Wafer clamping mechanism for wafer etching cleaning machine

Abstract

The utility model discloses a wafer clamping mechanism for a wafer etching cleaning machine, which comprises a base, two sides of the base are respectively and fixedly provided with a side plate, an electric telescopic rod is respectively arranged above the opposite side surfaces of the two side plates, the output end of the electric telescopic rod is fixedly provided with an arc-shaped clamping plate, the upper surface of the base is provided with a supporting seat, and the upper surface of the supporting seat is provided with a clamping plate. A first clamping groove is formed in the arc-shaped clamping plate, a plurality of first rotating rollers are rotationally mounted on the arc-shaped clamping plate, a second clamping groove is formed in the top of the supporting seat, two second rotating rollers are rotationally mounted on the top of the supporting seat, and a motor is arranged at the position, corresponding to the second rotating rollers, of the supporting seat; by arranging the supporting seat and the arc-shaped clamping plate, the first rotating roller is rotatably mounted in the arc-shaped clamping plate, and the second rotating roller is rotatably mounted in the supporting seat and is driven by the motor, so that the wafer can rotate along with the second rotating roller after being clamped, and the problem that the clamped part of the wafer cannot be cleaned is solved; and the position of the wafer does not need to be adjusted by a worker, so that the cleaning effect and the cleaning efficiency of the wafer are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a wafer clamping mechanism for a wafer etching and cleaning machine. Background Art

[0002] A wafer refers to the silicon chip used to make silicon semiconductor integrated circuits. Due to its round shape, it is called a wafer. Various circuit component structures can be processed on the silicon wafer to become IC products with specific electrical functions.

[0003] In the process of preparing semiconductor devices, it is usually necessary to clean the wafer. However, the clamping mechanism in the existing cleaning device cannot clean the clamped part when clamping and cleaning the wafer, which affects the cleaning effect. In addition, the staff needs to adjust the position of the wafer each time for complete cleaning, which leads to low cleaning efficiency. Utility Model Content

[0004] The utility model aims to provide a wafer clamping mechanism for a wafer etching and cleaning machine, which can automatically rotate the wafer during the cleaning process, so that the cleaning device can completely clean all parts of the wafer without the need for staff to adjust the wafer position, and has good cleaning effect and high cleaning efficiency.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer clamping mechanism for a wafer etching and cleaning machine, comprising a base, a side plate fixedly installed on both sides of the base, an electric telescopic rod fixedly installed on the upper surface of the two side plates facing the base, an arc-shaped clamping plate fixedly installed on the output end of the electric telescopic rod, a support seat fixedly installed at the middle position of the upper surface of the base, a first clamping groove is provided on the side of the arc-shaped clamping plate facing the middle of the base, a plurality of first rotating rollers are rotatably installed in the first clamping groove, a second clamping groove is provided on the top of the support seat, a second rotating roller is rotatably installed in the second clamping groove, two second rotating rollers are provided and are parallel and symmetrically distributed on both sides of the second clamping groove, a motor is provided on one of the second rotating rollers of the support seat, and the output end of the motor is fixedly connected to one end of the corresponding second rotating roller.

[0006] The clamping mechanism is installed below the water spray head in the cleaning machine, and the wafer is placed in the second slot on the support seat. The two second rotating rollers support the wafer, and the electric telescopic rods on the two side panels are extended at the same time, thereby driving the two arc-shaped clamping plates to approach the wafer at the same time to clamp the wafer, and then one of the second rotating rollers is driven by the motor to rotate, so that the wafer rotates between the first rotating roller and the second rotating roller, realizing the function of automatic rotation of the wafer, and finally water is sprayed through the water spray head to clean the surface of the wafer.

[0007] Preferably, a support frame is fixedly mounted on the lower surface of the two electric telescopic rods.

[0008] Preferably, the support frame is L-shaped, and one end of the support frame away from the electric telescopic rod is fixedly connected to the corresponding side plate. The support frame is used to fix and support the electric telescopic rod, so that the electric telescopic rod is more stable when working and avoids deviation.

[0009] Preferably, the widths of the first slot and the second slot are set according to the thickness of the wafer, and the first slot and the second slot are located in the same vertical plane, so that the wafer can be stably clamped in the first slot and the second slot, thereby improving the stability of wafer rotation.

