Current collecting components and heating devices

Abstract

The utility model discloses a current collecting assembly and a heating device, wherein the current collecting assembly comprises a current collecting block, a current collecting cavity is provided inside the current collecting block, the current collecting cavity is provided with a medium inlet and a plurality of medium outlets, a spoiler block is provided in the current collecting cavity, the spoiler block comprises a guide plate and a positioning part, the guide plate is fixed to the current collecting cavity through the positioning part; the guide plate comprises a first guide plate and a second guide plate, the second guide plate is close to the medium inlet relative to the first guide plate, one end of the second guide plate is connected to one end of the first guide plate, and the other end of the second guide plate extends obliquely toward the bottom wall of the current collecting cavity; the guide plate divides the current collecting cavity into a first flow layer and a second flow layer with opposite flow directions, one end of the first flow layer is connected to the medium inlet, and the other end of the first flow layer is connected to the second flow layer. The current collecting assembly can significantly increase the heat dissipation efficiency of heat-generating electronic devices.

Description

Technical Field

[0001] The utility model relates to the technical field of heating devices, in particular to a current collecting component of a heating device.

[0002] The utility model also relates to a current collecting component and a heating device. Background Art

[0003] The automotive round tube heater in the automotive thermal management system usually has heating tubes, manifolds and other components and electrical components such as PCB boards and IGBTs. Manifolds are provided at both ends of the heating tube, and the two manifolds are respectively connected to the inlet pipe and the outlet pipe. During operation, the medium flows into the manifold from the inlet pipe and is distributed to each heating tube by the manifold. After being heated by the heating tube, it flows into the manifold at the other end of the heating tube and then flows out from the outlet pipe.

[0004] IGBT generates a large amount of heat. In order to dissipate the heat of IGBT, the IGBT is usually contacted with the collector at the inlet end. When the medium flows through the collector, it can absorb the heat conducted from the IGBT to the collector, thereby achieving the effect of cooling the IGBT.

[0005] Since the medium flow rate flowing through the bottom of the IGBT contact position inside the current collector is low, the IGBT heat dissipation efficiency is low. If the IGBT runs at high temperature for a long time, its service life will be reduced. Utility Model Content

[0006] The present technical solution provides a current collecting component to solve the above-mentioned technical problems.

[0007] The technical solution also provides a heating device provided with the current collecting assembly.

[0008] The technical solution provides a collecting component, including a collecting block, a collecting cavity is provided inside the collecting block, a medium inlet is provided at one end of the collecting cavity, a plurality of medium outlets are provided on one side of the collecting cavity, a spoiler block is provided in the collecting cavity, the spoiler block includes a guide plate and a positioning portion, the guide plate is fixedly connected to the positioning portion or is an integral structure; the guide plate includes a first guide portion and a second guide portion, the second guide portion is close to the medium inlet relative to the first guide portion, one end of the second guide portion is connected to one end of the first guide portion, and the other end of the second guide portion extends obliquely toward the bottom wall of the collecting cavity; the guide plate separates the collecting cavity into a first flow layer and a second flow layer with opposite flow directions, one end of the first flow layer is connected to the medium inlet, and the other end of the first flow layer is connected to the second flow layer.

[0009] The above-mentioned current collecting assembly is provided with a spoiler block inside the current collecting block, and the guide plate of the spoiler block can separate the current collecting cavity of the current collecting block into a first flow layer and a second flow layer which are continuous and flow in opposite directions, wherein one end of the first flow layer is connected to the medium inlet, and the other end is connected to the second flow layer. In this way, when the medium flows in from the inlet of the current collecting block, it will first flow in the first flow layer, and then enter the second flow layer after turning. Since the top of the first flow layer is used to dissipate heat for heat-generating electronic devices such as IGBT modules, the medium flows through the first flow layer in a relatively concentrated manner first, and can participate in heat exchange more efficiently, thereby increasing the heat dissipation efficiency of heat-generating electronic devices such as IGBT modules, avoiding operation under high temperature conditions, and thus extending the service life.

