Wafer clamping and carrying device
By designing a wafer clamping and handling device combining X-axis and Z-axis servo modules, two-way clamping is achieved using fixture bearing discs, telescopic cylinders and multiple clamping blocks, the problems of center position offset and drop during wafer handling are solved, ensuring the stability and safety of the wafer.
Patent Information
- Application Number
- CN202420209886.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-29
- Publication Date
- 2025-04-04
- Estimated Expiration
- 2034-01-29
AI Technical Summary
The existing wafer handling methods have a center position offset before and after handling, which makes the wafer easy to fall off, and cannot remain clamped when the air is suddenly cut off, resulting in wafer damage.
A wafer clamping and handling device is designed, using the combination of X-axis and Z-axis servo modules to achieve bidirectional clamping through fixture bearing disc, telescopic cylinder and multiple clamping blocks to ensure the stability of the central position of the wafer during the handling process and to maintain the clamping state when the air is cut off.
The device ensures that the center position of the wafer remains unchanged during handling, avoids falling, and protects the wafer when air is cut off and prevents damage.
Smart Images
Figure CN222720390U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer transfer and transportation, in particular to a wafer clamping and transportation device. Background Art
[0002] In the semiconductor back-end process, wafers need to be thinned on the back before dicing, bonding and packaging to reduce the height of the package, reduce the chip package volume, improve the chip's thermal diffusion efficiency, electrical performance, mechanical properties and reduce the amount of dicing. Back grinding has the advantages of high efficiency and low cost, and has replaced traditional wet etching and ion etching processes to become the most important back thinning technology.
[0003] After the wafer is ground and thinned, the robot needs to grab it to the cleaning table to clean the ground surface. However, the wafer becomes very thin after grinding and even has a certain amount of warping, which places great demands on the stability of the robot arm's vacuum grasping.
[0004] The existing wafer handling method uses a vacuum adsorption mechanism or a clamping mechanism. Before and after handling, there is still a certain offset in the center position of the wafer. The wafer is easy to fall during the handling process, and most of them cannot maintain the current clamping state when the air is suddenly cut off, resulting in damage to the wafer. Utility Model Content
[0005] The purpose of the utility model is to provide a wafer clamping and transporting device to solve the problems raised in the above background technology.
[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer clamping and handling device, comprising an X-axis servo module, the X-axis servo module is provided with a Z-axis servo module movably connected thereto, the Z-axis servo module is provided with a wafer handling mechanism movably connected thereto, the wafer handling mechanism comprises a fixed frame, a clamp carrying plate is provided on the side of the fixed frame away from the Z-axis servo module, a telescopic cylinder is provided on the side of the fixed frame close to the Z-axis servo module, and a wafer is clamped in the middle of the wafer handling mechanism.
[0007] For further optimization, at least two first wafer clamping blocks are symmetrically provided at one end of the clamp carrier plate away from the telescopic cylinder, and the clamping stability of the wafer is ensured by the provision of the two first wafer clamping blocks.
[0008] Further optimized, at least four second wafer clamping blocks are provided at one end of the fixing frame close to the two first wafer clamping blocks, and the two first wafer clamping blocks and the four second wafer clamping blocks ensure that the wafer is clamped and carried in the wafer handling mechanism to prevent the wafer from falling.
[0009] For further optimization, the two first wafer clamping blocks are both fixedly connected to the fixture carrier plate, and the fixedly connected wafer clamping blocks ensure their stability.
[0010] For further optimization, the four second wafer clamping blocks are respectively fixedly connected to four fixing rods fixedly arranged on the fixing frame.
[0011] For further optimization, the four fixed rods are fixedly connected to a movable plate arranged on the end face of the fixed frame, and one end of the movable plate is connected to the telescopic end of the telescopic cylinder. Through the movement of the telescopic cylinder, the fixed rods and the clamp carrier plate are pushed and retracted to the edge of the wafer in two directions respectively, so as to clamp the wafer in the center position.
[0012] For further optimization, a position sensor is provided on one side of the Z-axis servo module. The Z-axis servo module senses the specific position of the wafer through the position sensor, moves to the wafer, and transports the wafer through the wafer transport mechanism.
[0013] For further optimization, a mounting plate connected to the wafer transport mechanism and the Z-axis servo module is provided.
[0014] Beneficial Effects
[0015] The wafer clamping and transporting device provided by the utility model is a bidirectional clamping and transporting device that ensures that the center position remains unchanged during transport. If the air is suddenly cut off during the transport process, the current state can be maintained. It is suitable for Taiko process products, provides freedom in the X-axis and Z-axis directions, can carry wafers, prevent wafers from falling, and realize air-cut state protection. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0017] Figure 2 It is a schematic diagram of the overall structure of the utility model from another angle;
[0018] Figure 3 This is a schematic diagram of the structure of the wafer transport mechanism of the present utility model.
