Cooling device and server
By setting an electrothermal structure on the side of the base of the heat dissipation device, the problems of chip preheating and heating of thermal interface materials are solved, and efficient heating of chip and thermal conductive layer is achieved, which is suitable for low-temperature areas and equipment disassembly scenarios.
Patent Information
- Application Number
- CN202420842188.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-22
- Publication Date
- 2025-04-08
- Estimated Expiration
- 2034-04-22
AI Technical Summary
The prior art cannot meet the use scenarios of chip preheating and thermal interface materials that need to be heated and removed, and cannot efficiently heat the chip and thermal conductive layer.
A heat dissipation device is designed, including a base and a heat dissipation body. An electrothermal structure is arranged on the side of the base facing away from the heat dissipation body. A current loop is formed through the current input and output ends of the electrothermal structure to realize the heating of the chip.
It realizes preheating and efficient heating of the chip, which is suitable for equipment startup in low-temperature areas, and efficiently melts the thermally conductive layer and safely disassembles the chip when the thermally conductive layer is a thermally induced phase change material.
Smart Images
Figure CN222734458U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation of electronic devices, in particular to a heat dissipation device and a server. Background Art
[0002] In electronic products, chips play an important control function and generate a lot of heat. Usually, a heat sink needs to be set up corresponding to the chip to dissipate heat in order to ensure the normal function of the chip.
[0003] In the related art, in order to solve the problem of chip heating, a heat sink is installed on the chip to control the chip temperature within a reasonable range. Specifically, the heat sink and the chip installed on the circuit board transfer heat through the thermal interface material bonded between the two to take away the heat from the chip. At the same time, a blower is provided on the side of the circuit board to further blow gas to the heat sink to take away the heat, thereby realizing the heat transfer path of the chip from the thermal interface material, the heat sink to the heat exchange gas in sequence.
[0004] However, the heat dissipation device in the related art cannot meet the requirements of chip preheating and the use scenarios of thermal interface materials that need to be removed by heating. Utility Model Content
[0005] The utility model provides a heat dissipation device and a server, which not only have the function of daily heat dissipation of chips, but also can meet the use scenarios of chip preheating and thermal interface materials that need to be removed after heating, and have high heating efficiency for chips and thermal interface materials.
[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0007] In a first aspect, the utility model provides a heat dissipation device, which is arranged in a server chassis, the heat dissipation device is attached to a heat conductive layer on a chip surface, the heat dissipation device comprises a base and a heat dissipation body, the heat dissipation body is arranged on the base, and the heat dissipation body is used to conduct heat from the chip through the heat conductive layer;
[0008] An electrothermal structure is provided on a side of the base away from the heat dissipation body. The electrothermal structure has a current input end and a current output end. The electrothermal structure is used for being energized to generate heat so as to heat the chip.
[0009] In a possible implementation, the electric heating structure includes an electric heating element, the first end of the electric heating element is the current input end, the second end of the electric heating element is the current output end, and a accommodating groove is provided on the side of the base facing away from the heat dissipation body, and the accommodating groove is used to accommodate the electric heating element. The accommodating groove has two ends extending to the edge of the base to correspond to the first end and the second end of the electric heating element.
[0010] In a possible implementation, the electrothermal heating element includes a metal wire, the metal wire is located in the accommodating groove, and two ends of the metal wire are respectively connected to a current input terminal and a current output terminal to form the current input end and the current output end.
[0011] In a possible implementation, along the thickness direction of the chip, at least a portion of the electric heating element and the orthographic projection of the chip on the base overlap.
[0012] In a possible implementation, along the thickness direction of the chip, the orthographic projections of the electric heating element and the chip on the base have no overlapping parts.
[0013] In a possible implementation, a first insulating layer is provided in the receiving groove, and the first insulating layer is located between the receiving groove and the electric heating element.
