Semiconductor chip glue coating device with curing structure

Abstract

The utility model discloses a semiconductor chip gluing device with a curing structure, including a base, a protective cover fixedly connected to the upper surface of the base, a curing driver fixedly connected to the upper surface of the protective cover, a voltage-stabilizing output line fixedly connected to the right side of the curing driver, and a gluing control pump fixedly connected to the upper surface of the protective cover. The device can adjust the gluing speed of the control valve and the gluing head, as well as the curing power of the curing driver and the curing lamp through a touch panel, and can quickly adjust the production process. During processing, the transmission is started to send the chip under the gluing head, and then the electric hydraulic telescopic rod is started to extend to drive the gluing head to maintain an appropriate distance from the chip. During curing, the curing driver is started to drive the curing lamp to emit ultraviolet rays through the voltage-stabilizing output line to cure the semiconductor chip coated with glue, which is not only conducive to improving the curing effect of the glue, but also improves production efficiency.

Description

Technical Field

[0001] The utility model relates to the field of chip gluing, in particular to a semiconductor chip gluing device with a curing structure. Background Art

[0002] A semiconductor chip is an integrated circuit made of semiconductor materials. It is a core component of modern electronic devices and is widely used in various electronic devices, including but not limited to computers, mobile phones, televisions, automotive electronic systems, medical equipment, industrial control systems, etc. The manufacture of semiconductor chips is a highly complex process involving multiple steps such as lithography, etching, doping, and deposition. With the advancement of technology, the performance of semiconductor chips continues to improve and their size continues to shrink, making electronic devices more miniaturized, efficient, and low-cost.

[0003] In the production process of semiconductor chips, glue coating is an important process step. Glue is used to bond the chip to the substrate or other chips to form a stable electrical and mechanical connection. However, the glue coating requires manual operation of the chip, which is inefficient and prone to errors. At the same time, for this reason, we propose a semiconductor chip glue coating device with a solidification structure to solve the above problems. Utility Model Content

[0004] The purpose of the utility model is to provide a semiconductor chip glue coating device with a curing structure to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A semiconductor chip gluing device with a curing structure comprises a base, the upper surface of the base is fixedly connected to a protective cover, the upper surface of the protective cover is fixedly connected to a curing driver, the right side of the curing driver is fixedly connected to a voltage-stabilizing output line, the upper surface of the protective cover is fixedly connected to a gluing control pump, the end of the voltage-stabilizing output line away from the curing driver passes through the protective cover and extends to the inside of the protective cover, the bottom surface of the base is fixedly connected to a glue storage box, the back of the protective cover is fixedly connected to a glue pump, the back of the glue storage box is fixedly connected to a glue guide tube, the end of the glue guide tube away from the glue storage box is connected to the bottom surface of the glue pump, and the upper surface of the glue pump is fixedly connected to a high The bottom surface of the adapter plate is fixedly connected with two groups of electric hydraulic telescopic rods, and the bottom surface of each group of electric hydraulic telescopic rods is fixedly connected with a glue coating head, and the upper surface of each glue coating head is fixedly connected with a glue delivery hose, and the bottom surface of the adapter plate is fixedly connected with a control valve, and the end of each glue delivery hose away from the glue coating head is connected with the control valve, and the inner top wall of the protective cover is fixedly connected with a potential seat, and the bottom surface of the potential seat is fixedly connected with a curing lamp.

[0007] In a further embodiment, two supporting feet are fixedly connected to the bottom surface of the base, and a positioning hole is formed on the bottom surface of each supporting foot.

[0008] In a further embodiment, a touch panel is fixedly connected to the front side of the protective cover.

[0009] In a further embodiment, two protective doors are snap-connected to the front of the protective cover, and buckle grooves are provided on the front of the two protective doors.

[0010] In a further embodiment, a parameter plate is provided on the back of the protective cover, and the front side of the parameter plate is fixedly connected to the back side of the protective cover.

[0011] In a further embodiment, a group of limiting grooves are formed on the outer surface of the transmission.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] Through the touch panel, the device can adjust the gluing speed of the control valve and the gluing head, as well as the curing power of the curing driver and the curing lamp, so as to quickly adjust the production process and improve the efficiency of gluing and curing. During processing, the actuator is started to send the chip under the gluing head, and then the electric hydraulic telescopic rod is started to extend to drive the gluing head to maintain an appropriate distance from the chip. During curing, the curing driver is started to drive the curing lamp to emit ultraviolet rays through the voltage-stabilized output line to cure the semiconductor chip coated with glue, which is not only beneficial to improving the curing effect of the glue, but also can improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the three-dimensional structure of a semiconductor chip gluing device with a curing structure.

