Chip packaging module and electronic equipment

Abstract

The utility model is applicable to the field of chip technology, and provides a chip packaging module and an electronic device. The chip packaging module includes: a system-level chip module and a voltage conversion module; a plurality of sub-units are arranged inside the system-level chip module, and the sub-units include at least a CPU core unit, a RAM memory unit and an IO output unit; the voltage conversion module is used to convert the power supply voltage into the power supply voltage required by the plurality of sub-units inside the system-level chip. The present application adopts a relatively independent voltage conversion module outside the package of a traditional system-level chip (SOC, System on Chip) module, thereby being able to provide a more stable low voltage to the plurality of sub-units inside the system-level chip module, and through relatively independent separate power supply, simplifies the design difficulty of the power supply for the system-level chip module, and improves the power supply efficiency and conversion efficiency of the power supply.

Description

Technical Field

[0001] The utility model belongs to the technical field of chips, and in particular relates to a chip packaging module and an electronic device. Background Art

[0002] Embedded package chips are microelectronic components that integrate the chip and package into one. They are often used in embedded systems such as smartphones, tablets, automotive electronic systems, etc. to provide processing power and functions. Embedded package chips usually include functional modules such as processor core, memory, input / output interface, etc., and they are integrated into a small package through packaging technology to achieve highly integrated and compact design. These chips usually have the characteristics of low power consumption, high performance and small size, which are very suitable for the needs of embedded systems.

[0003] Embedded packaged chips contain CPU core, RAM, I / O and other modules or units. These units usually require multiple low-voltage inputs, such as core voltage, memory voltage, I / O voltage, etc. Therefore, a large number of peripheral design circuits are required to power them. Existing designs usually use an LDO (low dropout linear regulator) integrated in the chip to achieve power supply. These low voltages are provided by the LDO inside the chip itself, which has the disadvantages of low efficiency and poor energy consumption ratio.

[0004] Therefore, it can be seen that in current products, the power supply of embedded packaged chips is inefficient in generating multiple internal low voltages and has poor utilization. It may require several sets of independent power supplies to supply power separately, which increases product costs. It is not environmentally friendly and efficient, and there is also the problem of complex peripheral design, which needs to be improved. Utility Model Content

[0005] The purpose of the embodiments of the present application is to provide a chip packaging module, which aims to solve the problem that the power supply of the current embedded packaged chip is inefficient and has poor utilization rate in generating multiple internal low voltages. It may require several groups of independent power supplies to supply power separately, thus increasing the product cost, and is not environmentally friendly and efficient. There is also a problem of complex peripheral design that needs to be improved.

[0006] The embodiment of the present application is implemented by providing a chip packaging module, the chip packaging module comprising:

[0007] System-on-chip modules and voltage conversion modules;

[0008] The system-on-chip module is internally provided with a plurality of sub-units, and the sub-units at least include a CPU core unit, a RAM memory unit and an IO output unit;

[0009] The voltage conversion module is used to convert the power supply voltage into the power supply voltage required by a plurality of sub-units inside the system-level chip.

[0010] Preferably, the chip packaging module further includes:

[0011] Clock module and memory module;

[0012] The clock module is connected to the system-on-chip module and is used to provide a system clock input to the system-on-chip module;

[0013] The memory module is connected to the system-on-chip module and is used to provide data storage space.

[0014] Preferably, the voltage conversion module comprises a plurality of voltage conversion units;

[0015] When there are three voltage conversion units, they are recorded as a first voltage conversion unit, a second voltage conversion unit and a third voltage conversion unit. The first voltage conversion unit is used to power the CPU core unit, the second voltage conversion unit is used to power the RAM memory unit, and the third voltage conversion unit is used to power the IO output unit.

[0016] Preferably, a low voltage drop linear regulator module is also provided inside the system-level chip module;

[0017] The low voltage drop linear regulator module is used to supply power to the CPU core unit, the RAM memory unit and the IO output unit.

[0018] Preferably, the low voltage dropout linear regulator module comprises:

[0019] A first low voltage dropout linear regulator unit, a second low voltage dropout linear regulator unit and a third low voltage dropout linear regulator unit, wherein the first low voltage dropout linear regulator unit is used to power the CPU core unit, the second low voltage dropout linear regulator unit is used to power the RAM memory unit, and the third low voltage dropout linear regulator unit is used to power the IO output unit.

[0020] Preferably, the input of the low voltage dropout linear regulator module is a direct current power supply or an alternating current power supply.

