X-ray detection device for wet etching equipment and wet etching equipment

Abstract

The utility model provides an X-ray detection device for wet etching equipment and wet etching equipment, including: an X-ray emitter, which is arranged in an etching groove and is used to emit X-rays to a wafer placed on a lifter; a digital detector, which is arranged in the etching groove and is arranged horizontally relative to the X-ray emitter, and the digital detector is used to receive X-rays transmitted through the wafer and generate an X-ray detection image of the wafer; a controller, which is controlled and connected with the X-ray emitter and the digital detector, and the controller is used to determine whether the wafer is tilted according to the wafer area in the X-ray detection image, and then determine whether the lifter is tilted. The utility model can automatically detect whether the wafer placed on the lifter is tilted through the X-ray emitter, the digital detector and the controller, and if the wafer is tilted, the lifter is also tilted, thereby improving the detection efficiency and avoiding contamination of the card slot during the test process.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to an X-ray detection device for wet etching equipment and the wet etching equipment. Background Art

[0002] Existing wet etching equipment includes an etching tank and an elevator. The elevator includes a mechanical arm and a slot for placing wafers. The wafer can be taken out or put into the etching tank by lifting the mechanical arm. During the long-term use of the elevator, if the elevator is not adjusted in time, the elevator may tilt, which in turn causes the wafer to tilt. The tilted wafer surface is prone to defects, which in turn affects product quality.

[0003] At present, the commonly used method to detect whether the lifter is tilted is to place a horizontal plate on the slot of the robot arm and then use a level to measure the inclination of the horizontal plate. This manual measurement method is cumbersome, requires testing on the spot, and may contaminate the slot during the test.

[0004] In view of this, it is necessary to propose an X-ray detection device for wet etching equipment and a wet etching equipment to solve the above problems. Utility Model Content

[0005] The utility model aims to provide an X-ray detection device for wet etching equipment and wet etching equipment, so as to improve the problem that the existing detection method is complicated and may cause pollution.

[0006] The utility model provides an X-ray detection device for wet etching equipment, comprising:

[0007] An X-ray emitter is disposed in the etching tank and is used to emit X-rays to the wafer placed on the elevator;

[0008] a digital detector, disposed in the etching groove and arranged horizontally opposite to the X-ray emitter, the digital detector being used to receive the X-rays transmitted through the wafer and generate an X-ray detection image of the wafer;

[0009] A controller is connected to the X-ray emitter and the digital detector, and is used to determine whether the wafer is tilted according to the wafer area in the X-ray detection image, and further determine whether the lifter is tilted.

[0010] In a possible embodiment, the controller includes:

[0011] an area comparison unit, for comparing the detected area of ​​the wafer region in the X-ray detection image with the actual area of ​​the wafer, so as to determine whether the wafer is tilted, and further determine whether the lifter is tilted; or,

[0012] The image comparison unit is used to compare the wafer area in the X-ray detection image with the X-ray standard image of the wafer to determine whether the wafer is tilted, and further determine whether the lifter is tilted.

[0013] In a possible embodiment, in the case where the controller includes the area comparison unit, the area comparison unit includes:

[0014] A first edge detection unit, configured to obtain edge point information of the wafer area by using an edge detection algorithm, wherein the edge point information includes outer contour point information;

[0015] An area calculation unit connected to the first edge detection unit, the area calculation unit being used to calculate the detection area of ​​the wafer area according to the outer contour point information;

[0016] The tilt judging unit is connected to the area calculating unit, and is used to calculate the difference between the detection area and the standard area. If the difference is less than or equal to a preset value, it is judged that the lifter is not tilted; if the difference is greater than the preset value, it is judged that the lifter is tilted.

[0017] In a possible embodiment, in the case where the controller includes the graphic comparison unit, the graphic comparison unit includes:

[0018] A second edge detection unit, configured to obtain edge point information of the wafer area by using an edge detection algorithm, wherein the edge point information includes outer contour point information;

[0019] A contour matching unit is connected to the second edge detection unit, and is used to match the outer contour points of the wafer area with the outer contour points of the X-ray standard image to obtain a similarity value. If the similarity value is less than or equal to the standard value, it is determined that the lifter is not tilted; if the similarity value is greater than the standard value, it is determined that the lifter is tilted.

