Follow-up sensor and processing equipment

Abstract

The utility model relates to a follow-up sensor and machining equipment, the follow-up sensor is used for adjusting the height of a cutting head to ensure that the distance between the cutting head and a workpiece to be machined is kept in the vertical direction, and the follow-up sensor specifically comprises a nozzle; the cooling mechanism comprises a shell, a cooling cavity and a cooling fluid connector, the cooling cavity is arranged in the shell and communicated with the cooling fluid connector, the cooling fluid connector is arranged on the shell, the nozzle is arranged at the bottom of the shell, and the cooling cavity comprises multiple layers of cooling sections arranged at different heights; and the circuit module is arranged in the shell. According to the follow-up sensor, heat generated by the follow-up sensor can be absorbed from different positions through the cooling fluid under the condition that the performance of the cutting head is not affected, then the overall working temperature of the follow-up sensor is reduced, and it is guaranteed that an internal circuit module of the follow-up sensor works normally without being affected by high temperature; therefore, the follow-up sensor has the follow-up adjusting function on the cutting head, and the cutting quality and efficiency are effectively guaranteed.

Description

Technical Field

[0001] The present application relates to the field of laser processing technology, and in particular to a follow-up sensor and processing equipment. Background Art

[0002] With the continuous development of laser processing technology and the continuous enrichment of laser product application scenarios, the operational requirements for each link in the laser processing process are becoming increasingly higher.

[0003] The follow-up sensor assembly is an important part of the cutting head. In order to realize the follow-up function, a circuit module needs to be embedded inside the sensor to realize the reception and transmission of capacitive signals. However, during the actual cutting process, the heat generated by the cutting head will increase the temperature of the follow-up sensor, affecting the performance of the electronic components in the circuit module and even making it unable to work normally. Utility Model Content

[0004] Based on this, it is necessary to provide a follow-up sensor and processing equipment to address the above technical problems.

[0005] A follow-up sensor, comprising:

[0006] nozzle;

[0007] A cooling mechanism, comprising a shell, a cooling cavity and a cooling fluid joint, wherein the cooling cavity is arranged inside the shell and communicates with the cooling fluid joint, the cooling fluid joint is arranged on the shell, the nozzle is arranged on the bottom of the shell, and the cooling cavity comprises a plurality of cooling sections arranged at different heights;

[0008] The circuit module is arranged inside the shell.

[0009] In one embodiment, the cooling fluid joint includes an inlet joint and an outlet joint, and the cooling cavity also includes a cooling fluid inlet section and a cooling fluid outflow section, both ends of the cooling fluid inlet section are connected to the inlet joint and one end of the multi-layer cooling section, and both ends of the cooling fluid outflow section are connected to the outflow joint and the other end of the multi-layer cooling section.

[0010] In one embodiment, the multi-layer cooling section includes a first upper cooling sub-segment, a second upper cooling sub-segment, a lower cooling sub-segment, a first interlayer DC sub-segment and a second interlayer DC sub-segment, the first upper cooling sub-segment is connected to the cooling fluid inflow section and the first interlayer DC sub-segment, the second upper cooling sub-segment is connected to the cooling fluid outflow section and the second interlayer DC sub-segment, and the first interlayer DC sub-segment and the second interlayer DC sub-segment are both connected to the lower cooling sub-segment.

[0011] In one embodiment, the first upper cooling sub-segment and the second upper cooling sub-segment are symmetrically arranged around the axis of the shell, and the first upper cooling sub-segment and the second upper cooling sub-segment are both arc-shaped cavities.

[0012] In one embodiment, the first interlayer DC sub-segment and the second interlayer DC sub-segment are symmetrically arranged parallel to the axis of the shell, and the first upper cooling sub-segment and the second upper cooling sub-segment are both cylindrical cavities.

[0013] In one of the embodiments, the lower cooling sub-segment is a semi-arc-shaped cavity.

[0014] In one embodiment, one end of the cooling fluid inflow section is connected to the inflow joint, and the other end is connected to an end of the multi-layer cooling section close to the inflow joint;

[0015] One end of the cooling fluid outflow section is connected to the outflow joint, and the other end is connected to an end of the multi-layer cooling section close to the outflow joint.

