Heat dissipation device for heat exchange pipeline of glass furnace

Abstract

The utility model relates to the technical field of glass kilns, and specifically to a heat dissipation device for heat exchange pipelines of glass kilns. The utility model includes a heat dissipation component, a bracket for installing the heat dissipation component, and a filter attached to the back of the bracket. The bracket is arranged in a cross shape, the heat dissipation component is located at the center of the bracket, and a sensor is arranged in the middle of the bracket extending outward along the heat dissipation component; the heat dissipation component is a multi-layer sleeve structure, including an outer spiral cone cavity shell, a middle tetrahedral guide plate, and an inner temperature-variable coil, wherein: a plurality of patch semiconductors are arranged on the surface of the tetrahedral guide plate, and the patch semiconductors are connected to the tetrahedral guide plate to form a loop. The utility model improves the heat dissipation device and uses the temperature-variable coil to fit tightly with the heat exchange pipeline of the glass kiln, thereby realizing efficient heat dissipation of the heat exchange pipeline.

Description

Technical Field

[0001] The utility model relates to the technical field of glass kilns, and in particular to a heat dissipation device for a heat exchange pipeline of a glass kiln. Background Art

[0002] In the glass production process, the heat exchange pipes of the kiln are key heat transfer components. However, as the production process continues, these pipes will generate a lot of heat. If timely and efficient heat dissipation is not achieved, it will not only seriously affect the production quality of glass products, but is also likely to cause irreversible damage to the structure and performance of the kiln itself. In order to solve this technical problem that has long plagued the field of glass manufacturing, researchers in this field have conducted in-depth exploration and research.

[0003] Although there are heat exchange components and heat dissipation devices such as those disclosed in Chinese patent CN219834745U, which use multiple semiconductor refrigeration plates to cool the guide members in contact with them and use heat sinks to enhance the heat dissipation efficiency of the heating surface of the refrigeration plates, in actual applications, this solution still faces the challenges of poor heat dissipation effect, poor system stability, and difficulty in effectively discharging water vapor formed by condensation of hot air during the heat exchange process. Utility Model Content

[0004] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide a heat dissipation device for a heat exchange pipeline of a glass kiln.

[0005] The technical solution adopted by the utility model is as follows:

[0006] A heat dissipation device for a heat exchange pipeline of a glass kiln comprises a heat dissipation component, a bracket for mounting the heat dissipation component, and a filter attached to the back of the bracket, wherein the bracket is arranged in a cross shape, the heat dissipation component is located at the center of the bracket, and a sensor is arranged in the middle of the part of the bracket extending outward along the heat dissipation component; the heat dissipation component is a multi-layer sleeve structure, comprising an outer spiral cone cavity shell, a middle tetrahedral guide plate and an inner temperature variable coil, wherein: a plurality of patch semiconductors are arranged on the surface of the tetrahedral guide plate, and the patch semiconductors are connected to the tetrahedral guide plate to form a loop.

[0007] This technical solution achieves efficient heat dissipation of the heat exchange pipeline by improving the heat dissipation device. The heat dissipation device consists of a heat dissipation component, a bracket and a filter. The bracket is arranged in a cross shape, and the heat dissipation component is located in the center. It includes a spiral cone cavity shell, a tetrahedral guide plate and a variable temperature coil through a multi-layer sleeve structure; wherein the variable temperature coil is tightly fitted with the heat exchange pipeline of the glass kiln, and the tightness of the fitting is ensured by fasteners; when the patch semiconductor on the tetrahedral guide plate is turned on by NP current, a temperature difference is generated on the tetrahedral guide plate, thereby achieving a heat dissipation effect; the heat dissipation component is arranged in the air outlet duct, and the number of conduction of the patch semiconductor is determined according to the temperature in the air outlet duct fed back by the sensor; the air in the air outlet duct is accelerated and centrifuged through the spiral cone cavity shell, which not only increases the outlet wind speed, but also effectively centrifuges the water vapor condensed by the hot air during the heat exchange process.

[0008] In addition, the heat dissipation device for the heat exchange pipeline of the glass furnace according to the utility model may also have the following additional technical features:

[0009] According to an embodiment of the utility model, the variable temperature coil extends outward from the heat dissipation component and fits tightly with the heat exchange pipeline of the glass furnace.

[0010] In this technical solution, when the variable temperature coil and the heat exchange pipeline are tightly fitted, an efficient heat conduction interface is formed between the two. Due to the tight fit, the thermal resistance is greatly reduced, so that heat can be quickly transferred to the external environment through the coil. When the cooling medium (such as water or cooling liquid) in the coil flows through the coil, it absorbs the heat on the coil, thereby reducing the temperature of the coil, realizing the transfer and reduction of heat from the heat exchange pipeline to the external environment.

[0011] According to an embodiment of the utility model, a fastener is provided at the joint between the variable temperature coil and the heat exchange pipeline.

