Microchannel heat exchangers and refrigeration equipment

Abstract

The present application relates to the field of refrigeration technology, and discloses a microchannel heat exchanger, comprising: a first header; a second header, arranged in parallel with the first header; a microchannel heat exchange plate group, bent and arranged between the first header and the second header, and the microchannel heat exchange plate group is parallel to the first header or the second header, wherein a plurality of heat dissipation fins are arranged on the surface of the microchannel heat exchange plate group, and the heat dissipation fins are parallel to the first header or the second header. The microchannel heat exchanger disclosed in the present application improves the outflow efficiency of defrost water, thereby improving the heat exchange efficiency of the microchannel heat exchanger. The present application also provides a refrigeration device.

Description

Technical Field

[0001] The present application relates to the field of refrigeration technology, for example, to a microchannel heat exchanger and a refrigeration device. Background Art

[0002] Refrigeration equipment such as refrigerators usually include a refrigeration system consisting of a compressor, a condenser, a throttle valve and an evaporator. The refrigerator body encloses a freezer compartment and a refrigerator compartment, and the evaporator is used to provide cooling for the freezer compartment and the refrigerator compartment.

[0003] At present, the evaporators of refrigerators and other refrigeration equipment are mostly fin-tube evaporators, which include fins and refrigerant tubes passing through the fins. However, the fin-tube evaporator is large in size and occupies a large installation space when installed in refrigerators and other refrigeration equipment, which is not conducive to the miniaturization of refrigeration equipment.

[0004] In the process of implementing the embodiments of the present disclosure, it is found that there are at least the following problems in the related art:

[0005] Microchannel heat exchangers are heat exchangers with high heat exchange efficiency and small size. However, the evaporator of refrigeration equipment such as refrigerators is prone to frost, and it is difficult to drain the defrost water when the existing microchannel heat exchanger is used as an evaporator.

[0006] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present application, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Utility Model Content

[0007] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical components or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

[0008] The embodiment of the present disclosure provides a microchannel heat exchanger, comprising: a first header; a second header, which is arranged in parallel with the first header; a microchannel heat exchange plate group, which is bent and arranged between the first header and the second header, and the microchannel heat exchange plate group is parallel to the first header or the second header, wherein a plurality of heat dissipation fins are arranged on the surface of the microchannel heat exchange plate group, and the heat dissipation fins are parallel to the first header or the second header.

[0009] In some optional embodiments, the microchannel heat exchange plate group includes: a first microchannel heat exchange plate, including a first connecting end connected to the first collecting pipe, and a second connecting end connected to the second collecting pipe; and a second microchannel heat exchange plate, arranged at the lower part of the first microchannel heat exchange plate, the second microchannel heat exchange plate including a third connecting end connected to the first collecting pipe, and a fourth connecting end connected to the second collecting pipe, wherein the first collecting pipe includes a first dividing point located between the first connecting end and the third connecting end, the second collecting pipe includes a second dividing point located at the lower part of the fourth connecting end, and the first dividing point and the second dividing point are both provided with dividing plates.

[0010] In some optional embodiments, the first microchannel heat exchange plate includes a first microchannel plate segment provided with a first connecting end, and a second microchannel plate segment provided with a second connecting end, a first heat dissipating fin group is provided between the first microchannel plate segment and the second microchannel plate segment, the second microchannel heat exchange plate includes a third microchannel plate segment provided with a third connecting end, and a fourth microchannel plate segment provided with a fourth connecting end, a second heat dissipating fin group is provided between the third microchannel plate segment and the fourth microchannel plate segment, wherein the multiple heat dissipating fins in the second heat dissipating fin group are correspondingly arranged at the lower part of the multiple heat dissipating fins in the first heat dissipating fin group.

[0011] In some optional embodiments, the number of heat dissipation fins in the first heat dissipation fin group is greater than the number of heat dissipation fins in the second heat dissipation fin group.

[0012] In some optional embodiments, the outer surface of the first microchannel plate segment is provided with a first bent fin, and the outer surface of the third microchannel plate segment is provided with a third bent fin, wherein the third bent fin is correspondingly arranged at the lower portion of the first bent fin; the outer surface of the second microchannel plate segment is provided with a second bent fin, and the outer surface of the fourth microchannel plate segment is provided with a fourth bent fin, wherein the fourth bent fin is correspondingly arranged at the lower portion of the second bent fin.

