of the fixed frame, a toothed plate is fixedly mounted on the inner wall of the sliding groove, one end of a rotating rod is rotatably connected to the side wall of the fixed plate, a rotating gear is fixedly mounted on the surface of the other end of the rotating rod, a reciprocating screw rod is fixedly mounted on the surface of the rotating rod, a moving cylinder is threadedly connected to the surface of the reciprocating screw rod, one end of an L-shaped rod is fixedly mounted on the lower end of the moving cylinder, and the other end of the L-shaped rod is connected to the side wall of the cleaning rack.

[0010] Preferably, a guide groove is formed on the side wall of the cleaning rack, one end of a guide rod is slidably connected to the inner wall of the guide groove, and the other end of the guide rod is fixedly connected to the end of the L-shaped rod.

[0011] Preferably, the rotating gear is meshed with the toothed plate, and the rotating rod on the surface of the rotating gear is driven to rotate by the rotation of the rotating gear.

[0012] Preferably, the moving trajectory of the moving cylinder is matched to the length of the guide groove.

[0013] Preferably, the upper side of the sleeve is slidably connected to the upper end of the inner wall of the device cavity.

[0014] Compared with the prior art, the utility model provides a wafer cleaning device with the following beneficial effects:

[0015] 1. The wafer cleaning device is equipped with a cleaning mechanism to facilitate the back and forth flushing and cleaning of the wafers inside the cleaning box. The user can start the motor to work, so that the output end of the motor drives the screw to rotate, so that the sleeve on the surface of the screw and the cleaning rack move from left to right, so as to lightly clean all the wafers on the surface of the filter and remove dust on the surface of the wafer.

[0016] 2. The wafer cleaning device increases the spraying range of multiple groups of nozzles by setting up a moving structure. The connecting rod is driven to move by the movement of the sleeve. At this time, the rotating rod at the lower end of the U-shaped frame also moves inside the slide groove. The rotating rod rotates on the surface of the toothed plate through the rotating gear on its surface, thereby rotating itself, and then drives the moving cylinder to move back and forth on the surface of the reciprocating screw, thereby driving the L-shaped rod to move back and forth, so that the cleaning frame and the nozzle spray left and right, thereby increasing the spraying range of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the three-dimensional structure of the device cavity of the utility model;

[0019] Figure 3This is a partial cross-sectional three-dimensional structural schematic diagram of the U-shaped frame of the utility model;

[0020] Figure 4 It is a partial cross-sectional three-dimensional structural schematic diagram of the guide groove of the utility model.

[0021] In the figure: 1. cleaning box; 2. filter screen; 3. cleaning mechanism; 4. moving structure; 5. fixed frame; 6. guide groove; 31. device cavity; 32. screw; 33. sleeve; 34. connecting rod; 35. cleaning frame; 36. support plate; 37. motor; 38. nozzle; 41. U-shaped frame; 42. fixed plate; 43. slide groove; 44. gear plate; 45. rotating rod; 46. rotating gear; 47. reciprocating screw; 48. moving cylinder; 49. L-shaped rod; 7. guide rod. DETAILED DESCRIPTION

[0022] like Figure 1-Figure 4 As shown, the utility model provides a technical solution: a wafer cleaning device, including a cleaning box 1, a filter screen 2 is arranged inside the cleaning box 1, a fixing frame 5 is fixedly installed on both sides of the upper end of the cleaning box 1, and a cleaning mechanism 3 is arranged inside the fixing frame 5, and the cleaning mechanism 3 includes a device cavity 31 opened inside the fixing frame 5, and the inner wall of the device cavity 31 is rotatably connected to a screw rod 32 through a shaft sleeve, and a sleeve 33 is threadedly connected to the surface of the screw 32, and one end of a connecting rod 34 is fixedly installed on the side wall of the sleeve 33, and a cleaning frame 35 is arranged at the other end of the connecting rod 34, and a cleaning frame 35 is fixedly installed on the side wall of the sleeve 33. A support plate 36 is fixedly installed on the side wall of the frame 5, and a motor 37 is fixedly installed on the upper end of the support plate 36. The output shaft of the motor 37 passes through the device cavity 31 and is fixedly connected to the end of the screw 32. A plurality of groups of nozzles 38 are arranged at the lower end of the cleaning frame 35, and a movable structure 4 is arranged at the connecting rod 34. A guide groove 6 is opened on the side wall of the cleaning frame 35, and one end of the guide rod 7 is slidably connected to the inner wall of the guide groove 6, and the other end of the guide rod 7 is fixedly connected to the end of the L-shaped rod 49. The rotating gear 46 is meshed with the tooth plate 44, and the upper side of the sleeve 33 is slidably connected to the upper end of the inner wall of the device cavity 31.