[0012] In this technical solution, the fasteners are bolts, clamps, clamps or other types of connectors, which are used to ensure the close fit between the variable temperature coil and the heat exchange pipeline to prevent looseness or gaps caused by vibration or temperature changes. If necessary, it is necessary to use gaskets, sealants or other sealing materials to enhance the sealing performance of the connection.

[0013] According to one embodiment of the utility model, when the current conducted by the patch semiconductor passes from N to P, the electric field causes the electrons in N and the holes in P to flow in opposite directions, absorbing heat on the tetrahedral guide plate and releasing heat at the other end to generate a temperature difference.

[0014] In this technical solution, when the patch semiconductor conducts current, due to the higher electron concentration in the N-type semiconductor and the higher hole concentration in the P-type semiconductor, when the current flows from N to P, the electrons flow from the N-type semiconductor to the P-type semiconductor, while the holes flow in the opposite direction. This flow generates an electric field inside the semiconductor material, which is opposite to the direction of the current, resulting in energy conversion. On the tetrahedral guide plate, due to the passage of current and the thermoelectric effect of the semiconductor material, the flow of electrons and holes absorbs heat near the PN junction, causing the temperature there to drop; while releasing heat at another junction, causing the temperature there to rise, thereby generating a temperature difference and achieving heat transfer and heat dissipation effects.

[0015] According to an embodiment of the utility model, the heat dissipation component is arranged in the air outlet duct, and the conduction number of the SMD semiconductor is determined according to the temperature feedback from the sensor in the air outlet duct.

[0016] In this technical solution, the heat dissipation component is located in the air outlet duct, and its function is to actively absorb and release heat through semiconductor materials. The sensor in the air outlet duct is used to monitor the outlet air temperature in real time and feed back the temperature information to the control system. If the outlet air temperature is high, the control system will increase the number of SMD semiconductors that are turned on to enhance the heat dissipation capacity of the heat dissipation component; conversely, if the outlet air temperature is low, the control system will reduce the number of SMD semiconductors that are turned on to reduce the heat dissipation capacity of the heat dissipation component.

[0017] According to an embodiment of the utility model, the air in the air outlet duct is spirally accelerated and centrifuged through the spiral cone cavity shell, thereby increasing the outlet wind speed and centrifuging the water vapor condensed by the hot air during the heat exchange process.

[0018] This technical solution achieves spiral acceleration and centrifugal separation of air through the design of the spiral cone cavity shell, increases the outlet wind speed, and effectively centrifuges the water vapor generated during the heat exchange process, thereby improving the heat dissipation effect and stability of the system. When the air flows through the spiral cone cavity shell, due to the shape and angle of the cavity shell, the air is forced to flow along a spiral path. This flow path gradually increases the speed of the air, forming a spiral acceleration effect; during the acceleration process, the static pressure energy of the air is converted into dynamic pressure energy, resulting in an increase in the outlet wind speed.

[0019] Compared with the prior art, the utility model has the following beneficial effects:

[0020] (1) By improving the heat dissipation device and using the variable temperature coil to fit closely with the heat exchange pipeline of the glass furnace, efficient heat dissipation of the heat exchange pipeline is achieved;

[0021] (2) The heat dissipation component is arranged in the air outlet duct. The air in the air outlet duct is accelerated and centrifuged by the spiral cone cavity shell, which not only increases the outlet wind speed, but also effectively centrifuges the water vapor condensed by the hot air during the heat exchange process. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural schematic diagram of the utility model.

[0023] Figure 2 It is a structural schematic diagram of a tetrahedral guide vane.

[0024] Figure 3 It is a structural diagram of the variable temperature coil.

[0025] Figure 4 It is a usage state diagram of the utility model.

[0026] In the figure: 1. filter; 2. spiral cone cavity shell; 3. sensor; 4. bracket; 5. tetrahedral guide vane; 6. patch semiconductor; 7. air outlet duct; 8. variable temperature coil. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] Example 1

[0029] like Figures 1 to 4 As shown, this embodiment provides a heat dissipation device for a glass kiln heat exchange pipeline, including a heat dissipation component, a bracket 4 for installing the heat dissipation component, and a filter screen 1 attached to the back of the bracket 4, the bracket 4 is arranged in a cross shape, the heat dissipation component is located at the center of the bracket 4, and a sensor 3 is arranged in the middle of the bracket 4 extending outward along the heat dissipation component; the heat dissipation component is a multi-layer socket structure, including an outer spiral cone cavity shell 2, a middle tetrahedral guide plate 5 and an inner temperature variable coil 8, wherein: a plurality of patch semiconductors 6 are arranged on the surface of the tetrahedral guide plate 5, and the patch semiconductors 6 are connected to the tetrahedral guide plate 5 to form a loop.

