Chassis thermal syphon cooling system

Abstract

The utility model relates to a chassis thermosyphon cooling system, including a chassis and a condenser assembly. An evaporator is arranged in the chassis, and the evaporator is connected to a condenser assembly located outside the chassis through a gas phase pipeline and a liquid phase pipeline. The evaporator is fixed in the chassis shell and contacts and conducts heat with a number of boards in the chassis shell. The utility model combines the chassis with a thermosyphon cooling device, and utilizes the principle of gravity self-circulation. The system can operate without a driving device, and the condenser assembly of the utility model is connected to the chassis through a pipeline, so that the heat in the chassis can be brought to an area with a larger cooling space for heat dissipation. A larger fan can be installed in the cooling space to reduce the noise pollution generated by the system. In addition, the utility model dissipates heat to the boards in the chassis through a thermosyphon cooling system, which can effectively reduce dust in the chassis caused by air cooling, and is conducive to keeping the chassis clean.

Description

Technical Field

[0001] The utility model belongs to the technical field of chassis heat dissipation, and in particular relates to a chassis thermal siphon heat dissipation system. Background Art

[0002] The chassis heat dissipation adopts the traditional direct air cooling and single-phase liquid cooling. Single-phase liquid cooling requires the addition of a cooling source, which in turn increases the size and weight of the system and requires a larger space. Direct air cooling will increase the noise of the system, mainly because the heat dissipation area of ​​electronic components is small, so a fan with a larger air volume needs to be selected. Installing a fan with a larger air volume in a small space will increase the fan noise; in addition, the air is in direct contact with the electronic components for convection heat dissipation, and the polluted air will bring dust into the electronic components, affecting the service life of the electronic equipment. Summary of the invention

[0003] In order to solve the above problems, the utility model provides a chassis thermal siphon cooling system, which can not only realize reliable heat dissipation of the chassis, but also can operate without a driving device. The refrigerant medium can bring heat to an area with a larger heat dissipation space for heat dissipation, thereby reducing noise and dust pollution at the chassis.

[0004] The purpose of the utility model and the technical problem solved are achieved by adopting the following technical solutions. A chassis thermosyphon heat dissipation system proposed by the utility model includes a chassis 1 and a condenser assembly 2. An evaporator is arranged in the chassis 1. The evaporator is connected to the condenser assembly 2 located outside the chassis through a gas phase pipeline 5 and a liquid phase pipeline 4. The evaporator is fixed in a chassis shell 7 and contacts with a plurality of boards in the chassis shell 7 for heat conduction.

[0005] The purpose of the utility model and the solution to its technical problems can also be further achieved by adopting the following technical measures.

[0006] In the aforementioned chassis thermosyphon cooling system, the gas phase pipeline 5 and the liquid phase pipeline 4 are connected to the condenser assembly 2 and the evaporator through fluid connectors to achieve rapid assembly and disassembly of the chassis and the condenser assembly.

[0007] In the aforementioned chassis thermosyphon cooling system, each evaporator is connected to at least one condenser assembly 2 to meet different condensation requirements.

[0008] In the aforementioned chassis thermosiphon cooling system, an upper partition 9 is fixed on the inner side of the top of the chassis shell 7, and a lower partition 10 is fixed on the inner side of the bottom. The upper partition 9 and / or the lower partition 10 are evaporators, and the number and position of the evaporators can be set as needed.

[0009] In the aforementioned chassis thermosiphon cooling system, when the upper partition 9 and / or the lower partition 10 is an evaporator, its internal flow channel adopts the form of a microchannel. The microchannel can increase the heat exchange area, reduce the boundary layer thickness, increase the number of vaporization cores, and thus reduce the contact thermal resistance.

[0010] In the aforementioned chassis thermal siphon cooling system, a plurality of upper guide plates 11 are spaced apart on the lower end surface of the upper partition plate 9, and a plurality of lower guide plates 12 are correspondingly distributed on the upper end surface of the lower partition plate 10. The upper and lower end side surfaces of the board and the upper guide plates 11 and the lower guide plates 12 are in contact with the side surfaces of the upper guide plates 11 and the lower guide plates 12 for heat conduction, so as to increase the contact area between the board and the guide plates and enhance the heat conduction efficiency.

