Vehicle-mounted refrigerator, thermal management system and vehicle

Abstract

The utility model discloses a vehicle-mounted refrigerator, a heat management system and a vehicle, the vehicle-mounted refrigerator comprises an inner container assembly, the inner container assembly comprises a first inner container and a second inner container, the first inner container and the second inner container are separated from each other, a heating cavity is arranged in the first inner container, and a refrigerating cavity is arranged in the second inner container; the heating pipeline assembly is arranged on the outer side of the first inner container, and a heating refrigerant flows in the heating pipeline assembly; and the refrigeration pipeline assembly is arranged on the outer side of the second inner container, and a refrigeration refrigerant flows in the refrigeration pipeline assembly. Heating refrigerants and refrigerating refrigerants are introduced into the heating pipeline assembly and the refrigerating pipeline assembly respectively, and the functions of heating of the first inner container and refrigerating of the second inner container are achieved at the same time.

Description

Technical Field

[0001] The utility model relates to the technical field of vehicle-mounted refrigerators, in particular to a vehicle-mounted refrigerator, a thermal management system and a vehicle. Background Art

[0002] As the vehicle market gradually expands, users' demands for vehicle functions are gradually increasing. For example, smart cabin car refrigerators have become one of the optional accessories for vehicles. Car refrigerators mainly include: cooling, heating, sterilization and other functions.

[0003] In the related art, some car refrigerators have cooling and heating functions, which achieve the effect of heating by installing a heating device at the bottom of the refrigeration cavity to heat the refrigeration cavity. In actual use, considering the load of the refrigeration system and the heating efficiency of the heating device, the refrigeration system and the heating device will not work at the same time. When the user needs to heat the refrigeration cavity, the refrigeration system will stop working, so the car refrigerator cannot be cooled and heated at the same time. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a vehicle refrigerator, which realizes the function of heating the first inner tank and cooling the second inner tank at the same time by respectively introducing a heating refrigerant and a cooling refrigerant into the heating pipeline assembly and the cooling pipeline assembly.

[0005] The utility model also provides a thermal management system.

[0006] The utility model further provides a vehicle.

[0007] According to the vehicle refrigerator of the first aspect of the utility model, the inner tank assembly includes: a first inner tank and a second inner tank, the first inner tank and the second inner tank are separated from each other, a heating cavity is arranged in the first inner tank, and a cooling cavity is arranged in the second inner tank; a heating pipeline assembly, the heating pipeline assembly is arranged on the outside of the first inner tank, and a heating refrigerant flows in the heating pipeline assembly; a cooling pipeline assembly, the cooling pipeline assembly is arranged on the outside of the second inner tank, and a cooling refrigerant flows in the cooling pipeline assembly.

[0008] According to the embodiment of the utility model, by respectively introducing a heating refrigerant and a cooling refrigerant into the heating pipeline assembly and the cooling pipeline assembly, the functions of simultaneously heating the first inner tank and cooling the second inner tank are achieved.

[0009] According to some embodiments of the utility model, the vehicle refrigerator further comprises: a semiconductor component, the semiconductor component is sandwiched between the first inner container and the second inner container, the side of the semiconductor component facing the first inner container is a hot end, and the side of the semiconductor component facing the second inner container is a cold end

[0010] According to some embodiments of the utility model, the semiconductor component includes: a semiconductor chip and two heat conductive parts, the two heat conductive parts are arranged on both sides of the semiconductor chip, one of the heat conductive parts is arranged at the hot end of the semiconductor chip, and the other heat conductive part is arranged at the cold end of the semiconductor chip.

[0011] According to some embodiments of the present utility model, the heat conducting component includes: a heat conducting plate and a heat exchanging plate, the heat conducting plate and the heat exchanging plate are connected to each other and the heat exchanging plate protrudes relative to the heat conducting plate, the heat conducting plate and the semiconductor sheet are in contact, the first inner liner and the second inner liner are provided with openings, and the heat exchanging plate is fitted at the openings.