[0016] In one embodiment, it also includes:

[0017] A ceramic ring is arranged between the nozzle and the cooling mechanism, the ceramic ring comprises an upper ceramic body and a lower ceramic body, and the upper ceramic body and the lower ceramic body are both arranged around the central axis of the follow-up sensor;

[0018] A locking ring is connected to the upper ceramic body and can lock the ceramic ring to the bottom of the cooling mechanism.

[0019] In one embodiment, the minimum distance between the geometric center points of the upper ceramic body and the lower ceramic body is greater than M; and the diameter of the locking ring is greater than N.

[0020] A processing device, comprising:

[0021] Such as the follow-up sensor mentioned above.

[0022] The technical effects of the embodiments provided in this application are as follows:

[0023] The above-mentioned follow-up sensor, during the operation of the cutting head, introduces external cooling fluid through the cooling fluid connector in the cooling mechanism, and allows the cooling fluid to flow through a cooling cavity of the cooling mechanism which is arranged inside the shell of the cooling mechanism and includes multiple cooling sections arranged at different heights. Since the circuit module is arranged inside the shell, the heat generated by the operation of the cutting head and the heat generated by the follow-up sensor itself can be absorbed from different positions by the cooling fluid without affecting the performance of the cutting head, thereby reducing the overall operating temperature of the follow-up sensor and ensuring that the internal circuit module of the follow-up sensor is not affected by high temperature and operates normally. The follow-up adjustment function of the follow-up sensor on the cutting head can effectively ensure the cutting quality and efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 A schematic diagram of the structure of a follow-up sensor in one embodiment;

[0026] Figure 2 A schematic diagram of the structure of a follow-up sensor in one embodiment;

[0027] Figure 3 A schematic diagram of the structure of a follow-up sensor in one embodiment;

[0028] Figure 4 A schematic diagram of the structure of a follow-up sensor in one embodiment;

[0029] Figure 5 Schematic diagram of the specific structure of a ceramic ring in an embodiment. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0031] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0032] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0033] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0034] Figure 1 and Figure 2 , is a schematic diagram of the structure of a follow-up sensor in an embodiment.

[0035] In this embodiment, the follow-up sensor is used to adjust the height of the cutting head to ensure that the cutting head and the workpiece to be processed maintain a distance in the vertical direction. Figure 1 and Figure 2 As shown, the follow-up sensor includes a nozzle 10 , a cooling mechanism 20 and a circuit module 30 .

[0036] The nozzle 10 can spray the laser beam onto the surface of the workpiece to be processed, and perform processing such as cutting, welding and marking on the workpiece to be processed to form a desired processed part.

[0037] like Figure 1 and Figure 2 As shown, the cooling mechanism 20 includes a shell 220, a cooling cavity 240 and a cooling fluid connector 260. The cooling cavity 240 is arranged inside the shell 220 and is connected to the cooling fluid connector 260. The cooling fluid connector 260 is arranged in the shell 220. The nozzle 10 is arranged at the bottom of the shell 220. The cooling cavity includes multiple layers of cooling sections arranged at different heights.

[0038] The cooling mechanism 20 can be a functional mechanism disposed inside the shell 220 and capable of receiving low-temperature fluid and allowing the low-temperature fluid to flow in the shell 220, so as to absorb the heat generated by the cutting head due to operation and the heat generated by the follow-up sensor itself to reduce the operating temperature of the follow-up sensor.

[0039] The cooling fluid connector 260 includes an inlet connector 2620 and an outlet connector 2640. The inlet connector 2620 can receive cooling fluid flowing in from the outside and introduce the cooling fluid into the cooling cavity 240; the outlet connector 2640 can discharge the cooling fluid after absorbing heat from the inside of the shell 220 through the cooling cavity 240; the inlet connector 2620 and the outlet connector 2640 can both be corner circular tubes arranged on the side wall of the shell 220 of the cooling mechanism 20.

[0040] Optionally, the cooling fluid may be a cooling liquid or a cooling gas, which is selected based on cooling requirements and usage scenarios. Generally, the cooling effect of cooling liquid is better than that of cooling gas.