[0011] In the aforementioned chassis thermosiphon cooling system, both sides of the roots where the upper guide plate 11 and the lower guide plate 12 are connected to the partition are formed with step surfaces 13, and the step surfaces 13 are used for contacting and conducting heat with the step surfaces on both sides of the upper and lower ends of the board.

[0012] In the aforementioned chassis thermosyphon cooling system, the chassis shell 7, the upper partition plate 9, the lower partition plate 10, the upper guide plate 11 and the lower guide plate 12 are all made of aluminum alloy.

[0013] In the aforementioned chassis thermosyphon cooling system, copper foil is installed on the surfaces of the upper partition plate 9, the lower partition plate 10, the upper guide plate 11 and the lower guide plate 12 that contact the inner wall of the chassis shell 7 to reduce thermal resistance.

[0014] The aforementioned chassis thermosyphon cooling system is characterized in that a pressure sensor 6 is also connected to at least one gas phase pipeline 5 connected to the same evaporator.

[0015] Compared with the prior art, the utility model has obvious advantages and beneficial effects. By means of the above technical solution, the utility model can achieve considerable technical progress and practicality, and has wide industrial utilization value, and has at least the following advantages:

[0016] The utility model combines the chassis and the thermosiphon heat dissipation device to form a thermosiphon heat dissipation system. By using the principle of gravity self-circulation, the system can operate without a driving device, and the condenser assembly of the utility model is connected to the chassis through a pipeline, which can bring the heat in the chassis to an area with a larger heat dissipation space for heat dissipation. A larger fan can be installed in the heat dissipation space to reduce the noise pollution generated by the system. In addition, the utility model dissipates heat from the boards in the chassis through the thermosiphon heat dissipation system, which can effectively reduce the dust in the chassis caused by air cooling and heat dissipation, and is conducive to keeping the chassis clean. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the composition of the chassis thermosyphon cooling system of the utility model;

[0018] Figure 2for Figure 1 Another viewing schematic diagram of ;

[0019] Figure 3 This is a schematic diagram of the chassis housing of the utility model after removing the panel;

[0020] Figure 4 for Figure 3 Schematic diagram of the rotation of ;

[0021] Figure 5 for Figure 3 Schematic diagram of the structure after cutting.

[0022]

Main component symbol description

[0023] 1: Chassis

[0024] 2: Condenser assembly

[0025] 3: Fluid connector

[0026] 4: Liquid phase pipeline

[0027] 5: Gas phase pipeline

[0028] 6: Pressure sensor

[0029] 7: Chassis shell

[0030] 8: Front panel

[0031] 9: Upper partition

[0032] 10: Lower partition

[0033] 11: Upper guide plate

[0034] 12: Lower guide plate

[0035] 13: Step surface DETAILED DESCRIPTION

[0036] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the specific implementation method, structure, characteristics and effects of the chassis thermal siphon cooling system proposed by the present invention are described in detail below in combination with the accompanying drawings and preferred embodiments.

[0037] See also Figure 1-5 , which is a schematic diagram of the structure of each part of the chassis thermosyphon cooling system of the utility model, the chassis thermosyphon cooling system includes a chassis 1 and at least one condenser assembly 2, wherein the chassis 1 includes a chassis shell 7, an upper partition 9 is fixed on the inner side of the top of the chassis shell 7, and a lower partition 10 is fixed on the inner side of the bottom, and the upper partition 9 and the lower partition 10 are both in contact with the inner wall of the chassis shell 7 to achieve heat conduction.

[0038] A plurality of upper guide rails 11 are arranged at intervals on the lower end surface of the upper partition 9, and a plurality of lower guide rails 12 are arranged at intervals on the upper end surface of the lower partition 10, and the upper guide rails 11 and the lower guide rails 12 are arranged correspondingly up and down, and guide rail grooves for inserting the upper and lower ends of the board and card are formed between adjacent upper guide rails 11 and adjacent lower guide rails 12, respectively, so as to limit the upper and lower ends of the board and card. When the board and card are inserted into the above-mentioned guide rail grooves, the upper and lower end surfaces of the board and card are respectively in contact with the lower end surface of the upper partition 9 and the upper end surface of the lower partition 10 to transfer heat.

[0039] In this embodiment, a flow channel is provided in the upper partition 9, and a refrigerant is contained in the flow channel, that is, the upper partition 9 is an evaporator. In another embodiment of the utility model, no flow channel is provided in the upper partition 9, and a flow channel and a refrigerant are provided in the lower partition 10, that is, the lower partition 10 is an evaporator. In yet another embodiment of the utility model, both the upper partition 9 and the lower partition 10 are evaporators.