[0015] Figure 2 It is a schematic diagram of the three-dimensional structure from a rear perspective of a semiconductor chip gluing device with a curing structure.

[0016] Figure 3 It is a schematic diagram of the three-dimensional structure of the actuator in the semiconductor chip gluing device with a solidified structure.

[0017] Figure 4 It is a schematic diagram of the three-dimensional structure of a curing lamp in a semiconductor chip gluing device with a curing structure.

[0018] In the figure: 1. Base; 2. Support feet; 3. Positioning holes; 4. Protective cover; 5. Protective door; 6. Touch panel; 7. Buckle slot; 8. Glue control pump; 9. Curing driver; 10. Voltage-stabilizing output line; 11. Glue delivery pump; 12. High-pressure pipe; 13. Glue guide hose; 14. Glue storage box; 15. Parameter plate; 16. Base; 17. Transmitter; 18. Limiting groove; 19. Potentiometer seat; 20. Curing lamp; 21. Adapter plate; 22. Control valve; 23. Glue delivery hose; 24. Electric hydraulic telescopic rod; 25. Glue coating head. DETAILED DESCRIPTION

[0019] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present utility model, unless otherwise specified, "multiple" means two or more.

[0020] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-4In the utility model, a semiconductor chip glue coating device with a curing structure includes a base 1, a protective cover 4 is fixedly connected to the upper surface of the base 1, a curing driver 9 is fixedly connected to the upper surface of the protective cover 4, a voltage-stabilizing output line 10 is fixedly connected to the right side of the curing driver 9, a glue coating control pump 8 is fixedly connected to the upper surface of the protective cover 4, and one end of the voltage-stabilizing output line 10 away from the curing driver 9 passes through the protective cover 4 and extends to the inside of the protective cover 4, a glue storage box 14 is fixedly connected to the bottom surface of the base 1, and the back of the protective cover 4 A glue pump 11 is fixedly connected, a glue guide tube 13 is fixedly connected to the back of the glue storage box 14, and one end of the glue guide tube 13 away from the glue storage box 14 is connected to the bottom surface of the glue pump 11, and a high-pressure pipe 12 is fixedly connected to the upper surface of the glue pump 11, and one end of the high-pressure pipe 12 away from the glue pump 11 is connected to the back of the glue control pump 8, the inner bottom wall of the protective cover 4 is fixedly connected to the base 16, and the inner wall of the base 16 is fixedly connected to the transmission device 17, and the inner top wall of the protective cover 4 is fixedly connected to the adapter plate 21, and the bottom surface of the adapter plate 21 is fixedly connected There are two groups of electric hydraulic telescopic rods 24, the bottom surface of each group of electric hydraulic telescopic rods 24 is fixedly connected with a glue coating head 25, the upper surface of each glue coating head 25 is fixedly connected with a glue delivery hose 23, the bottom surface of the adapter plate 21 is fixedly connected with a control valve 22, and one end of each glue delivery hose 23 away from the glue coating head 25 is connected to the control valve 22, the inner top wall of the protective cover 4 is fixedly connected with a potential seat 19, and the bottom surface of the potential seat 19 is fixedly connected with a curing lamp 20, and then the actuator 17 is started to send the chip under the glue coating head 25, and then Then, the electric hydraulic telescopic rod 24 is started to extend, driving the glue coating head 25 to be close to the chip, and then the glue delivery pump 11 is started to extract glue from the glue storage box 14, and the glue supply is regulated by the glue coating control pump 8 and the control valve 22. After that, the glue is evenly sprayed on the surface of the semiconductor chip through the glue coating head 25, and the curing driver 9 is started to drive the curing lamp 20 to emit ultraviolet rays through the voltage-stabilized output line 10 to cure the semiconductor chip coated with glue, which is not only beneficial to improve the curing effect of the glue, but also can improve the production efficiency.

[0023] Two supporting feet 2 are fixedly connected to the bottom surface of the base 1, and a positioning hole 3 is provided on the bottom surface of each supporting foot 2. The setting of the supporting feet 2 and the positioning holes 3 can facilitate the staff to install the present device. The front of the protective cover 4 is fixedly connected to a touch panel 6. The setting of the touch panel 6 can facilitate the staff to operate the present device. Two protective doors 5 are clamped on the front of the protective cover 4. Buckle grooves 7 are provided on the front of the two protective doors 5. The buckle grooves 7 can facilitate the staff to open and close the protective doors 5.