[0013] In some optional embodiments, the fin spacing in the first heat dissipating fin group is smaller than the fin spacing in the first bent fin or the second bent fin; and / or, the fin spacing in the second heat dissipating fin group is smaller than the fin spacing in the third bent fin or the fourth bent fin.

[0014] In some optional embodiments, the first bent fin includes a first bent heat dissipation segment, wherein the spacing between the first bent heat dissipation segment and the outer surface of the first microchannel plate segment is smaller than the spacing between the first microchannel plate segment and the second microchannel plate segment; and / or, the second bent fin includes a second bent heat dissipation segment, wherein the spacing between the second bent heat dissipation segment and the outer surface of the second microchannel plate segment is smaller than the spacing between the first microchannel plate segment and the second microchannel plate segment; and / or, the third bent fin includes a third bent heat dissipation segment, wherein the spacing between the third bent heat dissipation segment and the outer surface of the third microchannel plate segment is smaller than the spacing between the third microchannel plate segment and the fourth microchannel plate segment; and / or, the fourth bent fin includes a fourth bent heat dissipation segment, wherein the spacing between the fourth bent heat dissipation segment and the outer surface of the fourth microchannel plate segment is smaller than the spacing between the third microchannel plate segment and the fourth microchannel plate segment.

[0015] In some optional embodiments, the first microchannel heat exchange plate also includes a first curved channel section connected between the first microchannel plate section and the second microchannel plate section, wherein the first heat dissipation fin group includes a first end fin close to the first curved channel section, and the maximum distance between the first end fin and the inner surface of the first curved channel section is greater than or equal to the first preset spacing.

[0016] In some optional embodiments, the second microchannel heat exchange plate also includes a second curved channel section connected between the third microchannel plate section and the fourth microchannel plate section, wherein the second heat dissipation fin group includes a second end fin close to the second curved channel section, and the maximum distance between the second end fin and the inner surface of the second curved channel section is greater than or equal to the first preset spacing.

[0017] The disclosed embodiment also provides a refrigeration device, including the microchannel heat exchanger as described above.

[0018] The microchannel heat exchanger and refrigeration equipment provided by the embodiments of the present disclosure can achieve the following technical effects:

[0019] The microchannel heat exchanger provided in the embodiment of the present disclosure includes a first header, a second header and a microchannel heat exchange plate group. The microchannel heat exchange plate group is bent, and its two ends are respectively connected to the first header and the second header, and a plurality of heat dissipation fins are arranged on the surface of the microchannel heat exchange plate group. The microchannel heat exchange plate group is arranged in parallel with the first header or the second header, and the heat dissipation fins are also arranged in parallel with the first header or the second header.

[0020] In this way, when the frost layer on the surface of the microchannel heat exchanger is defrosted, the defrosting water can flow down along the microchannel heat exchange plates and heat dissipation fins, so that the defrosting water can be discharged smoothly, thereby ensuring the heat exchange efficiency of the microchannel heat exchanger.

[0021] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] One or more embodiments are exemplarily described by corresponding drawings, which do not limit the embodiments. Devices with the same reference numerals in the drawings are shown as similar devices, and the drawings do not constitute a scale limitation, and wherein:

[0023] Figure 1 is a schematic structural diagram of a microchannel heat exchanger provided in an embodiment of the present disclosure;

[0024] Figure 2 yes Figure 1 A magnified view of a selected portion;

[0025] Figure 3 is a schematic structural diagram of another microchannel heat exchanger provided by an embodiment of the present disclosure;

[0026] Figure 4 is a schematic diagram of the flow of refrigerant in a microchannel heat exchanger provided in an embodiment of the present disclosure;

[0027] Figure 5 is a schematic diagram of the flow of refrigerant in another microchannel heat exchanger provided in an embodiment of the present disclosure;

[0028] Figure 6 is a schematic structural diagram of another microchannel heat exchanger provided by an embodiment of the present disclosure;

[0029] Figure 7 It is a schematic structural diagram of another microchannel heat exchanger provided in an embodiment of the present disclosure.