[0040] The chassis shell 7, the upper partition 9, the lower partition 10, the upper guide plate 11 and the lower guide plate 12 are all made of aluminum alloy. The chassis shell 7 is formed by splicing and fixing the upper, lower, left, right and rear side plates by screws. The upper partition 9 and the lower partition 10 are also fixed in the chassis shell 7 by screws. When the upper partition 9 and / or the lower partition 10 are evaporators, they are structures formed by vacuum brazing of the bottom plate, the cover plate and the fins.

[0041] The evaporator in the chassis 1 is connected to the condenser assembly 2 through a liquid phase pipeline 4 and a gas phase pipeline 5. Each evaporator can be adapted to at least one condenser assembly 2 as required to meet the condensation effect. In this embodiment, the flow channel inlet on the side where the upper partition 9 contacts the rear side wall of the chassis shell is connected to two liquid phase pipelines 4, and the flow channel outlet is connected to two gas phase pipelines 5. The two liquid phase pipelines 4 and the gas phase pipeline 5 are respectively connected to each condenser assembly 2.

[0042] In order to facilitate the installation and disassembly of the thermal siphon heat dissipation device, improve the maintainability of the system, and avoid vacuum filling operations during each installation and disassembly process, the evaporator and condenser components 2 are connected to the pipeline using a fluid connector 3, which has a pressure plug-in and pull-out function, and the leakage of a single plug-in and pull-out is ≤0.01g. The fluid connector 3 includes a fluid connector plug and a fluid connector socket. In this embodiment, the flow channel inlet end of the upper partition 9 and / or the lower partition 10 used as the evaporator is connected to the fluid connector socket, and the air inlet and liquid outlet of the condenser assembly 2 are also connected to the fluid connector socket. Both ends of the liquid phase pipeline 4 and the gas phase pipeline 5 are connected to the fluid connector plug. As a result, the evaporator on the chassis 1 of the utility model can be quickly connected and assembled with the fluid connector plug at one end of the gas phase pipeline 5 and the liquid phase pipeline 4 through the fluid connector socket, and the fluid connector plug at the other end of the gas phase pipeline 5 and the liquid phase pipeline 4 is connected to the fluid connector socket on the condenser assembly 2, thereby realizing the rapid assembly between the chassis 1 and the condenser assembly 2. When disassembly is required, the fluid connector plug and the fluid connector socket can be directly separated to complete the task. In this embodiment, the fluid connector socket and the evaporator as well as the fluid connector socket and the condenser assembly 2 are fixedly installed by flanges, rubber rings are installed in the flanges, and the connection is sealed by the rubber rings. The gas phase pipeline 5 and the liquid phase pipeline 5 both use polytetrafluoroethylene hoses, but are not limited thereto. The fluid connection 3 is an existing fluid connector and will not be described in detail here.

[0043] In the embodiment of the utility model, at least one gas phase pipeline 5 is further connected to a pressure sensor 6, and the pressure of the heat dissipation system is detected by the pressure sensor 6 to ensure that the heat dissipation system can run smoothly.

[0044] When the utility model is in use, a board is installed in the chassis 1, and the board is fixed in the guide groove between adjacent guide plates by a locking strip. After the board is assembled in place, the locking strip is tightened and expanded by screws, so that the board can be closely fitted with the guide groove to reduce the contact thermal resistance. The heat generated by the chip in the board is transmitted upward along the board, and the heat is transferred through the contact between the upper end surface of the board and the bottom of the guide groove formed at the upper partition 9, and the contact between the side of the board and the upper guide plates 11 on both sides of the guide groove. The heat is transferred to the upper guide plate 11 and the upper partition 9, and then absorbed by the refrigerant in the flow channel of the upper guide plate. Another part of the heat on the board is transferred downward through the board, and then transferred to the lower guide plate 11 and the lower partition 10 through the guide groove on the lower partition 10. The heat is then transferred to the side wall of the chassis shell by the lower guide plate 11 and the lower partition 10 through heat conduction, and then transferred to the upper partition 9 by the chassis shell and absorbed by the refrigerant in the upper partition 9.

