Heat dissipation material heat dissipation capacity detection device

Abstract

The utility model discloses a device for detecting the heat dissipation capacity of heat dissipation materials, comprising a circuit board, a lower supporting plate and an upper cover plate which are arranged in sequence and spaced from each other, a heating resistor and an adjustable resistor module are respectively arranged on two side surfaces of the circuit board, and positive and negative poles are also arranged on any side surface of the circuit board, the lower supporting plate is in contact with the heating resistor, a plurality of first temperature test points are also arranged on the lower supporting plate, a plurality of second temperature test points are arranged on the side surface of the upper cover plate away from the lower supporting plate, the upper cover plate and the lower supporting plate are used for clamping the heat dissipation material, when the heating resistor generates heat, the temperature of the first temperature test point or / and the second temperature test point can be detected to detect the plane or / and normal heat dissipation capacity of the heat dissipation material, therefore, the heat dissipation performance of heat dissipation materials of different materials and the same material but different price processes can be compared, so as to realize a wide range of heat dissipation performance comparison of heat dissipation materials, and the operability is strong.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of electronic products, in particular to a device suitable for detecting the heat dissipation capacity of various heat dissipation materials. Background Art

[0002] Heat dissipation is an important issue facing modern electronic products. Too high or too low temperatures will lead to a decline in the performance of electronic products and shorten their lifespan. With the increase in the configuration and hardware upgrades of consumer electronic products such as smartphones, tablets, computers, and wearable devices, higher requirements are placed on heat dissipation performance. In particular, the compact structural design brings higher heat dissipation challenges, which also promotes the expansion of demand for heat dissipation materials. However, the heat dissipation technologies of electronic products are different. In order to achieve stronger heat dissipation performance, different heat dissipation materials and heat dissipation technologies are generally used in combination to form complementary advantages. However, different materials, processing techniques of different manufacturers, etc. cause performance differences between heat dissipation materials, so the reasonable selection of the required heat dissipation materials has become an irreplaceable means.

[0003] At present, the widely used heat dissipation materials mainly include artificial synthetic graphite heat dissipation film, thermal conductive interface material, heat pipe, heat spreader, etc. First of all, the difference in heat dissipation capacity between heat dissipation materials of different materials plays a decisive role in the selection of heat dissipation materials when designing heat dissipation solutions. Secondly, even if the heat dissipation materials of the same material are manufactured by different manufacturers, the different processing technology and raw material addition ratios will also lead to differences in thermal conductivity between heat dissipation materials of different manufacturers. These differences affect the design and cost of heat dissipation solutions for manufacturers that mass-produce electronic products, such as the plane size of the heat dissipation material, thickness selection, substrate thickness selection, etc.

[0004] Therefore, comparing the differences in heat dissipation capacity between heat dissipation materials of different materials, and the differences in heat dissipation capacity between heat dissipation materials of the same material but manufactured by different manufacturers, is helpful for planning selection, controlling costs, and rationally selecting heat dissipation solutions. However, there is currently no simple and convenient way to quickly verify and compare the heat dissipation capacity of various heat dissipation materials. The efficiency of verifying the heat dissipation capacity of a wide range of heat dissipation materials is low, and the equipment used is complex and diverse, and the cost is high.

[0005] Therefore, it is necessary to provide a device with a simple structure, easy operation, and the ability to quickly verify the heat dissipation performance of various heat dissipation materials to solve the above problems. Utility Model Content

[0006] The utility model aims to provide a heat dissipation material heat dissipation capacity detection device which has a simple structure, is easy to operate and can quickly verify the heat dissipation performance of various heat dissipation materials.