[0010] The heating device provided by the technical solution includes a shell, a PCB board, a heating element and a heat-generating electronic device. Both ends of the heating element are respectively provided with a collecting assembly. The collecting assembly at one end of the medium inlet of the heating element includes a collecting block. A collecting cavity is provided inside the collecting block. A medium inlet is provided at one end of the collecting cavity. A plurality of medium outlets are provided on one side of the collecting cavity. A spoiler block is provided in the collecting cavity. The spoiler block includes a guide plate and a positioning portion. The guide plate is fixedly connected to the positioning portion or is an integral structure. The guide plate includes a first guide portion and a second guide portion. The second guide portion is close to the medium inlet relative to the first guide portion. One end of the second guide portion is connected to one end of the first guide portion, and the other end of the second guide portion extends obliquely toward the bottom wall of the collecting cavity. The guide plate divides the collecting cavity into a first flow layer and a second flow layer with opposite flow directions. One end of the first flow layer is connected to the medium inlet, and the other end of the first flow layer is connected to the second flow layer. The heat-generating electronic device is attached to the top of the collecting block corresponding to the first flow layer.

[0011] The above-mentioned heating device is provided with the current collecting assembly. Since the current collecting assembly has the technical effects described above, the heating device provided with the current collecting assembly should also have corresponding technical effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 A schematic diagram of the structure of a current collecting assembly provided by an embodiment of the utility model applied to a heating device;

[0013] Figure 2 for Figure 1 AA section view;

[0014] Figure 3 for Figure 1 BB cross-sectional view;

[0015] Figure 4 for Figure 1 Axonometric view of the spoiler block shown in;

[0016] Figure 5 A schematic diagram of the structure of a second spoiler block provided in an embodiment of the utility model;

[0017] Figure 6 A schematic diagram of the structure of a third spoiler block provided in an embodiment of the utility model;

[0018] Figure 7 A schematic diagram of the structure of a fourth spoiler block provided in an embodiment of the utility model;

[0019] Figure 8 A schematic diagram of the structure of a fifth spoiler block provided in an embodiment of the utility model;

[0020] Fig. 9 A schematic diagram of the structure of a sixth spoiler block provided in an embodiment of the utility model;

[0021] Fig.10 A schematic diagram of the structure of a heating device provided in an embodiment of the utility model;

[0022] Fig.11 for Fig.10 A schematic diagram of the exploded structure of the heating device shown;

[0023] Fig.12 for Fig.11 The structural schematic diagram of the PCB fixing block is shown in FIG.

[0024] In the figure:

[0025] 10. Manifold block 11. Manifold cavity 12. Medium inlet 13. Inlet pipe 14. Medium outlet 111. First flow layer 112. Second flow layer 113. Bottom wall 20. Spoiler block 21. Guide plate 211. First guide portion 212. Second guide portion 213. Through hole 22. Positioning portion 221. First positioning plate 222. Second positioning plate 23. Reinforcing rib 30. Shell 40. PCB board 50. Heating element 51. Heating tube 60. IGBT module 70. PCB fixing block 71. Frame opening 72. Pressure portion 721. Step portion 722. Connection hole 723. Vertical cutting groove 724. Horizontal cutting groove 80. Nut. DETAILED DESCRIPTION

[0026] In order to enable those skilled in the art to better understand the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0027] In this article, the terms "upper, lower, inside, outside" and the like are established based on the positional relationships shown in the drawings. The corresponding positional relationships may also change depending on the drawings, and therefore cannot be understood as absolute limitations on the scope of protection; moreover, relational terms such as "first" and "second" and the like are merely used to distinguish one component from another with the same name, and do not necessarily require or imply any actual relationship or order between these components.

[0028] Please refer to Figures 1 to 4 , Figure 1 A schematic diagram of the structure of a current collecting assembly provided by an embodiment of the utility model applied to a heating device; Figure 2 for Figure 1 AA section view; Figure 3 for Figure 1 BB cross-sectional view; Figure 4 for Figure 1 Axonometric view of the spoiler shown in .

[0029] As shown in the figure, in a specific embodiment, the current collecting assembly provided by the utility model is mainly composed of components such as a current collecting block 10 and a spoiler block 20, wherein the current collecting block 10 is generally in the shape of a rectangular parallelepiped, and its interior is a hollow current collecting chamber 11, and a medium inlet 12 is provided at one end of the current collecting chamber 11 to connect to the inlet pipe 13, and a plurality of medium outlets 14 are provided on one side of the current collecting chamber 11, and each medium outlet 14 is respectively connected to a heating pipe 51.

