Wafer cleaning device

Abstract

The utility model discloses a wafer cleaning device, comprising a cleaning chamber, a plurality of wafer clamping grooves, a plurality of automatic scrubbing components and a plurality of spray components; the wafer clamping grooves are arranged at the bottom of the cleaning chamber; an automatic scrubbing component and a spray component are arranged above each wafer clamping groove; a plurality of air ducts and spray pipes are arranged on the inner wall of the cleaning chamber; a drain valve is arranged at the bottom of the cleaning chamber; a plurality of guide wheels are arranged inside the wafer clamping grooves; the spraying component injects cleaning liquid into the cleaning chamber to perform a water bath on the wafer; the wafer clamping grooves are used to fix the wafers, and the guide wheels are used to drive the wafers to rotate; the automatic scrubbing component scrubs the wafers with the assistance of the wafer clamping grooves; after scrubbing, the air ducts air dry the wafers. The cleaning device can perform a water bath, scrub and dry batches of wafers at the same time.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a wafer cleaning device. Background Art

[0002] Wafers are important products in the chip production process. After being produced, they undergo a series of quality inspections and then use cutting-edge processes such as photolithography and etching to manufacture batches of chip products on the round surface of the wafer. Finally, they are cut and tested as finished products.

[0003] Therefore, before manufacturing chips, the cleanliness of the wafer surface is required to be very high, which requires automated devices to replace manual cleaning. The wafer cleaning work mainly includes water bath, brushing and drying. Currently, the wafer cleaning devices on the market are incomplete, semi-automatic, or cannot meet the needs of cleaning batches of wafers at the same time. Utility Model Content

[0004] In view of the above-mentioned deficiencies of current wafer cleaning equipment, the utility model provides a wafer cleaning device capable of performing water bathing, scrubbing and drying on wafers in batches.

[0005] In order to achieve the above-mentioned purpose, the embodiment of the utility model adopts the following technical scheme:

[0006] A wafer cleaning device comprises a cleaning chamber, a plurality of wafer clamping grooves, a plurality of automatic brushing assemblies and a plurality of spraying assemblies; the wafer clamping grooves are arranged at the bottom of the cleaning chamber; an automatic brushing assembly and a spraying assembly are arranged above each of the wafer clamping grooves; a plurality of air ducts and a plurality of spraying pipes are arranged on the inner wall of the cleaning chamber; a drain valve is arranged at the bottom of the cleaning chamber; a plurality of guide wheels are arranged inside the wafer clamping grooves; when in use, the wafer is placed on the guide wheel, and the spraying assembly injects cleaning liquid into the cleaning chamber for water bathing; the wafer rotates under the drive of the guide wheel, and the automatic brushing assembly brushes the wafer; after brushing, the air duct dries the wafer.

[0007] According to one aspect of the utility model, the automatic scrubbing assembly is composed of a connecting rod and a rotating brush head; one end of the connecting rod is connected to the wall of the cleaning cabin, and the other end is connected to the rotating brush head.

[0008] The spray assembly includes a spray pipe and nozzles evenly distributed on the spray pipe. Each group of spray assemblies includes two spray pipes. The spray pipes are located on both sides of the wafer. Both ends of the spray pipes are fixedly connected to the wall of the cleaning cabin.

[0009] According to one aspect of the utility model, the air duct is arranged obliquely downward, and the angle between the air duct and the horizontal plane is between 25° and 45°.

[0010] According to one aspect of the utility model, air ducts are arranged on the four walls of the cleaning cabin.

[0011] According to one aspect of the utility model, the wafer clamping groove is installed in the cleaning chamber through a base, and guard strips are arranged on both sides thereof.

[0012] According to one aspect of the utility model, the rotating brush heads are cylindrical and arranged in pairs; the wafer clamping groove is arranged between the two rotating brush heads.

[0013] According to one aspect of the utility model, the outer surface of the cleaning cabin is provided with operating buttons, indicator lights and an electronic display screen.

