A Ku up-conversion component

Abstract

The present application discloses a Ku up-conversion component. By setting the ratio of the length and width of the circuit board to the shell, the volume of the circuit board is limited. A first mixing circuit, a second mixing circuit, a first output circuit and a second output circuit are connected by a straight microwave line, so that a radio frequency signal is output after the signal is mixed twice. The straight microwave line connects the components of each circuit without including the shell, which solves the problem of large signal transmission loss and large heat dissipation in a curved line, and realizes the microwave integration of the Ku up-conversion component.

Description

Technical Field

[0001] The present application relates to the technical field of frequency converters, and in particular to a Ku up-conversion component. Background Art

[0002] As aerospace electronic equipment develops towards "light, thin, short and small", the demand for broadband miniaturized design of up-conversion components is becoming more and more urgent. At present, through the use of advanced microwave integrated circuit technology and micro-assembly technology, the size of up-conversion components is constantly shrinking, while the bandwidth is also constantly expanding, and multi-standard compatibility is required, and it needs to adapt to multiple communication standards and frequency bands to meet diverse application needs.

[0003] Microwave integration technology has the defects that the complex integration process may lead to increased costs, and the high integration may lead to heat concentration and greater difficulty in heat dissipation. Therefore, in order to overcome the above defects, the volume of the circuit board is generally larger. Utility Model Content

[0004] The main purpose of the present application is to provide a Ku up-conversion component, aiming to solve the technical problem of how to reduce the volume of the circuit board to meet the requirements of microwave integration.

[0005] To achieve the above-mentioned purpose, the present application provides a Ku up-conversion component, comprising: a shell and a circuit board welded to the shell; the ratio of the length of the circuit board to the length of the shell is less than a first fixed value; the ratio of the width of the circuit board to the width of the shell is less than a second fixed value; the surface layer of the circuit board has a first mixing circuit, a second mixing circuit, a first output circuit, and a second output circuit with multiple straight microwave lines; the input end of the first mixing circuit receives a first pumping signal, and the output end of the first mixing circuit is connected to the input end of the first output circuit; the input end of the second mixing circuit receives a second pumping signal, and the output end of the second mixing circuit is connected to the input end of the second output circuit; the first mixing circuit is used to output a first radio frequency signal after mixing the first pumping signal twice; the second mixing circuit is used to output a second radio frequency signal after mixing the second pumping signal twice; the first output circuit is used to process the first radio frequency signal selected by the first switch to obtain a first radio frequency sub-signal; the second output circuit is used to process the second radio frequency signal selected by the second switch to obtain a second radio frequency sub-signal; the first radio frequency sub-signal and the second radio frequency sub-signal are selected by a third switch to output a third radio frequency signal.

[0006] Optionally, the circuit board includes a bottom layer and a conductive layer, an insulating layer and a surface layer stacked in sequence on the bottom layer; the first output circuit includes: a first coupling circuit and a first subcircuit and a second subcircuit respectively connected to the first coupling circuit; the second output circuit includes: a second coupling circuit and a third subcircuit and a fourth subcircuit respectively connected to the second coupling circuit; the second subcircuit and the third subcircuit are connected to a test signal output terminal after being aggregated by a power divider; the test signal output terminal is connected to an input terminal of a test signal output line located on the surface layer of the circuit board after punching and changing layers, and the output terminal of the test signal output line is connected to a first output interface; wherein the first coupling The circuit is used to process the first radio frequency signal after being selected by the first switch to obtain a first coupling signal and a second coupling signal; the second coupling circuit is used to process the second radio frequency signal after being selected by the second switch to obtain a third coupling signal and a fourth coupling signal; the second sub-circuit is used to process the second coupling signal to obtain a first sub-test signal; the third sub-circuit is used to process the third coupling signal to obtain a second sub-test signal; the first sub-test signal and the second sub-test signal are aggregated by the power divider to obtain a test output signal; the test output signal is output to the first output interface through the straight test signal output line; the first output interface is located on the first side wall of the circuit board.