[0024] A parameter plate 15 is provided on the back of the protective cover 4, and the front of the parameter plate 15 is fixedly connected to the back of the protective cover 4. The parameter plate 15 can facilitate the staff to understand the specific parameters and precautions of the device. A group of limiting grooves 18 are provided on the outer surface of the transmission 17. The limiting grooves 18 can improve the limiting effect of the transmission 17 on the chip to prevent it from shaking and affecting the gluing.

[0025] The working principle of the utility model is:

[0026] When in use, first move the device to the place of use, install it through the supporting feet 2 and the positioning holes 3 and connect it to the power supply, then adjust the gluing speed of the control valve 22 and the gluing head 25, and the curing power of the curing driver 9 and the curing lamp 20 through the touch panel 6, then clamp the chip into the different specifications of the limit groove 18 according to the different chip sizes, then start the transmission 17, send the chip under the gluing head 25, and start the electric hydraulic telescopic rod 24 to extend, drive the gluing head 25 close to the chip, then start the glue delivery pump 11 to extract glue from the glue storage box 14, and adjust the glue supply amount through the glue control pump 8 and the control valve 22, and then evenly spray the glue on the surface of the semiconductor chip through the gluing head 25, start the curing driver 9 through the voltage-stabilized output line 10, drive the curing lamp 20 to emit ultraviolet rays to cure the semiconductor chip coated with glue, and the chip can be taken out after curing is completed.

[0027] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0028] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A semiconductor chip glue coating device with a curing structure, characterized in that: The invention comprises a base (1), wherein the upper surface of the base (1) is fixedly connected with a protective cover (4), the upper surface of the protective cover (4) is fixedly connected with a curing driver (9), the right side of the curing driver (9) is fixedly connected with a voltage-stabilizing output line (10), the upper surface of the protective cover (4) is fixedly connected with a glue coating control pump (8), the end of the voltage-stabilizing output line (10) away from the curing driver (9) passes through the protective cover (4) and extends to the inside of the protective cover (4), the bottom surface of the base (1) is fixedly connected with a glue storage box (14), the back side of the protective cover (4) is fixedly connected with a glue delivery pump (11), the back side of the glue storage box (14) is fixedly connected with a glue guide tube (13), the end of the glue guide tube (13) away from the glue storage box (14) is connected to the bottom surface of the glue delivery pump (11), the upper surface of the glue delivery pump (11) is fixedly connected with a high-pressure tube (12), the high-pressure tube (12) away from the glue storage box (14) is connected to the bottom surface of the glue delivery pump (11), and the upper surface of the glue delivery pump (11) is fixedly connected with a high-pressure tube (12). One end of the glue delivery pump (11) is connected to the back of the glue coating control pump (8); the inner bottom wall of the protective cover (4) is fixedly connected to the base (16); the inner wall of the base (16) is fixedly connected to the transmission device (17); the inner top wall of the protective cover (4) is fixedly connected to the adapter plate (21); the bottom surface of the adapter plate (21) is fixedly connected to two groups of electric hydraulic telescopic rods (24); the bottom surface of each group of the electric hydraulic telescopic rods (24) is fixedly connected to the A glue coating head (25) is connected, and the upper surface of each of the glue coating heads (25) is fixedly connected to a glue delivery hose (23). The bottom surface of the adapter plate (21) is fixedly connected to a control valve (22), and one end of each of the glue delivery hoses (23) away from the glue coating head (25) is connected to the control valve (22). The inner top wall of the protective cover (4) is fixedly connected to a potential seat (19), and the bottom surface of the potential seat (19) is fixedly connected to a curing lamp (20).

2. The semiconductor chip glue coating device with a curing structure according to claim 1, characterized in that: Two supporting legs (2) are fixedly connected to the bottom surface of the base (1), and a positioning hole (3) is provided on the bottom surface of each supporting leg (2).

3. The semiconductor chip glue coating device with a curing structure according to claim 1, characterized in that: A touch panel (6) is fixedly connected to the front side of the protective cover (4).

4. The semiconductor chip glue coating device with a curing structure according to claim 1, characterized in that: Two protective doors (5) are clamped on the front of the protective cover (4), and buckle grooves (7) are provided on the front of the two protective doors (5).

5. The semiconductor chip glue coating device with a curing structure according to claim 1, characterized in that: A parameter plate (15) is provided on the back of the protective cover (4), and the front of the parameter plate (15) is fixedly connected to the back of the protective cover (4).

6. The semiconductor chip glue coating device with a curing structure according to claim 1, characterized in that: The outer surface of the transmission device (17) is provided with a group of limiting grooves (18).

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