[0030] Reference numerals:

[0031] 11: first header; 12: second header;

[0032] 21: first microchannel heat exchange plate; 211: first connecting end; 212: second connecting end; 22: second microchannel heat exchange plate; 221: third connecting end; 222: fourth connecting end; 201: first microchannel plate section; 202: second microchannel plate section; 203: first bending channel section;

[0033] 31: first heat dissipation fin group; 32: second heat dissipation fin group; 311: first end fin;

[0034] 41: first partition plate; 42: second partition plate. DETAILED DESCRIPTION

[0035] In order to be able to understand the features and technical contents of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The attached drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.

[0036] The terms "first", "second", etc. in the specification and claims of the disclosed embodiments and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged where appropriate to describe the disclosed embodiments here. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0037] In the embodiments of the present disclosure, the terms "upper", "lower", "inside", "middle", "outside", "front", "back" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. These terms are mainly intended to better describe the embodiments of the present disclosure and their embodiments, and are not intended to limit the indicated devices, components or components to have a specific direction, or to be constructed and operated in a specific direction. Moreover, in addition to being used to indicate directions or positional relationships, some of the above terms may also be used to indicate other meanings. For example, the term "upper" may also be used to indicate a certain dependency or connection relationship in certain circumstances. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0038] In addition, the terms "disposed", "connected", and "fixed" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, components, or components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to the specific circumstances.

[0039] Unless otherwise stated, the term "plurality" means two or more.

[0040] The term "and / or" is a description of the association relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or, A and B.

[0041] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.

[0042] The present disclosure provides a microchannel heat exchanger, such as Figures 1 to 7 shown.

[0043] Optionally, the microchannel heat exchanger includes a first header 11, a second header 12 and a microchannel heat exchange plate group. The second header 12 is arranged in parallel with the first header 11, the microchannel heat exchange plate group is bent and arranged between the first header 11 and the second header 12, and the microchannel heat exchange plate group is parallel to the first header 11 or the second header 12, wherein a plurality of heat dissipation fins are arranged on the surface of the microchannel heat exchange plate group, and the heat dissipation fins are parallel to the first header 11 or the second header 12.

[0044] In the microchannel heat exchanger provided in the embodiment of the present disclosure, the microchannel heat exchange plate group includes a plurality of microchannel heat exchange plates arranged vertically in sequence, and the plurality of microchannel heat exchange plates are all bent, with both ends respectively connected to the first header 11 and the second header 12.

[0045] In the installed state, the first header 11 and the second header 12 are both vertical and close to each other, and the multiple microchannel heat exchange plates in the microchannel heat exchange plate group are parallel to the first header 11, or the multiple microchannel heat exchange plates in the microchannel heat exchange plate group are parallel to the second header 12. It can be understood that the larger heat exchange surface of the microchannel heat exchange plate is arranged vertically. Similarly, the heat sink fins are also arranged parallel to the first header 11 or the second header 12. It can be understood that the larger heat sink surface of the heat sink fins is arranged vertically. In this way, the defrost water after defrosting can flow down along the surface of the microchannel heat exchange plate or the heat sink fins, so that the defrost water can be discharged smoothly, thereby ensuring the heat exchange efficiency of the microchannel heat exchanger, such as Figures 1 to 3 shown.

[0046] Optionally, the microchannel heat exchange plate group includes a first microchannel heat exchange plate 21 and a second microchannel heat exchange plate 22. The first microchannel heat exchange plate 21 includes a first connecting end 211 connected to the first header 11 and a second connecting end 212 connected to the second header 12. The second microchannel heat exchange plate 22 is arranged at the lower part of the first microchannel heat exchange plate 21, and the second microchannel heat exchange plate 22 includes a third connecting end 221 connected to the first header 11 and a fourth connecting end 222 connected to the second header 12. Among them, the first header 11 includes a first dividing point located between the first connecting end 211 and the third connecting end 221, the second header 12 includes a second dividing point located below the fourth connecting end 222, and the first dividing point and the second dividing point are both provided with a dividing plate.