[0007] Optionally, the first sub-circuit and the fourth sub-circuit are both connected to a third switch, and the third switch is connected to a radio frequency signal output terminal; the radio frequency signal output terminal is connected to a second output interface of the circuit board; wherein the third sub-circuit is used to process a third coupled signal to obtain a second radio frequency sub-signal; the fourth sub-circuit is used to process a fourth coupled signal to obtain a second test sub-signal; the first radio frequency sub-signal and the second radio frequency sub-signal are selected by the third switch to output a third radio frequency signal to the second output interface; the second output interface is located on a second side wall of the circuit board, and the first side wall is opposite to the second side wall.

[0008] Optionally, the Ku up-conversion component also includes: a third output circuit, whose input end is connected to the output end of the first mixing circuit; a fourth output circuit, whose input end is connected to the output end of the second mixing circuit; the output ends of the third output circuit and the fourth output circuit are both connected to a fourth switch, and the fourth switch is connected to a third output interface through a verification signal output line; the third output interface is located on a third side wall of the circuit board, and the third side wall is connected to the first side wall and the second side wall; the third output circuit is used to process the first RF signal after being selected by the first switch to obtain a first syndrome signal; the fourth output circuit is used to process the second RF signal after being selected by the second switch to obtain a second syndrome signal; the first syndrome signal and the second syndrome signal are selected by the fourth switch and then output the calibration signal through the third output interface.

[0009] Optionally, the first mixing circuit, the second mixing circuit, the first output circuit, the second output circuit, the third output circuit and the fourth output circuit all include multiple components and straight microwave lines connecting the multiple components, and at least two adjacent straight microwave lines are at right angles.

[0010] Optionally, the first frequency mixing circuit and the second frequency mixing circuit each include: a gain control circuit, a frequency conversion circuit and a first filter circuit connected in sequence, wherein the gain control circuit, the frequency conversion circuit and the first filter circuit each have a chip with a shell removed.

[0011] Optionally, the circuit board includes a bottom layer and a conductive layer, an insulating layer and a surface layer stacked in sequence on the bottom layer; the second mixing circuit is the same as the first mixing circuit and is respectively located on both sides of the verification signal output line, and the first mixing circuit and the second mixing circuit both include: a first local oscillator circuit, the output end of which is connected to the first mixing circuit / the second mixing circuit, the input end of the first local oscillator circuit is connected to a first input interface, and the first input interface is located on a third side wall of the circuit board; a second local oscillator circuit, the output end of which is connected to the first mixing circuit / the second mixing circuit, the input end of the second local oscillator circuit is connected to a second input interface, and the second input interface is located on the third side wall of the circuit board; a first signal circuit, the output end of which is connected to the first mixing circuit / the second mixing circuit, and the input end of the first signal circuit is connected to a third input interface located on the surface of the bottom layer.

[0012] Optionally, the first sub-circuit includes: a first power amplifier circuit, a first isolation circuit, and a second filtering circuit connected in sequence; the second sub-circuit includes: a first attenuation circuit and a second power amplifier circuit connected in sequence; the third sub-circuit includes: a second attenuation circuit and a third power amplifier circuit connected in sequence; the fourth sub-circuit includes: a fourth power amplifier circuit, a second isolation circuit, and a third filtering circuit connected in sequence; wherein the first power amplifier circuit, the first isolation circuit, the second filtering circuit, the first attenuation circuit, the second power amplifier circuit, the second attenuation circuit, the third power amplifier circuit, the fourth power amplifier circuit, the second isolation circuit, and the third filtering circuit all have chips after the shell is removed.

[0013] Optionally, the third output circuit includes: a first power management circuit; the third output circuit includes: a second power management circuit; wherein both the first power management circuit and the second power management circuit have a chip with the shell removed.

[0014] Optionally, the first half shell has a groove for a circuit board welded on its inner wall, and has notches on its outer wall for accommodating the first output interface, the second output interface, the third output interface and two of the first input interfaces and the second input interface, and the outer wall of the first half shell is provided with a physical interface for connecting the third input interface; the second half shell is arranged opposite to the first half shell and is screwed to the first half shell.