[0010] Preferably, the first rotating roller and the upper surface of the base are parallel to each other and arranged in an arc shape along the periphery of the wafer, and the first rotating rollers in the arc-shaped clamping plates on both sides are symmetrically distributed so that when the two arc-shaped clamping plates clamp the wafer, the first rotating roller and the side surface of the wafer fit each other, thereby improving the stability of the wafer during rotation.

[0011] Preferably, a support plate is provided on the lower surface of the motor, and the support plate is fixedly connected to the support seat, so that the motor can be fixedly mounted on the side of the support seat.

[0012] Preferably, a baffle is disposed on the outer side of the motor, and is used to block water flowing down from the wafer to protect the motor.

[0013] Compared with the prior art, the utility model adopts the above technical solution and has the following technical effects:

[0014] The utility model provides a support seat and two symmetrical arc-shaped clamping plates, a first clamping groove is opened in the arc-shaped clamping plate, a first rotating roller is rotatably installed in the first clamping groove, a second clamping groove is opened in the support seat, a second rotating roller is rotatably installed in the second clamping groove, and one of the second rotating rollers is driven to rotate by a motor, so that when the wafer is clamped between the first rotating roller and the second rotating roller, it can follow the second rotating roller to rotate, thereby solving the problem that the clamped part of the wafer cannot be cleaned, and there is no need for staff to adjust the wafer position, thereby improving the cleaning effect and cleaning efficiency of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a front view schematic diagram of the utility model;

[0016] Figure 2 It is a front cross-sectional schematic diagram of the utility model;

[0017] Figure 3 It is a side cross-sectional schematic diagram of the utility model.

[0018] Explanation of the accompanying drawings: 1. base; 2. side panel; 3. electric telescopic rod; 4. arc-shaped clamping plate; 5. support seat; 6. first card slot; 7. first rotating roller; 8. second card slot; 9. second rotating roller; 10. motor; 11. support frame; 12. support plate; 13. baffle. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the conditions under which this application can be implemented. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in this application without affecting the effects and purposes that can be achieved by this application.

[0021] See also Figure 1-3 The utility model provides a technical solution: it includes a base 1, a side plate 2 is fixedly installed on both sides of the base 1, an electric telescopic rod 3 is fixedly installed on the upper surface of the two side plates 2 facing the base 1, an arc-shaped clamping plate 4 is fixedly installed on the output end of the electric telescopic rod 3, a support seat 5 is fixedly installed at the middle position of the upper surface of the base 1, a first card slot 6 is opened on the arc-shaped clamping plate 4 facing the middle of the base 1, a plurality of first rotating rollers 7 are rotatably installed in the first card slot 6, a second card slot 8 is opened on the top of the support seat 5, a second rotating roller 9 is rotatably installed in the second card slot 8, two second rotating rollers 9 are provided and are parallel and symmetrically distributed on both sides of the second card slot 8, a motor 10 is provided at one of the second rotating rollers 9 of the support seat 5, and the output end of the motor 10 is fixedly connected to one end of the corresponding second rotating roller 9.

[0022] A support frame 11 is fixedly mounted on the lower surface of the two electric telescopic rods 3 .

[0023] The support frame 11 is L-shaped, and one end of the support frame 11 away from the electric telescopic rod 3 is fixedly connected to the corresponding side plate 2 .

[0024] The widths of the first card slot 6 and the second card slot 8 are both set according to the thickness of the wafer, and the first card slot 6 and the second card slot 8 are located in the same vertical plane.

[0025] The first rotating roller 7 and the upper surface of the base 1 are parallel to each other and arranged in an arc shape along the periphery of the wafer. The first rotating rollers 7 in the arc-shaped clamping plates 4 on both sides are symmetrically distributed.

[0026] A support plate 12 is disposed on the lower surface of the motor 10 , and the support plate 12 is fixedly connected to the support seat 5 .

[0027] A baffle 13 is disposed on the outer side of the motor 10 .