[0012] According to some embodiments of the present invention, the semiconductor component further includes: a heat insulating member, the heat insulating member is clamped between the two heat conducting plates, the heat insulating member is provided with a receiving groove, and the semiconductor chip is arranged in the receiving groove.

[0013] According to some embodiments of the utility model, a first mounting hole is provided on the two heat conducting plates, a second mounting hole is provided on the heat insulating member, a first fastener passes through the first mounting hole on one of the heat conducting plates, the second mounting hole on the heat insulating member, and the first mounting hole on the other heat conducting plate and is fixedly connected with a nut; and a third mounting hole is provided on the two heat conducting plates, a fourth mounting hole is provided on the first inner liner and the second inner liner, and the second fastener is suitable for passing through the fourth mounting hole and being fixedly connected with the third mounting hole.

[0014] According to some embodiments of the present invention, the semiconductor component further includes: two heat-conducting layers, wherein the heat-conducting layers are sandwiched between the heat-conducting plate and the semiconductor chip.

[0015] According to some embodiments of the utility model, the heating pipeline assembly also includes: a heating refrigerant pipe group, a first collecting pipe and a second collecting pipe, one end of the heating refrigerant pipe group is connected to the first collecting pipe and the other end is connected to the second collecting pipe, and the heating refrigerant pipe group is arranged on the outside of the first inner tank.

[0016] According to some embodiments of the present invention, the heating pipeline assembly further includes: two first joints, one of which is connected to the first header, and the other of which is connected to the second header.

[0017] According to some embodiments of the utility model, the refrigeration pipeline assembly also includes: a refrigeration refrigerant pipe group, a third header and a fourth header, one end of the refrigeration refrigerant pipe group is connected to the third header and the other end is connected to the fourth header, and the refrigeration refrigerant pipe group is arranged on the outside of the second inner tank.

[0018] According to some embodiments of the utility model, the refrigeration pipe assembly also includes: two second joints, one of which is connected to the third collecting pipe, and the other of which is connected to the fourth collecting pipe, wherein one of the first joints and one of the second joints are connected to each other, and the other of the first joints and the other of the second joints are connected to each other.

[0019] The thermal management system according to the second aspect of the embodiment of the utility model includes the vehicle-mounted refrigerator.

[0020] The vehicle according to the third aspect of the present utility model includes the vehicle-mounted refrigerator or thermal management system.

[0021] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0023] Figure 1 is a structural schematic diagram of a vehicle refrigerator according to an embodiment of the utility model;

[0024] Figure 2 is an exploded view of a vehicle refrigerator according to an embodiment of the utility model;

[0025] Figure 3 is a cross-sectional view of a vehicle refrigerator according to an embodiment of the utility model;

[0026] Figure 4 is a schematic structural diagram of a semiconductor component according to an embodiment of the utility model;

[0027] Figure 5 It is a schematic diagram of the structure of the inner tank assembly, the heating pipeline assembly and the refrigeration pipeline assembly cooperating with each other according to an embodiment of the utility model;

[0028] Figure 6 It is a schematic structural diagram of a first header and a third header according to an embodiment of the utility model;

[0029] Figure 7It is a schematic structural diagram of the second current collecting tube and the fourth current collecting tube according to an embodiment of the utility model.

[0030] Reference numerals:

[0031] 100. Car refrigerator;

[0032] 10. Inner liner assembly; 11. First inner liner; 12. Second inner liner; 13. Opening; 14. Fourth mounting hole;

[0033] 20. Heating pipeline assembly; 21. Heating refrigerant pipe group; 22. First header; 23. Second header; 24. First joint;

[0034] 30. Refrigeration pipeline assembly; 31. Refrigeration refrigerant pipe group; 32. Third header; 33. Fourth header; 34. Second joint; 35. End cover;

[0035] 40. Semiconductor assembly; 41. Semiconductor chip; 42. Heat conducting member; 421. Heat conducting plate; 422. Heat exchange plate; 43. Heat insulating member; 44. First mounting hole; 45. Second mounting hole; 46. Third mounting hole; 47. First fastener; 48. Second fastener. DETAILED DESCRIPTION

[0036] The embodiments of the present utility model are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. The embodiments of the present utility model are described in detail below.

