Integrated circuit chip turret sorting machine cooling marking and optical inspection integrated device

Abstract

The utility model relates to an integrated cooling, marking and optical inspection device for an integrated circuit chip turret sorting machine, characterized in that: the integrated cooling, marking and optical inspection device comprises a third turntable mounted on a machine platform, a plurality of second positioning seats are arranged in a circular array on the third turntable, the upper surface of the second positioning seat has a second positioning groove for placing the integrated circuit chip, an adsorption mechanism on the first turntable of the machine platform intersects with a second positioning seat of the third turntable, and the two form a junction area, and the junction area is used to transfer the integrated circuit chip on the adsorption mechanism of the first turntable to a second positioning seat of the third turntable. The integrated circuit chip turret sorting machine has a reasonable design for cooling, marking and optical inspection, which is beneficial to cooling the integrated circuit chip while avoiding the chip from falling due to wind blowing and causing damage to the chip.

Description

Technical field:

[0002] The utility model relates to a cooling, marking and optical inspection integrated device for an integrated circuit chip turret sorting machine. Background technology:

[0004] The integrated circuit chip is an electronic component including a silicon substrate, at least one circuit, a fixed sealing ring, a grounding ring and at least one guard ring.

[0005] After production, integrated circuit chips need to be tested for their high temperature resistance, that is, after the integrated circuit chips are heated to a certain temperature, some performance of the integrated circuit chips is tested to see whether they still meet their working performance. At present, the high temperature resistance testing equipment of integrated circuit chips is in the form of an assembly line, that is, heating stations, testing stations and qualified product marking stations are arranged in sequence along the length direction of the conveyor line of the assembly line.

[0006] Since the temperature of the integrated circuit chip is high after high-temperature heating and testing, if it is not cooled down, the integrated circuit chip will easily remain at a high temperature for a long time, which will easily affect the service life of the integrated circuit chip.

[0007] At present, a Chinese patent for a chip testing machine and a chip cooling device thereof has been retrieved, with publication number CN220206137U, which includes a mounting block and an air cooling mechanism. The mounting block is provided with a chip receiving groove to receive the chip through the chip receiving groove; although the air cooling mechanism can generate wind at the chip receiving groove to cool the chip, due to the light weight of the chip, blowing wind from the bottom of the groove can easily cause the chip to fall out of the groove and cause damage to the chip. Summary of the invention:

[0009] In view of the above-mentioned problems, the purpose of the utility model is to propose an integrated circuit chip turret sorting machine cooling, marking and optical inspection integrated device. The integrated circuit chip turret sorting machine cooling, marking and optical inspection integrated device is reasonably designed, which is beneficial to cooling the integrated circuit chips while preventing them from falling due to wind blowing and causing chip damage.

[0010] The technical solution of the utility model is as follows:

[0011] The utility model provides an integrated circuit chip turret sorting machine with cooling, marking and optical inspection, which is characterized in that: the integrated cooling, marking and optical inspection device comprises a third turntable mounted on the machine platform, a plurality of second positioning seats are arranged in a circular array on the third turntable, and a second positioning groove for placing the integrated circuit chip is arranged on the upper surface of the second positioning groove, an adsorption mechanism on the first turntable of the machine platform intersects with a second positioning groove of the third turntable, and the two form an intersection area, which is used to transfer the integrated circuit chip on the adsorption mechanism of the first turntable to a second positioning groove of the third turntable, and a first blowing cooling nozzle for blowing air from top to bottom to the integrated circuit chip is arranged above the second positioning groove of the third turntable, a third base fixedly mounted on the machine platform is arranged in the central part of the third turntable, a plurality of second blowing cooling nozzles are arranged in a circular array on the third base, a marking mechanism is arranged on the third base, and a marking head of the marking mechanism is directly above the second positioning groove in the intersection area opposite to the first turning table.

[0012] Preferably, a negative pressure dust suction mechanism is provided on the third base and located beside the marking mechanism, and the negative pressure dust suction mechanism includes a base body and a suction pipe fixed on the upper part of the base body, the first end of the suction pipe is close to the marking head, and the second end of the suction pipe is connected to the negative pressure pump through a pipeline.

[0013] Preferably, a light inspection device is provided on the third base, and the light inspection device and the first air blowing cooling nozzle are arranged opposite to each other on the third turntable.