[0020] In a possible embodiment, the controller further includes:

[0021] An angle calculation unit is used to calculate the minor axis through an ellipse fitting algorithm according to the outer contour point information when the judgment result is that the lifter is tilted, and calculate the tilt angle of the wafer according to the minor axis and the actual diameter of the wafer.

[0022] In a possible embodiment, the controller also includes a crack judgment unit, which is used to remove the outer contour point information from the edge point information to obtain remaining point information, extract the remaining point area from the wafer area according to the remaining point information, extract the detected texture features of the remaining point area, compare the detected texture features with the standard texture features of the wafer, and determine whether the remaining point area has cracks.

[0023] In a possible embodiment, the controller further includes:

[0024] An image acquisition unit connected to the digital detector, the image acquisition unit being used to acquire the X-ray detection image from the digital detector;

[0025] An image segmentation unit is connected to the image acquisition unit, and is used to segment a wafer area from the X-ray detection image using an image segmentation technique.

[0026] In a possible embodiment, the X-ray emitter has a first shell enclosing the internal components of the X-ray emitter, and the first shell is made of a material that is resistant to high temperature, acid and alkali and can transmit X-rays; and / or,

[0027] The digital detector has a second shell which encloses the internal components of the digital detector. The second shell is made of a material which is resistant to high temperature, acid and alkali and can transmit X-rays.

[0028] In a possible embodiment, the X-ray detection device further includes an alarm connected to the controller, and when the judgment result is that the lifter is tilted, the controller controls the alarm to sound an alarm.

[0029] The present invention also provides a wet etching device, comprising the X-ray detection device in any of the above embodiments.

[0030] The X-ray detection device for the wet etching equipment lifter provided by the utility model has the beneficial effect that: through the X-ray emitter, the digital detector and the controller, it is possible to automatically detect whether the wafer placed on the lifter is tilted, and if the wafer is tilted, the lifter is also tilted. In a further scheme, it is also possible to detect whether there are cracks on the wafer. In a further scheme, the X-ray emitter and the digital detector are protected by using a shell made of a material that is resistant to high temperature, acid and alkali and can transmit X-rays. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic diagram of the X-ray detection device of the wet etching equipment lifter of the utility model.

[0032] Figure 2This is a schematic diagram of an X-ray emitter and a digital detector in an X-ray detection device of a wet etching equipment lifter of the utility model when detecting cracks.

[0033] Figure 3 It is a schematic diagram of wafer projection when the wafer is tilted in the X-ray detection device of the wet etching equipment lifter of the utility model.

[0034] Figure 4 It is a schematic diagram of a controller in an X-ray detection device of a wet etching equipment lifter of the utility model in a first specific embodiment.

[0035] Figure 5 It is a schematic diagram of a controller in an X-ray detection device of a wet etching equipment lifter of the utility model in a second specific embodiment.

[0036] Explanation of the reference numerals: X-ray emitter 110; digital detector 120; controller 130; image acquisition unit 131; filter 132; image segmentation unit 133; area comparison unit 134; first edge detection unit 1341; area calculation unit 1342; tilt judgment unit 1343; graphic comparison unit 135; second edge detection unit 1351; contour matching unit 1352; angle calculation unit 136; fragment judgment unit 137; alarm 140; etching groove 200; wafer 300. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the technical solution in the embodiments of the utility model will be described clearly and completely below. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0038] In view of the problems existing in the prior art, the embodiment of the utility model provides an X-ray detection device for wet etching equipment, see Figure 1 and Figure 2The X-ray detection device includes: an X-ray emitter 110, a digital detector 120 and a controller 130. The X-ray emitter 110 is arranged in the etched groove 200 and is used to emit X-rays to the wafer 300 placed on the elevator (not shown in the figure). The digital detector 120 is arranged in the etched groove 200 and is arranged relative to the X-ray emitter 110 in the horizontal direction. The digital detector 120 is used to receive X-rays transmitted through the wafer 300 and generate an X-ray detection image of the wafer 300. The controller 130 is controlled and connected with the X-ray emitter 110 and the digital detector 120. The controller 130 is used to determine whether the wafer 300 is tilted according to the wafer area in the X-ray detection image, and then determine whether the elevator is tilted. The digital detector 120 and the X-ray emitter 110 are arranged relative to each other in the horizontal direction, so that the X-rays are emitted in the horizontal direction, and the X-ray detection image is also a forward projection image. It should be noted that the X-ray standard image is an X-ray image of a portion of the wafer 300 taken by forward projection when the wafer 300 is not tilted.