[0037] Reference below Figure 1-Figure 7 The vehicle refrigerator 100 according to the embodiment of the present invention is described, and the present invention also provides a vehicle.

[0038] The vehicle refrigerator 100 of the embodiment of the utility model comprises: an inner tank assembly 10, a heating pipeline assembly 20, a cooling pipeline assembly 30 and a semiconductor assembly 40. That is, the vehicle refrigerator 100 is provided with an inner tank assembly 10, and a heating pipeline assembly 20 and a cooling pipeline assembly 30 are provided on the outer side of the inner tank assembly 10, so that the inner tank assembly 10 is heated and cooled by the heating pipeline assembly 20 and the cooling pipeline assembly 30, and the semiconductor assembly 40 is also provided on the inner tank assembly 10, and the inner tank assembly 10 is assisted in heating and cooling by the semiconductor assembly 40.

[0039] Among them, Figure 1 and Figure 2As shown, the inner liner assembly 10 includes: a first inner liner 11 and a second inner liner 12, the first inner liner 11 and the second inner liner 12 are separated from each other, a heating chamber is provided in the first inner liner 11, and a cooling chamber is provided in the second inner liner 12. In other words, the inner liner assembly 10 is composed of the first inner liner 11 and the second inner liner 12 separated from each other. In addition, the first inner liner 11 is provided with a heating chamber, that is, the first inner liner 11 can be used to achieve functions such as heating or heat preservation; and the second inner liner 12 is provided with a cooling chamber, that is, the second inner liner 12 can be used to achieve functions such as cooling or refrigeration.

[0040] In addition, the first inner liner 11 and the second inner liner 12 are separated from each other, so that when the first inner liner 11 is heating and the second inner liner 12 is cooling, no heat exchange occurs between the first inner liner 11 and the second inner liner 12 .

[0041] And, refer to Figure 1 and Figure 5 As shown, the heating pipeline assembly 20 is arranged on the outside of the first inner liner 11, and a heating refrigerant flows in the heating pipeline assembly 20. That is, the heating pipeline assembly 20 is arranged on the outside of the first inner liner 11, and a heating refrigerant flows in the heating pipeline assembly 20, that is, the heating refrigerant can exchange heat with the first inner liner 11 when flowing in the heating pipeline assembly 20, so that the heating refrigerant can transfer heat to the first inner liner 11, and then the heating or heat preservation functions of the first inner liner 11 can be realized.

[0042] In addition, refer to Figure 1 and Figure 5 As shown, the refrigeration pipe assembly 30 is arranged on the outside of the second inner liner 12, and a refrigeration refrigerant flows in the refrigeration pipe assembly 30. That is, the refrigeration pipe assembly 30 is arranged on the outside of the second inner liner 12, and a refrigeration refrigerant flows in the refrigeration pipe assembly 30, that is, the refrigeration refrigerant can exchange heat with the second inner liner 12 when flowing in the refrigeration pipe assembly 30, so that the refrigeration refrigerant can transfer heat to the second inner liner 12, and then the refrigeration or heat preservation functions of the second inner liner 12 can be realized.

[0043] Therefore, by respectively introducing the heating refrigerant and the cooling refrigerant into the heating pipeline assembly 20 and the cooling pipeline assembly 30, the functions of heating the first inner tank 11 and cooling the second inner tank 12 at the same time are achieved.