[0014] In a possible implementation, a second insulating layer is provided on the periphery of the electric heating element. The base includes a bottom plate, and the heat dissipation body includes a plurality of heat dissipation plates, which are arranged on the bottom plate at intervals along a direction parallel to a plate surface of the bottom plate, and the gaps between the plurality of heat dissipation plates are used to conduct heat from the chip.
[0015] In a possible implementation, the base plate is provided with a threaded hole, the circuit board on which the chip is mounted is provided with a mounting hole, the mounting hole is arranged corresponding to the threaded hole, and the base plate is detachably connected to the circuit board by connecting bolts passing through the threaded hole.
[0016] The heat dissipation device provided in this application has at least the following beneficial effects:
[0017] By setting an electrothermal structure on the side of the base away from the heat dissipation body, the current input end and the current output end of the electrothermal structure are connected to form a current loop, so that the electrothermal structure generates heat for heating the chip, and an innovative heat dissipation device structure with a heating function is realized, so that the chip using the heat dissipation device can be used in low temperature areas, and the chip can be preheated to start the device efficiently; at the same time, when the heat conductive layer between the chip and the heat dissipation device is a thermotropic phase change material, the heat conductive layer can be heated to the phase change temperature point, and then the heat conductive layer can be melted efficiently to safely disassemble the chip. In the second aspect, the utility model provides a server, including a heat dissipation device of any scheme of the first aspect, including all the beneficial effects of the heat dissipation device provided in the first aspect, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0019] Figure 1 A schematic diagram of the side view of the heat dissipation device for cooling a chip provided in an embodiment of the present application;
[0020] Figure 2 A schematic diagram of the structure of a heat dissipation device provided in an embodiment of the present application;
[0021] Figure 3 A schematic structural diagram showing an electrothermal structure of a heat dissipation device provided in an embodiment of the present application;
[0022] Figure 4 A schematic structural diagram showing an electroheating structure of a heat dissipation device provided in yet another embodiment of the present application.
[0023] Description of reference numerals:
[0024] 100-thermal conductive layer;
[0025] 200-base;
[0026] 210-bottom plate; 211-threaded hole;
[0027] 300-heat dissipation body; 310-heat dissipation plate;
[0028] 400-Electrically induced heating structure;
[0029] 410-electric heating element;
[0030] 500-chip; 510-chip projection;
[0031] 600-Circuit Board. DETAILED DESCRIPTION
[0032] As described in the background technology, in electronic products, chips play an important control function and generate a large amount of heat. Usually, a heat sink is required to be provided for the corresponding chip to dissipate heat in order to ensure the normal function of the chip. In the related technology, the heat sink and the chip mounted on the circuit board are connected to the thermal interface material to transfer heat to remove the heat from the chip. At the same time, a blasting device is provided on the side of the circuit board to further blow gas to the heat sink to remove the heat, thereby realizing the heat transfer path of the chip from the thermal interface material, the heat sink to the heat exchange gas in sequence. However, the heat sink in the related technology cannot meet the chip preheating and the use scenarios of the thermal interface material that needs to be removed after heating.
[0033] The applicant has found that the scenarios where the chip needs to be heated include: when the communication cabinet is used in low-temperature areas, the chip temperature needs to reach above 0°C during the equipment startup phase to start normally, otherwise the equipment will not be able to start; in addition, when the radiator needs to be removed for maintenance, and the thermal conductive material between the chip and the radiator is a phase change material, the thermal conductive material needs to be heated to the phase change temperature (above 50°C) so that the phase change material can be melted from solid to liquid before the radiator can be removed smoothly without damaging the chip. The above scenarios include applications in AI chips.
[0034] However, existing heat dissipation devices can only dissipate heat from the chip but cannot apply a temperature field to the chip.