[0039] In this embodiment, the controller 130 controls the X-ray emitter 110 and the digital detector 120 to achieve automated detection. The controller 130 then analyzes the wafer area in the X-ray detection image to obtain the detection result. For example, by determining whether the shape and size of the wafer area projected in the forward direction have changed, it can be inferred whether the wafer 300 is tilted, that is, whether the lifter is tilted. Automated detection and judgment reduces the tedious steps of manual operation and improves detection efficiency. Since X-rays can penetrate objects, there is no need to directly contact the wafer 300 or the card slot. The contactless detection method avoids contamination of the card slot and the wafer 300 during the test process.

[0040] In some embodiments, the controller 130 includes: an area comparison unit 134, which is used to compare the detection area of ​​the wafer area in the X-ray detection image with the actual area of ​​the wafer 300 to determine whether the wafer 300 is tilted, and then determine whether the lifter is tilted; or, a graphic comparison unit 135, which is used to compare the wafer area in the X-ray detection image with the X-ray standard image of the wafer 300 to determine whether the wafer 300 is tilted, and then determine whether the lifter is tilted.

[0041] This solution provides two judgment methods, one judgment method is: area comparison, and the second judgment method is: graphic comparison. When the wafer 300 is not tilted, the X-ray detection image obtained by forward projection is circular; when the wafer 300 is tilted, the X-ray detection image obtained by forward projection becomes elliptical, that is, the shape changes. By comparing the graphics, it is easy to judge whether the lifter is tilted. Since the tilt is usually only a small angle, the projection area after the tilt will also change. By comparing the area, it is also possible to quickly judge whether the lifter is tilted. By storing the X-ray standard images and area data of wafers 300 of different sizes, automatic detection of wafers 300 of different sizes can be achieved.

[0042] In the first specific embodiment, see Figure 4 , in the case where the controller 130 includes an area comparison unit 134, the area comparison unit 134 includes: a first edge detection unit 1341, an area calculation unit 1342, and a tilt judgment unit 1343. The first edge detection unit 1341 is used to obtain edge point information of the wafer area through an edge detection algorithm, and the edge point information includes outer contour point information. The area calculation unit 1342 is connected to the first edge detection unit 1341, and the area calculation unit 1342 is used to calculate the detection area of ​​the wafer area according to the outer contour point information. The tilt judgment unit 1343 is connected to the area calculation unit 1342, and the tilt judgment unit 1343 is used to calculate the difference between the detection area and the standard area. If the difference is less than or equal to the preset value, it is judged that the lifter is not tilted. If the difference is greater than the preset value, it is judged that the lifter is tilted. In this embodiment, the edge detection algorithm can resist a certain degree of image noise and interference, thereby extracting more accurate edge information, ensuring the accuracy of subsequent area calculation, and then ensuring the accuracy of judgment.

[0043] For further information, see Figure 4 , the area calculation unit 1342 calculates the detection area of ​​the wafer area according to the outer contour point information, specifically: according to the outer contour point information, the fitting shape and fitting shape parameters of the wafer area are determined by the shape fitting algorithm, and the detection area of ​​the wafer area is calculated according to the fitting shape parameters, wherein the shape fitting algorithm includes a circle fitting algorithm and an ellipse fitting algorithm, when the fitting shape is a circle, the fitting shape parameter is the radius of the circle, and when the fitting shape is an ellipse, the fitting shape parameter is the major axis and minor axis of the ellipse. In this embodiment, the shape fitting algorithm usually has a certain noise suppression capability, and can eliminate the noise and interference generated during the image acquisition process to a certain extent.

[0044] Preferably, when determining the fitting shape of the wafer area, the circular fitting error and the ellipse fitting error are calculated using the circular fitting algorithm and the ellipse fitting algorithm respectively, and the shape of the wafer area is determined according to the circular fitting error and the ellipse fitting error. If the circular fitting error is small, the wafer area is close to a circle; if the ellipse fitting error is small, the wafer area is closer to an ellipse, and it is possible to accurately determine whether the shape of the wafer area is a circle or an ellipse, thereby selecting the correct fitting shape parameters for area calculation.