[0014] Preferably, the above-mentioned machine is provided with an integrated circuit chip waste sorting mechanism, which includes a rotating wheel, a partition block with a partition channel and a plurality of waste trough boxes, the rotating wheel is stepped, and has an upper boss and a lower boss rotatably hinged on a fourth base, the outer periphery of the lower boss is provided with pulley teeth, and the pulley teeth of the lower boss are connected to a driving pulley driven by a motor through a belt.

[0015] Preferably, a vertical material transfer channel is provided in the upper boss body, and an inclined material transfer channel is provided in the lower boss, the lower end of the vertical material transfer channel is connected with the upper end of the inclined material transfer channel, the lower end of the inclined material transfer channel is connected with the upper end of the separation channel, there are four separation channels, and under the drive of the motor, the rotating wheel has four stations, at any station, the lower end of the inclined material transfer channel is connected with the upper end of a separation channel, and the lower end of each separation channel is connected with the upper port of a waste trough box.

[0016] After the integrated circuit chip of the utility model integrated circuit chip turret sorting machine transfers the integrated circuit chip to the third turntable by the adsorption mechanism of the first turntable, the integrated circuit chip is sequentially cooled by the first blowing cooling nozzle and the blowing cooling by the plurality of second blowing cooling nozzles, so that the temperature of the integrated circuit chip with a relatively high temperature can be reduced. At the same time, the first blowing cooling nozzle is arranged directly above the integrated circuit chip and the second positioning groove, and the second blowing cooling nozzle is located to the side of the integrated circuit chip and the second positioning groove, so that the integrated circuit chip will not be blown out of the second positioning groove and cause falling damage. Description of the drawings:

[0018] The utility model is further described below in conjunction with the accompanying drawings;

[0019] Figure 1 It is a three-dimensional diagram of a turntable type high temperature test and sorting device for integrated circuit chips;

[0020] Figure 2 yes Figure 1 A top view of

[0021] Figure 3 yes Figure 1 A stereogram from another perspective;

[0022] Figure 4 yes Figure 1 A three-dimensional diagram after omitting some parts;

[0023] Figure 5 yes Figure 4 A stereogram from another perspective;

[0024] Figure 6 yes Figure 4 A cross-sectional view from one perspective (a cross-sectional view of the K plane);

[0025] Figure 7 yes Figure 6 A partial view of

[0026] Figure 8 It is a partial view of the heating and heat preservation mechanism;

[0027] Fig. 9 yes Figure 8 sectional view of

[0028] Fig.10 is a three-dimensional diagram of the connection between the first rotating disk and the adsorption mechanism;

[0029] Fig.11 It is a schematic diagram of the first turntable and the second turntable transferring the integrated circuit chip (transfer to the first circle);

[0030] Fig.12It is a schematic diagram of the first turntable and the second turntable transferring the integrated circuit chip (transfer to the second circle);

[0031] Fig.13 It is a cross-sectional view of the adsorption mechanism and the correction mechanism;

[0032] Fig.14 yes Fig.13 A partial view of

[0033] Fig.15 It is a stereogram of the corrective mechanism;

[0034] Fig.16 It is a three-dimensional diagram of the test organization;

[0035] Fig.17 is a cross-sectional perspective view of the adsorption mechanism and the third rotating disk;

[0036] Fig.18 It is a three-dimensional diagram of the integrated device for cooling, marking and optical inspection;

[0037] Fig.19 yes Fig.18 A partial view of

[0038] Fig. 20 It is a three-dimensional diagram of the second positioning seat (including the integrated circuit chip thereon), and the first positioning seat and the second positioning seat have the same structure;

[0039] Fig.21 It is a three-dimensional diagram of the waste sorting mechanism;

[0040] Fig. 22 It is a cross-sectional view of a waste sorting mechanism. Specific implementation method:

[0042] The utility model is further described below in conjunction with the accompanying drawings and specific implementation methods.

[0043] The integrated circuit chip turntable high-temperature testing and sorting device comprises a machine 1, a first turntable 2 intermittently rotating on the machine 1, and a second turntable 3 intermittently rotating on the machine next to the first turntable 2, wherein the first turntable 2 rotates intermittently, and each time it rotates through one grid, the grid refers to the spacing between adjacent adsorption mechanisms A6 on the first turntable. If the first turntable 2 has M groups of adsorption mechanisms evenly distributed in the circumferential direction, then each time the first turntable rotates through one grid, it rotates 360 / M degrees each time; wherein the second turntable 3 rotates intermittently, and each time it rotates through one grid, the grid refers to the circumferential spacing between two adjacent first sinks in the same circle on the second turntable. If the second turntable has N groups of first sinks evenly distributed in the circumferential direction in the same circle, then each time the second turntable rotates through one grid, it rotates 360 / N degrees each time.

