Electrostatic chuck film pasting device for semiconductor

Abstract

The utility model discloses an electrostatic chuck film pasting device for a semiconductor, which comprises a main mounting assembly, a transverse movement control module is arranged on the main mounting assembly, a lifting assembly is arranged at the output end of the transverse movement control module, a working object platform is arranged at the output end of the lifting assembly, and a working object electrostatic chuck is arranged on the working object platform. An auxiliary supporting assembly is arranged on the upper side portion of the main installation assembly, a pre-film-pasting assembly is arranged on the auxiliary supporting assembly, a hot-pressing wheel re-pressing assembly is arranged in the middle of the main installation assembly, an operation control assembly is arranged on the portion, located on one side of the hot-pressing wheel re-pressing assembly, of the main installation assembly, and a rotary cutter module is arranged on the auxiliary supporting assembly. According to the technical scheme, the film pasting device is ingenious in structural design, high in practicability and stable in work and operation, by means of the film pasting device, film pasting operation can be conducted on wafers of different sizes, pre-pasting and re-pressing operation are achieved, the film pasting efficiency is effectively improved, and the film pasting cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of electrostatic chuck film sticking, in particular to an electrostatic chuck film sticking device for semiconductors. Background Art

[0002] In the process of conductor production, wafer grinding, cutting, testing and other steps, due to the thin thickness of the wafer (70-200μm), it is not convenient to fix the wafer, so a blue film is needed as a carrier to hold the wafer. This process involves the process of attaching the wafer to the blue film. In the ordinary film attaching process, bubbles will remain between the blue film and the wafer. The presence of bubbles affects the height of the wafer, which will cause cracks, inaccurate testing, chip falling and other problems in subsequent grinding, testing, cutting, etc.

[0003] At present, the shapes of workpieces in the semiconductor industry are becoming more and more diverse. When the film is applied to the surface of semiconductor workpieces, if some workpieces with special shapes are encountered and the original conventional machines cannot meet their process requirements, it is necessary to develop a special device for pin electrostatic chuck film application.

[0004] The existing film pasting equipment is mainly used for pasting films on some workpieces with regular shapes and thin thickness. It is not suitable for pasting films on some workpieces with complex shapes and thick thickness. In addition, the existing film pasting devices have low film pasting efficiency and high cost. Therefore, it is necessary to develop an electrostatic chuck film pasting device for semiconductors. Utility Model Content

[0005] The utility model aims to solve the above problems and designs an electrostatic chuck film sticking device for semiconductors.

[0006] To achieve the above-mentioned purpose, the technical solution of the utility model is: a semiconductor electrostatic chuck film laminating device, comprising a main mounting assembly, a lateral movement control module is arranged on the main mounting assembly, a lifting assembly is arranged at the output end of the lateral movement control module, a workpiece platform is arranged at the output end of the lifting assembly, a workpiece electrostatic chuck is arranged on the workpiece platform, an auxiliary support assembly is arranged on the main mounting assembly, a pre-film laminating assembly is arranged on the auxiliary support assembly, a hot pressure wheel re-pressing assembly is arranged in the middle position of the main mounting assembly, a manipulation control assembly is arranged on the main mounting assembly at one side of the hot pressure wheel re-pressing assembly, and a rotary cutter module is arranged on the auxiliary support assembly.

[0007] As a further description of the technical solution, the main installation component includes a main installation frame, a lateral movement control module is arranged on the main installation frame, a mounting plate is arranged on the top of the main installation frame, and an auxiliary support component is arranged on the mounting plate.

[0008] As a further description of the technical solution, an auxiliary groove is provided on the mounting plate, and a lateral movement control module is arranged in the auxiliary groove.

[0009] As a further description of the technical solution, the auxiliary support assembly includes an auxiliary support vertical plate arranged on the mounting plate, and the auxiliary support vertical plate is provided with a pre-film lamination assembly.

[0010] As a further description of the technical solution, the pre-film laminating assembly includes a dry film wheel and a PE film wheel arranged on an auxiliary support assembly, the dry film wheel is provided with a dry film, and the PE film wheel is provided with a PE film.

[0011] As a further description of the technical solution, a plurality of film winding wheels are arranged on the auxiliary support assembly below the dry film wheel and the PE film wheel, and a waste recovery film wheel is arranged on the auxiliary support assembly above one of the film winding wheels.

[0012] As a further description of the technical solution, the hot pressing wheel re-pressing assembly includes a lifting control module arranged in the middle position of the main installation assembly, and a hot pressing wheel is arranged at the output end of the lifting control module.

[0013] As a further description of the technical solution, the manipulation control assembly includes an operation control box body arranged on the main installation assembly at one side of the hot pressing wheel re-pressing assembly, and the operation control box body is provided with a plurality of operation buttons.