[0035] In view of the above technical problems, an embodiment of the utility model provides a heat dissipation device, by arranging an electrothermal structure on the side of the base away from the heat dissipation body, and connecting the current input end and the current output end of the electrothermal structure respectively to form a current loop, so that the electrothermal structure generates heat for heating the chip, and innovatively realizes the heat dissipation device structure with heating function, so that the chip using the heat dissipation device can be used in low temperature areas, and the chip can be preheated to start the equipment efficiently; at the same time, when the heat conductive layer between the chip and the heat dissipation device is a thermotropic phase change material, the heat conductive layer can be heated to the phase change temperature point, thereby efficiently melting the heat conductive layer and safely disassembling the chip.
[0036] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.
[0037] In order to make the above-mentioned purposes, features and advantages of the embodiments of the utility model more obvious and easy to understand, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the utility model.
[0038] Combination Figures 1 to 4 The embodiment of the utility model provides a heat dissipation device, which is arranged in a server chassis. The heat dissipation device is attached to the heat-conducting layer 100 on the surface of the chip 500. The heat dissipation device includes a base 200 and a heat dissipation body 300. The heat dissipation body 300 is arranged on the base 200. The heat dissipation body 300 is used to conduct heat on the chip 500 through the heat-conducting layer 100; an electrothermal structure 400 is provided on the side of the base 200 away from the heat dissipation body 300. The electrothermal structure 400 has a current input terminal and a current output terminal. The electrothermal structure 400 is used to be energized to generate heat to heat the chip 500.
[0039] In this way, by arranging the electroheating structure 400 on the side of the base 200 away from the heat dissipation body 300, the current input end and the current output end of the electroheating structure 400 are connected to form a current loop, so that the electroheating structure 400 generates heat for heating the chip 500, and innovatively realizes the structure of the heat dissipation device with heating function, so that the chip 500 using the heat dissipation device can be used in low temperature areas, and the chip 500 can be preheated to start the equipment efficiently; at the same time, when the heat-conducting layer 100 between the chip 500 and the heat dissipation device is a thermotropic phase change material, the heat-conducting layer 100 can be heated to the phase change temperature point, thereby efficiently melting the heat-conducting layer 100 and safely removing the chip 500.
[0040] In this embodiment, illustratively, the phase change temperature point at which the material of the thermotropic phase change heat conductive layer 100 melts from a solid state to a liquid state is 50°C.
[0041] On the basis of the above embodiment, what can be improved is that the electric heating structure includes an electric heating element 410, the first end of the electric heating element 410 is a current input end, the second end of the electric heating element 410 is a current output end, and a accommodating groove is provided on the side of the base 200 away from the heat dissipation body 300, and the accommodating groove is used to accommodate the electric heating element 410, and the accommodating groove has two ends extending to the edge of the base 200 to correspond to the first end and the second end of the accommodating electric heating element 410.
[0042] Exemplarily, the base 200 is a metal base 200 , the electric heating element 410 includes a metal wire, and a receiving groove is milled on a side of the base 200 away from the heat dissipation body 300 by a milling machine to accommodate the metal wire.
[0043] In this way, by providing a receiving groove on the base 200 to receive the electric heating element 410 , an integrated design of the electric heating element 410 in the heat dissipation device is achieved, thereby improving the space utilization of the heat dissipation device base 200 .
[0044] As a possible implementation, the electric heating element 410 includes a metal wire, which is located in a receiving groove. Both ends of the metal wire are respectively connected to a current input terminal and a current output terminal to form a current input end and a current output end. Exemplarily, the metal wire is a copper wire, and the metal wire can also be a nickel-chromium alloy wire.
[0045] Through material design, the electric heating element 410 not only has efficient electric heating performance, but also has good high temperature resistance and oxidation resistance, thereby improving the service stability of the electric heating element 410.