[0015] A Ku up-conversion component proposed in an embodiment of the present application limits the volume of the circuit board by setting the ratio of the length and width of the circuit board to the shell. The first mixing circuit, the second mixing circuit, the first output circuit and the second output circuit connected by straight microwave lines realize the output of the radio frequency signal after the signal is mixed twice. The straight microwave lines connect the components of each circuit excluding the shell, which solves the problems of large signal transmission loss and large heat dissipation in a curved line, and realizes the microwave integration of the Ku up-conversion component. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A first principle block diagram of a Ku up-conversion component provided in an embodiment of the present application;

[0017] Figure 2 A schematic diagram of the circuit board structure of a Ku up-conversion component provided in one embodiment of the present application;

[0018] Figure 3 The first part of the circuit schematic diagram of the Ku up-conversion component provided in one embodiment of the present application;

[0019] Figure 4 The second part of the circuit schematic diagram of the Ku up-conversion component provided in one embodiment of the present application;

[0020] Figure 5 A first half shell of a Ku up-conversion assembly provided in an embodiment of the present application;

[0021] Figure 6 This is the second half shell of the Ku up-conversion component provided in one embodiment of the present application.

[0022] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0023] It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0024] In the prior art, the length and width of the circuit board 2 are generally 3-5 mm. The circuit board 2 is generally screwed to the housing 1 using surrounding screws. Since the screwed portion of the circuit board 2 has no other use except for the screwed purpose, this causes the circuit board 2 to be 1-2 mm larger than the practical part. In addition, since the components on the circuit board 2 are generally packaged only in the housing 1, the components will occupy too much circuit volume, making the layout of the miniaturized circuit board 2 more difficult. In addition, the connecting lines between the components on the circuit board 2 are generally arranged in a curved manner, which will cause greater transmission losses when the microwave signal is transmitted.

[0025] The present application provides a Ku up-conversion component to solve the above technical problems. Figure 1 A first principle block diagram of a Ku up-conversion component provided in an embodiment of the present application, Figure 2 A schematic diagram of the circuit board structure of a Ku up-conversion component provided in an embodiment of the present application, referring to Figure 1-Figure 2 , the Ku up-conversion component may include a shell 1 and a circuit board 2 welded to the shell 1, wherein the ratio of the length of the circuit board 2 to the length of the shell 1 is less than a first fixed value; the ratio of the width of the circuit board 2 to the width of the shell 1 is less than a second fixed value; the surface layer of the circuit board 2 has a first mixing circuit 3, a second mixing circuit 4, a first output circuit 5, and a second output circuit 6 with multiple straight microwave lines; the input end of the first mixing circuit 3 receives a first pumping signal, and the output end of the first mixing circuit 3 is connected to the input end of the first output circuit 5; the input end of the second mixing circuit 4 receives a second pumping signal, and the output end of the second mixing circuit 4 is connected to the input end of the second output circuit 6; the first mixing The frequency mixing circuit 3 is used to output a first radio frequency signal after mixing the first pump frequency signal twice; the second frequency mixing circuit 4 is used to output a second radio frequency signal after mixing the second pump frequency signal twice; the first output circuit 5 is used to process the first radio frequency signal selected by the first switch 7 to obtain a first radio frequency sub-signal; the second output circuit 6 is used to process the second radio frequency signal selected by the second switch 8 to obtain a second radio frequency sub-signal; the first radio frequency sub-signal and the second radio frequency sub-signal are selected by the third switch 9 to output a third radio frequency signal, wherein the components in the first frequency mixing circuit 3, the second frequency mixing circuit 4, the first output circuit 5, and the second output circuit 6 do not include a housing.

[0026] Among them, the first constant and the second constant can both be 0.7, and the ratio of the length and width of the circuit board 2 of the Ku upconverter to the length and width of the housing 1 is less than a certain value, which can ensure that the volume of the circuit board 2 of the Ku upconverter is smaller than the volume of the circuit board on the market, thereby improving the integration of components of the circuit board 2. It should be noted that the length and width of the housing 1 mentioned here refer to the average length and width of the housing 1 used by all Ku upconverter components on the market. The circuit board 2 can be a PCB circuit board.