[0023] Specifically, the cleaning mechanism 3 of the technical solution of the utility model includes: a device chamber 31, a screw 32, a sleeve 33, a connecting rod 34, a cleaning frame 35, a support plate 36, a motor 37, and a nozzle 38.

[0024] In one embodiment of the present invention, a cleaning mechanism 3 is provided to facilitate flushing and cleaning of the wafers inside the cleaning box 1. The model of the motor 37 is HG-JR353BK. The motor 37 increases the power for the rotation of the screw 32. When cleaning, the user can place multiple groups of wafers evenly on the surface of the filter 2, and then the user can start the motor 37 to work, so that the output end of the motor 37 drives the screw 32 to rotate, so that the sleeve 33 on the surface of the screw 32 moves to the left, and the sleeve 33 moves to the left, thereby driving the connecting rod 34 of its side wall and the cleaning rack 35 to move to the left. At the same time, the user can start the nozzle 38 to spray water for cleaning. A water inlet is also provided on the front side of the cleaning rack 35 to facilitate the user to add water thereto. At this time, water is sprayed through multiple groups of nozzles 38 to clean multiple groups of wafers on the surface of the filter 2. Then the user controls the output end of the motor 37 to reverse, so that the sleeve 33 on the surface of the screw 32 moves to the right and returns to normal. Then, the cleaning rack 35 moves from left to right, so that all the wafers on the surface of the filter 2 are lightly cleaned to remove dust on the surface of the wafers. Impurities on the surface of the wafers are filtered through the filter 2, so that impurities on the surface of the wafers can fall off, thereby improving the cleaning effect of the device. The spray cleaning effect of the device is improved by providing multiple groups of nozzles 38.

[0025] Please continue reading Figure 1-Figure 4, the mobile structure 4 includes a U-shaped frame 41 fixedly mounted on the side wall of the connecting rod 34, the U-shaped frame 41 is hinged to the side wall of the cleaning frame 35 through a hinge, a fixed plate 42 is fixedly mounted on the lower end of the U-shaped frame 41, a slide groove 43 is opened on the side wall of the fixed frame 5, a toothed plate 44 is fixedly mounted on the inner wall of the slide groove 43, one end of a rotating rod 45 is rotatably connected to the side wall of the fixed plate 42, a rotating gear 46 is fixedly mounted on the surface of the other end of the rotating rod 45, a reciprocating screw rod 47 is fixedly mounted on the surface of the rotating rod 45, a moving cylinder 48 is threadedly connected to the surface of the reciprocating screw rod 47, one end of an L-shaped rod 49 is fixedly mounted on the lower end of the moving cylinder 48, and the other end of the L-shaped rod 49 is connected to the side wall of the cleaning frame 35, the moving trajectory of the moving cylinder 48 is adapted to the length of the guide groove 6, and the spraying range of multiple groups of nozzles 38 is improved by setting the mobile structure 4, by fixing the U-shaped frame 41 on the side wall of the connecting rod 34, A hinge is provided inside the U-shaped frame 41 and is hinged to the side wall of the cleaning frame 35, so that the cleaning frame 35 can move left and right, and the sleeve 33 is moved to drive the connecting rod 34 to move. At this time, the connecting rod 34 drives the U-shaped frame 41 to move, and the movement of the U-shaped frame 41 drives the fixed plate 42 at its lower end to move, and the movement of the fixed plate 42 drives the rotating rod 45 of its side wall to move. At this time, the rotating rod 45 rotates on the surface of the toothed plate 44 through the rotating gear 46 on its surface, and the rotating gear 46 drives the rotating rod 45 inside to rotate. The rotation of the rotating rod 45 drives the reciprocating screw 47 on its surface to rotate, and when the reciprocating screw 47 rotates, it drives the L-shaped rod 49 on its side wall to move back and forth. The back and forth movement of the L-shaped rod 49 makes the cleaning frame 35 and the nozzle 38 swing left and right to spray, thereby improving the spraying range of the device.