[0045] In the second specific embodiment, see Figure 5 , in the case where the controller 130 includes a graphic comparison unit 135, the graphic comparison unit 135 includes a second edge detection unit 1351 and a contour matching unit 1352, the second edge detection unit 1351 is used to obtain edge point information of the wafer area through an edge detection algorithm, and the edge point information includes outer contour point information. The contour matching unit 1352 is connected to the second edge detection unit 1351, and the contour matching unit 1352 is used to match the outer contour points of the wafer area with the outer contour points of the X-ray standard image to obtain a similarity value. If the similarity value is less than or equal to the standard value, it is determined that the lifter is not tilted, and if the similarity value is greater than the standard value, it is determined that the lifter is tilted. In this embodiment, by comparing the outer contour points of the wafer area with the outer contour points of the X-ray standard image, the similarity value between the two is calculated. This contour-based matching method can capture subtle differences in shape and size, thereby more accurately determining whether the lifter is tilted, and improving the accuracy of tilt judgment.

[0046] In the actual production process, the wafer 300 needs to be placed vertically in the slot of the elevator (i.e., in a non-tilted state). Usually, the wafer 300 is only tilted in the left and right directions. Figure 1 In the embodiment, it can be understood that the tilt is toward the X-ray emitter 110 or the digital detector 120. The tilt angle detection in this solution is only for the tilt in the left and right directions. Figure 4 and Figure 5 The controller 130 further includes an angle calculation unit 136, which is used to calculate the short axis L by an ellipse fitting algorithm according to the outer contour point information when the judgment result is that the lifter is tilted, see Figure 3, the tilt angle β of the wafer 300 is calculated according to the minor axis L and the actual diameter d of the wafer 300. After the tilt in the front-to-back direction occurs, the distance between the two endpoints of the wafer 300 projected in the up-down direction (i.e., the minor axis L of the ellipse) will become smaller, and the tilt angle β=arccos(L / d) is calculated. In this embodiment, the tilt angle is calculated using an ellipse fitting algorithm and a trigonometric function relationship, thereby improving the accuracy of detection. The detected tilt angle can guide the angle adjustment of the lifter. Specifically, for the area comparison unit 134, the angle calculation unit 136 is connected to the tilt judgment unit 1343, and for the graphic comparison unit 135, the angle calculation unit 136 is connected to the contour matching unit 1352.

[0047] In a preferred embodiment, see Figure 2 , Figure 4 and Figure 5 , the controller 130 further includes 1341 a crack judgment unit 137, and the crack judgment unit 137 is connected to the first edge detection unit 1341 for the area comparison unit 134; and the crack judgment unit 137 is connected to the second edge detection unit 1351 for the graphic comparison unit 135. The crack judgment unit 137 is used to remove the outer contour point information from the edge point information to obtain the remaining point information, extract the remaining point area from the wafer area according to the remaining point information, extract the detection texture features of the remaining point area, compare the detection texture features with the standard texture features of the wafer 300, and judge whether there is a crack in the remaining point area. In this embodiment, the X-ray emitter 110 emits X-rays, and when the X-rays penetrate the wafer 300, the intensity of the X-rays will be attenuated due to the absorption and scattering of the wafer 300, and the degree of attenuation depends on the thickness and density of the wafer 300. When there is a defect in the wafer 300, the thickness and density of the defective part change, and the intensity of the rays passing through the intact part without defects and the defective part is different, so that the photosensitivity of the digital detector 120 is different. The digital detector 120 processes the received electrical signal and outputs a black and white X-ray image. Based on the difference between the texture of the defective part and the texture of the non-defective part, it can be identified whether the wafer 300 has a crack. The edge points of the wafer area include outer contour points (i.e., points at the edge contour of the wafer 300) and edge points on the surface of the wafer 300 (points that may be cracks). The standard texture features of the wafer 300 are a set of texture features pre-collected and established from the standard wafer 300 (crack-free wafer 300). By comparing the detected texture features of the remaining point area (the area that may be cracked) with the standard texture features, it can be determined whether the remaining point area has a crack, thereby realizing automatic detection and identification of cracks in the wafer 300 and improving the accuracy and efficiency of detection.

