A high-brightness Micro-LED lamp bead

Abstract

The utility model provides a high-brightness Micro-LED lamp bead, belonging to the technical field of Micro-LED lamp bead; the technical problem to be solved is: to provide an improvement in the structure of a high-brightness Micro-LED lamp bead; the technical solution adopted to solve the technical problem is: the high-brightness Micro-LED lamp bead includes a base, a heat dissipation substrate is arranged at the bottom of the cavity of the base, a first red LED chip, a second red LED chip, a green LED chip, and a blue LED chip are arranged on the heat dissipation substrate, three pairs of pads are also arranged on the heat dissipation substrate, each pad is connected to a corresponding pin after packaging, and a corresponding electrode is also arranged on each pad; the utility model is applied to Micro-LED lamp beads.

Description

Technical Field

[0001] The utility model provides a high-brightness Micro-LED lamp bead, belonging to the technical field of Micro-LED lamp beads. Background Art

[0002] As the market demand for LED display screens increases, the terminal's requirements for the installation and application of display screens are also constantly increasing. One of the important reference projects is the high-brightness application of LEDs. However, while the display screen lamp beads achieve high-brightness display effects, the cost of preparing the lamp beads' light-emitting chips will be too high. In addition, there are defects such as excessive lamp bead power consumption, low overall luminous efficiency, and severe heat generation. Under the current demand for products with higher brightness, the cost increase of achieving high brightness by increasing the cost of the light-emitting chip is not proportional to the effect achieved, making the existing LED light-emitting structure unable to meet the demand.

[0003] At present, LED lamp bead chips are composed of three light-emitting chips, red, green and blue. Under the demand for high brightness, existing products can only improve the luminous efficiency by increasing the size of the light-emitting chip. However, the increase in brightness is not directly proportional to power consumption. When the critical current increases, the brightness of the light-emitting chip increases slowly, especially in the red light-emitting chip. Due to the low light conversion efficiency of the red light-emitting chip itself, the use of large-size red light-emitting chips is costly, the brightness improvement is limited, and it will also cause serious heat, affecting the life of the lamp beads. Utility Model Content

[0004] In order to overcome the deficiencies in the prior art, the utility model aims to solve the technical problem of providing an improvement in the structure of a high-brightness Micro-LED lamp bead.

[0005] In order to solve the above technical problems, the technical solution adopted by the utility model is: a high-brightness Micro-LED lamp bead, including a base, a heat dissipation substrate is arranged at the bottom of the cavity of the base, a first red LED chip, a second red LED chip, a green LED chip, and a blue LED chip are arranged on the heat dissipation substrate, and three pairs of pads are also arranged on the heat dissipation substrate, and corresponding electrodes are also arranged on each pad, wherein:

[0006] A first electrode is disposed on the first pad, and the first red LED chip is disposed on the first electrode;

[0007] A second electrode is arranged on the second pad, and the second red LED chip is arranged on the second electrode;

[0008] A third electrode is disposed on the third pad, and a fourth electrode is disposed on the fourth pad;

[0009] A fifth electrode is disposed on the fifth pad, and a sixth electrode is disposed on the sixth pad;

[0010] The first electrode is connected to the third electrode via a welding wire;

[0011] The third electrode is connected to the input end of the green LED chip through a bonding wire;

[0012] The output end of the green LED chip is connected to the fifth electrode via a bonding wire;

[0013] The second electrode is connected to the fourth electrode via a welding wire;

[0014] The fourth electrode is connected to the input end of the blue LED chip through a bonding wire;

[0015] The output end of the blue LED chip is connected to the sixth electrode via a bonding wire;

[0016] Each pad is connected to the corresponding pin after packaging.

[0017] The beneficial effects of the present invention compared to the prior art are as follows: the present invention improves the internal structure of the existing Micro-LED lamp beads, especially by separating the red light-emitting chips inside the lamp beads, redesigning the welding wire connection layout, and re-layouting the packaging structure of the lamp bead chips. When performing high-brightness display, the brightness of the module can be effectively improved, the heat generation of the light-emitting chips can be reduced, the life of the lamp beads can be prolonged, and the preparation cost of the lamp beads can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The utility model is further described below in conjunction with the accompanying drawings:

[0019] Figure 1 This is a schematic diagram of the structure of the lamp bead of the utility model;

[0020] Figure 2 This is a schematic diagram of the structure inside the lamp bead of the utility model;

[0021] In the figure: 1 is a base, 2 is a heat dissipation substrate, 3 is a pin, 11 is a first red LED chip, 12 is a second red LED chip, 21 is a green LED chip, and 31 is a blue LED chip;

[0022] 101 is a first pad, 201 is a first electrode;

[0023] 102 is a second pad, 202 is a second electrode;

[0024] 103 is a third pad, 203 is a third electrode;