[0047] The first connecting end 211 and the second connecting end 212 of the first microchannel heat exchange plate 21 are directly connected to the first collecting pipe 11 and the second collecting pipe 12 respectively, the second microchannel heat exchange plate 22 is arranged at the lower part of the first microchannel heat exchange plate 21, and the third connecting end 221 and the fourth connecting end 222 of the second microchannel heat exchange plate 22 are directly connected to the first collecting pipe 11 and the second collecting pipe 12 respectively. Optionally, a first partition plate 41 is provided at the first dividing point of the first manifold 11, and a second partition plate 42 is provided at the second dividing point of the second manifold 12. It can be understood that the first partition plate 41 and the second partition plate 42 are both used to separate the refrigerant and block the circulation of the refrigerant, so that after the refrigerant flows into the first manifold 11, it first flows into the first microchannel heat exchange plate 21 through the first connecting end 211, and after heat exchange in the first microchannel heat exchange plate 21, it flows into the second manifold 12 through the second connecting end 212, and then flows into the second microchannel heat exchange plate 22 through the fourth connecting end 222, and after heat exchange in the second microchannel heat exchange plate 22, it flows into the first manifold 11 through the third connecting end 221, as shown in FIG. Figure 4 and Figure 5 shown.

[0048] Optionally, a plurality of partition plates are provided in the first manifold 11, and the plurality of partition plates are provided at intervals of a connecting end of a microchannel heat exchange plate. Similarly, a plurality of partition plates are also provided in the second manifold 12, and the plurality of partition plates are provided at intervals of a connecting end of a microchannel heat exchange plate. Optionally, the plurality of partition plates in the first manifold 11 and the plurality of partition plates in the second manifold 12 are alternately provided in the vertical direction, such as Figure 5 shown.

[0049] Optionally, the partition plate is welded to the first collecting tube 11 or the second collecting tube 12, or the first collecting tube 11 or the second collecting tube 12 includes two open D-shaped tubes with the partition plate disposed inside the D-shaped tube, and the first collecting tube 11 or the second collecting tube 12 is obtained by splicing two D-shaped tubes.

[0050] Optionally, the first microchannel heat exchange plate 21 includes a first microchannel plate section 201 and a second microchannel plate section 202, the first microchannel plate section 201 includes a first connecting end 211, and the second microchannel plate section 202 includes a second connecting end 212. A first heat dissipation fin group 31 is arranged between the first microchannel plate section 201 and the second microchannel plate section 202. The second microchannel heat exchange plate 22 includes a third microchannel plate section and a fourth microchannel plate section, the third microchannel plate section includes a third connecting end 221, and the fourth microchannel plate section includes a fourth connecting end 222. A second heat dissipation fin group 32 is arranged between the third microchannel plate section and the fourth microchannel plate section, wherein the plurality of heat dissipation fins in the second heat dissipation fin group 32 are arranged correspondingly to the lower part of the plurality of heat dissipation fins in the first heat dissipation fin group 31.

[0051] The multiple heat dissipation fins in the first heat dissipation fin group 31 are all arranged vertically, and both ends of the multiple heat dissipation fins are respectively connected to the first microchannel plate segment 201 and the second microchannel plate segment 202. Similarly, the multiple heat dissipation fins in the second heat dissipation fin group 32 are all arranged vertically, and both ends of the multiple heat dissipation fins are respectively connected to the third microchannel plate segment and the fourth microchannel plate segment.

[0052] The multiple heat dissipation fins in the second heat dissipation fin group 32 are correspondingly arranged at the lower part of the multiple heat dissipation fins in the first heat dissipation fin group 31. It can be understood that the multiple heat dissipation fins in the first heat dissipation fin group 31 are projected in the vertical direction, and the multiple heat dissipation fins in the second heat dissipation fin group 32 are projected in the vertical direction, and the two groups of projections are overlapped.