[0048] In a preferred embodiment, see Figure 4 and Figure 5, the controller 130 further includes an image acquisition unit 131 and an image segmentation unit 133. The image acquisition unit 131 is connected to the digital detector 120. The image acquisition unit 131 is used to acquire an X-ray detection image from the digital detector 120. The image segmentation unit 133 is connected to the image acquisition unit 131. The image segmentation unit 133 is used to segment a wafer area from the X-ray detection image using an image segmentation technique. For the area comparison unit 134, a first edge detection unit 1341 is connected to the image segmentation unit 133; for the graphic comparison unit 135, a second edge detection unit 1351 is connected to the image segmentation unit 133. In this embodiment, before the comparison is performed, the image segmentation technique is first used to remove background information irrelevant to the wafer 300 in the X-ray detection image to obtain the wafer area, thereby improving the accuracy of the analysis. Subsequently, only the wafer area will be processed and analyzed, thereby reducing the complexity and amount of calculation of data processing.

[0049] In one embodiment, see Figure 4 and Figure 5 The controller 130 also includes a filter 132 connected to the image acquisition unit 131, which is used to filter and denoise the X-ray detection image to obtain a filtered image. The image segmentation unit 133 is connected to the filter 132, and the image segmentation unit 133 uses image segmentation technology to segment the wafer area from the X-ray detection image, specifically used to: segment the wafer area from the filtered image using image segmentation technology. In this embodiment, the function of the filter 132 is to remove noise interference in the X-ray detection image, and the filtered image is clearer, which is conducive to the subsequent image segmentation unit 133 to more accurately identify the wafer area and improve the accuracy of segmentation.

[0050] It should be noted that see Figure 4 and Figure 5 In this solution, the area comparison unit 134, the first edge detection unit 1341, the area calculation unit 1342, the tilt judgment unit 1343, the graphic comparison unit 135, the second edge detection unit 1351, the contour matching unit 1352, the angle calculation unit 136, the fragment judgment unit 137, the image acquisition unit 131, the image segmentation unit 133, and the filter 132 are all hardware components integrated on the controller 130.

[0051] In some possible embodiments, the X-ray emitter 110 has a first shell that encloses the internal components of the X-ray emitter 110, and the first shell is made of a material that is resistant to high temperature, acid and alkali, and can transmit X-rays; and / or, the digital detector 120 has a second shell that encloses the internal components of the digital detector 120, and the second shell is made of a material that is resistant to high temperature, acid and alkali, and can transmit X-rays. Specifically, the material that is resistant to high temperature, acid and alkali, and can transmit X-rays can be ceramic, glass, and other materials. In this embodiment, the first shell and the second shell have the performance of transmitting X-rays, ensuring that X-rays can pass through the first shell and the second shell and transmit to the surface of the wafer 300. The first shell and the second shell are also resistant to high temperature and acid and alkali, so as to prevent the X-ray emitter 110 and the digital detector 120 from being corroded by the etching solution.

[0052] In one embodiment, see Figure 4 and Figure 5 The X-ray detection device also includes an alarm 140 connected to the controller 130. When the judgment result is that the lifter is tilted, the controller 130 controls the alarm 140 to issue an alarm. Specifically, the alarm 140 includes an alarm light and / or an alarm speaker. In this embodiment, when the controller 130 detects that the lifter is tilted, the alarm 140 is immediately controlled to issue an alarm signal to promptly remind the operator to take corresponding measures. Specifically, for the area comparison unit 134, the alarm 140 is connected to the tilt judgment unit 1343, and for the graphic comparison unit 135, the alarm 140 is connected to the contour matching unit 1352.

[0053] The present invention also provides a wet etching device, comprising the X-ray detection device in any of the above embodiments.