[0041] The circuit module 30 is disposed inside the housing 220 .

[0042] The circuit module 30 may be a controller embedded in the housing 220 and isolated from the low-temperature fluid flow channel, and capable of controlling the follow-up height between the cutting head and the workpiece. Optionally, the low-temperature fluid flow channel may be a cooling channel disposed inside the housing 220 and formed by the cooling fluid connector 260 and the cooling cavity 240 and surrounding the circuit module 30.

[0043] Specifically, during the operation of the cutting head, the cooling fluid input from the outside enters the cooling cavity 240 distributed at different heights inside the shell 220 through the inlet joint 2620. When the cooling fluid flows through the cooling cavity 240, it absorbs the heat generated by the operation of the cutting head, and then is discharged through the outlet joint 2640.

[0044] The follow-up sensor provided in this embodiment introduces external cooling fluid through the cooling fluid connector 260 in the cooling mechanism 20 during the operation of the cutting head, and allows the cooling fluid to flow through the cooling cavity 240 of the cooling mechanism 20 which is arranged inside the shell 220 in the cooling mechanism 20 and includes a multi-layer cooling section arranged at different heights. Since the circuit module 30 is arranged inside the shell 220, the heat generated by the operation of the cutting head and the heat generated by the follow-up sensor itself can be absorbed from different positions by the cooling fluid without affecting the performance of the cutting head, thereby reducing the overall operating temperature of the follow-up sensor and ensuring that the internal circuit module 30 of the follow-up sensor is not affected by high temperature and operates normally, thereby realizing the follow-up adjustment function of the follow-up sensor on the cutting head, thereby effectively ensuring the cutting quality and efficiency.

[0045] Figure 2 and Figure 3 , is a schematic diagram of the structure of a follow-up sensor in an embodiment.

[0046] In this embodiment, if Figure 2 and Figure 3 As shown, the cooling cavity 240 includes a cooling fluid inlet section, a cooling fluid outflow section and a multi-layer cooling section 2400 arranged at different heights, the two ends of the cooling fluid inlet section are connected to the inlet joint 2620 and one end of the multi-layer cooling section 2400, and the two ends of the cooling fluid outflow section are connected to the outflow joint 2640 and the other end of the multi-layer cooling section 2400.

[0047] The cooling fluid inflow section may be a functional structure in the cooling cavity 240 that is connected to the inflow joint 2620 and the multi-layer cooling section 2400, and is capable of receiving the cooling fluid input through the inflow joint 2620 and introducing the cooling fluid into the multi-layer cooling section 2400. The cooling fluid outflow section may be a functional structure in the cooling cavity 240 that is connected to the outflow joint 2640 and the multi-layer cooling section 2400, and is capable of receiving the cooling fluid outflowing through the multi-layer cooling section 2400 and outputting the cooling fluid to the outflow joint 2640. The multi-layer cooling section 2400 may be a functional structure in the cooling cavity 240 that is connected to the cooling fluid inflow section and the cooling fluid outflow section, and is capable of receiving the cooling fluid input through the cooling fluid inflow section and outputting the cooling fluid to the cooling fluid outflow section.

[0048] Optionally, the cooling fluid inflow section may be a special-shaped tube with a circular arc cross section connected to the inflow joint 2620 and a polygonal cross section connected to the multi-layer cooling section 2400. The cooling fluid outflow section may be a special-shaped tube with a circular arc cross section connected to the outflow joint 2640 and a polygonal cross section connected to the multi-layer cooling section 2400. The multi-layer cooling section 2400 may be a plurality of arc-shaped cavity pipes arranged at different heights.

[0049] The multi-layer cooling section 2400 includes a first upper cooling sub-segment 2420, a second upper cooling sub-segment 2440, a lower cooling sub-segment 2460, a first interlayer DC sub-segment 2430 and a second interlayer DC sub-segment 2450. The first upper cooling sub-segment 2420 is connected to the cooling fluid inflow section and the first interlayer DC sub-segment 2430, the second upper cooling sub-segment 2440 is connected to the cooling fluid outflow section and the second interlayer DC sub-segment 2450, and the first interlayer DC sub-segment 2430 and the second interlayer DC sub-segment 2450 are both connected to the lower cooling sub-segment 2460.