[0053] Optionally, the number of heat dissipation fins in the first heat dissipation fin group 31 is greater than the number of heat dissipation fins in the second heat dissipation fin group 32. For example, the first heat dissipation fin group 31 includes heat dissipation fins marked as 1, 2, 3, 4, 5, 6, 7, 8, 9, and 10 in sequence, and correspondingly, heat dissipation fins are arranged below the positions corresponding to positions 1, 3, 5, 7, and 9 in the second heat dissipation fin group 32.

[0054] Optionally, the refrigerant flow path of the microchannel heat exchanger provided in the embodiment of the present disclosure is: after the refrigerant flows into the first manifold 11, it first flows into the first microchannel plate segment 201 through the first connecting end 211, flows into the second microchannel plate segment 202 in the first microchannel plate segment 201, and after heat exchange, flows into the second manifold 12 through the second connecting end 212, and then flows into the fourth microchannel plate segment through the fourth connecting end 222, flows into the third microchannel plate segment in the fourth microchannel plate segment, and after heat exchange, flows into the first manifold 11 through the third connecting end 221. It can be understood that when the microchannel heat exchanger includes more than two microchannel heat exchange plates, the refrigerant flow paths of the other microchannel heat exchange plates are the same as the first microchannel heat exchange plate 21 and the second microchannel heat exchange plate 22. Figure 4 and Figure 5 shown.

[0055] Optionally, a first bent fin is disposed on an outer surface of the first microchannel plate segment 201, and a third bent fin is disposed on an outer surface of the third microchannel plate segment, wherein the third bent fin is disposed correspondingly at the lower portion of the first bent fin.

[0056] In order to improve the heat exchange efficiency, the outer surface of the first microchannel plate segment 201 is also provided with a first bent fin, and the outer surface of the third microchannel plate segment is also correspondingly provided with a third bent fin. In the vertical direction, the third bent fin is correspondingly provided at the lower part of the first bent fin, so that the defrost water flowing down from the first bent fin will not be blocked by the third bent fin and can be discharged smoothly.

[0057] Optionally, the first bent fin is integrally formed and welded to the outer surface of the first microchannel plate segment 201; similarly, the third bent fin is integrally formed and welded to the outer surface of the third microchannel plate segment.

[0058] Optionally, the outer surface of the second microchannel plate segment 202 is provided with a second bent fin, and the outer surface of the fourth microchannel plate segment is provided with a fourth bent fin, wherein the fourth bent fin is correspondingly provided at the lower part of the second bent fin.

[0059] Similarly, in order to improve the heat exchange efficiency, the outer surface of the second microchannel plate segment 202 is also provided with a second bent fin, and the outer surface of the fourth microchannel plate segment is also correspondingly provided with a fourth bent fin. In the vertical direction, the fourth bent fin is correspondingly provided at the lower part of the second bent fin, so that the defrost water flowing down from the second bent fin will not be blocked by the fourth bent fin and can flow down smoothly.

[0060] Optionally, the second bent fin is integrally formed and welded to the outer surface of the second microchannel plate segment 202; similarly, the fourth bent fin is integrally formed and welded to the outer surface of the fourth microchannel plate segment.

[0061] Optionally, the fin spacing in the first heat dissipating fin group 31 is smaller than the fin spacing in the first bent fins or the second bent fins.

[0062] Compared with the first bent fins disposed on the outer surface of the first microchannel plate segment 201, the spacing between two adjacent fins in the first heat dissipation fin group 31 is smaller, so that the heat dissipation effect of the first heat dissipation fin group 31 on the first microchannel heat exchange plate 21 is improved. Optionally, the first bent fins can also be called first folded fins, and the first bent fins are formed by a plurality of continuously bent fins, including vertical fins perpendicular to the first microchannel plate segment 201 and parallel fins parallel to the first microchannel plate segment 201. It can be understood that the fin spacing of the first bent fins is the spacing between two adjacent vertical fins.

[0063] Similarly, relative to the second bent fins disposed on the outer surface of the second microchannel plate segment 202, the spacing between the two adjacent fins in the first heat dissipation fin group 31 is smaller, thus improving the heat dissipation effect of the first heat dissipation fin group 31 on the first microchannel heat exchange plate 21. Optionally, the second bent fins can also be called second folded fins, and the second bent fins are formed by a plurality of continuously bent fins, including vertical fins perpendicular to the second microchannel plate segment 202 and parallel fins parallel to the second microchannel plate segment 202. It can be understood that the fin spacing of the second bent fins is the spacing between two adjacent vertical fins. Optionally, the fin spacing of the first bent fins is equal to the fin spacing of the second bent fins.