[0027] Specifically, the Ku up-conversion component processes the input first pumping signal and the second pumping signal through the first mixing circuit 3 and the second mixing circuit 4, respectively, to obtain the corresponding first RF signal and the second RF signal. The first mixing circuit 3 and the second mixing circuit 4 are connected to the first output circuit 5 and the second output circuit 6 through the first switch 7 and the second switch 8, respectively. The first output circuit 5 processes the first RF signal selected by the first switch 7 to obtain the first RF sub-signal; the second output circuit 6 processes the second RF signal selected by the second switch 8 to obtain the second RF sub-signal; the first RF sub-signal and the second RF sub-signal are selected by the third switch 9 to output the third RF signal. The embodiment of the present application uses a plurality of straight microwave lines to connect the first mixing circuit 3, the second mixing circuit 4, the first output circuit 5, and the second output circuit 6, shortening the length of the connecting lines of each circuit, thereby reducing the loss of the signal during transmission.

[0028] Exemplarily, the first pump frequency signal and the second pump frequency signal can both be two 720MHz output signals from the signal processor. After the two 720MHz output signals are processed by the first mixer circuit 3 and the second mixer circuit 4, two 17.25GHz RF signals are outputted accordingly. After the two 17.25GHz RF signals are processed by the first output circuit 5 and the second output circuit 6 for amplification coupling, power amplification, isolation filtering, two same-frequency signals are obtained, and the two same-frequency signals are outputted as a phased array RF excitation signal after being selected by the switch.

[0029] In an embodiment of the present application, the circuit board 2 includes a bottom layer and a conductive layer, an insulating layer and a surface layer stacked in sequence on the bottom layer; the first output circuit 5 includes a first coupling circuit 10 and a first sub-circuit 5-1 and a second sub-circuit 5-2 respectively connected to the first coupling circuit 10; the second output circuit 6 includes a second coupling circuit 11 and a third sub-circuit 6-1 and a fourth sub-circuit 6-2 respectively connected to the second coupling circuit 11; the second sub-circuit 5-2 and the third sub-circuit 6-1 are connected to the test signal output terminal 22 after being aggregated by a power divider 12; the test signal output terminal 22 is connected to the input end of a test signal output line 21 located on the surface layer of the circuit board 2 after punching and changing layers, and the output end of the test signal output line 21 is connected to the first An output interface 13, wherein the first coupling circuit 10 is used to process the first RF signal selected by the first switch 7 to obtain a first coupling signal and a second coupling signal; the second coupling circuit 11 is used to process the second RF signal selected by the second switch 8 to obtain a third coupling signal and a fourth coupling signal; the second sub-circuit 5-2 is used to process the second coupling signal to obtain a first sub-test signal; the third sub-circuit 6-1 is used to process the third coupling signal to obtain a second sub-test signal; the first sub-test signal and the second sub-test signal are aggregated by the power divider 12 to obtain a test output signal; the test output signal is output to the first output interface 13 via a straight test signal output line 21; the first output interface 13 is located on the first side wall of the circuit board 2.

[0030] Specifically, the first output circuit 5 is divided into a first subcircuit 5-1 and a second subcircuit 5-2 with the first coupling circuit 10 as a node, and the second output circuit 6 is divided into a third subcircuit 6-1 and a fourth subcircuit 6-2 with the second coupling circuit 11 as a node. The second subcircuit 5-2 and the third subcircuit 6-1 are connected to the test signal output terminal 22 after being aggregated by the power divider 12. After the test signal output terminal 22 reaches the conductive layer of the circuit board 2 by punching and changing layers, it bypasses the first output circuit 5 located on the surface of the circuit board 2, and then punches and changes layers to the surface layer, and is connected to one end of the test signal output line 21, and the other end of the test signal output line 21 is connected to the first output interface 13.

[0031] In an embodiment of the present application, the first subcircuit 5-1 and the fourth subcircuit 6-2 are both connected to the third switch 9, and the third switch 9 is connected to the RF signal output end; the RF signal output end is connected to the second output interface 14 of the circuit board 2; wherein, the first subcircuit 5-1 is used to process the first coupling signal to obtain the first RF sub-signal; the fourth subcircuit 6-2 is used to process the fourth coupling signal to obtain the second RF sub-signal; the first RF sub-signal and the second RF sub-signal are selected by the third switch 9 to output the third RF signal to the second output interface 14; the second output interface 14 is located on the second side wall of the circuit board 2, and the first side wall and the second side wall are arranged relative to each other.