[0007] To achieve the above-mentioned purpose, the technical solution of the utility model is as follows: a device for detecting the heat dissipation capacity of a heat dissipation material is provided, which comprises a circuit board, a lower support plate and an upper cover plate; wherein, a heating resistor and an adjustable resistance module are respectively provided on two side surfaces of the circuit board, and a positive and negative pole position is also provided on any side surface of the circuit board, power is supplied to the circuit board through the positive and negative pole positions, and the resistance value of the heating resistor is changed by adjusting the resistance value of the adjustable resistance module; the lower support plate is arranged above the circuit board and in contact with the heating resistor, and a plurality of first temperature test points are provided on the side of the lower support plate in contact with the heating resistor; the upper cover plate is arranged above the lower support plate and spaced apart from the lower support plate, and the upper cover plate and the lower support plate are used to clamp the heat dissipation material, and a plurality of second temperature test points are provided on the side of the upper cover plate away from the lower support plate; when the heating resistor is heated, the temperature of the first temperature test point or / and the second temperature test point can be detected to detect the heat dissipation capacity of the heat dissipation material.

[0008] Preferably, temperature detection components are installed at at least a portion of the first temperature test points and the second temperature test points. Therefore, temperature detection components can be selectively installed at part or all of the preset multiple first temperature test points and multiple second temperature test points according to detection needs to adapt to the detection of a wide range of heat dissipation materials.

[0009] Preferably, the temperature detection element is a universal thermocouple, and different materials can be selected according to test requirements. It is used to collect the temperature of the test points reserved on the lower support plate and the upper cover plate and has a fast response speed.

[0010] Preferably, the first temperature test point and the second temperature test point are arranged opposite to each other up and down, so that when reading the temperatures of the first temperature test point and the second temperature test point which are opposite to each other up and down, it is convenient to quickly verify and compare the normal heat dissipation capacity of the heat dissipation material.

[0011] Preferably, the heating resistor is arranged at the center of the circuit board, the adjustable resistor module and the positive and negative poles are arranged at the edges of the circuit board, and the adjustable resistor module is arranged on the side away from the heating resistor and located at the edge position, thereby reducing the impact on the heat dissipation environment of the heating resistor.

[0012] Preferably, the heating resistor is in a square structure, which is convenient for welding on a circuit board.

[0013] Preferably, the heat dissipation material heat dissipation capacity detection device further comprises a thermally conductive gasket, which is adhered to the surface of the heating resistor and in contact with the lower support plate, so as to reduce the thermal resistance from the heating resistor to the lower support plate.

[0014] Preferably, the opposite sides of the lower support plate and the upper cover plate are respectively provided with a first bonding line and a second bonding line for positioning the heat dissipation material, and the other side of the lower support plate is also provided with a third bonding line for positioning the heating resistor, so as to facilitate alignment during installation.

[0015] Preferably, the spacing between the circuit board and the lower support plate, and the spacing between the lower support plate and the upper cover plate are both adjustable. On the one hand, this ensures that the contact force between the heating resistor and the lower support plate is stable, thereby reducing data errors caused by inconsistent distances between the heat source and the heat dissipation material. On the other hand, the spacing between the lower support plate and the upper cover plate can be used to accommodate the installation of different heat dissipation materials.

[0016] Preferably, the heat dissipation capacity detection device of the heat dissipation material also includes a pressure sensor, which is arranged between the lower support plate and the circuit board, and is used to detect the pressure between the lower support plate and the circuit board, so as to indirectly detect the distance between the heating resistor and the lower support plate, thereby reducing the data error caused by the inconsistent distance between the heat source and the heat dissipation material.

[0017] Preferably, the heat dissipation capacity detection device of the heat dissipation material also includes a support column and an adjusting member, the circuit board, the lower support plate, and the upper cover plate are adjustably installed on the support column in sequence, and the adjusting member is rotatably connected to the support column, and the upper cover plate and / or the circuit board are pressed together by rotating the adjusting member along the support column, thereby adjusting the distance between the upper cover plate and the lower support plate and / or the distance between the lower support plate and the circuit board.

[0018] Preferably, the adjusting member is a universal nut, which is threadedly connected to the support column, so that the nut can be rotated to adjust the position to press the circuit board and / or the upper cover plate.