[0030] The spoiler block 20 is installed in the manifold 11 . The spoiler block 20 is an integrated structure, and has a guide plate 21 and a positioning portion 22 connected in sequence. The guide plate 21 is fixed in the manifold 11 through the positioning portion 22 .

[0031] Specifically, the guide plate 21 has a first guide portion 211 and a second guide portion 212. The first guide portion 211 is parallel to the bottom wall 113 of the collecting chamber 11. The second guide portion 212 is adjacent to the medium inlet 12, opposite to the medium inlet 12 and extends obliquely from one end of the first guide portion 211 to the bottom wall 113 of the collecting chamber 11. The positioning portion 22 includes a transverse first positioning plate 221 and a vertical second positioning plate 222. The lower end of the second guide portion 212 is connected to the first positioning plate 221, and the first positioning plate 221 is connected to the second positioning plate 222, and a transition is made through a larger rounded corner. The first positioning plate 221 is attached to the bottom wall 113 of the collecting chamber 11, and the second positioning plate 222 is attached to the inner end wall of the collecting chamber 11, which is the inner wall of the end of the collecting block away from the medium inlet 12.

[0032] In this way, the guide plate 21 can be fixed in the collecting chamber 11 by the first positioning plate 221 and the second positioning plate 222. The first positioning plate 221 limits the freedom of the entire spoiler block 20 in the lateral direction, and the second positioning plate 222 limits the freedom of the entire spoiler block 20 in the vertical direction. Since the width of the guide plate 21, the first positioning plate 221 and the second positioning plate 222 are equal to the internal width of the collecting chamber 11, the freedom of the entire spoiler block 20 in the loading direction can be limited by the cover plates on both sides of the collecting chamber, so that the spoiler block 20 can be reliably fixed in three dimensions to prevent the spoiler block 20 from loosening when impacted by the medium.

[0033] After the spoiler block 20 is installed inside the manifold 10, the guide plate 21 of the spoiler block 20 separates the manifold cavity 11 into a first flow layer 111 and a second flow layer 112 that are continuous and flow in opposite directions, wherein the first flow layer 111 is located at the top and the second flow layer 112 is located at the bottom. Since the second guide portion 212 is in a downwardly inclined shape, a cavity with a gradually decreasing thickness is formed at one end of the first flow layer 111, and this cavity completely covers the medium inlet 12 of the manifold, and the medium flowing into the medium inlet 12 can be gradually guided into the horizontal cavity, and flow into the second flow layer 112 from the other end of the first flow layer 111.

[0034] The chamfer of the smooth transition between the first positioning plate 221 and the second positioning plate 222 is larger than the internal chamfer of the manifold 11 , so as to better guide the flow and enable the medium to smoothly turn 180 degrees and continue to flow.

[0035] The guide plate 21 is provided with a rectangular through hole 213 at one end away from the medium inlet to connect the first flow layer 111 and the second flow layer 112. When the medium flows from one end of the first flow layer 111 to the other end, it can enter the second flow layer 112 through the rectangular through hole 213, and then continue to flow after turning 180 degrees. While the medium flows in the first flow layer 111 and the second flow layer 112, it can be diverted to each heating tube 51 from the medium outlet 14 on the side of the manifold 10.

[0036] The positioning portion 22 includes a supporting portion connected to the first flow guiding portion 211 , and an upper end of the supporting portion abuts against an inner top wall of the manifold 11 .

[0037] For example, in order to improve the structural strength of the spoiler 20, a vertical reinforcing rib 23 is provided between the first guide portion 211 and the inner top wall of the collecting chamber 11, and a vertical reinforcing rib 23 is also provided between the first guide portion 211 and the first positioning plate 221, for a total of four vertical reinforcing ribs 23. Through the support of the reinforcing ribs 23, deformation of the spoiler 20 can be avoided.

[0038] Moreover, in the direction perpendicular to the first guide portion 211, the height of the first flow layer 111 is less than the height of the second flow layer 112. In this way, the medium can flow through the first flow layer 111 more concentratedly, and the distribution amount entering the heating tube 51 when flowing through the first flow layer 111 is smaller, thereby participating in heat dissipation more efficiently.

[0039] Please refer to Figure 5 , Figure 5 A schematic structural diagram of a second spoiler block provided in an embodiment of the utility model.