[0050] The first upper cooling sub-segment 2420 may be a component structure disposed at the top of the multi-layer cooling segment 2400, and communicated with the cooling fluid inflow segment and the first inter-layer direct current sub-segment 2430, and capable of receiving the cooling fluid outputted through the cooling fluid inflow segment and then outputting the cooling fluid to the first inter-layer direct current sub-segment 2430. The second upper cooling sub-segment 2440 is disposed at the top of the multi-layer cooling segment 2400, and communicated with the cooling fluid outflow segment and the second inter-layer direct current sub-segment 2450, and capable of receiving the cooling fluid outputted through the second inter-layer direct current sub-segment 2450 and then outputting the cooling fluid to the cooling fluid outflow segment.

[0051] The lower cooling sub-segment 2460 may be a component structure disposed at the bottom of the multi-layer cooling segment 2400, and communicated with the first inter-layer DC sub-segment 2430 and the second inter-layer DC sub-segment 2450, and capable of receiving the cooling fluid outputted through the first inter-layer DC sub-segment 2430 and then outputting the cooling fluid to the second inter-layer DC sub-segment 2450. The first inter-layer DC sub-segment 2430 may be a component structure disposed in the middle of the multi-layer cooling segment 2400, and communicated with the first upper cooling sub-segment 2420 and the lower cooling sub-segment 2460, and capable of receiving the cooling fluid outputted through the first upper cooling sub-segment 2420 and then outputting the cooling fluid to the lower cooling sub-segment 2460. The second interlayer DC sub-segment 2450 may be a structure that is disposed in the middle of the multi-layer cooling segment 2400 and is connected to the second upper cooling sub-segment 2440 and the lower cooling sub-segment 2460, and is capable of receiving the cooling fluid output through the lower cooling sub-segment 2460 and then outputting the cooling fluid to the second upper cooling sub-segment 2440.

[0052] Optionally, the first upper cooling sub-segment 2420 and the second upper cooling sub-segment 2440 are symmetrically arranged around the axis of the shell 220, and the first upper cooling sub-segment 2420 and the second upper cooling sub-segment 2440 are both arc-shaped cavities. The first interlayer direct current sub-segment 2430 and the second interlayer direct current sub-segment 2450 are symmetrically arranged parallel to the axis of the shell 220, and the first upper cooling sub-segment 2420 and the second upper cooling sub-segment 2440 are both cylindrical cavities. The lower cooling sub-segment 2460 is a semi-arc-shaped cavity.

[0053] Specifically, during the operation of the cutting head, the inflow joint 2620 introduces the cooling fluid input from the outside, the cooling fluid inflow section connected to the inflow joint 2620 receives the cooling fluid input through the inflow joint 2620 and outputs the cooling fluid, the first upper cooling sub-segment 2420 connected to the cooling fluid inflow section receives the cooling fluid output through the cooling fluid inflow section and then outputs the cooling fluid, the first inter-layer direct current sub-segment 2430 connected to the first upper cooling sub-segment 2420 receives the cooling fluid output through the first upper cooling sub-segment 2420 and then outputs the cooling fluid, and the lower cooling sub-segment 2430 connected to the first inter-layer direct current sub-segment 2430 receives the cooling fluid output through the first upper cooling sub-segment 2420 and then outputs the cooling fluid. The cooling sub-segment 2460 receives the cooling fluid outputted via the first interlayer DC sub-segment 2430 and then outputs the cooling fluid; the second interlayer DC sub-segment 2450 connected to the lower cooling sub-segment 2460 receives the cooling fluid outputted via the lower cooling sub-segment 2460 and then outputs the cooling fluid; the second upper cooling sub-segment 2440 connected to the second interlayer DC sub-segment 2450 receives the cooling fluid outputted via the second interlayer DC sub-segment 2450 and then outputs the cooling fluid; the outflow joint 2640 connected to the second upper cooling sub-segment 2440 receives the cooling fluid outputted via the second upper cooling sub-segment 2440 and discharges it from the cooling mechanism 20.