[0019] Compared with the prior art, the heat dissipation capacity detection device of the heat dissipation material of the utility model firstly arranges a heating resistor and an adjustable resistor module on the two sides of the circuit board respectively, uses the heat generated by the heating resistor as a heat source, and adjusts the adjustable resistor module to change the resistance value of the heating resistor, thereby obtaining different heating powers to simulate the heating power of a wide range of heat source chips, and can cover different heating powers of a wide range of electronic products; secondly, by presetting a plurality of first temperature test points on the lower support plate and a plurality of second temperature test points on the upper cover plate, when the heating resistor generates heat, by detecting the temperature of the first temperature test point and / or the second temperature test point, the plane heat dissipation capacity and / or the normal heat dissipation capacity of the heat dissipation material are detected, and the heat dissipation performance of the heat dissipation material can be quickly verified, and the heat dissipation performance of heat dissipation materials of different materials and different price processes of the same material can be compared. The selection range of heat dissipation materials is wide, and the heat dissipation performance comparison of a wide range of heat dissipation materials can be realized; furthermore, the detection device has a simple structure, is easy to operate, and has strong operability. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of a heat dissipation capacity detection device for heat dissipation materials of the present utility model.

[0021] Figure 2 yes Figure 1 sectional view of .

[0022] Figure 3 yes Figure 1 Exploded diagram of .

[0023] Figure 4 yes Figure 3 Schematic diagram of the circuit board structure.

[0024] Figure 5 yes Figure 4 sectional view of .

[0025] Figure 6 yes Figure 4 Top view of the .

[0026] Figure 7 yes Figure 4 Bottom view of .

[0027] Figure 8 yes Figure 3 Front view of the middle and lower support plate.

[0028] Fig. 9 yes Figure 8 Schematic diagram of the back side.

[0029] Fig.10 yes Figure 3 Front view of the middle upper cover.

[0030] Fig.11 yes Figure 1 Schematic diagram of usage status. DETAILED DESCRIPTION

[0031] The embodiments of the present invention are now described with reference to the accompanying drawings, in which similar element numbers represent similar elements. It should be noted that the orientation descriptions involved in the present invention, such as the orientations or positional relationships indicated by up, down, left, right, front, and back, are all based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the technical solutions of the present application or / and simplifying the description, rather than indicating or implying that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limitations on the present application. The first, second, etc. described are only used to distinguish technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0032] Combine first Figure 1-Figure 11 As shown, the heat dissipation material heat dissipation capacity detection device 100 provided by the utility model is suitable for rapid detection and verification of the heat dissipation performance of heat dissipation materials 200 of different materials or the same material with different processes, and has strong operability. The heat dissipation material 200 is a common material for electronic products, mainly including artificial synthetic graphite heat dissipation film, thermal interface material, heat pipe, heat spreader, etc., but is not limited to the aforementioned heat dissipation materials.

[0033] Continue to combine Figure 1-Figure 11 As shown in the figure, in the present invention, the heat dissipation material heat dissipation capacity detection device 100 includes a circuit board 110, a lower support plate 120 and an upper cover plate 130. The two sides of the circuit board 110 are respectively provided with a heating resistor 111 and an adjustable resistor module 112, and any side of the circuit board 110 is also provided with a positive and negative pole position 113 (see Figure 7 ), the circuit board 110 is powered by the positive and negative poles 113, so that the heating resistor 111 generates heat to simulate different heat sources, and the resistance of the heating resistor 111 can be changed by adjusting the resistance of the adjustable resistance module 112. The lower support plate 120 is arranged above the circuit board 110 and in contact with the heating resistor 111. The side of the lower support plate 120 in contact with the heating resistor 111 is provided with a plurality of first temperature test points (see Fig. 9 The upper cover plate 130 is disposed above the lower support plate 120 and is spaced apart from the lower support plate 120. The upper cover plate 130 and the lower support plate 120 are used to clamp the heat dissipation material 200. The side of the upper cover plate 130 away from the lower support plate 120 is provided with a plurality of second temperature test points (see Fig.10), therefore, when the heating resistor 111 generates heat, the temperature of the first temperature test point or / and the second temperature test point can be detected to detect and verify the heat dissipation capacity of the heat dissipation material 200, thereby quickly comparing the planar or / and normal heat dissipation capacities of different heat dissipation materials 200.