[0032] Specifically, the second output interface 14 is disposed on the second side wall of the circuit board 2, and the first side wall and the second side wall are opposite to each other, thereby improving the space utilization of the circuit board 2. The test output signal and the RF output signal are separated from each other, thereby reducing interference between them.

[0033] In an embodiment of the present application, the Ku up-conversion component may also include a third output circuit 15 and a fourth output circuit 16, wherein the input end of the third output circuit 15 is connected to the output end of the first mixing circuit 3; the input end of the fourth output circuit 16 is connected to the output end of the second mixing circuit 4; the output ends of the third output circuit 15 and the fourth output circuit 16 are both connected to the fourth switch 23, and the fourth switch 23 is connected to the third output interface 17 through the verification signal output line; the third output interface 17 is located on the third side wall of the circuit board 2, and the third side wall is connected to the first side wall and the second side wall; the third output circuit 15 is used to process the first RF signal selected by the first switch 7 to obtain a first check sub-signal; the fourth output circuit 16 is used to process the second RF signal selected by the second switch 8 to obtain a second check sub-signal; the first check sub-signal and the second check sub-signal are selected by the fourth switch 23 and output a calibration signal through the third output interface 17.

[0034] Specifically, the third output interface 17 is located on the third side wall of the circuit board 2, and the third side wall connects the first side wall and the second side wall. The third output interface 17, the first output interface 13 and the second output interface 14 are respectively located on three adjacent side walls of the circuit board 2, and are isolated from each other to avoid the separation of high-frequency signals, thereby improving the space utilization of the circuit board 2. Moreover, the straight microwave lines are arranged according to the signal flow, and the orthographic projections of the straight microwave lines on the bottom layer will not overlap, thereby avoiding mutual interference of signals.

[0035] In an embodiment of the present application, the first mixing circuit 3, the second mixing circuit 4, the first output circuit 5, the second output circuit 6, the third output circuit 15 and the fourth output circuit 16 all include multiple components and straight microwave lines connecting the multiple components, and at least two adjacent straight microwave lines are at right angles.

[0036] It should be noted that two adjacent straight microwave lines at right angles can minimize the bending of the microwave lines, thereby minimizing the loss. The straight microwave lines connecting various circuit components have very few right angles except for necessary bends, which can further avoid signal loss.

[0037] Figure 3 The first part of the circuit schematic diagram of the Ku up-conversion component provided in an embodiment of the present application is referred to as Figure 3In an embodiment of the present application, the first mixing circuit 3 and the second mixing circuit 4 may each include a gain control circuit, a frequency conversion circuit and a first filtering circuit connected in sequence, wherein the gain control circuit, the frequency conversion circuit and the first filtering circuit all have a chip after the shell 1 is removed.

[0038] Specifically, the first mixer circuit 3 and the second mixer circuit 4 may include: a first fixed attenuator 3-1, a first radio frequency switch 3-2, two groups of pre-selection filters 3-3 to be selected, a second fixed attenuator 3-4, a first mixer 3-5, a dielectric filter 3-6, a temperature-compensated attenuator 3-7, a first amplifier 3-11, a third fixed attenuator 3-15, a second mixer 3-8, a first band-pass filter 3-9, a first digitally controlled attenuator 3-10, a second amplifier 3-14, a second digitally controlled attenuator 3-12, and a second band-pass filter 3-13, which are sequentially connected in series. The instantaneous bandwidths of the two groups of pre-selection filters 3-3 to be selected are 100MHz and 240MHz respectively.