[0040] As shown in the figure, compared with the first embodiment, the difference of this embodiment is:

[0041] An end of the guide plate 21 away from the medium inlet 12 is spaced apart from the inner end wall of the manifold 11 , and can also connect the first flow layer 111 with the second flow layer 112 .

[0042] In this embodiment, the same parts as those in the first embodiment are given the same figure marks, and the same text descriptions are omitted.

[0043] Please refer to Figure 6 , Figure 6 A schematic structural diagram of a third spoiler block provided in an embodiment of the utility model.

[0044] As shown in the figure, compared with the first embodiment, the difference of this embodiment is:

[0045] The end of the guide plate 21 away from the medium inlet 12 is spaced apart from the inner end wall of the manifold 11 to connect the first flow layer 111 with the second flow layer 112. At the same time, the vertical reinforcing rib 23 between the first guide portion 211 and the first positioning plate 221 is omitted, so that the overall structure is further simplified.

[0046] In this embodiment, the same parts as those in the first embodiment are given the same figure marks, and the same text descriptions are omitted.

[0047] Please refer to Figure 7 , Figure 7 A schematic structural diagram of a fourth spoiler block provided in an embodiment of the utility model.

[0048] As shown in the figure, compared with the first embodiment, the difference of this embodiment is:

[0049] One end of the guide plate 21 away from the medium inlet 12 is spaced apart from the inner end wall of the collecting chamber 11 to connect the first flow layer 111 with the second flow layer 112. At the same time, the vertical reinforcing ribs 23 between the first guide portion 211 and the inner top wall of the collecting chamber 11 and the vertical reinforcing ribs 23 between the first guide portion 211 and the first positioning plate 221 are omitted, thereby further simplifying the overall structure.

[0050] In this embodiment, the same parts as those in the first embodiment are given the same figure marks, and the same text descriptions are omitted.

[0051] Please refer to Figure 8 , Figure 8 A schematic structural diagram of a fifth spoiler block provided in an embodiment of the utility model.

[0052] As shown in the figure, compared with the first embodiment, the difference of this embodiment is:

[0053] One end of the guide plate 21 away from the medium inlet 12 is spaced apart from the inner end wall of the collecting chamber 11 to connect the first flow layer 111 with the second flow layer 112. At the same time, the second positioning plate 222 and the vertical reinforcing rib 23 between the first guide portion 211 and the first positioning plate 221 are omitted, and only the vertical reinforcing rib 23 between the first guide portion 211 and the inner top wall of the collecting chamber 11 is retained.

[0054] During installation, the spoiler 20 is positioned in the transverse direction by the first positioning plate 221 and in the vertical direction by the vertical reinforcing ribs 23 , and can also be reliably fixed in the manifold 11 .

[0055] In this embodiment, the same parts as those in the first embodiment are given the same figure marks, and the same text descriptions are omitted.

[0056] Please refer to Fig. 9 , Fig. 9 A schematic structural diagram of a sixth spoiler block provided in an embodiment of the utility model.

[0057] As shown in the figure, compared with the first embodiment, the difference of this embodiment is:

[0058] The end of the guide plate 21 away from the medium inlet 12 is spaced apart from the inner end wall of the manifold 11 to connect the first flow layer 111 and the second flow layer 112. At the same time, the vertical reinforcing ribs 23 between the first guide portion 211 and the inner top wall of the manifold 11 are omitted, and only two vertical reinforcing ribs 23 between the first guide portion 211 and the first positioning plate 221 are retained. The first positioning plate 221 is shortened by nearly half, so that the first positioning plate 221 and the second guide portion 212 of the guide plate 21 are no longer connected, but disconnected by a certain distance. The spoiler 20 of this structure can also be reliably fixed in the manifold 11.

[0059] In this embodiment, the same parts as those in the first embodiment are given the same figure marks, and the same text descriptions are omitted.

[0060] Please refer to Figures 10 to 12 , Fig.10 A schematic diagram of the structure of a heating device provided in an embodiment of the utility model; Fig.11 for Fig.10 A schematic diagram of the exploded structure of the heating device shown; Fig.12 for Fig.11 The structural schematic diagram of the PCB fixing block is shown in FIG.