[0044] The second turntable is provided with a heating and insulation mechanism A for heating and keeping the integrated circuit chip warm. A heating test channel mechanism B and a cooling, marking and optical inspection integrated device C are provided in sequence on the side of the discharge end of the second turntable. The heating test channel mechanism B is used for performing performance test on the integrated circuit chip after position correction, and the cooling, marking and optical inspection integrated device C is used for cooling, marking and optical inspection of the integrated circuit chip.

[0045] The heating and heat preservation mechanism A specifically includes a second base A1 for mounting the second turntable 3 and a second motor A2 arranged on the second base A1 for driving the second turntable 3 to rotate; a cover body A3 is arranged on the second base A1 for covering the second turntable; a heating and heat preservation cavity A4 is arranged between the cover body A3 and the second turntable 3; the heating and heat preservation cavity A4 is opposite to a first sink A5 for placing the integrated circuit chip M on the second turntable 3; the second base A1 is fixedly mounted on the machine platform; the shell of the second motor A2 is fixed on the second base A1; and the free end of the output shaft of the second motor A2 is fixedly connected to the second turntable 3.

[0046] Specifically, the rotation axis lines of the first turntable and the second turntable are connected to form a first plane K. The first turntable has adsorption mechanisms A6 for integrated circuit chips arranged in a circular array. The transfer station of the adsorption mechanism A6 of an integrated circuit chip of the first turntable that transfers the integrated circuit chip to a first sink of the second turntable is located on the first plane. At the transfer station, each adsorption mechanism A6 on the first turntable transfers the integrated circuit chip to the second turntable; that is, the unheated and heat-insulated integrated circuit chip on the first turntable is transferred to the second turntable through the transfer station, and the heated and heat-insulated integrated circuit chip on the second turntable is adsorbed and output by the adsorption mechanism, thereby realizing the replacement of the unheated and heat-insulated integrated circuit chip with the heated and heat-insulated integrated circuit chip.

[0047] When the integrated circuit chip is heated and kept warm at a fixed temperature in the heating and heat preservation cavity A4, a certain amount of time is required. In order to ensure sufficient heating and heat preservation time, it is hoped that the circumferential diameter of the second turntable is larger, so that the first sink groove is set near the circular edge of the second turntable, which can make the heating time longer to meet the heating and heat preservation time. However, the larger diameter of the second turntable also increases the footprint of the equipment (or the area occupied by the machine). In order to ensure both the heating and heat preservation time and control the diameter of the second turntable, the circular array on the second turntable has one, two or more circles of first sink grooves A5; the heating and heat preservation cavity is in a ring shape, and the ring-shaped heating and heat preservation cavity A4 is opposite to the first sink grooves A5 in the annular array, and the radial width of the heating and heat preservation cavity on the second turntable covers the radial width of two first sink grooves A5 (taking the circular array on the second turntable with two circles of first sink grooves A5 as an example).

[0048] During operation, the adsorption mechanism on the first turntable (through the lower end of the vertical suction pipe) puts the unheated integrated circuit chip into the second turntable, and the second turntable rotates one grid, and the adsorption mechanism on the first turntable adsorbs the heated integrated circuit chip. Then the first turntable rotates one grid, and the first turntable adsorbs the unheated integrated circuit chip. When the first sink groove A5 on the second turntable has two circles (or more than two circles, taking two circles as an example), the integrated circuit chip is equivalent to being sucked out by the adsorption mechanism after rotating two circles. During the operation, the first circle of the second turntable is sucked out by the adsorption mechanism. After the integrated circuit chips are completely replaced one by one (after the heated and heat-insulated integrated circuit chip located at the transfer station is adsorbed by the previous adsorption mechanism, the first turntable rotates one grid, the subsequent adsorption mechanism rotates to the transfer station, and puts the adsorbed integrated circuit chip into the first sink of the transfer station, the second turntable rotates one grid, and the heated and heat-insulated integrated circuit chip in the second turntable rotates to the transfer station, and the subsequent process is repeated as before), the first sink of the integrated circuit chip of the second circle is driven by the subsequent first screw nut mechanism to be pushed to the transfer station so that it can be adsorbed by the adsorption mechanism.