[0014] As a further description of the technical solution, a plurality of balancing adjustment feet are arranged at the bottom of the main mounting assembly.

[0015] The beneficial effect is that the film pasting device of the technical solution has an ingenious structural design, strong practicality, and stable operation. By using this film pasting device, film pasting operations can be performed on wafers of different sizes. The technical solution realizes pre-lamination and re-pressing operations, effectively improves the film pasting efficiency, and reduces the film pasting cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is a schematic diagram of the installation structure of the hot pressing wheel re-pressing assembly of the utility model.

[0018] In the figure, 1. main installation component; 2. lifting component; 3. workpiece platform; 4. workpiece electrostatic chuck; 5. auxiliary support component; 6. pre-film laminating component; 7. hot pressing wheel re-pressing component; 8. operation control component; 9. rotary cutter module; 10. main installation frame; 11. mounting plate; 12. auxiliary slot; 13. auxiliary support vertical plate; 14. dry film wheel; 15. PE film wheel; 16. film winding wheel; 17. waste material recovery film wheel; 18. lifting control module; 19. hot pressing wheel; 20. operation control box; 21. operation button; 22. balance adjustment foot. DETAILED DESCRIPTION

[0019] First of all, the design intention of the utility model is explained. The existing film pasting equipment is mainly used for pasting films on some workpieces with regular shapes and thin thickness. It is not suitable for pasting films on some workpieces with complex shapes and thick thickness. In addition, the existing film pasting devices have low film pasting efficiency and high cost. Therefore, the utility model designs an electrostatic chuck film pasting device for semiconductors.

[0020] The utility model is described in detail below in conjunction with the accompanying drawings. Figure 1-Figure 2 As shown, an electrostatic chuck film sticking device for semiconductors includes a main mounting component 1. The main mounting component 1 will be described in detail below. The main mounting component 1 includes a main mounting frame 10, and a lateral movement control module is arranged on the main mounting frame 10. A mounting plate 11 is arranged on the top of the main mounting frame 10, and an auxiliary support component 5 is arranged on the mounting plate 11.

[0021] An auxiliary groove 12 is formed on the mounting plate 11 , and a lateral movement control module is disposed in the auxiliary groove 12 .

[0022] In order to facilitate the control of the lateral movement of the workpiece platform 3, a lateral movement control module is arranged on the main installation component 1. In order to facilitate the control of the lifting and lowering of the workpiece platform 3, a lifting component 2 is arranged at the output end of the lateral movement control module, and a workpiece platform 3 is arranged at the output end of the lifting component 2. A workpiece electrostatic chuck 4 is arranged on the workpiece platform 3.

[0023] In order to facilitate the installation of the pre-film laminating component 6, an auxiliary support component 5 is arranged on the main installation component 1. The auxiliary support component 5 will be described in detail below. The auxiliary support component 5 includes an auxiliary support vertical plate 13 arranged on the installation flat plate 11, and the pre-film laminating component 6 is arranged on the auxiliary support vertical plate 13.

[0024] In order to facilitate the pre-film laminating operation on the wafer on the workpiece platform 3, a pre-film laminating component 6 is arranged on the auxiliary support component 5. The pre-film laminating component 6 will be described in detail below. The pre-film laminating component 6 includes a dry film wheel 14 and a PE film wheel 15 arranged on the auxiliary support component 5. The dry film wheel 14 is provided with a dry film, and the PE film wheel 15 is provided with a PE film.

[0025] A plurality of film winding wheels 16 are arranged below the dry film wheel 14 and the PE film wheel 15 on the auxiliary support assembly 5 , and a waste film recovery wheel 17 is arranged above one of the film winding wheels 16 on the auxiliary support assembly 5 .

[0026] In order to facilitate cutting of the dry film and the PE film, a rotary cutter module 9 is provided on the auxiliary support assembly 5 .

[0027] In order to facilitate the re-pressing of the film attached to the wafer, a hot pressing wheel re-pressing assembly 7 is arranged in the middle position on the main mounting assembly 1. The hot pressing wheel re-pressing assembly 7 will be described in detail below. The hot pressing wheel re-pressing assembly 7 includes a lifting control module 18 arranged in the middle position on the main mounting assembly 1, and a hot pressing wheel 19 is arranged at the output end of the lifting control module 18.

[0028] In order to facilitate the control of this state, a manipulation control component 8 is arranged on the main installation component 1 at one side of the hot pressure wheel re-pressing component 7. The manipulation control component 8 will be described in detail below. The manipulation control component 8 includes an operation control box 20 arranged on the main installation component 1 at one side of the hot pressure wheel re-pressing component 7, and a plurality of operation buttons 21 are arranged on the operation control box 20.

[0029] In order to ensure the stability of the device during operation, a plurality of balancing adjustment feet 22 are provided at the bottom of the main mounting assembly 1 .