[0044] Furthermore, if Figure 1-Figure 3As shown, the semiconductor component 40 is sandwiched between the first inner liner 11 and the second inner liner 12, the side of the semiconductor component 40 facing the first inner liner 11 is the hot end, and the side of the semiconductor component 40 facing the second inner liner 12 is the cold end. When the semiconductor component 40 is supplied with current, the semiconductor component 40 generates a cold end with a lower temperature close to the second inner liner 12 and a hot end with a higher temperature close to the first inner liner 11. The cold end transfers the cold to the refrigeration cavity, further improving the refrigeration effect of the refrigeration cavity; the hot end transfers the heat to the heating cavity, further improving the heating effect of the heating cavity.

[0045] In addition, the semiconductor component 40 is sandwiched between the first inner liner 11 and the second inner liner 12 , that is, the hot end of the semiconductor component 40 can be opposite to the first inner liner 11 , and the cold end of the semiconductor component 40 can be opposite to the second inner liner 12 .

[0046] When the first inner liner 11 and the second inner liner 12 are turned on in cooling and heating modes, the heating refrigerant enters the heating pipeline assembly 20, and the temperature of the first inner liner 11 is increased by heat conduction, and the cooling refrigerant enters the cooling pipeline assembly 30, and the temperature of the second inner liner 12 is reduced by heat conduction. At the same time, when the semiconductor component 40 is supplied with current, the hot end transfers heat to the heating cavity, further improving the heating effect of the first inner liner 11, and the cold end transfers cold energy to the cooling cavity, further improving the cooling effect of the second inner liner 12.

[0047] In addition, if Figure 4 As shown, the semiconductor assembly 40 includes: a semiconductor chip 41 and two heat-conducting members 42, the two heat-conducting members 42 are arranged on both sides of the semiconductor chip 41, one of the heat-conducting members 42 is arranged at the hot end of the semiconductor chip 41, and the other heat-conducting member 42 is arranged at the cold end of the semiconductor chip 41. That is, the heat-conducting members 42 are arranged on both sides of the semiconductor chip 41, wherein when the semiconductor chip 41 is powered on, the semiconductor chip 41 generates a cold end with a lower temperature close to the second inner liner 12 and a hot end with a higher temperature close to the first inner liner 11, and the two heat-conducting members 42 are arranged at the hot end and the cold end of the semiconductor chip 41, respectively, so that the two heat-conducting members 42 respectively supply the heat generated by the hot end to the first inner liner 11, and supply the cold generated by the cold end to the second inner liner 12.

[0048] In addition, the heat conductive element 42 has a high thermal conductivity, so that the heat conductive element 42 can easily transfer heat or cold to the first inner liner 11 or the second inner liner 12 .

[0049] Furthermore, if Figure 3As shown, the heat conducting member 42 includes: a heat conducting plate 421 and a heat exchanging plate 422, the heat conducting plate 421 and the heat exchanging plate 422 are connected to each other and protrude relative to the heat conducting plate 421, the heat conducting plate 421 and the semiconductor chip 41 are in contact, the first inner liner 11 and the second inner liner 12 are provided with an opening 13, and the heat exchanging plate 422 is matched at the opening 13. In other words, the heat conducting member 42 is composed of the heat conducting plate 421 and the heat exchanging plate 422 connected to each other, wherein the heat conducting plate 421 and one side of the semiconductor chip 41 are in direct contact, that is, the heat or cold generated by the semiconductor chip 41 can be directly exchanged with the heat conducting plate 421, and finally exchanged with the first inner liner 11 or the second inner liner 12 through the heat exchanging plate 422, thereby achieving heating of the first inner liner 11 or cooling of the second inner liner 12.

[0050] Among them, the heat exchange plate 422 can be composed of multiple heat exchange teeth. By arranging multiple heat exchange teeth on the heat conductive plate 421, the heat exchange area between the heat conductive plate 421 and the first inner liner 11 or the second inner liner 12 can be increased, thereby improving the heat exchange efficiency between the first inner liner 11 or the second inner liner 12 and the heat conductive member 42.