[0039] In an embodiment of the present application, the circuit board 2 includes a bottom layer and a conductive layer, an insulating layer and a surface layer stacked in sequence on the bottom layer; the second mixing circuit 4 is the same as the first mixing circuit 3 and is respectively located on both sides of the verification signal output line, and the first mixing circuit 3 and the second mixing circuit 4 can both include a first local oscillator circuit, a second local oscillator circuit and a first signal circuit, wherein the output end of the first local oscillator circuit is connected to the first mixing circuit 3 / the second mixing circuit 4, the input end of the first local oscillator circuit is connected to the first input interface 18, and the first input interface 18 is located on the third side wall of the circuit board 2; the output end of the second local oscillator circuit is connected to the first mixing circuit 3 / the second mixing circuit 4, the input end of the second local oscillator circuit is connected to the second input interface 19, and the second input interface 19 is located on the third side wall of the circuit board 2; the output end of the first signal circuit is connected to the first mixing circuit 3 / the second mixing circuit 4, and the input end of the first signal circuit is connected to the third input interface located on the surface of the bottom layer.

[0040] It should be noted that the first local oscillator circuit and the second local oscillator circuit both include two circuits at right angles, one of which is perpendicular to an edge of the circuit board 2. The first signal line includes a U-shaped line with a right angle at the bottom and a straight line connected to the bottom of the U-shaped line, the straight line is perpendicular to an edge of the circuit board 2, and the first local oscillator circuit and the second local oscillator circuit are both located on both sides of the straight line.

[0041] Figure 4 The second part of the circuit schematic diagram of the Ku up-conversion component provided in one embodiment of the present application is referred to as Figure 4In an embodiment of the present application, the first sub-circuit 5-1 may include a first power amplifier circuit, a first isolation circuit and a second filtering circuit connected in sequence; the second sub-circuit 5-2 may include a first attenuation circuit and a second power amplifier circuit connected in sequence; the third sub-circuit 6-1 may include a second attenuation circuit and a third power amplifier circuit connected in sequence; the fourth sub-circuit 6-2 may include a fourth power amplifier circuit, a second isolation circuit and a third filtering circuit connected in sequence; wherein the first power amplifier circuit, the first isolation circuit, the second filtering circuit, the first attenuation circuit, the second power amplifier circuit, the second attenuation circuit, the third power amplifier circuit, the fourth power amplifier circuit, the second isolation circuit and the third filtering circuit all have a chip after the shell 1 is removed.

[0042] Specifically, the first subcircuit 5-1 and the fourth subcircuit 6-2 may each include a second amplifier 5-1-1, a third fixed attenuator 5-1-2, a power amplifier 5-1-3, an isolator 5-1-4, and a digital filter 5-1-5 connected in series. The second subcircuit 5-2 and the third subcircuit 6-1 may each include a fourth fixed attenuator 5-2-1 and a third amplifier 5-2-2 connected in series.

[0043] In an embodiment of the present application, the third output circuit 15 may include a first power management circuit; the fourth output circuit 16 includes a second power management circuit; wherein the chips in the first power management circuit and the second power management circuit are both chips after the shell 1 is removed.

[0044] Specifically, the first power management circuit and the second power management circuit can both be power splitters. The power splitters in the embodiments of the present utility model are all abbreviations of power distributors.

[0045] Figure 5 The first half shell of the Ku up-conversion component provided in one embodiment of the present application, Figure 6 The second half shell of the Ku up-conversion assembly provided in one embodiment of the present application, refer to Figure 5 and Figure 6 In an embodiment of the present application, the shell 1 may include a first half shell 1-1 and a second half shell 1-2, wherein a groove for a circuit board 2 is welded on the inner wall of the first half shell 1-1, and notches for accommodating a first output interface 13, a second output interface 14, a third output interface 17 and two first input interfaces 18 and a second input interface 19 are provided on the outer wall, and a physical interface for connecting the third input interface is provided on the outer wall of the first half shell 1-1; the second half shell 1-2 is arranged opposite to the first half shell 1-1, and is screwed to the first half shell 1-1.

[0046] Specifically, the circuit board 2 is located in the cavity between the first half shell 1-1 and the second half shell 1-2, and the first half shell 1-1 and the second half shell 1-2 are screwed to each other through threaded holes around each straight microstrip line of the circuit board 2, thereby increasing the stability of the connection between the shell 1 and the circuit board 2.