[0061] As shown in the figure, in addition to the above-mentioned current collecting assembly, the utility model also provides a heating device, specifically a vehicle-used round tube heater in a vehicle thermal management system.

[0062] The heater is mainly composed of parts and electronic components such as a shell 30, a PCB board 40, a heating element 50 and an IGBT module 60. The heating element 50 can be specifically in the form of a heating tube 51, and current collecting assemblies are respectively provided at both ends of the heating tube 51. The current collecting assembly at one end of the medium inlet is the current collecting assembly with a spoiler block introduced above. The IGBT module 60 is attached to the top of the first flow layer 111 of the current collecting block 10, and the medium flowing through the first flow layer 111 dissipates heat for the IGBT module 60.

[0063] This embodiment is provided with a substantially rectangular PCB fixing block 70, and the PCB board 40 is loaded into the PCB fixing block 70 and fixed on the PCB fixing block 70 by screws, thereby forming an independent PCB module, which is convenient for subsequent assembly and improves production efficiency.

[0064] Moreover, nuts 80 are welded on the top of the current collecting blocks 10 at both ends of the heating tube 51, and the PCB module is fixed on the current collecting blocks 10 by screws. Since the PCB module is no longer fixed by the housing 30, the structure of the housing 30 can be greatly simplified.

[0065] The PCB fixing block 70 is provided with a frame opening 71 corresponding to the pin position of the IGBT module 60, and the pin of the IGBT module 60 passes through the frame opening 71 to connect with the PCB board 40. The PCB fixing block 70 is provided with a pressing portion 72 to press the IGBT module 60 on the top of the collector block 10. The pressing portion 72 is located at the frame edge of the frame opening 71. The thickness of the pressing portion 72 is greater than the thickness of the main body of the PCB fixing block 70, and has a first surface a and a second surface b that are arranged oppositely. After installation, the first surface a contacts with the inner top surface of the housing 30, and the second surface b contacts with the IGBT module 60.

[0066] In this way, the PCB fixing block 70 can fix the PCB board 40 and, during installation, can press the IGBT module 60 by cooperating with the housing 30, thereby improving the heat dissipation efficiency.

[0067] More specifically, the first surface a of the pressure portion 72 is provided with step portions 721 at both ends, and the second surface b of the pressure portion 72 is provided with vertical cutting grooves 723 and transverse cutting grooves 724 at both ends, respectively. The transverse cutting grooves 724 extend from the inner end of the vertical cutting grooves 723 to the outer side in the length direction of the pressure portion 72. The step portion 721 is provided with a connecting hole 722, and the connecting hole 722 passes through the transverse cutting groove 724. This structure allows the pressure portion 72 to have a certain elasticity, thereby avoiding excessive squeezing of the IGBT module 60, and also allows the screw connection portion to have a certain elasticity, which can play a role in preventing loosening and effectively avoid the screws from loosening.

[0068] During actual assembly, the spoiler block 20 is first installed into the collecting block 10, and then the flow channel assembly is welded and assembled. After that, the PCB board 40 is installed into the PCB fixing block 70 and fixed by screws. Then, the PCB module is fixed on the welding nut 80 above the collecting block 10, and the inlet pipe, outlet pipe and sealing ring are installed and installed into the shell 30 together. The pressure part 72 of the PCB fixing block 70 presses the IGBT module 60 by cooperating with the inner wall of the shell 30, and fixes the PCB module. Finally, the flow channel assembly is pressed by the cover plate and screws of the shell 30 to achieve sealing.

[0069] The above is a detailed introduction to the current collecting assembly and the heating device provided by the utility model. This article uses specific examples to illustrate the principle and implementation method of the utility model. The description of the above embodiments is only used to help understand the core idea of ​​the utility model. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the utility model, the utility model can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the claims of the utility model.

Claims

1. A current collecting assembly, comprising a current collecting block (10), wherein a current collecting chamber (11) is provided inside the current collecting block (10), a medium inlet (12) is provided at one end of the current collecting chamber (11), and a plurality of medium outlets (14) are provided at one side of the current collecting chamber (11), characterized in that: A spoiler block (20) is provided in the manifold (11), the spoiler block (20) comprising a guide plate (21) and a positioning portion (22), the guide plate (21) and the positioning portion (22) being fixedly connected or forming an integral structure; the guide plate (21) comprises a first guide portion (211) and a second guide portion (212), the second guide portion (212) being closer to the medium inlet (12) relative to the first guide portion (211), and one end of the second guide portion (212) The second flow guide portion (212) is connected to one end of the first flow guide portion, and the other end of the second flow guide portion (212) extends obliquely toward the bottom wall (113) of the manifold (11); the flow guide plate (21) divides the manifold (11) into a first flow layer (111) and a second flow layer (112) having opposite flow directions; one end of the first flow layer (111) is connected to the medium inlet (12), and the other end of the first flow layer (111) is connected to the second flow layer (112).