[0034] Combine the following Figure 1-Figure 7 As shown, in one embodiment of the utility model, the heating resistor 111 is arranged at the center of the front of the circuit board 110, and the heating resistor 111 is in a square structure to facilitate welding on the circuit board 110. Of course, the heating resistor 111 is not limited to a square shape, and it is feasible to set it in any other shape. The adjustable resistance module 112 and the positive and negative poles 113 are all arranged on the back of the circuit board 110 and at the edge. By adjusting the resistance value of the adjustable resistance module 112, the resistance value of the heating resistor 111 can be changed so that the heating resistor 111 has different heating powers. Therefore, through the cooperation of the adjustable resistance module 112 and the heating resistor 111, the heating power of a wide range of heat source chips can be simulated, thereby covering the heating power of a wide range of electronic components; and the adjustable resistance module 112 is arranged on a side away from the heating resistor 111 and at the edge position, which can reduce the influence of the adjustable resistance module 112 on the heat dissipation environment of the heating resistor 111 when it is heated.

[0035] See also Figure 2-Figure 3 As shown, in one embodiment of the present utility model, the heat dissipation material heat dissipation capacity detection device 100 further includes a thermally conductive pad 114, which is attached to the surface of the heating resistor 111 and in contact with the lower support plate 120, and is used to reduce the thermal resistance from the heating resistor 111 to the lower support plate 120. Of course, it is not limited to filling the gap between the heating resistor 111 and the lower support plate 120 with the thermally conductive pad 114, and it is feasible to use any other thermally conductive interface material to fill it.

[0036] Combine the following Figure 1-3 , Figure 8-11As shown, in one embodiment of the present invention, after the lower support plate 120 and the upper cover plate 130 are installed in sequence, the two are spaced apart and used to clamp the heat dissipation material 200, and the spacing between the two is adjustable, as described later. At the same time, the back of the lower support plate 120 is preset with a plurality of first temperature test points a1, b1, c1, d1, e1, f1, g1, and the front of the upper cover plate 130 is preset with a plurality of second temperature test points a2, b2, c2, d2, e2, f2, g2. During detection, temperature detection components can be installed at at least a part of the first temperature test points a1, b1, c1, d1, e1, f1, g1 and the second temperature test points a2, b2, c2, d2, e2, f2, g2 according to different heat dissipation materials 200 and different detection requirements. That is to say, temperature detection components can be selectively installed at part or all of the first temperature test points a1, b1, c1, d1, e1, f1, g1 and the second temperature test points a2, b2, c2, d2, e2, f2, g2 according to detection needs, so as to make detection more flexible and convenient.

[0037] See also Figure 8-10 As shown, in this embodiment, the first temperature test points a1, b1, c1, d1, e1, f1, g1 and the second temperature test points a2, b2, c2, d2, e2, f2, g2 are arranged in an up-and-down manner. Specifically, when the lower support plate 120 and the upper cover plate 130 are installed in sequence, the first temperature test points a1, b1, c1, d1, e1, f1, g1 on the lower support plate 120 and the second temperature test points a2, b2, c2, d2, e2, f2, g2 on the upper cover plate 130 are arranged one by one in the vertical direction, thereby forming multiple pairs of detection points that are in an up-and-down manner. In this way, after reading the temperature of the first temperature test point a1, b1, c1, d1, e1, f1, g1 or / and the second temperature test point a2, b2, c2, d2, e2, f2, g2, not only the planar heat dissipation capacity of the heat dissipation material 200 can be verified and compared, but also the normal heat dissipation capacity of the heat dissipation material 200 can be quickly verified and compared through the temperatures of the first temperature test points a1, b1, c1, d1, e1, f1, g1 and the second temperature test points a2, b2, c2, d2, e2, f2, g2 that are relatively opposite to each other.