[0047] The above are only preferred embodiments of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A Ku up-conversion component, characterized in that: include: A housing (1) and a circuit board (2) welded to the housing (1); The ratio of the length of the circuit board (2) to the length of the housing (1) is less than a first fixed value; The ratio of the width of the circuit board (2) to the width of the housing (1) is smaller than a second fixed value; The surface layer of the circuit board (2) has a first frequency mixing circuit (3), a second frequency mixing circuit (4), a first output circuit (5), and a second output circuit (6) having a plurality of straight microwave lines, wherein each component in the first frequency mixing circuit (3), the second frequency mixing circuit (4), the first output circuit (5), and the second output circuit (6) does not include a housing; The input end of the first frequency mixing circuit (3) receives the first pump frequency signal, and the output end of the first frequency mixing circuit (3) is connected to the input end of the first output circuit (5); The input end of the second frequency mixing circuit (4) receives the second pump frequency signal, and the output end of the second frequency mixing circuit (4) is connected to the input end of the second output circuit (6); The first frequency mixing circuit (3) is used to mix the first pump frequency signal twice to output a first radio frequency signal; the second frequency mixing circuit (4) is used to mix the second pump frequency signal twice to output a second radio frequency signal; The first output circuit (5) is used for processing the first radio frequency signal selected by the first switch (7) to obtain a first radio frequency sub-signal; the second output circuit (6) is used for processing the second radio frequency signal selected by the second switch (8) to obtain a second radio frequency sub-signal; The first radio frequency sub-signal and the second radio frequency sub-signal are selected by a third switch (9) to output a third radio frequency signal.

2. The Ku up-conversion component according to claim 1, characterized in that: The circuit board (2) comprises a bottom layer, and a conductive layer, an insulating layer and a surface layer which are sequentially stacked on the bottom layer; The first output circuit (5) comprises: a first coupling circuit (10) and a first subcircuit (5-1) and a second subcircuit (5-2) respectively connected to the first coupling circuit (10); the second output circuit (6) comprises: a second coupling circuit (11) and a third subcircuit (6-1) and a fourth subcircuit (6-2) respectively connected to the second coupling circuit (11); The second sub-circuit (5-2) and the third sub-circuit (6-1) are connected to a test signal output terminal (22) after being aggregated through a power divider; The test signal output end (22) is connected to the input end of a test signal output line (21) located on the surface layer of the circuit board (2) by punching and changing layers, and the output end of the test signal output line (21) is connected to a first output interface (13); The first coupling circuit (10) is used to process the first radio frequency signal selected by the first switch (7) to obtain a first coupling signal and a second coupling signal; The second coupling circuit (11) is used to process the second radio frequency signal selected by the second switch (8) to obtain a third coupling signal and a fourth coupling signal; The second sub-circuit (5-2) is used for processing the second coupling signal to obtain a first sub-test signal; The third sub-circuit (6-1) is used for processing the third coupling signal to obtain a second sub-test signal; The first sub-test signal and the second sub-test signal are aggregated by the power divider to obtain a test output signal; The test output signal is output to the first output interface (13) via the straight test signal output line (21); The first output interface (13) is located on a first side wall of the circuit board (2).

3. The Ku up-conversion component according to claim 2, characterized in that: The first subcircuit (5-1) and the fourth subcircuit (6-2) are both connected to a third switch (9), and the third switch (9) is connected to a radio frequency signal output terminal; the radio frequency signal output terminal is connected to a second output interface (14) of the circuit board (2); Wherein, the first sub-circuit (5-1) is used to process the first coupled signal to obtain a first radio frequency sub-signal; The fourth sub-circuit (6-2) is used for processing the fourth coupled signal to obtain a second radio frequency sub-signal; The first radio frequency sub-signal and the second radio frequency sub-signal are selected by a third switch (9) to output a third radio frequency signal to a second output interface (14); The second output interface (14) is located on a second side wall of the circuit board (2), and the first side wall and the second side wall are arranged opposite to each other.