[0026] During operation, the user can place multiple groups of wafers evenly on the surface of the filter screen 2, and then the user can start the motor 37 to work, so that the output end of the motor 37 drives the screw 32 to rotate, so that the sleeve 33 on the surface of the screw 32 moves to the left, and the sleeve 33 moves to the left, thereby driving the connecting rod 34 and the cleaning rack 35 of its side wall to move to the left. At the same time, the user can start the nozzle 38 to spray water for cleaning, and then the user controls the motor 37 to reverse, so that the sleeve 33 on the surface of the screw 32 moves to the right and returns to normal, and then through the movement of the cleaning rack 35 from left to right, all the wafers on the surface of the filter screen 2 are lightly cleaned to remove dust on the surface of the wafers, and the filter screen 2 is used to clean the wafers. Impurities on the surface of the wafer are filtered, and at this time the connecting rod 34 drives the U-shaped frame 41 to move, and the movement of the U-shaped frame 41 drives the fixed plate 42 at its lower end to move, and the movement of the fixed plate 42 drives the rotating rod 45 on the side wall to move, and at this time the rotating rod 45 rotates on the surface of the toothed plate 44 through the rotating gear 46 on its surface, and the rotation of the rotating gear 46 drives the rotating rod 45 inside to rotate, and the rotation of the rotating rod 45 drives the reciprocating screw 47 on its surface to rotate, and when the reciprocating screw 47 rotates, it drives the L-shaped rod 49 on the side wall to move back and forth, and the back and forth movement of the L-shaped rod 49 makes the cleaning frame 35 and the nozzle 38 swing left and right to spray, thereby further improving the cleaning effect of the device.

[0027] The above generally describes the present invention in detail, but it is obvious to a person skilled in the art that some modifications or improvements can be made to the present invention. Therefore, modifications or improvements that do not deviate from the spirit of the present invention are within the scope of protection of the present invention.

Claims

1. A wafer cleaning device, comprising a cleaning box (1), wherein a filter screen (2) is arranged inside the cleaning box (1), characterized in that: A fixing frame (5) is fixedly mounted on both sides of the upper end of the cleaning box (1), and a cleaning mechanism (3) is arranged inside the fixing frame (5). The cleaning mechanism (3) comprises: A device cavity (31), the device cavity (31) is opened inside the fixed frame (5), the inner wall of the device cavity (31) is rotatably connected to a screw rod (32) through a shaft sleeve, the surface of the screw rod (32) is threadedly connected to a sleeve (33), one end of a connecting rod (34) is fixedly installed on the side wall of the sleeve (33), the other end of the connecting rod (34) is provided with a cleaning frame (35), and a support plate (36) is fixedly installed on the side wall of the fixed frame (5); A motor (37) is fixedly mounted on the upper end of the support plate (36); an output shaft of the motor (37) passes through the device cavity (31) and is fixedly connected to the end of the screw rod (32); a plurality of groups of nozzles (38) are arranged at the lower end of the cleaning frame (35); and a moving structure (4) is arranged at the connecting rod (34).

2. A wafer cleaning device according to claim 1, characterized in that: The movable structure (4) comprises a U-shaped frame (41) fixedly mounted on the side wall of the connecting rod (34); the interior of the U-shaped frame (41) is hingedly connected to the side wall of the cleaning frame (35) through a hinge; a fixed plate (42) is fixedly mounted on the lower end of the U-shaped frame (41); a sliding groove (43) is provided on the side wall of the fixed frame (5); a toothed plate (44) is fixedly mounted on the inner wall of the sliding groove (43); one end of a rotating rod (45) is rotatably connected to the side wall of the fixed plate (42); a rotating gear (46) is fixedly mounted on the surface of the other end of the rotating rod (45); a reciprocating screw rod (47) is fixedly mounted on the surface of the rotating rod (45); a movable cylinder (48) is threadedly connected to the surface of the reciprocating screw rod (47); one end of an L-shaped rod (49) is fixedly mounted on the lower end of the movable cylinder (48); the other end of the L-shaped rod (49) is connected to the side wall of the cleaning frame (35).

3. A wafer cleaning device according to claim 2, characterized in that: The side wall of the cleaning rack (35) is provided with a guide groove (6), the inner wall of the guide groove (6) is slidably connected to one end of a guide rod (7), and the other end of the guide rod (7) is fixedly connected to the end of the L-shaped rod (49).

4. A wafer cleaning device according to claim 2, characterized in that: The rotating gear (46) is meshed with the toothed plate (44).

5. The wafer cleaning device according to claim 2, characterized in that: The moving track of the moving cylinder (48) is matched to the length of the guide groove (6).

6. The wafer cleaning device according to claim 1, characterized in that: The upper side of the sleeve (33) is slidably connected to the upper end of the inner wall of the device cavity (31).

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