A wiring structure for PCB substrate deformation detection

Abstract

The utility model discloses a wiring structure for detecting deformation of a PCB substrate, wherein the wiring (2) comprises an end (21) and a detection part (22), wherein the end (21) is connected to a pad (3), and the detection part (22) extends from the end (21) to a deformable part of a substrate (1) and is arranged by bending back and forth at the deformable part of the substrate (1), and the length direction of the detection part (22) is consistent with the deformation direction of the substrate (1). The utility model has the characteristics of being easy to detect deformation of a substrate (1) and having high detection accuracy.

Description

Technical Field

[0001] The utility model relates to a PCB substrate structure, in particular to a wiring structure for detecting deformation of a PCB substrate. Background Art

[0002] PCB substrate is composed of copper foil, epoxy resin, glass fiber cloth, polyimide and other materials. Generally, a large area of ​​copper foil is designed on the PCB substrate for grounding. When the PCB substrate is subjected to external forces, such as extrusion and collision, it will cause mechanical deformation of the PCB substrate, and the various connection points and screw fixing points on the substrate will also indirectly cause the PCB substrate to bend and warp.

[0003] In view of the fact that PCB substrates are easily deformed under the action of external forces, a sensor can be used according to actual usage. However, since the deformation of PCB substrates is generally very small, it is difficult to detect the small deformation of the substrate with current technology. Therefore, there is no method for detecting deformation of substrates in the prior art. Utility Model Content

[0004] The purpose of the utility model is to provide a wiring structure for detecting deformation of a PCB substrate. The utility model has the characteristics of being easy to detect deformation of the substrate and having high detection accuracy.

[0005] The technical solution of the utility model is: a routing structure for detecting deformation of a PCB substrate, the routing comprising an end and a detection portion, the end being connected to a pad, the detection portion extending from the end to a deformable portion of the substrate and being bent back and forth at the deformable portion of the substrate, the length direction of the detection portion being consistent with the deformation direction of the substrate.

[0006] The fixed resistance of the detection unit is at least 50Ω.

[0007] In the aforementioned wiring structure for detecting deformation of a PCB substrate, the bending point of the detection portion is located at the point on the PCB substrate that is most susceptible to deformation.

[0008] In the aforementioned wiring structure for detecting deformation of a PCB substrate, the width and thickness of the end portion are both greater than the width and thickness of the detection portion.

[0009] In the aforementioned wiring structure for PCB substrate deformation detection, the wiring adopts a resistance wire strain gauge material with strain effect.

[0010] In the aforementioned routing structure for PCB substrate deformation detection, when the deformation direction of the substrate is in four directions, namely, up, down, left, and right, the routing is axially symmetrically distributed on the substrate and the angle between the length direction of the detection part and the horizontal direction is 45 degrees.

[0011] In the aforementioned routing structure for detecting deformation of a PCB substrate, the routing also includes a protection portion, the protection portion is located at a position where the substrate is not easily deformed, and the width and thickness of the protection portion are greater than the width and thickness of the detection portion.

[0012] In the aforementioned wiring structure for detecting deformation of a PCB substrate, when the deformation direction of the substrate is in the up and down directions, the length direction of the detection portion is in the vertical direction.

[0013] In the aforementioned wiring structure for PCB substrate deformation detection, the length of the detection portion is 5 to 80 m.

[0014] In the aforementioned wiring structure for PCB substrate deformation detection, the width of the detection portion is 0.3 to 0.05 mm, and the thickness of the detection portion is 20 μm to 1 mm.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] The traces on the PCB substrate are bent back and forth in parallel and distributed at the easily deformed parts of the substrate, and the length direction is consistent with the deformation direction of the substrate, so that the resistance at both ends of the trace can reach several hundred Ω, or even more than 1kΩ. When the substrate is deformed, the deformation direction of the substrate is the length direction of the trace, so the trace can be deformed. At this time, the resistance change at both ends of the trace is the largest, and it is easier to collect the voltage value change at both ends of the trace. Then, a high-precision AD acquisition chip is used to collect the voltage value change at both ends of the trace through a voltage divider, and the acquisition results are output to the main controller, so that the deformation of the substrate can be judged more accurately. The traces on the substrate have low environmental requirements, strong stability, high detection sensitivity, easy to identify, and high judgment accuracy.

[0017] The utility model converts the tiny deformation of the substrate that is difficult to detect into a detectable voltage value, so the detection is easier and more accurate. Since the length direction of the wiring can be adjusted within the range of 360 degrees of the substrate, it can be applicable to substrates of different categories and is flexible to use. The wiring method and the installation and fixing points of the substrate can be adjusted according to the actual substrate category structure and application scenarios, so that deformations in all directions on the substrate can be detected. The utility model has strong practicality and a wide range of applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of embodiment 1 of the utility model.

[0019] Figure 2 It is a structural schematic diagram of embodiment 2 of the present utility model.

[0020] Figure 3 It is a schematic diagram of the circuit structure of voltage division collection.