[0046] In another possible implementation manner, along a direction perpendicular to the thickness of the chip 500, at least a portion of the electric heating element 410 and the orthographic projection of the chip 500 on the base 200 overlap, such as Figure 3 The chip projection 510 shown, exemplarily, the electric heating element 410 is a metal wire, and a concave receiving groove is provided on the base 200, which is located directly above the chip 500 and the heat-conducting layer 100. The metal wire is buried in the concave receiving groove, and the concave receiving groove has at least two notches connected to the outer side of the edge of the base 200, that is, the metal wire forms a plurality of heating sections in the concave receiving groove, and the heating sections at both ends extend the notches to respectively form a current input end and a current output end, until at least part of the structure of the heating section is located directly above the chip 500 and the heat-conducting layer 100, that is, along the thickness direction of the chip 500, at least part of the structure of the heating section coincides with the positive projection of the chip 500 on the base 200, so that a concave heating loop is formed directly above the chip 500, the heat transfer distance is short, and the heating efficiency of the chip 500 is high.
[0047] It should be noted that, in this embodiment, the layout design of the electric heating element 410 on the base 200 has relatively high requirements for the processing of the accommodating groove area and the metal wire of the base 200, which is mainly reflected in the high requirements for the flatness and roughness of the material in this area, which must be less than or equal to 0.05mm to meet the surface parameter specifications for contact with the thermal conductive layer 100 of the chip 500.
[0048] In another possible embodiment, along the thickness direction perpendicular to the chip 500, the orthographic projections of the electric heating element 410 and the chip 500 on the base 200 have no overlapping parts. Exemplarily, a receiving groove is provided around the position of the base 200 corresponding to the chip 500 to form a "door"-shaped receiving groove. The electric heating element is a metal wire, which is embedded in the "door"-shaped receiving groove. When the base 200 is attached to the thermal conductive layer 100 of the chip 500, there is an avoidance space between the metal wire and the edge of the thermal conductive layer 100 of the chip 500. In this way, the avoidance position of the receiving groove on the base 200 and the chip 500 and the thermal conductive layer 100 is designed, so that the electric heating element can form a heat-affected zone around the chip 500, rather than directly contacting and heating above the thermal conductive layer 100, thereby avoiding the influence on the heat dissipation effect of the chip 500, and the processing accuracy requirements for the surface of the receiving groove and the metal wire are relatively small.
[0049] Based on the above embodiment, it can be improved that when the base 200 and the heat conductive layer 100 of the chip 500 are attached, the distance between the receiving groove and the edge of the chip 500 is 2-5mm, for example, the distance between the receiving groove and the edge of the chip 500 is 2mm or 3mm or 5mm.
[0050] In some embodiments, a first insulating layer is provided in the receiving groove, and the first insulating layer is located between the receiving groove and the electric heating element 410, that is, the receiving groove is filled with insulating material. Exemplarily, the material of the first insulating layer is epoxy resin, mica or bakelite.
[0051] Based on the above embodiment, it can be improved that the material of the first insulating layer is magnesium oxide, which has good insulation and thermal conductivity.
[0052] In more embodiments, the first insulating layer is provided with a receiving groove which is formed by milling, and the electric heating element 410 is received in the receiving groove.
[0053] In other possible implementations, a second insulating layer is provided on the periphery of the electric heating element 410 , and the electric heating element 410 is a metal wire. Exemplarily, the second insulating layer is made of insulating paint to prevent the metal wire from being exposed and leaking electricity or causing electrical breakdown.
[0054] In some embodiments, the electric heating element 410 is a metal wire, which is a high-resistance alloy material. For example, the metal wire is an iron-chromium-aluminum alloy or a nickel-chromium electric heating alloy. The metal wire is led to the circuit board 600 by a wire, powered by a power supply unit provided on the circuit board 600, and controlled by a control unit provided on the circuit board 600.
[0055] As a possible implementation, the base 200 includes a bottom plate 210, and the heat dissipation body 300 includes a plurality of heat dissipation plates 310. The plurality of heat dissipation plates 310 are spaced apart on the bottom plate 210 along a board surface direction parallel to the bottom plate 210, and the gaps between the plurality of heat dissipation plates 310 are used to extract heat from the chip 500.