[0019] Reference numerals
[0020] 1-X-axis servo module, 2-Z-axis servo module, 3-mounting plate, 4-in-position sensor, 5-fixed frame, 6-telescopic cylinder, 7-clamp carrier plate, 8-fixed rod, 9-first wafer clamping block, 10-second wafer clamping block, 11-wafer, 12-movable plate. DETAILED DESCRIPTION
[0021] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.
[0022] Example
[0023] like Figure 1-3 As shown, a wafer clamping and handling device includes an X-axis servo module 1, on which a Z-axis servo module 2 movably connected is provided, on which the Z-axis servo module 2 is provided a wafer handling mechanism movably connected, the wafer handling mechanism includes a fixed frame 5, on which a clamp carrier plate 7 is provided on the side of the fixed frame 5 away from the Z-axis servo module 2, on which a telescopic cylinder 6 is provided on the side of the fixed frame 5 close to the Z-axis servo module 2, a wafer 11 is clamped in the middle of the wafer handling mechanism.
[0024] In this embodiment, at least two first wafer clamping blocks 9 are symmetrically provided at one end of the clamp carrier plate 7 away from the telescopic cylinder 6 , and the wafer clamping stability is ensured by the provision of the two first wafer clamping blocks 9 .
[0025] At least four second wafer clamping blocks 10 are provided at one end of the fixing frame 5 close to the two first wafer clamping blocks 9. The two first wafer clamping blocks 9 and the four second wafer clamping blocks ensure that the wafer 11 is clamped in the wafer handling mechanism and does not fall.
[0026] The two first wafer clamping blocks 9 are both fixedly connected to the fixture carrying plate 7 .
[0027] The four second wafer clamping blocks 10 are respectively fixedly connected to the four fixed rods 8 fixedly arranged on the fixed frame 5. The four fixed rods 8 are all fixedly connected to the moving plate 12 arranged on the end face of the fixed frame 5, and one end of the moving plate 12 is connected to the telescopic end of the telescopic cylinder 6. Through the movement of the telescopic cylinder 6, the fixed rods 8 are pushed to the edge of the wafer to clamp the wafer. In addition, a wafer in-position sensor is arranged between the four fixed rods 8. A Z-axis servo module 2 is provided with an in-position sensor 4 on one side. The Z-axis servo module 2 senses the specific position of the wafer through the in-position sensor, moves to the wafer, and transports the wafer through the wafer transport mechanism.
[0028] A mounting plate 3 connected to the wafer transport mechanism and the Z-axis servo module 2 is provided.
[0029] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions recorded in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the utility model content within the protection scope of the utility model.
Claims
1. A wafer clamping and transporting device, characterized in that: The invention comprises an X-axis servo module (1), wherein the X-axis servo module (1) is provided with a Z-axis servo module (2) movably connected thereto, wherein the Z-axis servo module (2) is provided with a wafer handling mechanism movably connected thereto, wherein the wafer handling mechanism comprises a fixed frame (5), wherein a clamp carrier plate (7) is provided on a side of the fixed frame (5) away from the Z-axis servo module (2), and a telescopic cylinder (6) is provided on a side of the fixed frame (5) close to the Z-axis servo module (2), and a wafer (11) is clamped in the middle of the wafer handling mechanism.
2. The wafer holding and transporting device according to claim 1, characterized in that: At least two first wafer clamping blocks (9) are symmetrically arranged at one end of the clamp carrier plate (7) away from the telescopic cylinder (6).
3. The wafer holding and transporting device according to claim 2, characterized in that: At least four second wafer clamping blocks (10) are provided at one end of the fixing frame (5) close to the two first wafer clamping blocks (9).
4. The wafer holding and transporting device according to claim 2, characterized in that: The two first wafer clamping blocks (9) are both fixedly connected to the clamp carrier plate (7).
5. The wafer holding and transporting device according to claim 3, characterized in that: The four second wafer clamping blocks (10) are respectively fixedly connected to four fixing rods (8) fixedly arranged on the fixing frame (5).
6. The wafer holding and transporting device according to claim 5, characterized in that: The four fixed rods (8) are all fixedly connected to a movable plate (12) arranged on the end surface of the fixed frame (5), and one end of the movable plate (12) is connected to the telescopic end of the telescopic cylinder (6).
7. The wafer holding and transporting device according to claim 1, characterized in that: A position sensor (4) is provided on one side of the Z-axis servo module (2).
8. The wafer holding and transporting device according to claim 1, characterized in that: A mounting plate (3) connected to the wafer transport mechanism is provided between the Z-axis servo module (2).