[0030] like Figures 1 to 4As shown, the technical solution realizes efficient heat dissipation of the heat exchange pipeline by improving the heat dissipation device. The heat dissipation device is composed of a heat dissipation component, a bracket 4 and a filter 1. The bracket 4 is arranged in a cross shape, and the heat dissipation component is located in the center, and includes a spiral cone cavity shell 2, a four-sided pyramid guide plate 5 and a variable temperature coil 8 through a multi-layer sleeve structure; wherein the variable temperature coil 8 is tightly fitted with the heat exchange pipeline of the glass kiln, and the tightness of the fitting is ensured by fasteners; when the patch semiconductor 6 on the four-sided pyramid guide plate 5 is turned on by NP current, a temperature difference is generated on the four-sided pyramid guide plate 5, thereby achieving a heat dissipation effect; the heat dissipation component is arranged in the air outlet pipeline 7, and the number of conduction of the patch semiconductor 6 is determined according to the temperature in the air outlet pipeline 7 fed back by the sensor 3; the air in the air outlet pipeline 7 is accelerated and centrifuged through the spiral cone cavity shell 2, which not only increases the outlet wind speed, but also effectively centrifuges the water vapor condensed by the hot air during the heat exchange process.

[0031] In addition, the heat dissipation device for the heat exchange pipeline of the glass furnace according to the utility model may also have the following additional technical features:

[0032] According to an embodiment of the present invention, the variable temperature coil 8 extends outward from the heat dissipation component and fits tightly with the heat exchange pipeline of the glass furnace.

[0033] In this technical solution, when the variable temperature coil 8 is tightly fitted with the heat exchange pipeline, an efficient heat conduction interface is formed between the two. Due to the tight fit, the thermal resistance is greatly reduced, so that heat can be quickly transferred to the external environment through the coil. When the cooling medium (such as water or cooling liquid) in the coil flows through the coil, it absorbs the heat on the coil, thereby reducing the temperature of the coil, realizing the transfer and reduction of heat from the heat exchange pipeline to the external environment.

[0034] According to an embodiment of the present utility model, a fastener is provided at the joint between the temperature-variable coil 8 and the heat exchange pipeline.

[0035] In the present technical solution, the fasteners are bolts, clamps, clamps or other types of connectors, which are used to ensure the close fit between the variable temperature coil 8 and the heat exchange pipeline to prevent looseness or gaps caused by vibration or temperature changes. If necessary, it is necessary to use a gasket, sealant or other sealing materials to enhance the sealing performance of the connection.

[0036] According to one embodiment of the utility model, when the current conducted by the patch semiconductor 6 passes from N to P, the electric field causes the electrons in N and the holes in P to flow in opposite directions, absorbing heat on the tetrahedral guide plate 5 and releasing heat at the other end to generate a temperature difference.

[0037] In this technical solution, when the patch semiconductor 6 conducts current, due to the higher electron concentration in the N-type semiconductor and the higher hole concentration in the P-type semiconductor, when the current flows from N to P, the electrons flow from the N-type semiconductor to the P-type semiconductor, while the holes flow in the opposite direction. This flow generates an electric field inside the semiconductor material, which is opposite to the direction of the current, thereby leading to energy conversion. On the tetrahedral guide plate 5, due to the passage of current and the thermoelectric effect of the semiconductor material, the flow of electrons and holes absorbs heat near the PN junction, causing the temperature there to drop; and releases heat at another junction, causing the temperature there to rise, thereby generating a temperature difference and achieving heat transfer and heat dissipation effects.

[0038] According to an embodiment of the utility model, the heat dissipation component is arranged in the air outlet duct 7 , and the number of the SMD semiconductors 6 that are turned on is determined according to the temperature fed back by the sensor 3 in the air outlet duct 7 .

[0039] In this technical solution, the heat dissipation component is located in the air outlet duct 7, and its function is to actively absorb and release heat through semiconductor materials. The sensor 3 in the air outlet duct 7 is used to monitor the outlet air temperature in real time and feed back the temperature information to the control system. If the outlet air temperature is high, the control system will increase the number of conduction of the patch semiconductor 6 to enhance the heat dissipation capacity of the heat dissipation component; conversely, if the outlet air temperature is low, the control system will reduce the number of conduction of the patch semiconductor 6 to reduce the heat dissipation capacity of the heat dissipation component.

[0040] According to an embodiment of the utility model, the air in the air outlet duct 7 is spirally accelerated and centrifuged through the spiral cone cavity shell 2, thereby increasing the outlet wind speed and centrifuging the water vapor condensed by the hot air during the heat exchange process.