[0049] In order to realize the position adjustment of the first circle first groove and the second circle first groove on the transfer station, specifically, the second base A1 is driven to move by the first screw nut mechanism A7 arranged on the machine platform, and the moving direction of the second base A1 is the vertical connecting line of the rotation axis centerline of the first turntable 2 and the second turntable 3. The second base A1 is driven to move in a straight line by the first screw nut mechanism A7, that is, the distance between the rotation axis centerline of the second turntable and the rotation axis centerline of the first turntable is moved.

[0050] The symmetric center lines of the two adjacent circles of the first sink grooves fall on the same radial plane, and the radial plane passes through the axis line of the second turntable and the symmetric center lines of the two adjacent circles of the first sink grooves.

[0051] The specific connection structure of the cover body is that a plurality of brackets A8 are fixedly installed on the second base A1, and the bracket A8 is fixedly connected to the cover body. The housing of the second motor A2 is fixedly provided on the second base, and the output shaft of the second motor is fixedly connected to the second turntable 3. The cover body A3 includes a fixedly connected annular lower cover body A301 and annular upper cover A302, and the inner peripheral wall of the annular lower cover body A301 is provided with a groove A303 for the second turntable to extend into, and the second turntable can rotate relative to the annular lower cover body, and an annular heat conductive block A304 is provided below the annular upper cover, and the annular heat conductive block A304 is provided below the annular upper cover. An annular electric heating wire A305 is provided on the heat block, and the power supply end of the annular electric heating wire A305 extends out of the cover body. An annular heat-conducting block may also be provided below the second turntable in the cover body, and the annular heat-conducting block is provided with an electric heating wire; a heating and heat-insulating cavity A4 is formed between the lower surface of the annular heat-conducting block A304 and the upper surface of the second turntable 3 extending into the groove, and the cover body has a notch A9 for avoiding the adsorption mechanism of the integrated circuit chip of the second turntable to rotate through, and the transfer station is arranged at the notch position, and the first sink is not blocked by the annular upper cover, the annular heat-conducting block and the annular electric heating wire above the notch position.

[0052] The first turntable 2 is driven to rotate by a first motor A10 arranged on the machine platform. A plurality of integrated circuit chip adsorption mechanisms A6 are arranged in a circular array on the first turntable 2. The integrated circuit chip adsorption mechanism A6 comprises a rigid vertical suction pipe A601 and a horizontal suction pipe A602 whose first end is connected to the vertical suction pipe (the horizontal suction pipe A602 can be a plastic hose). The lower end of the vertical suction pipe is used to adsorb the integrated circuit chip. The second end of the horizontal suction pipe is connected to a negative pressure pump. A lifting mechanism (not shown in the figure) for driving the vertical suction pipe to lift and lower is arranged on the first base installed on the first turntable. The lifting mechanism can be a screw nut mechanism driven by a cylinder or a motor, or a cam mechanism driven by a motor. The cam surface of the cam mechanism presses against the upper end of the vertical suction pipe to drive the vertical suction pipe to descend (so that the vertical suction pipe descends close to the integrated circuit chip to achieve adsorption or release). At the same time, a return spring is arranged between the vertical suction pipe and the first turntable to achieve return and rise.

[0053] After the integrated circuit chip is heated and kept warm, each integrated circuit chip needs to be tested for performance at high temperature.

[0054] Specifically, the above-mentioned heating test channel mechanism B includes an integrated circuit chip position correction mechanism B1 and a plurality of testing mechanisms B2. The integrated circuit chip position correction mechanism B1 includes a first mounting seat B3 and a first positioning seat B4 arranged on the first mounting seat. The upper surface of the first positioning seat B4 is provided with a first positioning groove B5 for positioning the integrated circuit chip. The shape of the first positioning groove B5 matches the shape of the integrated circuit chip.

[0055] A rotating adjustment motor B6 for driving the first positioning seat B4 to rotate is installed on the first mounting seat B3. Since it is necessary to ensure that each integrated circuit chip corresponds to the test probe during the high temperature resistance performance test, after the integrated circuit chip is placed in the first positioning seat B4, the first positioning seat B4 is driven to rotate a certain angle by the adjusting motor B6 to correct the position of the integrated circuit chip. The angle that needs to be driven by the adjusting motor to rotate the first positioning seat B4 can be detected by a position detection device. The position detection device detects the degree of misalignment of the integrated circuit chip and is an existing device, which will not be described here.