4. The Ku up-conversion component according to claim 3, characterized in that: The Ku up-conversion component also includes: A third output circuit (15), an input end of which is connected to the output end of the first mixing circuit (3); a fourth output circuit (16), the input end of which is connected to the output end of the second frequency mixing circuit (4); The output ends of the third output circuit (15) and the fourth output circuit (16) are both connected to a fourth switch (23), and the fourth switch (23) is connected to a third output interface (17) via a verification signal output line; The third output interface (17) is located on a third side wall of the circuit board (2), and the third side wall connects the first side wall and the second side wall; The third output circuit (15) is used to process the first radio frequency signal selected by the first switch (7) to obtain a first syndrome signal; The fourth output circuit (16) is used for processing the second radio frequency signal selected by the second switch (8) to obtain a second syndrome signal; The first syndrome signal and the second syndrome signal are selected by a fourth switch (23) to output a calibration signal via a third output interface (17).

5. The Ku up-conversion component according to claim 4, characterized in that: The first frequency mixing circuit (3), the second frequency mixing circuit (4), the first output circuit (5), the second output circuit (6), the third output circuit (15) and the fourth output circuit (16) all comprise a plurality of components and straight microwave lines connecting the plurality of components, and at least two adjacent straight microwave lines form a right angle.

6. The Ku up-conversion component according to claim 1, characterized in that: The first frequency mixing circuit (3) and the second frequency mixing circuit (4) both comprise: a gain control circuit, a frequency conversion circuit and a first filter circuit connected in sequence, wherein the gain control circuit, the frequency conversion circuit and the first filter circuit all have a chip after the housing (1) is removed.

7. The Ku up-conversion component according to claim 4, characterized in that: The circuit board (2) comprises a bottom layer, and a conductive layer, an insulating layer and a surface layer stacked in sequence on the bottom layer; the second frequency mixing circuit (4) is the same as the first frequency mixing circuit (3) and is respectively located on both sides of the verification signal output line, and the first frequency mixing circuit (3) and the second frequency mixing circuit (4) both comprise: A first local oscillator circuit, the output end of which is connected to the first mixing circuit (3) / the second mixing circuit (4), the input end of which is connected to a first input interface (18), and the first input interface (18) is located on a third side wall of the circuit board (2); A second local oscillator circuit, the output end of which is connected to the first mixing circuit (3) / the second mixing circuit (4), the input end of which is connected to a second input interface (19), and the second input interface (19) is located on a third side wall of the circuit board (2); The first signal line has an output end connected to the first mixing circuit (3) / the second mixing circuit (4), and an input end connected to a third input interface located on the surface of the bottom layer.

8. The Ku up-conversion component according to claim 2, characterized in that: The first sub-circuit (5-1) comprises: a first power amplifier circuit, a first isolation circuit and a second filter circuit connected in sequence; The second sub-circuit (5-2) comprises: a first attenuation circuit and a second power amplification circuit connected in sequence; The third sub-circuit (6-1) comprises: a second attenuation circuit and a third power amplification circuit connected in sequence; The fourth sub-circuit (6-2) comprises: a fourth power amplifier circuit, a second isolation circuit and a third filter circuit connected in sequence; The first power amplifier circuit, the first isolation circuit, the second filtering circuit, the first attenuation circuit, the second power amplifier circuit, the second attenuation circuit, the third power amplifier circuit, the fourth power amplifier circuit, the second isolation circuit and the third filtering circuit all have a chip after the housing (1) is removed.

9. The Ku up-conversion component according to claim 4, characterized in that: The third output circuit (15) comprises: a first power management circuit; The fourth output circuit (16) comprises: a second power management circuit; The first power management circuit and the second power management circuit both have a chip with the housing (1) removed.

10. The Ku up-conversion component according to claim 7, characterized in that: include: A first half shell (1-1), the inner wall of which is welded with a groove for a circuit board (2), and the outer wall is provided with notches for accommodating the first output interface (13), the second output interface (14), the third output interface (17) and the two first input interfaces (18), and the second input interface (19), and the outer wall of the first half shell (1-1) is provided with a physical interface for connecting the third input interface; The second half shell (1-2) is arranged opposite to the first half shell (1-1) and is screwed to the first half shell (1-1).

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