[0025] 104 is a fourth pad, 204 is a fourth electrode;

[0026] 105 is a fifth pad, 205 is a fifth electrode;

[0027] 106 is a sixth pad, and 206 is a sixth electrode. DETAILED DESCRIPTION

[0028] like Figure 1 and Figure 2 As shown, the utility model provides a high-brightness Micro-LED lamp bead, including a base 1, a heat dissipation substrate 2 is arranged at the bottom of the cavity of the base 1, a first red LED chip 11, a second red LED chip 12, a green LED chip 21, and a blue LED chip 31 are arranged on the heat dissipation substrate 2, and three pairs of pads are also arranged on the heat dissipation substrate 2, and corresponding electrodes are also arranged on each pad, wherein:

[0029] A first electrode 201 is disposed on the first pad 101 , and the first red LED chip 11 is disposed on the first electrode 201 ;

[0030] A second electrode 202 is disposed on the second solder pad 102 , and the second red LED chip 12 is disposed on the second electrode 202 ;

[0031] A third electrode 203 is disposed on the third pad 103 , and a fourth electrode 204 is disposed on the fourth pad 104 ;

[0032] A fifth electrode 205 is disposed on the fifth pad 105 , and a sixth electrode 206 is disposed on the sixth pad 106 ;

[0033] The first electrode 201 is connected to the third electrode 203 via a welding wire;

[0034] The third electrode 203 is connected to the input end of the green LED chip 21 through a bonding wire;

[0035] The output end of the green LED chip 21 is connected to the fifth electrode 205 via a bonding wire;

[0036] The second electrode 202 is connected to the fourth electrode 204 via a welding wire;

[0037] The fourth electrode 204 is connected to the input end of the blue LED chip 31 through a bonding wire;

[0038] The output end of the blue LED chip 31 is connected to the sixth electrode 206 via a bonding wire;

[0039] Each pad is connected to the corresponding pin 3 after packaging.

[0040] The utility model provides a high-brightness Micro-LED lamp bead structure, which specifically improves and optimizes the overall structural structure of the lamp bead and introduces the joint work of two red light-emitting chips. The two red light-emitting chips emit light together, and the red light-emitting chips with lower installation costs can be installed, so that the overall luminous efficiency and heat generation of the lamp bead reach a good balance. Compared with the existing solution of simply increasing the chip size, it can better control costs, improve luminous efficiency, and increase the service life of the lamp bead.

[0041] Regarding the specific structure of the utility model, it should be explained that the connection relationship between the various component modules adopted in the utility model is definite and feasible. Except for special instructions in the embodiments, the specific connection relationship can bring corresponding technical effects and solve the technical problems raised by the utility model without relying on the execution of corresponding software programs. The components, modules, models of specific components and the connection methods between each other appearing in the utility model, as well as the conventional use methods and expected technical effects brought about by the above-mentioned technical features, except for specific instructions, all belong to the disclosed contents in patents, journal articles, technical manuals, technical dictionaries, and textbooks that can be obtained by technical personnel in this field before the application date, or belong to the existing technologies such as conventional technologies and common knowledge in this field, and there is no need to elaborate, so that the technical solution provided in this case is clear, complete and feasible, and the corresponding physical products can be reproduced or obtained according to the technical means.

[0042] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the utility model.

Claims

1. A high-brightness Micro-LED lamp bead, comprising a base (1), characterized in that: A heat dissipation substrate (2) is arranged at the bottom of the cavity of the base (1); a first red LED chip (11), a second red LED chip (12), a green LED chip (21), and a blue LED chip (31) are arranged on the heat dissipation substrate (2); three pairs of solder pads are also arranged on the heat dissipation substrate (2); and corresponding electrodes are also arranged on each solder pad, wherein: A first electrode (201) is arranged on the first solder pad (101), and the first red LED chip (11) is arranged on the first electrode (201); A second electrode (202) is arranged on the second solder pad (102), and the second red LED chip (12) is arranged on the second electrode (202); A third electrode (203) is arranged on the third pad (103), and a fourth electrode (204) is arranged on the fourth pad (104); A fifth electrode (205) is arranged on the fifth pad (105), and a sixth electrode (206) is arranged on the sixth pad (106); The first electrode (201) is connected to the third electrode (203) via a welding wire; The third electrode (203) is connected to the input end of the green LED chip (21) via a bonding wire; The output end of the green LED chip (21) is connected to the fifth electrode (205) via a welding wire; The second electrode (202) is connected to the fourth electrode (204) via a welding wire; The fourth electrode (204) is connected to the input end of the blue LED chip (31) via a bonding wire; The output end of the blue LED chip (31) is connected to the sixth electrode (206) via a bonding wire; Each pad is connected to the corresponding pin (3) after packaging.

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