[0056] The testing mechanism B2 includes a second mounting seat B7 and a test seat B8 disposed on the second mounting seat. The second mounting seat B7 and the test seat B8 may have multiple groups for detecting different electrical properties of the integrated circuit chip.

[0057] For the sake of reasonable design, the above-mentioned first mounting seat B3 and the second mounting seat B7 both include a horizontally arranged transverse seat B9 and a first L-shaped connecting plate B10 whose first end is fixedly connected to the first end of the transverse seat, the second end of the first L-shaped connecting plate B10 is connected to the first end of the second L-shaped connecting plate B11, and the second end of the second L-shaped connecting plate B11 is provided with the first positioning seat B4 or the second mounting seat B7.

[0058] In order to adjust the installation position of the first positioning seat B4 or the second mounting seat B7, a screw hole B12 is provided on the first end of the second L-shaped connecting plate B11, and a strip groove B13 corresponding to the screw hole B12 is provided on the second end of the first L-shaped connecting plate. A screw B14 passes through the strip groove and is locked with the screw hole. After the relative position of the first L-shaped connecting plate and the second L-shaped connecting plate is determined by adjustment, the screw hole B12 is locked to achieve relative fixation of the first L-shaped connecting plate and the second L-shaped connecting plate.

[0059] In order to more accurately adjust the relative position of the first L-shaped connecting plate and the second L-shaped connecting plate, the first end of the second L-shaped connecting plate is vertically threadedly connected with an adjustable screw B15 through a connecting piece B19, and the free end of the adjustable screw is placed on the upper end of the second end of the first L-shaped connecting plate. When it is necessary to adjust the relative position of the first L-shaped connecting plate and the second L-shaped connecting plate, the adjustable screw B15 is rotated. After the position is determined, the nut on the adjustable screw B15 is locked, and the nut abuts against the connecting piece B19.

[0060] In order to facilitate the adjustment of the position of the transverse seat B9, the bottom surface of the transverse seat B9 is slidably connected to the transverse slide rail B16, and the rear part of the transverse seat B9 is threadedly connected with an adjusting bolt B17, and the free end of the adjusting bolt B17 is placed on the rear end surface of the transverse slide rail. The side of the transverse seat B9 is penetrated by a locking screw B18, and the free end of the locking screw is placed on the side of the transverse slide rail. The transverse slide rail is fixed on the machine platform. When adjustment is needed, the adjusting bolt B17 is rotated to change the relative position of the transverse seat B9 and the transverse slide rail B16. When the relative position of the transverse seat B9 is adjusted, the locking screw B18 is tightened to achieve the fixation of the relative position of the transverse seat B9 and the transverse slide rail B16.

[0061] After the integrated circuit chip is heated and kept warm and its performance is tested at high temperature, it is necessary to cool the integrated circuit chip, and mark and inspect the appearance of qualified products.

[0062] The specific integrated temperature-cooling marking and optical inspection device C includes a third turntable C1 installed on the machine 1, and a plurality of second positioning seats C2 are arranged in a circular array on the third turntable C1. Preferably, the second positioning seats C2 are evenly distributed on the circumference of the third turntable C1, and each second positioning seat C2 has a second positioning groove C3 for placing an integrated circuit chip on its upper surface, and the shape of the second positioning groove C3 matches the shape of the integrated circuit chip.

[0063] An adsorption mechanism A6 on the first turntable of the heating and heat preservation mechanism intersects with a second positioning seat C2 of the third turntable C1, and the two form an intersection area. The intersection area is in a fixed position and is used to transfer the integrated circuit chip on the adsorption mechanism of the first turntable to a second positioning seat C2 of the third turntable. A first blowing cooling nozzle C4 for blowing air from top to bottom on the integrated circuit chip is provided above several second positioning seats of the third turntable C1. A third base C5 fixedly installed on the machine table is provided at the center of the third turntable C1. A plurality of second blowing cooling nozzles C6 are provided in a circular array on the third base C5. The second blowing cooling nozzles C6 blow air in a circumferential direction of the third turntable to achieve blowing cooling of the integrated circuit chips in each second positioning groove C3 on the third turntable.