[0051] like Figure 3 and Figure 4 As shown, the semiconductor assembly 40 further includes: a heat insulating member 43, the heat insulating member 43 is sandwiched between two heat conducting plates 421, and a receiving groove is provided on the heat insulating member 43, and the semiconductor chip 41 is provided in the receiving groove. In other words, the projection of the semiconductor chip 41 on the heat conducting plate 421 is smaller than the heat conducting plate 421, so that the heat insulating member 43 is provided around the semiconductor chip 41, and the heat insulating member 43 can separate the semiconductor chip 41 from the external environment, thereby preventing the cold end and the hot end of the semiconductor chip 41 from exchanging heat with the external environment.

[0052] The heat insulating member 43 may be foam.

[0053] Reference Figure 4 As shown, the two heat conducting plates 421 are provided with a first mounting hole 44, the heat insulating member 43 is provided with a second mounting hole 45, and the first fastener 47 passes through the first mounting hole 44 on one of the heat conducting plates 421, the second mounting hole 45 on the heat insulating member 43, and the first mounting hole 44 on the other heat conducting plate 421, and then is fixedly connected with a nut. In other words, the two heat conducting plates 421 and the heat insulating member 43 are fixedly connected together by the first fastener 47. Specifically, the first mounting hole 44 is provided on the heat conducting plate 421, and the second mounting hole 45 is provided on the heat insulating member 43, so that the first fastener 47 passes through the first mounting hole 44 on one of the heat conducting plates 421, the second mounting hole 45 on the heat insulating member 43, and the first mounting hole 44 on the other heat conducting plate 421, and then is fixedly connected with a nut, so that the two heat conducting plates 421, the semiconductor chip 41 and the heat insulating member 43 can be fixedly connected together.

[0054] In addition, refer to Figure 2 and Figure 4 As shown, the two heat conducting plates 421 are provided with third mounting holes 46, the first inner liner 11 and the second inner liner 12 are provided with fourth mounting holes 14, and the second fastener 48 is fixedly connected with the third mounting holes 46 after passing through the fourth mounting holes 14. In other words, the heat conducting plates 421 are provided with third mounting holes 46, and the first inner liner 11 and the second inner liner 12 are provided with fourth mounting holes 14, so that the heat conducting plates 421 and the first inner liner 11 and the second inner liner 12 can be fixedly connected by the second fastener 48 passing through the fourth mounting holes 14 and the third mounting holes 46, so that the fixed connection between the heat conducting plates 421 and the first inner liner 11 and the second inner liner 12 can be achieved, so that the fixed connection between the semiconductor component 40 and the first inner liner 11 and the second inner liner 12 can be achieved.

[0055] Furthermore, the semiconductor component 40 further includes: two heat-conducting layers, which are sandwiched between the heat-conducting plate 421 and the semiconductor chip 41. That is, a heat-conducting layer is provided between the heat-conducting plate 421 and the semiconductor chip 41, and the heat-conducting layer has a high thermal conductivity, so that the heat generated by the hot end of the semiconductor chip 41 can be well transferred to one of the heat-conducting plates 421, and the cold generated by the cold end of the semiconductor chip 41 can be well transferred to the other heat-conducting plate 421.

[0056] The thermal conductive layer is not limited to thermal conductive silicone grease.

[0057] like Figure 5 As shown, the heating pipeline assembly 20 further includes: a heating refrigerant pipe group 21, a first header 22, and a second header 23. One end of the heating refrigerant pipe group 21 is connected to the first header 22 and the other end is connected to the second header 23. The heating refrigerant pipe group 21 is arranged outside the first inner tank 11. In other words, the heating pipeline assembly 20 is composed of the heating refrigerant pipe group 21, the first header 22, and the second header 23. The heating refrigerant first flows into the first header 22, and then flows into the heating refrigerant pipe group 21. The heating refrigerant exchanges heat with the first inner tank 11 in the heating refrigerant pipe group 21, thereby achieving heating of the first inner tank 11. Finally, it flows into the second header 23 and flows to the outside.

[0058] The heating refrigerant pipe group 21 is composed of a plurality of heating harmonica pipes spaced apart in the up-and-down direction.