[0038] In the present invention, the temperature detection element is preferably a universal thermocouple, and different materials can be selected according to the test needs. The thermocouple is easy to mount on the circuit board 110, and the thermocouple has a fast response, and can quickly collect the temperature of the test points reserved on the lower support plate 120 and the upper cover plate 130, so as to quickly detect and verify the temperature of different parts of the heat dissipation material 200, so as to quickly compare the heat dissipation performance of different heat dissipation materials 200. It can be understood that the temperature detection element is not limited to a thermocouple, and can also be any other device that can quickly detect temperature.

[0039] Continue to combine Figure 8-10 As shown, in one embodiment of the present invention, the lower support plate 120 and the upper cover plate 130 are provided with corresponding first and second bonding lines on the opposite sides, respectively, for alignment and limiting when bonding the heat dissipation material 200. Specifically, the front of the lower support plate 120 is provided with a first bonding line 121, and the back of the upper cover plate 130 is provided with a second bonding line 131. Moreover, when the lower support plate 120 and the upper cover plate 130 are installed, the first bonding line 121 and the second bonding line 131 are arranged opposite to each other up and down.

[0040] More preferably, the shapes of the first bonding line 121 and the second bonding line 131 correspond to the shape of the heat dissipation material 200. The first temperature test points a1, b1, c1, d1, e1, f1, g1 are flexibly set according to the position, shape, size, etc. of the first bonding line 121, and the second temperature test points a2, b2, c2, d2, e2, f2, g2 are flexibly set according to the position, shape, size, etc. of the second bonding line 131. In this way, when the heat dissipation material 200 is bonded, the edges of the heat dissipation material 200 are placed along the first bonding line 121 and the second bonding line 131, so that the heat dissipation material 200 can be quickly aligned and its edge position can be limited. When the heat dissipation material 200 is clamped between the lower support plate 120 and the upper cover plate 130, the first temperature test points a1, b1, c1, d1, e1, f1, g1 and the second temperature test points a2, b2, c2, d2, e2, f2, g2 are just opposite to each other and will not be staggered. On the one hand, it ensures that the points on the heat dissipation material 200 that need to be detected can be detected by each detection point, and on the other hand, it ensures that the normal heat dissipation capacity of the heat dissipation material 200 can be accurately compared.

[0041] See also Fig. 9As shown, in one embodiment of the present invention, the back of the lower support plate 120 is further provided with a third bonding line 122 corresponding to the shape of the heating resistor 111, and the third bonding line 122 is provided at the center of the lower support plate 120. Therefore, when installing the lower support plate 120, the third bonding line 122 is made to correspond to the thermal conductive pad 114 before bonding, which facilitates the alignment of the heating resistor 111 to prevent installation misalignment, thereby ensuring the accuracy of subsequent temperature detection.

[0042] It is understandable that the alignment of the heating resistor 111 and the heat dissipation material 200 is not limited to being achieved by setting a fitting line, and it is also feasible to achieve positioning by setting other forms of positioning structures.

[0043] See again Figure 1-3 , Fig.11 As shown, in one embodiment of the present invention, the spacing between the circuit board 110 and the lower support plate 120, and the spacing between the lower support plate 120 and the upper cover plate 130 are both adjustable. In this way, by adjusting the spacing between the circuit board 110 and the lower support plate 120, the contact force between the heating resistor 111 and the lower support plate 120 is ensured to be stable, so that after replacing the heat dissipation material 200, the data error caused by the inconsistent distance between the heat source and the heat dissipation material 200 is reduced. By adjusting the spacing between the lower support plate 120 and the upper cover plate 130, it is possible to adapt to the installation of different heat dissipation materials 200, so that the selection range of the heat dissipation material 200 is wider.