[0021] The marks in the attached figure are: 1, substrate; 2, routing; 21, end; 22, detection part; 23, protection part; 3, pad; 4, fixed resistor; 5, equivalent resistor; 6, AD acquisition chip. DETAILED DESCRIPTION

[0022] The present invention is further described below in conjunction with the accompanying drawings and embodiments, but they are not intended to limit the present invention.

[0023] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0024] A routing structure for detecting deformation of a PCB substrate, wherein the routing 2 comprises an end 21 and a detection portion 22, wherein the end 21 is connected to a pad 3, and the detection portion 22 extends from the end 21 to a deformable portion of a substrate 1 and is bent back and forth at the deformable portion of the substrate 1, wherein the deformable portion of the substrate is the portion that first deforms when subjected to an external force; adjacent bent routings 2 are parallel to each other, and the length direction of the detection portion 22 is consistent with the deformation direction of the substrate 1.

[0025] The fixed resistance of the detection unit 22 is at least 50Ω.

[0026] The bending point of the detection portion 22 is located at the most easily deformed point of the PCB substrate.

[0027] The width and thickness of the end portion 21 are greater than the width and thickness of the detection portion 22. The design of the end portion structure improves the wiring strength, plays a role in fixing the wiring and protecting the detection portion.

[0028] The wiring is made of a resistance wire strain gauge material with a strain effect, that is, when the wiring is mechanically deformed under the action of an external force, its resistance value changes accordingly.

[0029] The length of the detection unit 22 is 5 to 80 m.

[0030] The width of the detection part 22 is 0.3-0.05 mm, and the thickness of the detection part 22 is 20 μm-1 mm.

[0031] A trace 2 on a PCB circuit board has a certain resistance value at both ends. When the PCB substrate 1 is deformed, the trace 2 will be deformed, and its length, width or thickness will change, thereby changing the resistance value at both ends of the trace 2. Therefore, by collecting the voltage value change at both ends of the trace 2 by voltage division, it can be determined whether the PCB substrate 1 is deformed. When the fixed resistance of the trace is at least 50Ω, it is easy to be detected.

[0032] The wiring 2 is bent back and forth and distributed at the easily deformed part of the substrate, and the length direction is consistent with the deformation direction of the substrate 1, so that the resistance at both ends of the wiring 2 can reach several hundred Ω, or even more than 1000 Ω. When the substrate 1 is deformed, the deformation direction of the substrate 1 is the length direction of the wiring 2, so the wiring 2 can be deformed. At this time, the resistance change at both ends of the wiring 2 is the largest, which is easier to detect. The deformation detection method is: using a high-precision AD acquisition chip 6, collecting the voltage value change at both ends of the wiring 2 by voltage division, and outputting the collection result to the main controller, so that the deformation of the substrate 1 can be accurately judged. As long as the resistance change of the wiring reaches 0.1Ω, it can be detected. The wiring 2 on the substrate 1 has low environmental requirements, strong stability, high detection sensitivity, is easy to be identified, and has high judgment accuracy.

[0033] The utility model converts the small deformation of the substrate 1 which is difficult to detect into a detectable voltage value, so the detection is easier and more accurate. Since the length direction of the wiring 2 can be adjusted within the range of 360° of the substrate 1, it can be applicable to substrates 1 of different categories, and is flexible to use. The wiring 2 mode and the installation and fixing points of the substrate 1 can be adjusted according to the actual category structure and application scenario of the substrate 1, so that deformations in all directions on the substrate 1 can be detected. The utility model has strong practicality and a wide range of applications. A minimum deformation of 1% of the substrate can be detected, and the detection sensitivity is high.

[0034] The present application also discloses a deformation detection application of a PCB substrate, that is, the PCB substrate 1 is installed in a massage chair through screws in positioning holes. When the posture of the massage chair changes during operation, it may hit the ground, the wall, or press down on something or a person underneath. At this time, the chair will have a certain deformation, which will also cause the PCB substrate 1 at this position to deform. At this time, by detecting the resistance of the trace 2 on the PCB substrate 1, the deformation of the PCB substrate 1 can be detected, thereby playing the role of a sensor. If the deformation of the PCB substrate 1 reaches a preset deformation, the chair can be paused or self-protected, which plays a role in preventing danger.

[0035] Embodiment 1:

[0036] like Figure 1As shown, a routing structure for detecting deformation of a PCB substrate is shown, wherein the substrate 1 is a rectangular structure, and the deformation directions of the substrate 1 are four directions: up, down, left, and right. The most easily deformed and vulnerable positions of the substrate 1 are the middle and two side parts, and the routing 2 includes an end 21 and a detection part 22, and the end 21 is connected to the pad 3. The detection part 22 extends from the end 21 to the easily deformed part of the substrate 1, and is divided into two parts that are V-shaped and axially symmetrically distributed in the middle of the substrate 1. Each part of the detection part 22 is bent back and forth, and the adjacent bent routings 2 are parallel to each other. The angle between the length direction of the detection part 22 and the horizontal direction is 45 degrees.