[0014] Advantages of the utility model:

[0015] The device is provided with a cleaning cabin, an automatic scrubbing assembly, an air duct and a spray pipe, which can simplify the cleaning steps of the wafers and complete the automated operations of water bath, scrubbing and drying in the same device; batches of wafers can be cleaned simultaneously; the device has a simple structure, adopts a modular design, is easy to operate, and can be combined into devices of corresponding specifications according to actual needs, making it more flexible to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 This is a schematic structural diagram of a wafer cleaning device according to the utility model;

[0018] Figure 2 It is a schematic diagram of the structure of the wafer clamping groove and the automatic scrubbing assembly in the embodiment of the utility model;

[0019] Figure 3 This is a top view of the wafer clamping groove described in an embodiment of the utility model.

[0020] Legend: 1. Cleaning cabin; 11. Air duct; 12. Drain valve; 13. Start switch; 14. Electronic display screen; 15. Indicator light; 2. Wafer clamping slot; 21. Guide wheel; 22. Base; 23. Guard strip; 3. Automatic brushing assembly; 31. Connecting rod; 33. Rotating brush head; 4. Spray pipe; 41. Nozzle. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] like Figure 1 , Figure 2 , Figure 3 As shown, a wafer cleaning device comprises a cleaning chamber 1, a plurality of wafer clamping grooves 2, a plurality of automatic brushing components 3 and a plurality of spraying components; the wafer clamping grooves 2 are arranged at the bottom of the cleaning chamber 1; an automatic brushing component 3 and a spraying component are arranged above each of the wafer clamping grooves 2; a plurality of air ducts 11 and a plurality of spraying pipes 4 are arranged on the inner wall of the cleaning chamber 1; a drain valve 12 is arranged at the bottom of the cleaning chamber 1; a plurality of guide wheels 21 are arranged inside the wafer clamping grooves 2; the spraying components inject cleaning liquid into the cleaning chamber 1 to spray and bathe the wafers; the wafer clamping grooves 2 are used to fix the wafers, and the guide wheels 21 are used to drive the wafers to rotate; the automatic brushing components 3 brush the wafers with the assistance of the wafer clamping grooves 2; after brushing, the air ducts 11 air-dry the wafers.

[0023] The wafer clamping groove 2 is installed in the cleaning chamber 1 through a base 22 at the bottom. The cleaning chamber 1 of appropriate size can be matched according to design requirements and a corresponding number of wafer clamping grooves 2 can be installed; protective strips 23 are arranged on both sides of the wafer clamping groove 2 to protect the wafer; the wafer clamping groove 2 fits the arc of the wafer, and a number of guide wheels 21 made of rubber are arranged inside along the direction of the arc. The surface of the guide wheel 21 has convex teeth, which can effectively drive the wafer to rotate when rotating.

[0024] The automatic brushing assembly 3 consists of a connecting rod 31 and a rotating brush head 33; one end of the connecting rod 31 is connected to the wall of the cleaning cabin, and the other end is connected to the rotating brush head 33; the rotating brush head 33 is cylindrical and arranged in pairs; the wafer clamping groove 2 is arranged between the two rotating brush heads 33; when placing the wafer and before brushing begins, the connecting rod 31 can move up and down to drive the rotating brush head 33 to rise. During brushing, the rotating brush head 33 is lowered to clamp the wafer between the two rotating brush heads 33. Driven by the guide wheel 21 in the wafer clamping groove 2, the wafer rotates, and the brush head can clean the entire surface of the wafer.

[0025] The spray assembly includes a spray pipe 4 and nozzles 41 evenly distributed on the spray pipe 4. Each group of spray assemblies includes two spray pipes 4, and each wafer is provided with a group of spray assemblies. The spray pipes 4 are provided on both sides of the upper side of the wafer, and both ends of the spray pipes 4 are fixedly connected to the wall of the cleaning chamber. During scrubbing, the cleaning liquid is sprayed onto the surface of the wafer through the spray assembly, and the two sides of the wafer are scrubbed through the automatic scrubbing assembly.

[0026] To ensure the air-drying efficiency, air ducts 11 are provided on all four walls of the cleaning cabin 1. The air ducts 11 are provided at a higher position of the inner wall and the openings are provided obliquely downward. The angle between the air ducts 11 and the horizontal plane is between 25° and 45°. The air ducts 11 blowing air obliquely downward helps to promote the flow of water and accelerate the air-drying process during the water bath. In actual applications, the typical value of the angle is 30°, which can achieve a better balance between the water flow promotion effect and the air-drying effect.