[0064] The fin spacing in the second heat dissipating fin group 32 is smaller than the fin spacing in the third bent fin or the fourth bent fin.

[0065] Compared with the third bent fins disposed on the outer surface of the third microchannel plate segment, the spacing between two adjacent fins in the second heat dissipation fin group 32 is smaller, so that the heat dissipation effect of the second heat dissipation fin group 32 on the second microchannel heat exchange plate 22 is improved. Optionally, the third bent fins can also be called third folded fins, and the third bent fins are formed by a plurality of continuously bent fins, including vertical fins perpendicular to the third microchannel plate segment and parallel fins parallel to the third microchannel plate segment. It can be understood that the fin spacing of the third bent fin is the spacing between two adjacent vertical fins.

[0066] Similarly, relative to the fourth bent fin disposed on the outer surface of the fourth microchannel plate segment, the spacing between two adjacent fins in the second heat dissipation fin group 32 is smaller, thus improving the heat dissipation effect of the second heat dissipation fin group 32 on the second microchannel heat exchange plate 22. Optionally, the fourth bent fin can also be called the fourth folded fin, and the fourth bent fin is formed by a plurality of continuously bent fins, including vertical fins perpendicular to the fourth microchannel plate segment and parallel fins parallel to the fourth microchannel plate segment. It can be understood that the fin spacing of the fourth bent fin is the spacing between two adjacent vertical fins. Optionally, the fin spacing of the third bent fin is equal to the fin spacing of the fourth bent fin, and the fin spacing of the first bent fin is smaller than the fin spacing of the third bent fin, and the fin spacing of the second bent fin is smaller than the fin spacing of the fourth bent fin.

[0067] The first bent fin includes a first bent heat dissipation segment, wherein the distance between the first bent heat dissipation segment and the outer surface of the first microchannel plate segment 201 is smaller than the distance between the first microchannel plate segment 201 and the second microchannel plate segment 202 .

[0068] As mentioned above, the first bent fin includes a vertical fin perpendicular to the first microchannel plate segment 201 and a parallel fin parallel to the first microchannel plate segment 201. The first bent heat dissipation segment can be understood as a parallel fin in the first bent fin. The distance between the first bent heat dissipation segment and the outer surface of the first microchannel plate segment 201 is less than the distance H1 between the first microchannel plate segment 201 and the second microchannel plate segment 202. Figure 7 As shown, in this way, the connection stability of the first bent fin on the surface of the microchannel heat exchanger is improved, and at the same time, the installation volume occupied by the first bent fin is reduced.

[0069] The second bent fin includes a second bent heat dissipation segment, wherein the distance between the second bent heat dissipation segment and the outer surface of the second microchannel plate segment 202 is smaller than the distance between the first microchannel plate segment 201 and the second microchannel plate segment 202 .

[0070] Similarly, the second bent fins include vertical fins perpendicular to the second microchannel plate segment 202 and parallel fins parallel to the second microchannel plate segment 202. The second bent heat dissipation segment can be understood as a parallel fin in the second bent fins. The spacing between the second bent heat dissipation segment and the outer surface of the second microchannel plate segment 202 is smaller than the spacing H1 between the first microchannel plate segment 201 and the second microchannel plate segment 202. In this way, the connection stability of the second bent fin on the surface of the microchannel heat exchanger is improved, and at the same time, the installation volume occupied by the second bent fin is reduced.

[0071] The third bent fin includes a third bent heat dissipation segment, wherein a distance between the third bent heat dissipation segment and an outer surface of the third microchannel plate segment is smaller than a distance between the third microchannel plate segment and a fourth microchannel plate segment.