[0059] Heating refrigerants include Freon and hydrofluorocarbons, such as R-22, R-410A, R-134a, etc.

[0060] In addition, if Figure 6 and Figure 7As shown, the heating pipeline assembly 20 further includes: two first joints 24, one of which is connected to the first header 22, and the other first joint 24 is connected to the second header 23. That is, the two first joints 24 are connected to the first header 22 and the second header 23, respectively, the first joint 24 connected to the first header 22 is a heating liquid inlet joint, and the first joint 24 connected to the second header 23 is a heating liquid outlet joint.

[0061] like Figure 5 As shown, the refrigeration pipeline assembly 30 also includes: a refrigeration refrigerant pipe group 31, a third header 32 and a fourth header 33. One end of the refrigeration refrigerant pipe group 31 is connected to the third header 32 and the other end is connected to the fourth header 33. The refrigeration refrigerant pipe group 31 is arranged on the outside of the second inner liner 12. In other words, the refrigeration pipeline assembly 30 is composed of the refrigeration refrigerant pipe group 31, the third header 32 and the fourth header 33. The refrigeration refrigerant first flows into the third header 32 and then flows into the refrigeration refrigerant pipe group 31. The refrigeration refrigerant exchanges heat with the second inner liner 12 in the refrigeration refrigerant pipe group 31, thereby realizing the refrigeration of the second inner liner 12. Finally, it flows into the fourth header 33 and flows to the outside.

[0062] The cooling refrigerant pipe group 31 is composed of a plurality of cooling harmonica pipes spaced apart in the up-down direction.

[0063] Among them, Figure 6 and Figure 7 As shown, the first header 22 and the third header 32 are connected to each other, and the second header 23 and the fourth header 33 are connected to each other. That is, the first header 22 and the third header 32 are an integrally formed structure, and the second header 23 and the fourth header 33 are an integrally formed structure, that is, this can effectively reduce the space occupied by the refrigeration pipeline assembly 30 and the heating pipeline assembly 20.

[0064] like Figure 6 and Figure 7 As shown, the refrigeration pipeline assembly 30 also includes: two second joints 34, one of which is connected to the third header 32, and the other second joint 34 is connected to the fourth header 33. That is, the two second joints 34 are connected to the third header 32 and the fourth header 33 respectively, the second joint 34 connected to the third header 32 is a refrigeration liquid inlet joint, and the second joint 34 connected to the fourth header 33 is a refrigeration liquid outlet joint.

[0065] In addition, one of the first joints 24 and one of the second joints 34 are connected to each other, and the other first joint 24 and the other second joint 34 are connected to each other. That is, one of the first joints 24 and one of the second joints 34 are an integrally formed structure, and the other first joint 24 and the other second joint 34 are an integrally formed structure, that is, the space occupied by the two first joints 24 and the two second joints 34 can be effectively reduced.

[0066] In addition, end covers 35 are provided at both ends of the first header 22 . Similarly, end covers 35 are provided at both ends of the second header 23 , the third header 32 , and the fourth header 33 .

[0067] According to the second aspect of the present invention, the thermal management system includes: a vehicle refrigerator 100, wherein the refrigerant in the heating pipeline assembly and the cooling pipeline assembly of the vehicle refrigerator 100 is the refrigerant of the vehicle refrigerator 100 itself.

[0068] Of course, the thermal management system also includes: an air-conditioning system. The air-conditioning system and the vehicle refrigerator 100 can be connected through a refrigerant pipeline, that is, the refrigerant in the air-conditioning system can flow into the vehicle refrigerator 100 to achieve heating of the first inner tank 11 and cooling of the second inner tank 12.

[0069] The vehicle according to the third aspect of the present utility model includes a vehicle refrigerator 100 or a thermal management system.

[0070] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0071] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example.