2. The current collecting assembly according to claim 1, characterized in that: The positioning portion (22) comprises a first positioning plate (221) connected to the first flow guide portion (211) and / or the second flow guide portion (212), and the first positioning plate (221) is attached to the bottom wall (113) of the manifold (11).

3. The current collecting assembly according to claim 2, characterized in that: The positioning portion (22) comprises a second positioning plate (222) connected to the first positioning plate (221), and the second positioning plate (222) is attached to the inner end wall of the manifold (11).

4. The current collecting assembly according to claim 2, characterized in that: The positioning portion (22) comprises a supporting portion connected to the first flow guiding portion (211), and the upper end of the supporting portion abuts against the inner top wall of the manifold (11).

5. The current collecting assembly according to any one of claims 2 to 4, characterized in that: An end of the guide plate (21) away from the medium inlet (12) is spaced apart from the inner end wall of the manifold (11) so as to connect the first flow layer (111) with the second flow layer (112); or a through hole (213) is provided at the end of the guide plate (21) away from the medium inlet (12) so as to connect the first flow layer (111) with the second flow layer (112).

6. The current collecting assembly according to claim 5, characterized in that: A vertical reinforcing rib (23) is provided between the first flow guide portion (211) and the inner top wall of the manifold (11) and / or between the first flow guide portion (211) and the first positioning plate (221).

7. A heating device, comprising a housing (30), a PCB board (40), a heating element (50) and a heat-generating electronic device, wherein both ends of the heating element (50) are provided with current collecting assemblies, the current collecting assembly at one end of the medium inlet of the heating element (50) comprises a current collecting block (10), a current collecting cavity (11) is provided inside the current collecting block (10), a medium inlet (12) is provided at one end of the current collecting cavity (11), and a plurality of medium outlets (14) are provided on one side of the current collecting cavity (11), characterized in that: A spoiler block (20) is provided in the manifold (11), the spoiler block (20) comprising a guide plate (21) and a positioning portion (22), the guide plate (21) and the positioning portion (22) being fixedly connected or forming an integral structure; the guide plate (21) comprises a first guide portion (211) and a second guide portion (212), the second guide portion (212) being closer to the medium inlet (12) relative to the first guide portion (211), one end of the second guide portion (212) being connected to one end of the first guide portion, and the second guide portion (212) being connected to the medium inlet (12) The other end of the flow portion (212) extends obliquely toward the bottom wall (113) of the manifold (11); the guide plate (21) divides the manifold (11) into a first flow layer (111) and a second flow layer (112) with opposite flow directions; one end of the first flow layer (111) is connected to the medium inlet (12); the other end of the first flow layer (111) is connected to the second flow layer (112); and the heat-generating electronic device is attached to the top of the manifold block (10) corresponding to the first flow layer (111).

8. The heating device according to claim 7, characterized in that: It comprises a PCB fixing block (70), and the PCB board (40) is installed in the PCB fixing block (70) to form a PCB module.

9. The heating device according to claim 8, characterized in that: The PCB module is fixed to the top of the current collecting block (10) at both ends of the heating element (50).

10. The heating device according to claim 9, characterized in that A pressure-applying portion (72) for pressing the heat-generating electronic device against the top of the current collecting block (10) is provided at one end of the PCB fixing block (70); the pressure-applying portion (72) has a first surface (a) and a second surface (b) that are arranged opposite to each other; the first surface (a) contacts the inner top surface of the housing (30), and the second surface (b) contacts the heat-generating electronic device.

11. The heating device according to claim 10, characterized in that The PCB fixing block (70) is provided with a frame opening (71) corresponding to the pin position of the heat-generating electronic device, and the pin of the heat-generating electronic device passes through the frame opening (71) to be connected to the PCB board (40).

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