[0021] Preferably, the voltage conversion module is connected to a module power supply and is provided with a voltage input by the module power supply. The voltage conversion module is used to provide a DC power supply voltage output to a plurality of sub-units inside the system-level chip.

[0022] Preferably, the module power supply is used to provide a DC voltage input to the voltage conversion module.

[0023] Preferably, the voltage conversion module is used to replace the low voltage dropout linear regulator module to supply power to a plurality of sub-units arranged inside the system-on-chip module.

[0024] Another object of an embodiment of the present application is to provide an electronic device, wherein the electronic device is equipped with the chip packaging module as described above, and the packaging module is used to control the operation mode of the electronic device.

[0025] A chip packaging module provided in an embodiment of the present application adopts a relatively independent voltage conversion module on the outside of the package of a traditional system-on-chip (SOC) module, thereby being able to provide a more stable low voltage to several sub-units inside the system-on-chip module, and through relatively independent separate power supply, it simplifies the design difficulty of power supply for the system-on-chip module and improves the power supply efficiency and conversion efficiency of the power supply. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 An application scenario diagram of a chip packaging module provided in an embodiment of the present application;

[0027] Figure 2 An internal module diagram of a chip packaging module provided in an embodiment of the present application;

[0028] Figure 3 An internal module diagram of another chip packaging module provided in an embodiment of the present application. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0030] The specific implementation of the present application is described in detail below in conjunction with specific embodiments.

[0031] As a preferred embodiment of the present application, the chip packaging module includes:

[0032] A system-level chip module and a voltage conversion module; the system-level chip module is provided with several sub-units, and the sub-units at least include a CPU core unit, a RAM memory unit and an IO output unit; the voltage conversion module is used to convert the power supply voltage into the power supply voltage required by the several sub-units inside the system-level chip.

[0033] In the embodiments of the present application, Figure 1As shown, it is an application scenario diagram of a chip packaging module provided by an embodiment of the present application. In this embodiment, the voltage conversion module can be an external high-efficiency DC-DC1 in the figure, and the system-level chip module can be a SOC (System on Chip) packaged chip in the figure. The chip packaging module in the present application can be in the form of an integrated package and can be integrated into an electronic device, that is, the voltage conversion module can be integrated outside the system-level chip module and then packaged, thereby improving the modular performance of the device.

[0034] It is known to those skilled in the art that in existing designs, a low-dropout linear regulator (LDO) is usually integrated into the system chip to provide a stable power supply for the SOC (system on chip). The main advantage of this solution is that power management can be directly implemented inside the chip, reducing the dependence on external components, saving PCB (printed circuit board) space, and better optimizing the power management strategy to improve system performance. However, this solution also has some problems, such as heat dissipation problems. Integrating the LDO inside the chip may cause local temperature rise, increase the difficulty of heat dissipation of the chip, and may require additional heat dissipation design to ensure stable operation of the system. Performance limitations. The internally integrated LDO is usually limited by chip area and power consumption, and its performance is often not as good as that of an external independent high-performance power supply, affecting the stability and power consumption performance of the system. Poor flexibility. The internally integrated LDO is often fixed, difficult to flexibly adjust and optimize, and cannot meet the changing needs in different application scenarios. The fault has a large impact range. If the internally integrated LDO fails, it may directly affect the power supply stability of the entire chip, resulting in performance degradation or collapse of the entire system, and it is difficult to repair.

[0035] The present application adopts a relatively independent voltage conversion module outside the package of the traditional system-level chip module, thereby being able to provide a more stable low voltage to several sub-units inside the system-level chip module, and through relatively independent separate power supply, it simplifies the design difficulty of power supply for the system-level chip module and improves the power supply efficiency and conversion efficiency of the power supply.

[0036] As a preferred embodiment of the present application, since the efficiency of the DC-DC (switching power supply) circuit is higher than that of the LDO, the switching power supply can use a high-frequency switching method to adjust the output voltage. By storing energy through inductance and capacitance, high-efficiency energy conversion can be achieved and energy loss can be reduced. LDO consumes excess voltage through devices to generate heat, and its efficiency is relatively low. The SOC chip and the high-performance DC-DC can be integrated into a module, and multiple DC-DCs can provide multiple low voltages to the module chip to improve the efficiency of the entire module. At the same time, by making it into a module, in addition to greatly improving the efficiency of the power supply, the design complexity of the external circuit board is also reduced.

[0037] As a preferred embodiment of the present application, the chip packaging module further includes:

[0038] A clock module and a memory module; the clock module is connected to the system-on-chip module to provide a system clock input to the system-on-chip module; the memory module is connected to the system-on-chip module to provide a data storage space.