[0044] Combine the following Figure 1-5 As shown, in this embodiment, the heat dissipation material heat dissipation capacity detection device 100 further includes a pressure sensor 140, which is disposed between the lower support plate 120 and the circuit board 110. The pressure sensor 140 is used to detect the pressure between the lower support plate 120 and the circuit board 110, thereby indirectly detecting the distance between the lower support plate 120 and the heating resistor 111, so as to reduce the data error caused by the inconsistent distance between the heat source and the heat dissipation material 200 when replacing the heat dissipation material 200. The pressure sensor 140 is a conventional detection device in the art.

[0045] Combine the following Figure 1-3 , Fig.11As shown, in one embodiment of the utility model, the heat dissipation material heat dissipation capacity detection device 100 also includes a mounting bracket 150, and the mounting bracket 150 includes a support column 151 and an adjusting member 152. Among them, the support column 151 is provided in plurality, and the circuit board 110, the lower support plate 120, and the upper cover plate 130 are sequentially and adjustably mounted on each support column 151 and spaced apart. The adjusting member 152 is rotatably connected to the support column 151, and the adjusting member 152 is at least mounted below the circuit board 110 or / and above the upper cover plate 130. By rotating the adjusting member 152 along the support column 151, the upper cover plate 130 or / and the circuit board 110 can be pressed together, thereby adjusting the spacing between the upper cover plate 130 and the lower support plate 120 or / and the spacing between the lower support plate 120 and the circuit board 110.

[0046] Combination Figure 1-3 , Figure 8-10 As shown, in a specific embodiment, four support columns 151 are provided, and the four corners of the circuit board 110, the lower support plate 120, and the upper cover plate 130 are respectively installed on the four support columns 151. Specifically, the four corners of the circuit board 110 are respectively provided with first mounting holes 115, the four corners of the lower support plate 120 are respectively provided with second mounting holes 123, and the four corners of the upper cover plate 130 are respectively provided with third mounting holes 132. The four support columns 151 are respectively and sequentially penetrated through the first mounting holes 115, the second mounting holes 123, and the third mounting holes 132 for installation. The adjusting member 152 is installed below the circuit board 110 and above the upper cover plate 130.

[0047] In this specific embodiment, the adjusting member 152 is a universal nut, and the support column 151 is provided with a thread that matches the nut. The nut and the support column 151 are threadedly connected to facilitate the rotation of the nut to adjust the position to press the circuit board 110 and / or the upper cover 130. Of course, the adjusting member 152 can also select other connecting components.

[0048] Combine again below Figure 1-Figure 11 As shown, the working principle of the heat dissipation capacity detection device 100 of the heat dissipation material of the present invention is explained.

[0049] First, install the required number of temperature detection parts at the first temperature test points a1, b1, c1, d1, e1, f1, g1 on the back of the lower support plate 120, and install the required number of temperature detection parts at the second temperature test points a2, b2, c2, d2, e2, f2, g2 on the front of the upper cover plate 130. For example, in one embodiment, thermocouples are respectively affixed to the seven first temperature test points a1, b1, c1, d1, e1, f1, g1 on the back of the lower support plate 120, and thermocouples are respectively affixed to the seven second temperature test points a2, b2, c2, d2, e2, f2, g2 on the front of the upper cover plate 130, so that seven pairs of corresponding temperature collection points are formed in the vertical direction. After the lower support plate 120 is installed above the circuit board 110, the third bonding line 122 on the back of the lower support plate 120 corresponds to the thermal pad 114 on the surface of the heating resistor 111 and is bonded.

[0050] Next, the heat dissipation material 200 is attached to the first attachment line 121 on the front side of the lower support plate 120. After the upper cover plate 130 is covered on the heat dissipation material 200, the heat dissipation material 200 is attached to the second attachment line 131 on the back side of the upper cover plate 130. At this time, the heat dissipation material 200 is clamped between the upper cover plate 130 and the lower support plate 120. Fig.11 As shown, the upper cover plate 130 and the lower support plate 120 are positioned within the first bonding line 121 and the second bonding line 131. During the installation of the heat dissipation material 200, the spacing between the upper cover plate 130 and the lower support plate 120 can be adjusted by adjusting the adjusting member 152 to adapt to different heat dissipation materials 200.