[0064] The third base is provided with a marking mechanism C7, and the marking head of the marking mechanism is opposite to the second positioning groove of the handover area, that is, the marking mechanism C7 and the handover area are relatively fixedly arranged in the circumferential direction of the third turntable.

[0065] In order to collect the waste gas, debris and dust generated during marking, a negative pressure dust suction mechanism C8 is provided on the third base C5 and located next to the marking mechanism. The negative pressure dust suction mechanism includes a base body C801 and a suction pipe C802 fixed on the upper part of the base body. The first end of the suction pipe is close to the marking head, and the second end of the suction pipe is connected to the negative pressure pump through a pipeline.

[0066] The third base is provided with an optical inspection device C9, which is arranged opposite to the first blowing cooling nozzle C4 on the third turntable, that is, the optical inspection device C9 and the first blowing cooling nozzle C4 are relatively fixedly arranged in the circumferential direction of the third turntable.

[0067] In order to classify the unqualified products tested in the previous steps (the specific tester and the testing method are existing technologies and will not be described here), the above-mentioned machine 1 is provided with an integrated circuit chip waste sorting mechanism D, and the integrated circuit chip waste sorting mechanism D includes a rotating wheel D1, a partition block D2 with a partition channel and a plurality of waste trough boxes D3 from top to bottom. The rotating wheel D1 is stepped, and has an upper boss D5 and a lower boss D6 rotatably hinged on the fourth base D4. The outer periphery of the lower boss D6 is provided with pulley teeth D7. The pulley teeth D7 of the lower boss are connected to a driving pulley driven by a motor through a belt D8. The driving pulley, the pulley teeth D7 and the lower boss D6 rotate under the driving action of the motor.

[0068] A vertical material transfer channel D501 is provided in the upper boss D5, and an inclined material transfer channel D601 is provided in the lower boss D6. The lower end of the vertical material transfer channel D501 is connected with the upper end of the inclined material transfer channel D601, and the lower end of the inclined material transfer channel D601 is connected with the upper end of the separation channel D9. There are four separation channels. Driven by a motor, the wheel can rotate to four workstations and stop. At any workstation, the lower end of the inclined material transfer channel D601 is connected with the upper end of a separation channel D9, and the lower end of each separation channel D9 is connected with the upper port of a waste trough box D3.

[0069] The working method of the adsorption mechanism on the first turntable to replace the integrated circuit chip thereon with the integrated circuit chip on the third turntable is the same as the working method of the adsorption mechanism on the first turntable to replace the integrated circuit chip thereon with the integrated circuit chip on the second turntable, and will not be repeated here.

[0070] When the integrated circuit chip waste sorting mechanism D is working, when the previous step detects integrated circuit chips that do not meet the performance requirements such as high temperature resistance, when the adsorption mechanism of the first turntable rotates to the upper end of the vertical transfer channel D501, the adsorption mechanism releases the unqualified integrated circuit chip products, and the unqualified integrated circuit chip products fall into the vertical transfer channel D501. At the same time, the motor drives the lower boss D6 to rotate, so that the lower end of the inclined transfer channel D601 is connected with the upper end of different separation channels D9. The unqualified integrated circuit chip products in the vertical transfer channel D501 pass through the inclined transfer channel D601 and the separation channel D9 and then fall into one of the waste trough boxes D3.

[0071] Working method of integrated circuit chip turntable high temperature test sorting device,

[0072] Through the intermittent rotation of the first turntable, each rotation of one grid (the spacing between adjacent adsorption mechanisms on the first turntable) drives the adsorption mechanisms on the first turntable to rotate, that is, drives the integrated circuit chips adsorbed by the adsorption mechanisms to rotate, and then when the first turntable rotates to the transfer station, the adsorption mechanism of the first turntable releases (without negative pressure adsorption force) to adsorb the integrated circuit chip, and the integrated circuit chip falls into the first sink groove of the second turntable at this station. As the second turntable rotates, the integrated circuit chips in the first sink groove are heated by the heat transfer of the heating and heat preservation cavity. When the adsorption mechanism of the first turntable releases the adsorption of an integrated circuit chip, the second turntable rotates one grid (referring to the adjacent adsorption mechanisms in the same circle) The circumferential spacing between the two first sink grooves) makes the integrated circuit chip that has been heated and kept warm for one circle in the second turntable be in the transfer station. At this time, the adsorption mechanism of the first turntable in this station adsorbs the integrated circuit chip in the first sink groove, and the first sink groove position in the second turntable is vacated. Then the first turntable rotates one grid, and the adsorption mechanism of the next grid rotates to the transfer station. At this time, the adsorption mechanism of the next grid releases the adsorption of the integrated circuit chip, and the integrated circuit chip falls into the vacated first sink groove; the integrated circuit chip that has been heated and kept warm adsorbed by the adsorption mechanism of the first turntable is tested by the heating test channel mechanism in turn after being output, and after the test, it is cooled and marked by the cooling, marking and optical inspection integrated device, and the appearance is optically inspected.