[0072] Similarly, the third bent fin includes a vertical fin perpendicular to the third microchannel plate segment and a parallel fin parallel to the third microchannel plate segment, and the third bent heat dissipation segment can be understood as a parallel fin in the third bent fin. The spacing between the third bent heat dissipation segment and the outer surface of the third microchannel plate segment is smaller than the spacing between the third microchannel plate segment and the fourth microchannel plate segment, thus improving the connection stability of the third bent fin on the surface of the microchannel heat exchanger, and at the same time, reducing the installation volume occupied by the third bent fin.

[0073] The fourth bent fin includes a fourth bent heat dissipation segment, wherein a distance between the fourth bent heat dissipation segment and an outer surface of the fourth microchannel plate segment is smaller than a distance between the third microchannel plate segment and the fourth microchannel plate segment.

[0074] Similarly, the fourth bent fin includes a vertical fin perpendicular to the fourth microchannel plate segment and a parallel fin parallel to the fourth microchannel plate segment, and the fourth bent heat dissipation segment can be understood as a parallel fin in the fourth bent fin. The spacing between the fourth bent heat dissipation segment and the outer surface of the fourth microchannel plate segment is smaller than the spacing between the third microchannel plate segment and the fourth microchannel plate segment, thus improving the connection stability of the fourth bent fin on the surface of the microchannel heat exchanger, and at the same time, reducing the installation volume occupied by the fourth bent fin.

[0075] Optionally, the first microchannel heat exchange plate 21 further includes a first curved channel section 203 connected between the first microchannel plate section 201 and the second microchannel plate section 202, wherein the first heat dissipation fin group 31 includes a first end fin 311 close to the first curved channel section 203, and the maximum distance H2 between the first end fin 311 and the inner surface of the first curved channel section 203 is greater than or equal to the first preset distance. Figure 7 shown.

[0076] The maximum distance between the first end fin 311 and the inner surface of the first bending channel section 203 is greater than or equal to the first preset spacing, so that the heat dissipation fins are prevented from blocking the fluidity of the defrosting water in the first bending channel section 203. Optionally, the spacing between two adjacent heat dissipation fins in the first heat dissipation fin group 31 is the first spacing. The first preset spacing is greater than the first spacing and less than or equal to three times the first spacing.

[0077] The second microchannel heat exchange plate 22 also includes a second curved channel section connected between the third microchannel plate section and the fourth microchannel plate section, wherein the second heat dissipation fin group 32 includes a second end fin close to the second curved channel section, and the maximum distance between the second end fin and the inner surface of the second curved channel section is greater than or equal to the first preset spacing.

[0078] Similarly, the maximum distance between the second end fin and the inner surface of the second curved channel section is greater than or equal to the first preset spacing, so that the heat dissipation fins are prevented from blocking the fluidity of the defrost water in the second curved channel section. Optionally, the spacing between two adjacent heat dissipation fins in the first heat dissipation fin group 31 is the first spacing. The first preset spacing is greater than the first spacing and less than or equal to three times the first spacing.

[0079] The disclosed embodiment also provides a refrigeration device including the aforementioned microchannel heat exchanger.

[0080] Refrigeration equipment may include refrigerators, freezers, display cabinets, etc. The aforementioned microchannel heat exchanger may be used as an evaporator in a refrigeration equipment for cooling a refrigerated compartment or a frozen compartment.

[0081] The refrigeration equipment uses the aforementioned microchannel heat exchanger as the evaporator, which reduces the volume occupied by the evaporator in the refrigeration equipment, which is conducive to the miniaturization of the refrigeration equipment. At the same time, it is conducive to the timely discharge of defrost water, ensuring the heat exchange efficiency of the evaporator.

[0082] The above description and the accompanying drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Unless explicitly required, individual components and functions are optional, and the order of operations may vary. Portions and features of some embodiments may be included in or replace portions and features of other embodiments. The embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A microchannel heat exchanger, characterized in that: include: The first header; A second header is arranged in parallel with the first header; The microchannel heat exchange plate group is bent and arranged between the first header and the second header, and the microchannel heat exchange plate group is parallel to the first header or the second header. Wherein, a plurality of heat dissipation fins are arranged on the surface of the microchannel heat exchange plate group, and the heat dissipation fins are parallel to the first header or the second header.