[0051] Then, the pressure between the lower support plate 120 and the circuit board 110 is detected by the pressure sensor 140, and the adjusting member 152 is adjusted according to the data of the pressure sensor 140, so as to adjust the distance between the lower support plate 120 and the circuit board 110. In fact, the distance between the lower support plate 120 and the thermal conductive gasket 114 on the surface of the heating resistor 111 is adjusted to ensure that the distance between the lower support plate 120 and the heating resistor 111 is stable, so that after replacing the heat dissipation material 200, the data error caused by the inconsistent distance between the heat source and the heat dissipation material 200 is reduced, thereby ensuring the accuracy of the comparison result.

[0052] Next, the circuit board 110 is powered by the positive and negative poles 113, so that the heating resistor 111 generates heat to simulate the heating power of the heat source chip. In addition, by adjusting the resistance value of the adjustable resistance module 112, the resistance value of the heating resistor 111 can be changed to achieve different heating powers of the heating resistor 111, thereby covering the heating power of a wide range of electronic components. During the heating process of the heating resistor 111, the heat is transferred to the heat dissipation material 200 through the thermal pad 114 and the lower support plate 120 in turn, and the heat is dissipated through the heat dissipation material 200.

[0053] Finally, by reading the temperatures of the thermocouples at the first temperature test points a1, b1, c1, d1, e1, f1, and g1 on the back of the lower support plate 120, or reading the temperatures of the thermocouples at the second temperature test points a2, b2, c2, d2, e2, f2, and g2 on the front of the upper cover plate 130, the planar heat dissipation capacity of the heat dissipation material 200 can be obtained, and the planar heat dissipation capacities of different heat dissipation materials 200 can be quickly compared through the above-mentioned temperatures. By reading the temperatures of the first temperature test points a1, b1, c1, d1, e1, f1, g1 and the second temperature test points a2, b2, c2, d2, e2, f2, g2, for example, by reading the temperatures of the temperature collection points a1 and a2, b1 and b2, c1 and c2, d1 and d2, e1 and e2, f1 and f2, g1 and g2, the normal heat dissipation capacity of the heat dissipation material 200 can be obtained, and the normal heat dissipation capacity of different heat dissipation materials 200 can be quickly compared through the temperatures of the test points relative to each other. In this way, the heat dissipation performance of heat dissipation materials 200 of different materials can be compared, and the heat dissipation performance of heat dissipation materials 200 of the same material but different processes can also be compared, so as to achieve the purpose of quickly verifying the heat dissipation performance of a wide range of heat dissipation materials 200, and the operation is convenient and operability is strong.

[0054] In summary, the heat dissipation capacity detection device 100 of the heat dissipation material of the present invention firstly sets a heating resistor 111 and an adjustable resistor module 112 on the two sides of the circuit board 110 respectively, uses the heat generated by the heating resistor 111 as a heat source, and changes the resistance value of the heating resistor 111 by adjusting the adjustable resistor module 112, thereby obtaining different heating powers to simulate the heating power of a wide range of heat source chips, and can cover different heating powers of a wide range of electronic products; secondly, by presetting a plurality of first temperature test points a1, b1, c1, d1, e1, f1, g1 on the lower support plate 120 and presetting a plurality of second temperature test points a2, b2, c2, d2 on the upper cover plate 130 , e2, f2, g2. When the heating resistor 111 generates heat, the plane heat dissipation capacity and / or normal heat dissipation capacity of the heat dissipation material 200 is detected by detecting the temperature of the first temperature test point a1, b1, c1, d1, e1, f1, g1 and / or the second temperature test point a2, b2, c2, d2, e2, f2, g2, so as to quickly verify the heat dissipation performance of the heat dissipation material 200. It can compare the heat dissipation performance of heat dissipation materials 200 of different materials as well as heat dissipation performance of heat dissipation materials 200 of the same material but different price processes. The selection range of the heat dissipation material 200 is wide, and a wide range of heat dissipation performance comparisons of the heat dissipation materials 200 can be realized. Furthermore, the detection device 100 has a simple structure, is easy to operate, and has strong operability.

