Semiconductor chip wafer diaphragm rotation supporting structure

Abstract

The utility model relates to the technical field of semiconductor production, in particular to a rotary supporting structure for a wafer diaphragm of a semiconductor chip. A rotary supporting structure for a semiconductor chip wafer diaphragm comprises a base, a supporting plate is fixed on the base through a vertical rod, a telescopic die expanding support is arranged in the supporting plate, a rotary disc covers the die expanding support, arc-shaped guide grooves are evenly distributed in the rotary disc, and guide columns clamped into the guide grooves are arranged on the die expanding support. According to the rotary supporting structure for the wafer diaphragm of the semiconductor chip, the die expanding support arranged on the supporting plate is driven by the rotatable rotating disc to move back and forth, and the relative position of the die expanding support is adjusted, so that the rotary supporting structure can be used for producing and processing wafers with different sizes, and a corresponding supporting mechanism does not need to be replaced; and the production efficiency is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor production, in particular to a semiconductor chip wafer diaphragm rotation support structure. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, also known as a wafer.

[0003] The wafer will be placed on a tough film. When the wafer is taken out, the film needs to be supported and stretched for easy access. Due to its own toughness, the film drives the divided silicon wafers in the wafer to expand outward, so that there are gaps between the silicon wafers for easy access. The current mechanism uses support mechanisms of different diameters for wafers of different sizes, which requires shutdown to replace the corresponding support mechanism when changing wafer production, resulting in low work efficiency.

[0004] In view of the above-mentioned defects, the designers have actively carried out research and innovation in order to create a semiconductor chip wafer diaphragm rotation support structure to make it more valuable for industrial use. Summary of the invention

[0005] In order to solve the above technical problems, the purpose of the utility model is to provide a semiconductor chip wafer diaphragm rotation support structure.

[0006] The utility model discloses a semiconductor chip wafer diaphragm rotating support structure, comprising a base, a support plate fixed on the base through a vertical rod, a retractable expansion bracket inside the support plate, the expansion bracket is covered with a rotating disk, the rotating disk is provided with evenly arranged arc guide grooves, and the expansion bracket is provided with guide columns inserted into the guide grooves.

[0007] The semiconductor chip wafer diaphragm rotating support structure drives the expansion support to move forward and backward through a rotatable mechanism to adjust the diameter of the expansion circle, so that the device can adapt to the production of wafers of various sizes.

[0008] Furthermore, the surface of the support plate has uniform protrusions, and the grooves between the protrusions are used to place the expansion bracket.

[0009] The raised structure on the support plate can be stuck on both sides of the expansion bracket to provide guidance for the movement of the expansion bracket.

[0010] Furthermore, a support plate is fixed on one side of the base, and a rotating mechanism for driving the rotating disk to rotate is arranged on the support plate.

[0011] The rotating mechanism installed on the support plate on one side of the base is used to drive the rotating disk to rotate and provide power for the movement of the expansion bracket.

[0012] Furthermore, the rotating mechanism includes a motor fixed on the support plate, a screw is installed on the output shaft of the motor, the screw drives the drive frame to move through a screw sleeve installed in the drive frame, and the drive frame is connected to the rotating disk.

[0013] The motor drives the screw to rotate, the screw drives the driving frame to move, and the driving frame can drive the rotating disk to rotate.

[0014] Furthermore, a slide rail is fixed on the support plate, and the lower end of the driving frame cooperates with the slide rail through a sliding block.

[0015] The moving direction and distance of the drive frame are limited by the guide rails.

[0016] Furthermore, a waist-shaped groove is provided at the top of the driving frame, and a sliding head fixed on the rotating disk is clamped in the waist-shaped groove.

[0017] The sliding head on the rotating disk is stuck in the waist-shaped groove on the driving frame for easy movement.

[0018] Furthermore, an infrared sensor is fixed on the support plate, and the end of the infrared sensor is in a "concave" shape. A metal sheet is fixed on the side wall of the driving frame, and the metal sheet can extend into the end of the infrared sensor.

[0019] The opening of the infrared sensor cooperates with the metal sheet to monitor the moving direction of the moving frame, and combined with the industrial computer, the maximum moving distance of the driving frame can be limited.

[0020] Through the above scheme, the present invention has at least the following advantages: this semiconductor chip wafer diaphragm rotating support structure drives the expansion mold bracket placed on the support plate to move back and forth through a rotatable rotating disk, adjusts the relative position of the expansion mold bracket, and enables the device to use the production and processing of wafers of different sizes without replacing the corresponding support mechanism, thereby effectively improving production efficiency.