2. The microchannel heat exchanger according to claim 1, characterized in that: Microchannel heat exchange plate group includes: A first microchannel heat exchange plate includes a first communication end connected to the first header and a second communication end connected to the second header; and, The second microchannel heat exchange plate is arranged at the lower part of the first microchannel heat exchange plate, and the second microchannel heat exchange plate includes a third connecting end connected to the first header and a fourth connecting end connected to the second header. The first header includes a first dividing point between the first connecting end and the third connecting end, the second header includes a second dividing point below the fourth connecting end, and both the first dividing point and the second dividing point are provided with dividing plates.

3. The microchannel heat exchanger according to claim 2, characterized in that: The first microchannel heat exchange plate includes a first microchannel plate segment provided with a first connecting end, and a second microchannel plate segment provided with a second connecting end, a first heat dissipation fin group is provided between the first microchannel plate segment and the second microchannel plate segment, The second microchannel heat exchange plate includes a third microchannel plate segment provided with a third connecting end, and a fourth microchannel plate segment provided with a fourth connecting end, and a second heat dissipation fin group is provided between the third microchannel plate segment and the fourth microchannel plate segment. The plurality of heat dissipation fins in the second heat dissipation fin group are correspondingly arranged at the lower part of the plurality of heat dissipation fins in the first heat dissipation fin group.

4. The microchannel heat exchanger according to claim 3, characterized in that: The number of heat dissipation fins in the first heat dissipation fin group is greater than the number of heat dissipation fins in the second heat dissipation fin group.

5. The microchannel heat exchanger according to claim 3, characterized in that: The outer surface of the first microchannel plate segment is provided with a first bent fin, and the outer surface of the third microchannel plate segment is provided with a third bent fin, wherein the third bent fin is correspondingly provided at the lower part of the first bent fin; The outer surface of the second microchannel plate segment is provided with a second bent fin, and the outer surface of the fourth microchannel plate segment is provided with a fourth bent fin, wherein the fourth bent fin is correspondingly provided at the lower part of the second bent fin.

6. The microchannel heat exchanger according to claim 5, characterized in that: The fin spacing in the first heat dissipating fin group is smaller than the fin spacing in the first bent fin or the second bent fin; and / or, The fin spacing in the second heat dissipating fin group is smaller than the fin spacing in the third bent fin or the fourth bent fin.

7. The microchannel heat exchanger according to claim 5, characterized in that: The first bent fin comprises a first bent heat dissipation segment, wherein the distance between the first bent heat dissipation segment and the outer surface of the first microchannel plate segment is smaller than the distance between the first microchannel plate segment and the second microchannel plate segment; and / or, The second bent fin comprises a second bent heat dissipation segment, wherein the distance between the second bent heat dissipation segment and the outer surface of the second microchannel plate segment is smaller than the distance between the first microchannel plate segment and the second microchannel plate segment; and / or, The third bent fin comprises a third bent heat dissipation segment, wherein the distance between the third bent heat dissipation segment and the outer surface of the third microchannel plate segment is smaller than the distance between the third microchannel plate segment and the fourth microchannel plate segment; and / or, The fourth bent fin includes a fourth bent heat dissipation segment, wherein a distance between the fourth bent heat dissipation segment and an outer surface of the fourth microchannel plate segment is smaller than a distance between the third microchannel plate segment and the fourth microchannel plate segment.

8. The microchannel heat exchanger according to claim 3, characterized in that: The first microchannel heat exchange plate also includes a first bent channel section connected between the first microchannel plate section and the second microchannel plate section, wherein the first heat dissipation fin group includes a first end fin close to the first bent channel section, and the maximum distance between the first end fin and the inner surface of the first bent channel section is greater than or equal to a first preset spacing.

9. The microchannel heat exchanger according to claim 3, characterized in that: The second microchannel heat exchange plate also includes a second curved channel section connected between the third microchannel plate section and the fourth microchannel plate section, wherein the second heat dissipation fin group includes a second end fin close to the second curved channel section, and the maximum distance between the second end fin and the inner surface of the second curved channel section is greater than or equal to the first preset spacing.

10. A refrigeration device, characterized in that: It comprises the microchannel heat exchanger as claimed in any one of claims 1 to 9.

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