[0054] The follow-up sensor provided in this embodiment uses the first upper cooling sub-segment 2420, the second upper cooling sub-segment 2440 and the lower cooling sub-segment 2460 which are arranged at different heights, and the first interlayer DC sub-segment 2430 and the second interlayer DC sub-segment 2450 which are used for communication, so as to absorb the heat generated by the follow-up sensor from different positions by the flowing cooling fluid, thereby effectively reducing the overall operating temperature of the follow-up sensor.

[0055] In one embodiment, one end of the cooling fluid inflow section is connected to the inflow joint 2620, and the other end is connected to one end of the multi-layer cooling section 2400 close to the inflow joint 2620; one end of the cooling fluid outflow section is connected to the outflow joint 2640, and the other end is connected to one end of the multi-layer cooling section 2400 close to the outflow joint 2640, thereby effectively shortening the connection distance between the cooling fluid inflow section and the inflow joint 2620 and the cooling fluid outflow section and the outflow joint 2640, so that the cooling fluid can flow into the cooling mechanism 20 faster and be discharged from the cooling mechanism 20 faster, thereby ensuring the heat dissipation efficiency of the follow-up sensor.

[0056] Figure 4 and Figure 5 , is a schematic diagram of the structure of a follow-up sensor in an embodiment.

[0057] In this embodiment, if Figure 4 and Figure 5 As shown, the follow-up sensor further includes a ceramic ring 40 and a locking ring 50 .

[0058] The ceramic ring 40 is disposed between the nozzle 10 and the cooling mechanism 20. The ceramic ring 40 includes an upper ceramic body 420 and a lower ceramic body 440. The upper ceramic body 420 and the lower ceramic body 440 are both disposed around the central axis of the follow-up sensor.

[0059] The locking ring 50 is connected to the upper ceramic body 420 and can lock the ceramic ring 40 to the bottom of the cooling mechanism 20 .

[0060] The ceramic ring 40 may be an integrated design of an upper ceramic body 420 and a lower ceramic body 440, and the upper ceramic body 420 and the lower ceramic body 440 are respectively arranged around the central axis of the follow-up sensor between the nozzle 10 and the cooling mechanism 20. The upper ceramic body 420 may be a ceramic body closer to the cooling mechanism 20. The lower ceramic body 440 may be a ceramic body closer to the nozzle 10. The locking ring 50 may be a structure capable of locking the ceramic ring 40 and surrounding the central axis of the follow-up sensor.

[0061] Optionally, the minimum distance between the geometric center points of the upper ceramic body 420 and the lower ceramic body 440 is greater than M, the diameter of the locking ring 50 is greater than N, and the maximum diameter of the cross section of the upper ceramic body 420 is greater than P. The value of M can be 10 mm, the value of N can be 48 mm, and the value of P can be 31 mm.

[0062] The follow-up sensor provided in this embodiment is connected to the top of the upper ceramic body 420 through a locking ring 50, which increases the distance between the locking ring 50 and the cutting head, thereby reducing the influence of temperature on the locking effect; and by increasing the size of the ceramic ring 40 and increasing the distance between the upper ceramic body 420 and the lower ceramic body 440, the installation contact area of ​​the ceramic ring 40 is increased, which effectively improves the risk of conduction between the upper and lower layers of the ceramic ring 40 after iron slag accumulates at the ceramic ring 40 due to long-term cutting processing; and by increasing the diameter of the locking ring 50 of the ceramic ring 40, the locking strength is enhanced, thereby achieving the heat dissipation efficiency of the follow-up sensor while improving the working stability of the follow-up sensor.

[0063] The present application also provides a laser processing head, which includes a follow-up sensor as in the above embodiment.

[0064] The present application also provides a processing device, which includes a follow-up sensor as in the above embodiment.

[0065] The division of the various modules in the above-mentioned follow-up sensor is only for illustration. In other embodiments, the follow-up sensor can be divided into different modules as needed to complete all or part of the functions of the above-mentioned follow-up sensor.