[0054] Although the embodiments of the utility model are described in detail above, it is obvious to those skilled in the art that various modifications and changes can be made to these embodiments. However, it should be understood that such modifications and changes are within the scope and spirit of the utility model described in the claims. Moreover, the utility model described herein may have other embodiments and may be implemented or realized in a variety of ways. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with ordinary skills in the field to which the utility model belongs. The words "including" and the like used herein mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

Claims

1. An X-ray detection device for wet etching equipment, characterized in that: include: An X-ray emitter is disposed in the etching tank and is used to emit X-rays to the wafer placed on the elevator; a digital detector, disposed in the etching groove and arranged horizontally opposite to the X-ray emitter, the digital detector being used to receive the X-rays transmitted through the wafer and generate an X-ray detection image of the wafer; A controller is connected to the X-ray emitter and the digital detector, and is used to determine whether the wafer is tilted according to the wafer area in the X-ray detection image, and further determine whether the lifter is tilted.

2. The X-ray detection device for wet etching equipment according to claim 1, characterized in that: The controller comprises: an area comparison unit, for comparing the detected area of ​​the wafer region in the X-ray detection image with the actual area of ​​the wafer, so as to determine whether the wafer is tilted, and further determine whether the lifter is tilted; or, The image comparison unit is used to compare the wafer area in the X-ray detection image with the X-ray standard image of the wafer to determine whether the wafer is tilted, and further determine whether the lifter is tilted.

3. The X-ray detection device for wet etching equipment according to claim 2, characterized in that: In the case where the controller includes the area comparison unit, the area comparison unit includes: A first edge detection unit, configured to obtain edge point information of the wafer area by using an edge detection algorithm, wherein the edge point information includes outer contour point information; An area calculation unit connected to the first edge detection unit, the area calculation unit being used to calculate the detection area of ​​the wafer area according to the outer contour point information; The tilt judging unit is connected to the area calculating unit, and is used to calculate the difference between the detection area and the standard area. If the difference is less than or equal to a preset value, it is judged that the lifter is not tilted; if the difference is greater than the preset value, it is judged that the lifter is tilted.

4. The X-ray detection device for wet etching equipment according to claim 2, characterized in that: In the case where the controller includes the graphic comparison unit, the graphic comparison unit includes: A second edge detection unit, configured to obtain edge point information of the wafer area by using an edge detection algorithm, wherein the edge point information includes outer contour point information; A contour matching unit is connected to the second edge detection unit, and is used to match the outer contour points of the wafer area with the outer contour points of the X-ray standard image to obtain a similarity value. If the similarity value is less than or equal to the standard value, it is determined that the lifter is not tilted; if the similarity value is greater than the standard value, it is determined that the lifter is tilted.

5. The X-ray detection device for wet etching equipment according to claim 3 or 4, characterized in that: The controller further comprises: An angle calculation unit is used to calculate the minor axis through an ellipse fitting algorithm according to the outer contour point information when the judgment result is that the lifter is tilted, and calculate the tilt angle of the wafer according to the minor axis and the actual diameter of the wafer.

6. The X-ray detection device for wet etching equipment according to claim 3 or 4, characterized in that: The controller also includes a crack judgment unit, which is used to remove the outer contour point information from the edge point information to obtain remaining point information, extract the remaining point area from the wafer area according to the remaining point information, extract the detection texture features of the remaining point area, compare the detection texture features with the standard texture features of the wafer, and judge whether the remaining point area has cracks.

7. The X-ray detection device for wet etching equipment according to any one of claims 1 to 4, characterized in that: The controller further comprises: An image acquisition unit connected to the digital detector, the image acquisition unit being used to acquire the X-ray detection image from the digital detector; An image segmentation unit is connected to the image acquisition unit, and is used to segment a wafer area from the X-ray detection image using an image segmentation technique.

8. The X-ray detection device for wet etching equipment according to any one of claims 1 to 4, characterized in that: The X-ray emitter has a first shell enclosing the internal components of the X-ray emitter, and the first shell is made of a material that is resistant to high temperatures, acids and alkalis and can transmit X-rays; and / or, The digital detector has a second shell which encloses the internal components of the digital detector. The second shell is made of a material which is resistant to high temperature, acid and alkali and can transmit X-rays.

9. The X-ray detection device for wet etching equipment according to any one of claims 1 to 4, characterized in that: It also includes an alarm connected to the controller. When the judgment result is that the lifter is tilted, the controller controls the alarm to sound an alarm.

10. A wet etching device, characterized in that: The invention comprises an X-ray detection device as claimed in any one of claims 1 to 9.

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