[0021] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solution of the embodiment of the utility model, the drawings required for use in the embodiment will be briefly introduced below. It should be understood that the following drawings only show a certain embodiment of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 It is a structural schematic diagram of the utility model;

[0024] Figure 2 It is the front view of the utility model;

[0025] Figure 3 This utility model Figure 1 Schematic diagram of the structure without the rotating disk;

[0026] Figure 4 This utility model Figure 1 A partial enlarged schematic diagram of

[0027] In the figure, 1, base, 2, vertical pole, 3, support plate, 4, expansion bracket, 5, rotating disk, 6, guide column, 7, support plate, 8, motor, 9, screw, 10, drive frame, 11, sliding head, 12, infrared sensor, and 13, metal sheet. DETAILED DESCRIPTION

[0028] The following is a further detailed description of the specific implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0029] See also Figure 1-3 This semiconductor chip wafer diaphragm rotating support structure, the base 1 of the device is used to be fixed on other equipment, the base 1 is a metal plate with a hollow middle part, a support plate 3 is fixed on the base 1 through a plurality of vertical rods 2, a retractable expansion bracket 4 is placed on the support plate 3, and an upwardly bent support portion is provided at the end of the expansion bracket 4, which is used to contact the diaphragm on which the wafer is placed, and the guide column 6 on the expansion bracket 4 is inserted into the arc guide groove on the rotating disk 5. When the rotating disk 5 rotates, the expansion bracket 4 can be driven to move forward and backward.

[0030] See also Figure 3 The support plate 3 is annular and has evenly arranged protrusions. The slots between the protrusions can just fit into the expansion bracket 4, providing guidance for the movement of the expansion bracket 4.

[0031] See also Figure 1 , 24, a support plate 7 is fixed on one side of the base 1, and the support plate 7 is used to install a rotating mechanism, and the rotating mechanism is used to drive the rotating disk 5 to rotate.

[0032] The motor 8 installed on the support plate 7 is used to drive the screw 9 to rotate. The drive frame 10 has a screw sleeve that cooperates with the screw 9. When the screw 9 rotates, the drive frame 10 can be driven to move, and the drive frame 10 can drive the rotating disk 5 to rotate.

[0033] The slide rails installed on the support plate 7 and the sliders under the driving frame 10 facilitate the movement of the driving frame 10.

[0034] The sliding head 11 of the rotating disk 5 is inserted into the waist-shaped groove at the top of the driving frame 10. When the driving frame 10 moves, the sliding head 11 can move in the waist-shaped groove to drive the rotating disk 5 to rotate.

[0035] See also Figure 4 An infrared sensor 12 is also fixedly installed on the support plate 7. The front end of the infrared sensor 12 is open. The metal sheet 13 fixed on the side wall of the driving frame 10 can be stuck in the infrared sensor 12 when following the movement of the driving frame 10, triggering the infrared sensor 12. The infrared sensor 12 sends a sensing signal that is acquired by the industrial computer, and then the industrial computer controls the motor 8 to stop, so as to achieve the purpose of controlling the maximum moving distance of the driving frame 10 and prevent the driving frame 10 from slipping off the guide rail.

[0036] Finally, a few points should be explained: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, which may refer to mechanical connection or electrical connection, or internal communication between two components, or direct connection. "upper", "lower", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may change;

[0037] Secondly: In the drawings of the embodiments disclosed in the present utility model, only the structures related to the embodiments disclosed in the present utility model are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present utility model can be combined with each other;

[0038] Finally: The above description is only a preferred implementation mode of the present utility model and is not intended to limit the present utility model. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the protection scope of the present utility model.

Claims

1. A semiconductor chip wafer membrane rotation support structure, comprising a base (1), characterized in that: A support plate (3) is fixed on the base (1) via a vertical rod (2), a retractable expansion bracket (4) is arranged inside the support plate (3), a rotating disk (5) is covered on the expansion bracket (4), arc-shaped guide grooves are arranged evenly on the rotating disk (5), and a guide column (6) is provided on the expansion bracket (4) and is inserted into the guide groove.

2. A semiconductor chip wafer diaphragm rotation support structure according to claim 1, characterized in that: The surface of the support plate (3) has uniform protrusions, and the slots between the protrusions are used to place the expansion bracket (4).

3. A semiconductor chip wafer diaphragm rotation support structure according to claim 2, characterized in that: A support plate (7) is fixed on one side of the base (1), and a rotating mechanism for driving the rotating disk (5) to rotate is disposed on the support plate (7).

4. A semiconductor chip wafer diaphragm rotation support structure according to claim 3, characterized in that: The rotating mechanism comprises a motor (8) fixed on a support plate (7), a screw rod (9) being mounted on an output shaft of the motor (8), the screw rod (9) driving the driving frame (10) to move by cooperating with a screw sleeve mounted in the driving frame (10), and the driving frame (10) is connected to the rotating disk (5).

5. A semiconductor chip wafer diaphragm rotation support structure according to claim 4, characterized in that: A slide rail is fixed on the support plate (7), and the lower end of the driving frame (10) cooperates with the slide rail through a sliding block.

6. A semiconductor chip wafer diaphragm rotation support structure according to claim 5, characterized in that: The top of the driving frame (10) is provided with a waist-shaped groove, and the sliding head (11) fixed on the rotating disk (5) is clamped in the waist-shaped groove.

7. The semiconductor chip wafer membrane rotation support structure according to claim 6, characterized in that: An infrared sensor (12) is fixed on the support plate (7), and the end of the infrared sensor (12) is in a "concave" shape. A metal sheet (13) is fixed on the side wall of the driving frame (10), and the metal sheet (13) can extend into the end of the infrared sensor (12).

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