[0037] The bending point of the detection portion 22 is located at the most easily deformed point of the PCB substrate.

[0038] The width and thickness of the end portion 21 are greater than the width and thickness of the detection portion 22. The design of the end portion structure improves the wiring strength, plays a role in fixing the wiring and protecting the detection portion.

[0039] The wiring is made of a resistance wire strain gauge material with a strain effect, that is, when the wiring is mechanically deformed under the action of an external force, its resistance value changes accordingly.

[0040] The wiring 2 further includes a protection portion 23, which is located at a position where the substrate 1 is not easily deformed. In this embodiment, the protection portion 23 is located between two symmetrical parts of the detection portion 22, and the width and thickness of the protection portion 23 are greater than the width and thickness of the detection portion 22. The setting of the protection portion 23 plays a role in protecting the detection portion.

[0041] The width of the detection portion 22 is 0.127 mm, and the thickness of the detection portion 22 is 35 μm.

[0042] Embodiment 2:

[0043] like Figure 2 As shown, a wiring structure for detecting deformation of a PCB substrate is shown, wherein the substrate 1 is in an I-shaped structure, the deformation direction of the substrate 1 is in two directions, the most easily deformed and most vulnerable position of the substrate 1 is the middle part, the wiring 2 includes an end 21 and a detection part 22, the end 21 of the wiring 2 is connected to the pad 3, the detection part 22 extends from the end 21 to the easily deformed part of the substrate 1, and is bent back and forth in the middle part of the substrate 1 to form an S-shaped arrangement, the adjacent bent wirings 2 are parallel to each other, and the length direction of the detection part 22 is the vertical direction.

[0044] The width of the detection portion 22 is 0.127 mm, and the thickness of the detection portion 22 is 35 μm.

[0045] like Figure 3As shown, the detection circuit for deformation detection of the PCB substrate 1 includes an AD acquisition chip 6, a fixed resistor 4 and an equivalent resistor 5, one end of the fixed resistor 4 is connected to the VCC end, the other end of the fixed resistor 4 is connected to one end of the equivalent resistor 5, and the other end of the equivalent resistor 5 is connected to the GND end. The acquisition position of the AD acquisition chip 6 is located between the fixed resistor 4 and the equivalent resistor 5, and is used to detect the voltage value of the equivalent resistor 5.

[0046] When the deformation of the substrate 1 is detected, the AD acquisition chip 6 is used to collect the voltage value changes at both ends of the trace 2 by voltage division, so as to determine whether the PCB substrate 1 is deformed. The AD acquisition chip 6 can use a 24-bit high-precision AD chip with high detection accuracy, and can detect small changes in resistance.

[0047] The calculation method of the divided voltage value is: divided voltage value = equivalent resistance / (equivalent resistance + fixed resistance) × circuit supply voltage, where the equivalent resistance 5 is the resistance of trace 2. The fixed resistance is a resistor of the same level as the equivalent resistance, such as a chip resistor.

[0048] The parts not described in detail in the present invention are prior art and thus will not be described in detail here.

Claims

1. A wiring structure for PCB substrate deformation detection, characterized in that: The routing line (2) comprises an end portion (21) and a detection portion (22), wherein the end portion (21) is connected to the pad (3), and the detection portion (22) extends from the end portion (21) to a deformable portion of the substrate (1) and is bent back and forth at the deformable portion of the substrate (1), and the length direction of the detection portion (22) is consistent with the deformation direction of the substrate (1).

2. The wiring structure for PCB substrate deformation detection according to claim 1, characterized in that: The fixed resistance of the detection part (22) is at least 50Ω.

3. The wiring structure for PCB substrate deformation detection according to claim 1, characterized in that: The width and thickness of the end portion (21) are both greater than the width and thickness of the detection portion (22).

4. The wiring structure for PCB substrate deformation detection according to claim 1, characterized in that: The wiring (2) is made of a resistance wire strain gauge material having a strain effect.

5. The wiring structure for PCB substrate deformation detection according to claim 1, characterized in that: When the deformation direction of the substrate (1) is in the four directions of up, down, left, and right, the traces (2) are axially symmetrically distributed on the substrate (1) and the angle between the length direction of the detection part (22) and the horizontal direction is 45 degrees.

6. The wiring structure for PCB substrate deformation detection according to claim 5, characterized in that: The routing (2) further comprises a protection portion (23), the protection portion (23) being located at a position of the substrate (1) that is not easily deformed, and the width and thickness of the protection portion (23) being greater than the width and thickness of the detection portion (22).

7. The wiring structure for PCB substrate deformation detection according to claim 1, characterized in that: When the deformation direction of the substrate (1) is in the up and down directions, the length direction of the detection portion (22) is in the vertical direction.

8. The wiring structure for PCB substrate deformation detection according to claim 1, characterized in that: The length of the detection part (22) is 5 to 80 m.

9. The wiring structure for PCB substrate deformation detection according to claim 1, characterized in that: The width of the detection part (22) is 0.3-0.05 mm, and the thickness of the detection part (22) is 20 μm-1 mm.

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