[0073] The integrated circuit chip turntable high-temperature testing and sorting device transfers the integrated circuit chips adsorbed by the adsorption mechanism on the first turntable to the second turntable through the intermittent rotation of the first turntable and the intermittent rotation of the second turntable. The chips are heated and kept warm by the heating and heat preservation mechanism of the second turntable to reach the highest temperature resistance required for detecting the integrated circuit chips. The performance test under high temperature state, as well as cooling, marking and optical inspection are carried out through the heating test channel mechanism and the cooling, marking and optical inspection integrated device arranged in sequence beside the discharge end of the second turntable.

[0074] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in the relevant field should understand that the specific implementation methods of the utility model can still be modified or some technical features can be replaced by equivalents without departing from the spirit of the technical solution of the utility model, which should be included in the scope of the technical solution for protection of the utility model.

Claims

1. A cooling, marking and optical inspection integrated device for integrated circuit chip turret sorting machine, characterized in that: The cooling, marking and optical inspection integrated device includes a third turntable installed on the machine platform, a plurality of second positioning seats are arranged in a circular array on the third turntable, and a second positioning groove for placing an integrated circuit chip is provided on the upper surface of the second positioning seat. An adsorption mechanism on the first turntable of the machine platform intersects with a second positioning seat of the third turntable, and the two form an intersection area, which is used to transfer the integrated circuit chip on the adsorption mechanism of the first turntable to a second positioning seat of the third turntable. A first blowing cooling nozzle for blowing air from top to bottom to the integrated circuit chip is arranged above the second positioning seat of the third turntable. A third base fixedly installed on the machine platform is arranged in the central part of the third turntable, and a plurality of second blowing cooling nozzles are arranged in a circular array on the third base. A marking mechanism is arranged on the third base, and a marking head of the marking mechanism is directly above the second positioning groove in the intersection area opposite to the marking head.

2. The integrated circuit chip turret sorting machine cooling, marking and optical inspection integrated device according to claim 1, characterized in that: A negative pressure dust suction mechanism is provided on the third base and beside the marking mechanism. The negative pressure dust suction mechanism includes a base body and a suction pipe fixed on the upper part of the base body. The first end of the suction pipe is close to the marking head, and the second end of the suction pipe is connected to a negative pressure pump through a pipeline.

3. The integrated circuit chip turret sorting machine cooling, marking and optical inspection device according to claim 2, characterized in that: The third base is provided with a light inspection device, and the light inspection device and the first air blowing cooling nozzle are arranged opposite to the third turntable.

4. The integrated circuit chip turret sorting machine cooling, marking and optical inspection integrated device according to claim 3, characterized in that: The machine platform is provided with an integrated circuit chip waste sorting mechanism, which includes a rotating wheel, a partition block with a partition channel and a plurality of waste trough boxes. The rotating wheel is stepped, and has an upper boss and a lower boss rotatably hinged on a fourth base. The outer periphery of the lower boss is provided with pulley teeth, and the pulley teeth of the lower boss are connected to a driving pulley driven by a motor through a belt.

5. The integrated circuit chip turret sorting machine cooling, marking and optical inspection device according to claim 4, characterized in that: A vertical material transfer channel is provided in the upper boss body, and an inclined material transfer channel is provided in the lower boss. The lower end of the vertical material transfer channel is connected with the upper end of the inclined material transfer channel, and the lower end of the inclined material transfer channel is connected with the upper end of the separation channel. There are four separation channels. Driven by a motor, the rotating wheel has four workstations. At any workstation, the lower end of the inclined material transfer channel is connected with the upper end of a separation channel, and the lower end of each separation channel is connected with the upper port of a waste trough box.

Images