[0030] The above describes the specific structure of the utility model in detail. The following describes the working principle of the utility model: the wafer is placed on the workpiece electrostatic chuck 4, the workpiece electrostatic chuck 4 is placed on the workpiece platform 3, the workpiece platform 3 is driven to move to the bottom of the pre-filming component 6 by the lateral movement control module, and then the lifting component 2 drives the workpiece platform 3 to rise, so that the wafer on the workpiece electrostatic chuck 4 contacts the film on the film winding wheel 16, and the lateral movement control module drives the workpiece platform 3 to continue to move toward the rotary cutter module 9, so that the dry film on the film winding wheel 16 and the film winding wheel 16 are in contact. The workpiece is pre-laminated. After lamination is completed, the rotary cutter module 9 cuts the dry film. After cutting, the lateral movement control module drives the workpiece platform 3 to move to the bottom of the hot pressing wheel 19 re-pressing assembly 7. The lifting control module 18 controls the hot pressing wheel 19 to descend and contact the workpiece, and heats and pressurizes the previously pasted film to improve the bonding force between the dry film and the electrostatic chuck, thereby improving the yield. Finally, the lateral movement control module drives the workpiece platform 3 to move to the starting position, the workflow ends, and the workpiece with the dry film is taken out. During normal production, the above steps are repeated. The film laminating device of this technical solution has a clever structural design, strong practicality, and stable operation. Using this film laminating device, wafers of different sizes can be laminating. This technical solution realizes pre-lamination and re-pressing operations, effectively improves the film laminating efficiency, and reduces the film laminating cost.

[0031] The above technical solutions only reflect the preferred technical solutions of the technical solutions of the utility model. Some changes that may be made to certain parts thereof by technicians in this technical field all reflect the principles of the utility model and fall within the protection scope of the utility model.

Claims

1. An electrostatic chuck film laminating device for semiconductor, characterized in that: The invention comprises a main mounting component (1), wherein a lateral movement control module is arranged on the main mounting component (1), a lifting component (2) is arranged at the output end of the lateral movement control module, a workpiece platform (3) is arranged at the output end of the lifting component (2), a workpiece electrostatic chuck (4) is arranged on the workpiece platform (3), an auxiliary support component (5) is arranged on the main mounting component (1), a pre-film laminating component (6) is arranged on the auxiliary support component (5), a hot pressing wheel re-pressing component (7) is arranged at the middle position of the main mounting component (1), a manipulation control component (8) is arranged on the main mounting component (1) at one side of the hot pressing wheel re-pressing component (7), and a rotary cutter module (9) is arranged on the auxiliary support component (5).

2. The semiconductor electrostatic chuck film laminating device according to claim 1, characterized in that: The main installation component (1) comprises a main installation frame (10), a lateral movement control module is arranged on the main installation frame (10), a mounting plate (11) is arranged on the top of the main installation frame (10), and an auxiliary support component (5) is arranged on the mounting plate (11).

3. The semiconductor electrostatic chuck film laminating device according to claim 2, characterized in that: An auxiliary groove (12) is provided on the mounting plate (11), and a lateral movement control module is arranged in the auxiliary groove (12).

4. The semiconductor electrostatic chuck film laminating device according to claim 2, characterized in that: The auxiliary support assembly (5) comprises an auxiliary support upright plate (13) arranged on the mounting plate (11), and a pre-film laminating assembly (6) is arranged on the auxiliary support upright plate (13).

5. The semiconductor electrostatic chuck film laminating device according to claim 1, characterized in that: The pre-film laminating component (6) comprises a dry film wheel (14) and a PE film wheel (15) which are arranged on the auxiliary support component (5); the dry film wheel (14) is provided with a dry film, and the PE film wheel (15) is provided with a PE film.

6. The semiconductor electrostatic chuck film laminating device according to claim 5, characterized in that: The auxiliary support assembly (5) is provided with a plurality of film winding wheels (16) below the dry film wheel (14) and the PE film wheel (15), and the auxiliary support assembly (5) is provided with a waste material recovery film wheel (17) above one of the film winding wheels (16).

7. The semiconductor electrostatic chuck film laminating device according to claim 1, characterized in that: The hot pressing wheel re-pressing assembly (7) comprises a lifting control module (18) arranged at the middle position of the main installation assembly (1), and a hot pressing wheel (19) is arranged at the output end of the lifting control module (18).

8. The semiconductor electrostatic chuck film laminating device according to claim 1, characterized in that: The manipulation control assembly (8) comprises an operation control box (20) arranged on the main installation assembly (1) at one side of the hot pressing wheel re-pressing assembly (7), and a plurality of operation buttons (21) are arranged on the operation control box (20).

9. The semiconductor electrostatic chuck film laminating device according to claim 1, characterized in that: A plurality of balance adjustment feet (22) are arranged at the bottom of the main installation component (1).

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