[0055] The above disclosure is only the preferred embodiment of the present invention, which certainly cannot be used to limit the scope of rights of the present invention. Therefore, equivalent changes made according to the scope of the patent application of the present invention are still within the scope covered by the present invention.

Claims

1. A device for detecting the heat dissipation capacity of a heat dissipation material, characterized in that: include: A circuit board, wherein a heating resistor and an adjustable resistance module are respectively disposed on two sides of the circuit board, and a positive and negative poles are also disposed on any side of the circuit board, and power is supplied to the circuit board through the positive and negative poles, and the resistance value of the heating resistor is changed by adjusting the resistance value of the adjustable resistance module; A lower support plate is disposed above the circuit board and in contact with the heating resistor, and a side of the lower support plate in contact with the heating resistor is provided with a plurality of first temperature test points; An upper cover plate, arranged above the lower support plate and spaced apart from the lower support plate, the upper cover plate and the lower support plate are used to clamp the heat dissipation material, and a side of the upper cover plate away from the lower support plate is provided with a plurality of second temperature test points; When the heating resistor generates heat, the temperature of the first temperature test point and / or the second temperature test point may be detected to detect the heat dissipation capacity of the heat dissipation material.

2. The heat dissipation capacity detection device of heat dissipation material according to claim 1, characterized in that: A temperature detection component is installed at at least a portion of the first temperature test point and the second temperature test point.

3. The heat dissipation capacity detection device of heat dissipation material according to claim 1 or 2, characterized in that: The first temperature test point and the second temperature test point are arranged opposite to each other up and down.

4. The device for detecting the heat dissipation capacity of heat dissipation materials according to claim 1, characterized in that: The heating resistor is arranged at the center of the circuit board, and the adjustable resistor module and the positive and negative poles are arranged at the edges of the circuit board.

5. The device for detecting the heat dissipation capacity of heat dissipation materials according to claim 1, characterized in that: The heating resistor is in a square structure.

6. The device for detecting the heat dissipation capacity of heat dissipation materials according to claim 1, 4 or 5, characterized in that: It also includes a thermally conductive pad, which is attached to the surface of the heating resistor and contacts the lower support plate.

7. The device for detecting the heat dissipation capacity of heat dissipation materials according to claim 1, characterized in that: The opposite sides of the lower support plate and the upper cover plate are respectively provided with a first bonding line and a second bonding line for positioning the heat dissipation material; the other side of the lower support plate is also provided with a third bonding line for positioning the heating resistor.

8. The device for detecting the heat dissipation capacity of heat dissipation materials according to claim 1, characterized in that: The distance between the circuit board and the lower support plate, and the distance between the lower support plate and the upper cover plate are both adjustable.

9. The device for detecting the heat dissipation capacity of heat dissipation materials according to claim 1 or 8, characterized in that: It also includes a pressure sensor, which is arranged between the lower support plate and the circuit board and is used to detect the pressure between the lower support plate and the circuit board.

10. The device for detecting the heat dissipation capacity of heat dissipation materials according to claim 1 or 8, characterized in that: It also includes a support column and an adjusting member, wherein the circuit board, the lower support plate, and the upper cover plate are adjustably mounted on the support column in sequence, and the adjusting member is rotatably connected to the support column. The adjusting member is rotated along the support column to press the upper cover plate and / or the circuit board, thereby adjusting the distance between the upper cover plate and the lower support plate and / or the distance between the lower support plate and the circuit board.

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