[0072] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A vehicle refrigerator, characterized in that: include: An inner liner assembly, the inner liner assembly comprising: a first inner liner and a second inner liner, the first inner liner and the second inner liner are separated from each other, a heating chamber is provided in the first inner liner, and a cooling chamber is provided in the second inner liner; A heating pipeline assembly, wherein the heating pipeline assembly is arranged on the outside of the first inner tank, and a heating refrigerant flows in the heating pipeline assembly; A refrigeration pipeline assembly is arranged on the outside of the second inner tank, and a refrigeration refrigerant flows in the refrigeration pipeline assembly.

2. The vehicle refrigerator according to claim 1, characterized in that: Also includes: A semiconductor component is sandwiched between the first inner liner and the second inner liner, the side of the semiconductor component facing the first inner liner is a hot end, and the side of the semiconductor component facing the second inner liner is a cold end.

3. The vehicle refrigerator according to claim 2, characterized in that: The semiconductor component comprises: a semiconductor chip and two heat-conducting members, wherein the two heat-conducting members are arranged at both sides of the semiconductor chip, one of the heat-conducting members is arranged at the hot end of the semiconductor chip, and the other heat-conducting member is arranged at the cold end of the semiconductor chip.

4. The vehicle refrigerator according to claim 3, characterized in that: The heat conducting component includes: a heat conducting plate and a heat exchanging plate, the heat conducting plate and the heat exchanging plate are connected to each other and the heat exchanging plate protrudes relative to the heat conducting plate, the heat conducting plate is in contact with the semiconductor sheet, the first inner liner and the second inner liner are provided with openings, and the heat exchanging plate is fitted at the openings.

5. The vehicle refrigerator according to claim 4, characterized in that: The semiconductor assembly further includes: a heat insulating member, the heat insulating member is sandwiched between the two heat conducting plates, the heat insulating member is provided with a receiving groove, and the semiconductor chip is arranged in the receiving groove.

6. The vehicle refrigerator according to claim 5, characterized in that: The two heat conducting plates are provided with a first mounting hole, the heat insulating member is provided with a second mounting hole, a first fastener passes through the first mounting hole on one of the heat conducting plates, the second mounting hole on the heat insulating member, and the first mounting hole on the other heat conducting plate, and then is fixedly connected with a nut; and, A third mounting hole is provided on the two heat conducting plates, a fourth mounting hole is provided on the first inner liner and the second inner liner, and the second fastener is suitable for passing through the fourth mounting hole and then being fixedly connected with the third mounting hole.

7. The vehicle refrigerator according to claim 4, characterized in that: The semiconductor component further comprises: two heat-conducting layers, wherein the heat-conducting layers are sandwiched between the heat-conducting plate and the semiconductor chip.

8. The vehicle refrigerator according to claim 1, characterized in that: The heating pipeline assembly also includes: a heating refrigerant pipe group, a first header and a second header, one end of the heating refrigerant pipe group is connected to the first header and the other end is connected to the second header, and the heating refrigerant pipe group is arranged on the outside of the first inner tank.

9. The vehicle refrigerator according to claim 8, characterized in that: The heating pipeline assembly further includes: two first joints, one of which is communicated with the first header, and the other of which is communicated with the second header.

10. The vehicle refrigerator according to claim 9, characterized in that: The refrigeration pipeline assembly also includes: a refrigeration refrigerant pipe group, a third header and a fourth header, one end of the refrigeration refrigerant pipe group is connected to the third header and the other end is connected to the fourth header, and the refrigeration refrigerant pipe group is arranged on the outside of the second inner tank.

11. The vehicle refrigerator according to claim 10, characterized in that: The refrigeration pipeline assembly further includes: two second joints, one of which is connected to the third header, and the other of which is connected to the fourth header, wherein: One of the first connectors and one of the second connectors are connected to each other, and another of the first connectors and another of the second connectors are connected to each other.

12. A thermal management system, characterized in that: include: The vehicle refrigerator according to any one of claims 1 to 11.

13. A vehicle, characterized in that: include: The vehicle refrigerator according to any one of claims 1 to 11 or the thermal management system according to claim 12.

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