[0056] On the basis of the above embodiment, what can be improved is that the base plate 210 is provided with a threaded hole 211, and the circuit board 600 on which the chip 500 is installed is provided with a mounting hole, the mounting hole is arranged corresponding to the threaded hole 211, and the base plate 210 is detachably connected to the circuit board 600 by connecting bolts passing through the threaded hole 211. In this way, the base plate 210 can be firmly fixed to the circuit board 600 to achieve stable contact and heat transfer with the thermal conductive layer 100 and the chip 500.
[0057] In the second aspect, an embodiment of the utility model provides a server, comprising multiple chips and a heat dissipation device according to any embodiment of the first aspect, wherein the heat dissipation device is located above the chip to exchange heat with the chip. The server includes all the beneficial effects of the first aspect, which will not be repeated here.
[0058] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0059] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0060] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0061] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0062] The various embodiments or implementation methods in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referenced to each other.
[0063] It should be noted that the embodiments represented by "one embodiment", "an embodiment", "an exemplary embodiment", "some embodiments", etc. mentioned in the specification may include specific features, structures or characteristics, but not every embodiment may include the specific features, structures or characteristics. In addition, such phrases do not necessarily refer to the same embodiment. In addition, when describing specific features, structures or characteristics in conjunction with an embodiment, it is within the knowledge of those skilled in the art to implement such features, structures or characteristics in conjunction with other embodiments that are explicitly or not explicitly described.
[0064] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the utility model.
Claims
1. A heat dissipation device, characterized in that: The heat sink is arranged in a server chassis, the heat sink is attached to the heat-conducting layer on the surface of the chip, the heat sink comprises a base and a heat sink body, the heat sink body is arranged on the base, and the heat sink body is used to conduct heat from the chip through the heat-conducting layer; An electrothermal structure is provided on a side of the base away from the heat dissipation body. The electrothermal structure has a current input end and a current output end. The electrothermal structure is used for being energized to generate heat so as to heat the chip.
2. The heat dissipation device according to claim 1, characterized in that: The electric heating structure includes an electric heating element, the first end of the electric heating element is the current input end, the second end of the electric heating element is the current output end, and a accommodating groove is provided on the side of the base away from the heat dissipation body, and the accommodating groove is used to accommodate the electric heating element. The accommodating groove has two ends extending to the edge of the base to correspond to the first end and the second end of the electric heating element.
3. The heat dissipation device according to claim 2, characterized in that: The electrothermal heating element comprises a metal wire, the metal wire is located in the containing groove, and two ends of the metal wire are respectively connected with a current input terminal and a current output terminal to form the current input end and the current output end.
4. The heat dissipation device according to claim 2, characterized in that: Along the thickness direction of the chip, at least a portion of the electric heating element and the orthographic projection of the chip on the base overlap.
5. The heat dissipation device according to claim 2, characterized in that: Along the thickness direction of the chip, the orthographic projections of the electric heating element and the chip on the base have no overlapping parts.
6. The heat dissipation device according to any one of claims 2 to 5, characterized in that: A first insulating layer is provided in the containing groove, and the first insulating layer is located between the containing groove and the electric heating element.
7. The heat dissipation device according to claim 6, characterized in that: A second insulating layer is disposed on the outer periphery of the electric heating element.
8. The heat dissipation device according to any one of claims 1 to 5, characterized in that: The base includes a bottom plate, and the heat dissipation body includes a plurality of heat dissipation plates. The plurality of heat dissipation plates are arranged on the bottom plate at intervals along a plate surface direction parallel to the bottom plate, and the gaps between the plurality of heat dissipation plates are used to conduct heat from the chip.
9. The heat dissipation device according to claim 8, characterized in that: The bottom plate is provided with a threaded hole, and the circuit board on which the chip is mounted is provided with a mounting hole, the mounting hole is arranged corresponding to the threaded hole, and the bottom plate is detachably connected to the circuit board by connecting bolts passing through the threaded hole.
10. A server, characterized in that: Comprising the heat dissipation device as described in any one of claims 1-9.