[0066] The follow-up sensor and processing equipment provided in the above-mentioned embodiment introduce external cooling fluid through the cooling fluid connector 260 in the cooling mechanism 20 during the operation of the cutting head, and make the cooling fluid flow through the cooling cavity 240 of the cooling mechanism 20 which is arranged inside the shell 220 in the cooling mechanism 20 and includes a multi-layer cooling section arranged at different heights. Since the circuit module 30 is arranged inside the shell 220, the heat generated by the operation of the cutting head and the heat generated by the follow-up sensor itself can be absorbed from different positions by the cooling fluid without affecting the performance of the cutting head, thereby reducing the overall operating temperature of the follow-up sensor and ensuring that the internal circuit module 30 of the follow-up sensor is not affected by high temperature and operates normally. Therefore, the follow-up adjustment function of the follow-up sensor on the cutting head effectively ensures the cutting quality and efficiency, which has important economic value and promotion and practical value.

[0067] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0068] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A follow-up sensor, characterized in that: include: nozzle; A cooling mechanism, comprising a shell, a cooling cavity and a cooling fluid joint, wherein the cooling cavity is arranged inside the shell and communicates with the cooling fluid joint, the cooling fluid joint is arranged on the shell, the nozzle is arranged on the bottom of the shell, and the cooling cavity comprises a plurality of cooling sections arranged at different heights; The circuit module is arranged inside the shell.

2. The follow-up sensor according to claim 1, characterized in that: The cooling fluid joint includes an inlet joint and an outlet joint, and the cooling cavity also includes a cooling fluid inlet section and a cooling fluid outflow section. Both ends of the cooling fluid inlet section are connected to the inlet joint and one end of the multi-layer cooling section, and both ends of the cooling fluid outflow section are connected to the outflow joint and the other end of the multi-layer cooling section.

3. The follow-up sensor according to claim 2, characterized in that: The multi-layer cooling section includes a first upper cooling sub-segment, a second upper cooling sub-segment, a lower cooling sub-segment, a first interlayer DC sub-segment and a second interlayer DC sub-segment, the first upper cooling sub-segment is connected to the cooling fluid inflow section and the first interlayer DC sub-segment, the second upper cooling sub-segment is connected to the cooling fluid outflow section and the second interlayer DC sub-segment, and the first interlayer DC sub-segment and the second interlayer DC sub-segment are both connected to the lower cooling sub-segment.

4. The follow-up sensor according to claim 3, characterized in that: The first upper cooling sub-segment and the second upper cooling sub-segment are symmetrically arranged around the axis of the shell, and both the first upper cooling sub-segment and the second upper cooling sub-segment are arc-shaped cavities.

5. The follow-up sensor according to claim 3, characterized in that: The first interlayer DC sub-segment and the second interlayer DC sub-segment are symmetrically arranged parallel to the axis of the shell, and the first upper cooling sub-segment and the second upper cooling sub-segment are both cylindrical cavities.

6. The follow-up sensor according to claim 3, characterized in that: The lower cooling subsection is a semi-arc cavity.

7. The follow-up sensor according to claim 2, characterized in that: One end of the cooling fluid inflow section is connected to the inflow joint, and the other end is connected to an end of the multi-layer cooling section close to the inflow joint; One end of the cooling fluid outflow section is connected to the outflow joint, and the other end is connected to an end of the multi-layer cooling section close to the outflow joint.

8. The follow-up sensor according to any one of claims 1 to 7, characterized in that: Also includes: A ceramic ring is arranged between the nozzle and the cooling mechanism, the ceramic ring comprises an upper ceramic body and a lower ceramic body, and the upper ceramic body and the lower ceramic body are both arranged around the central axis of the follow-up sensor; A locking ring is connected to the upper ceramic body and can lock the ceramic ring to the bottom of the cooling mechanism.

9. The follow-up sensor according to claim 8, characterized in that: The minimum distance between the geometric center points of the upper ceramic body and the lower ceramic body is greater than M; and the diameter of the locking ring is greater than N.

10. A processing equipment, characterized in that: include: A follow-up sensor as claimed in any one of claims 1 to 9.

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