[0045] After the refrigerant in the upper partition 9 absorbs heat, the liquid refrigerant becomes gas and rises along the gas phase pipeline 5 to the condenser assembly 2 under the action of the thermal pressure difference. The condenser assembly 2 releases the heat into the air through forced convection heat exchange by the fan. The gas phase refrigerant after releasing the heat becomes liquid phase refrigerant and flows back to the upper partition 9 along the liquid phase pipeline 4, completing a heat dissipation cycle.

[0046] In other embodiments of the present invention, when both the upper partition 9 and the lower partition 10 are evaporators, the heat transferred downward and upward by the board card is absorbed by the refrigerant in the upper partition 9 and the lower partition 10 respectively.

[0047] In this embodiment, in order to reduce the contact thermal resistance, copper foil is added to the surfaces of the upper partition 9, the lower partition 10 and the lower guide plate 12 that contact the inner wall of the chassis shell 7. In other embodiments, when the lower partition 10 is an evaporator and the upper partition 9 is not provided with a flow channel, copper foil is added to the surfaces of the upper partition 9, the lower partition 10 and the upper guide plate 11 that contact the inner wall of the chassis shell 7. That is, when only one of the upper partition 9 and the lower partition 10 is an evaporator, copper foil is added to the surfaces of the two partitions and the guide plate on the partition without a flow channel inside that contact the inner wall of the chassis shell 7, so that heat can be conducted from the partition without a flow channel inside and the guide plate on the partition through the chassis shell 7 to the partition that serves as the evaporator.

[0048] The internal flow channels of the upper baffle 9 and / or the lower baffle 10 of the evaporator of the utility model adopt the form of microchannels, which can increase the heat exchange area, reduce the boundary layer thickness, increase the number of gasification cores, and thus reduce the contact thermal resistance.

[0049] In the embodiment of the utility model, step surfaces 13 are formed on both sides of the roots of the upper guide plate 11 and the lower guide plate 12 connected to the partition plate. The step surfaces 13 are used to adapt to the step surfaces on both sides of the upper and lower ends of the board to enhance the contact area between the board and the guide plate.

[0050] The above description is only a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention has been disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technician familiar with the profession can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A chassis thermosyphon cooling system, characterized in that: It includes a chassis and a condenser assembly. An evaporator is arranged in the chassis. The evaporator is connected to the condenser assembly outside the chassis through a gas phase pipeline and a liquid phase pipeline. The evaporator is fixed in the chassis shell and contacts with several boards in the chassis shell for heat conduction.

2. The chassis thermosyphon cooling system according to claim 1, characterized in that: The gas phase pipeline and the liquid phase pipeline are both connected to the condenser assembly and the evaporator through a fluid connector.

3. The chassis thermosyphon cooling system according to claim 2, characterized in that: At least one condenser assembly is connected to each evaporator.

4. The chassis thermosyphon cooling system according to claim 3, characterized in that: An upper baffle is fixed on the inner side of the top of the chassis shell, and a lower baffle is fixed on the inner side of the bottom. The upper baffle and / or the lower baffle are evaporators.

5. The chassis thermosyphon cooling system according to claim 4, characterized in that: When the upper baffle and / or the lower baffle is an evaporator, the internal flow channel thereof is in the form of a microchannel.

6. The chassis thermosyphon cooling system according to claim 4, characterized in that: A plurality of upper guide rails are arranged at intervals on the lower end surface of the upper partition, and a plurality of lower guide rails are distributed correspondingly on the upper end surface of the lower partition. The upper and lower end sides of the board are in contact with the upper and lower guide rails for heat conduction.

7. The chassis thermosyphon cooling system according to claim 6, characterized in that: Step surfaces are formed on both sides of the roots where the upper guide plate and the lower guide plate are connected to the partition plate, and the step surfaces are used for contacting and conducting heat with the step surfaces on both sides of the upper and lower ends of the board.

8. The chassis thermosyphon cooling system according to claim 6 or 7, characterized in that: The chassis shell, the upper partition, the lower partition, the upper guide plate and the lower guide plate are all made of aluminum alloy.

9. The chassis thermosyphon cooling system according to claim 8, characterized in that: Copper foil is installed on the surfaces of the upper partition plate, the lower partition plate, the upper guide rail plate and the lower guide rail plate that contact the inner wall of the chassis shell.

10. The chassis thermosyphon cooling system according to claim 3, characterized in that: At least one gas phase pipeline connected to the same evaporator is also connected to a pressure sensor.

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