[0028] Working principle or structural principle: first, the clamping mechanism is installed below the water spray head in the cleaning machine, and the wafer is placed in the second slot 8 on the support seat 5. The two second rotating rollers 9 support the wafer, and the electric telescopic rods 3 on the two side panels 2 are extended at the same time, thereby driving the two arc-shaped clamping plates 4 to approach the wafer at the same time to clamp the wafer, and then start the motor 10, and drive one of the second rotating rollers 9 to rotate through the motor 10, thereby driving the wafer to rotate between the first rotating roller 7 and the second rotating roller 9, so that the clamped part of the wafer continues to change, and finally the water sprayed from the water spray head cleans the surface of the wafer. After cleaning, the water on the surface of the wafer flows downward, and the baffle 13 separates the water and the motor 10 to protect the motor 10; this clamping mechanism solves the problem that the clamped part of the wafer cannot be cleaned, and there is no need for the staff to adjust the position of the wafer, thereby improving the cleaning effect and cleaning efficiency of the wafer.

[0029] So far, the embodiments of the utility model have been described in detail in conjunction with the accompanying drawings. It should be noted that the implementation methods not shown or described in the drawings or the body of the specification are all forms known to ordinary technicians in the relevant technical field and are not described in detail. In addition, the above definitions of each component are not limited to the various specific structures, shapes or methods mentioned in the embodiments, and ordinary technicians in the field can simply change or replace them.

[0030] Those skilled in the art will appreciate that the features described in the various embodiments and / or claims of the present invention may be combined and / or combined in various ways, even if such combinations and / or combinations are not explicitly described in the present invention. In particular, the features described in the various embodiments and / or claims of the present invention may be combined and / or combined in various ways without departing from the spirit and teachings of the present invention. All of these combinations and / or combinations fall within the scope of the present invention.

[0031] The specific embodiments described above further illustrate the purpose, technical solutions and beneficial effects of the present invention. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer clamping mechanism for a wafer etching and cleaning machine, comprising a base (1), characterized in that: A side plate (2) is fixedly mounted on both sides of the base (1); an electric telescopic rod (3) is fixedly mounted on the upper surface of each of the two side plates (2) facing the base (1); an arc-shaped clamping plate (4) is fixedly mounted on the output end of the electric telescopic rod (3); a support seat (5) is fixedly mounted at the middle position of the upper surface of the base (1); a first clamping groove (6) is provided on the side of the arc-shaped clamping plate (4) facing the middle of the base (1); a plurality of first rotating rollers (7) are rotatably mounted in the first clamping groove (6); a second clamping groove (8) is provided on the top of the support seat (5); a second rotating roller (9) is rotatably mounted in the second clamping groove (8); two second rotating rollers (9) are provided and are parallel and symmetrically distributed on both sides of the second clamping groove (8); a motor (10) is provided on the support seat (5) at one of the second rotating rollers (9); the output end of the motor (10) is fixedly connected to one end of the corresponding second rotating roller (9).

2. The wafer clamping mechanism for a wafer etching and cleaning machine according to claim 1, characterized in that: A support frame (11) is fixedly mounted on the lower surface of the two electric telescopic rods (3).

3. The wafer clamping mechanism for a wafer etching and cleaning machine according to claim 2, characterized in that: The support frame (11) is L-shaped, and one end of the support frame (11) away from the electric telescopic rod (3) is fixedly connected to the corresponding side plate (2).

4. The wafer clamping mechanism for a wafer etching and cleaning machine according to claim 1, characterized in that: The widths of the first card slot (6) and the second card slot (8) are both set according to the thickness of the wafer, and the first card slot (6) and the second card slot (8) are located in the same vertical plane.

5. The wafer clamping mechanism for a wafer etching and cleaning machine according to claim 1, characterized in that: The first rotating roller (7) and the upper surface of the base (1) are parallel to each other and are arranged in an arc shape along the periphery of the wafer, and the first rotating rollers (7) in the arc-shaped clamping plates (4) on both sides are symmetrically distributed.

6. The wafer clamping mechanism for a wafer etching and cleaning machine according to claim 1, characterized in that: A support plate (12) is provided on the lower surface of the motor (10), and the support plate (12) is fixedly connected to the support seat (5).

7. The wafer clamping mechanism for a wafer etching and cleaning machine according to claim 6, characterized in that: A baffle (13) is arranged on the outer side of the motor (10).

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