[0041] This technical solution realizes the spiral acceleration and centrifugal separation of air through the design of the spiral cone cavity shell 2, increases the outlet wind speed, and effectively centrifuges the water vapor generated during the heat exchange process, thereby improving the heat dissipation effect and stability of the system. When the air flows through the spiral cone cavity shell 2, due to the shape and angle of the cavity shell, the air is forced to flow along a spiral path. This flow path gradually increases the speed of the air, forming a spiral acceleration effect; during the acceleration process, the static pressure energy of the air is converted into dynamic pressure energy, resulting in an increase in the outlet wind speed.

[0042] The usage process of the above embodiment is as follows:

[0043] like Figures 1 to 4As shown, the heat exchange pipeline of the glass furnace generates heat, and the heat is transferred to the heat dissipation device through the tightly fitted variable temperature coil 8; when the cooling medium (such as water or cooling liquid) in the variable temperature coil 8 flows through the coil, it absorbs the heat on the coil and reduces the coil temperature; the sensor 3 detects that the temperature in the air outlet pipeline 7 rises to a preset threshold; the control system decides to start the patch semiconductor 6 in the heat dissipation component based on the temperature information fed back by the sensor 3; the patch semiconductor 6 starts to work, and when the current passes from N to P, a temperature difference is generated on the tetrahedral guide plate 5, thereby absorbing and releasing heat; the outside air enters the heat dissipation device through the filter 1, and when it passes through the spiral cone cavity shell 2, The air is accelerated and centrifuged by the spiral; the process of acceleration and centrifugation not only increases the outlet wind speed, but also effectively centrifuges the water vapor condensed by the hot air during the heat exchange process; the sensor 3 continuously monitors the temperature in the air outlet duct 7 and feeds back the data to the control system; the control system dynamically adjusts the conduction number of the patch semiconductor 6 according to the real-time temperature information to maintain the temperature in the air outlet duct 7 within a preset range; the heat dissipation device achieves efficient heat dissipation of the glass kiln heat exchange pipeline through the synergistic effect of the variable temperature coil 8, the patch semiconductor 6 and the spiral cone cavity shell 2; the cooled air is discharged through the air outlet duct 7 to maintain the temperature stability inside the glass kiln.

[0044] It should be noted that the control system's control of the number of on-state semiconductors 6 is a conventional technical means, and the improvement of the present invention is only in hardware improvement.

[0045] Although the utility model is described in detail by referring to the accompanying drawings and in combination with the preferred embodiments, the utility model is not limited thereto. Without departing from the spirit and essence of the utility model, a person of ordinary skill in the art may make various equivalent modifications or substitutions to the embodiments of the utility model, and these modifications or substitutions shall be within the scope of the utility model / any person of ordinary skill in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the utility model, and they shall be within the scope of protection of the utility model. Therefore, the scope of protection of the utility model shall be based on the scope of protection of the claims.

Claims

1. A heat dissipation device for a glass furnace heat exchange pipeline, characterized in that: The invention comprises a heat dissipation component, a bracket (4) for mounting the heat dissipation component, and a filter (1) attached to the back of the bracket (4); the bracket (4) is arranged in a cross shape, the heat dissipation component is located at the center of the bracket (4), and a sensor (3) is arranged in the middle of the bracket (4) extending outward from the heat dissipation component; the heat dissipation component is a multi-layer sleeve structure, comprising an outer spiral cone cavity shell (2), a middle quadrangular pyramid guide plate (5), and an inner temperature-variable coil (8), wherein: a plurality of patch semiconductors (6) are arranged on the surface of the quadrangular pyramid guide plate (5), and the patch semiconductors (6) are connected to the quadrangular pyramid guide plate (5) to form a circuit.

2. The heat dissipation device for heat exchange pipelines of a glass furnace according to claim 1, characterized in that: The variable temperature coil (8) extends outward from the heat dissipation component and fits tightly with the heat exchange pipeline of the glass furnace.

3. The heat dissipation device for heat exchange pipelines of a glass furnace according to claim 2, characterized in that: A fastener is provided at the joint between the temperature-variable coil (8) and the heat exchange pipeline.

4. The heat dissipation device for heat exchange pipelines of a glass furnace according to claim 1, characterized in that: When the current conducted by the patch semiconductor (6) passes from N to P, the electric field causes the electrons in N and the holes in P to flow in opposite directions, absorbing heat on the tetrahedral guide plate (5) and releasing heat at the other end to generate a temperature difference.

5. The heat dissipation device for heat exchange pipelines of a glass furnace according to claim 4, characterized in that: The heat dissipation component is arranged in the air outlet duct (7), and the number of the SMD semiconductors (6) that are turned on is determined according to the temperature fed back by the sensor (3) in the air outlet duct (7).

6. The heat dissipation device for heat exchange pipelines of a glass furnace according to claim 5, characterized in that: The air in the air outlet pipeline (7) is spirally accelerated and centrifuged through the spiral cone cavity shell (2), thereby increasing the outlet wind speed and centrifuging the water vapor condensed by the hot air during the heat exchange process.

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