[0027] A transparent sealing cover is arranged above the cleaning chamber 1, which can provide protection and facilitate observation of the internal conditions. Furthermore, operation buttons, indicator lights 15 and an electronic display screen 14 are arranged on the outer surface of the cleaning chamber 1.

[0028] The following is a usage procedure of the device: place a number of wafers on the corresponding wafer clamping slots 2; inject cleaning liquid (a mixture of water and special cleaning agent) into the cleaning chamber 1 through the spray assembly; exhaust air from the air duct 11 to drive the water flow; the guide wheel 21 in the wafer clamping slot 2 drives the wafer to rotate slowly to ensure that every part of the wafer is immersed in the cleaning liquid; after a period of time, open the drain valve 12 to discharge the cleaning liquid; rotate the brush head 33 to clean and scrub the surface of the wafer; exhaust air from the air duct 11 to dry the surface of the wafer.

[0029] Advantages of the utility model:

[0030] The device is provided with a cleaning cabin, an automatic scrubbing assembly, an air duct and a spray assembly, which can simplify the cleaning steps of the wafers and complete the automated operations of water bath, scrubbing and drying in the same device; batches of wafers can be cleaned simultaneously; the device has a simple structure, adopts a modular design, is easy to operate, and can be combined into devices of corresponding specifications according to actual needs, making it more flexible to use.

[0031] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that can be easily thought of by any technician familiar with the technical field within the technical scope disclosed in the utility model should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model shall be based on the protection scope of the claims.

Claims

1. A wafer cleaning device, characterized in that: The invention comprises a cleaning chamber (1), a plurality of wafer clamping grooves (2), a plurality of automatic brushing components (3) and a plurality of spraying components; the wafer clamping grooves (2) are arranged at the bottom of the cleaning chamber (1); an automatic brushing component (3) and a spraying component are arranged above each of the wafer clamping grooves (2); a plurality of air ducts (11) and a plurality of spraying pipes (4) are arranged on the inner wall of the cleaning chamber (1); a drain valve (12) is arranged at the bottom of the cleaning chamber (1); a plurality of guide wheels (21) are arranged inside the wafer clamping grooves (2); when in use, the wafer is placed on the guide wheel (21), and the spraying component injects cleaning liquid into the cleaning chamber (1) for water bathing; the wafer rotates under the drive of the guide wheel (21), and the automatic brushing component (3) brushes the wafer; after brushing, the air duct (11) air-dries the wafer.

2. The wafer cleaning device according to claim 1, characterized in that: The automatic scrubbing assembly (3) is composed of a connecting rod (31) and a rotating brush head (33); one end of the connecting rod (31) is connected to the wall of the cleaning cabin, and the other end is connected to the rotating brush head (33).

3. The wafer cleaning device according to claim 1, characterized in that: The spray assembly comprises a spray pipe (4) and nozzles (41) evenly distributed on the spray pipe (4); each group of spray assemblies comprises two spray pipes (4); the spray pipes (4) are located on both sides of a wafer; and both ends of the spray pipes (4) are fixedly connected to the wall of the cleaning cabin.

4. The wafer cleaning device according to claim 1, characterized in that: The air duct (11) is arranged obliquely downward, and the angle between it and the horizontal plane is between 25° and 45°.

5. The wafer cleaning device according to claim 1, characterized in that: Air ducts (11) are arranged on the four inner walls of the cleaning cabin (1).

6. The wafer cleaning device according to claim 1, characterized in that: The bottom of the wafer clamping groove (2) is installed in the cleaning chamber (1) via a base (22), and guard strips (23) are arranged on both sides thereof.

7. The wafer cleaning device according to claim 2, characterized in that: The rotating brush heads (33) are cylindrical and arranged in pairs; the wafer clamping groove (2) is arranged between the two rotating brush heads (33).

8. The wafer cleaning device according to claim 1, characterized in that: The outer surface of the cleaning cabin (1) is provided with operating buttons, indicator lights (15) and an electronic display screen (14).

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