[0039] In the embodiment of the present application, the clock module and the memory module can be integrated inside the chip, or provided by several external peripheral circuits or hardware and / or software. Preferably, they are arranged inside the chip packaging module in an integrated manner. After combining the clock module and the memory module, the chip packaging module can constitute a minimum independent working system without the assistance of external signals or modules. The clock of the system content can improve the time accuracy inside the chip and maintain the time and configuration after power failure.

[0040] In one embodiment, the chip packaging module provided in the present application is used to control and drive the display panel of the screen. Through a screen driving module solution that integrates all necessary functions provided by this solution, the screen driving chip, memory, clock, driving chip power supply and part of the screen power supply can be designed into one module, greatly reducing the complexity of operation and the difficulty of implementation.

[0041] like Figure 2 As shown, as a preferred embodiment of the present application, the voltage conversion module includes a plurality of voltage conversion units;

[0042] When the voltage conversion unit is three-way, it is recorded as: the first voltage conversion unit is used to power the CPU core unit, the second voltage conversion unit is used to power the RAM memory unit, and the third voltage conversion unit is used to power the IO output unit.

[0043] In the embodiment of the present application, the voltage conversion module can be one-way power supply to power the entire chip, or two-way or more, in order to freely allocate the power supply. In one embodiment, it can include at least three parallel outputs of the first voltage conversion unit, the second voltage conversion unit and the third voltage conversion unit, and the three outputs can be relatively independent, or they can be three output ends of an integral transformer module. In one embodiment, it is three independent transformer outputs.

[0044] As a preferred embodiment of the present application, a low voltage drop linear regulator module is also provided inside the system-level chip module; the low voltage drop linear regulator module is used to supply power to the CPU core unit, the RAM memory unit and the IO output unit.

[0045] In the embodiments of the present application, Figure 3 As shown, in this embodiment, the voltage conversion module can be the external high-efficiency DC-DC1 in the figure, and the system-level chip module can be the SOC (System on Chip) packaged chip in the figure. A low-voltage difference linear regulator module is also provided inside the system-level chip module to power the SOC chip.

[0046] As a preferred embodiment of the present application, the low dropout linear regulator module (LOD) includes:

[0047] A first low voltage dropout linear regulator unit, a second low voltage dropout linear regulator unit and a third low voltage dropout linear regulator unit, wherein the first low voltage dropout linear regulator unit is used to power the CPU core unit, the second low voltage dropout linear regulator unit is used to power the RAM memory unit, and the third low voltage dropout linear regulator unit is used to power the IO output unit.

[0048] In an embodiment of the present application, the low voltage difference linear regulator module can be composed of several sub-modules, for example, including three relatively independent transformer units, wherein the first low voltage difference linear regulator unit is used to power the CPU core unit, the second low voltage difference linear regulator unit is used to power the RAM memory unit, and the third low voltage difference linear regulator unit is used to power the IO output unit.

[0049] As a preferred embodiment of the present application, the input of the low voltage dropout linear regulator module is a DC power supply or an AC power supply.

[0050] In an embodiment of the present application, the low voltage dropout linear regulator module can be connected to an external power supply for stabilizing direct current and / or alternating current.

[0051] As a preferred embodiment of the present application, the voltage conversion module is connected to the module power supply and provided with voltage input by the module power supply. The voltage conversion module is used to provide a DC power supply voltage output to several sub-units inside the system-level chip.

[0052] In the embodiment of the present application, power supply through a module power supply is beneficial to reducing production costs and improving the adaptability of the device described in the present application.

[0053] As a preferred embodiment of the present application, the module power supply is used to provide a DC voltage input to the voltage conversion module.

[0054] In the embodiment of the present application, the module power supply may be a DC power supply to further improve the voltage stabilization capability of the system.

[0055] As a preferred embodiment of the present application, the voltage conversion module is used to replace the low voltage drop linear regulator module to supply power to a plurality of sub-units provided inside the system-on-chip module.

[0056] In the embodiment of the present application, the low voltage drop linear regulator module and the voltage conversion module provided by the present application can be used to power the system-on-chip module separately or in combination. In a preferred embodiment, the power supply mode can be switched in certain scenarios, or only the voltage conversion module outside the SOC package can be used for power supply.

[0057] In another preferred embodiment, after the external power supply enters the module, it can be stepped down through a high-efficiency multi-channel DC-DC to directly power the CPU core, memory, IO and other devices inside the packaged chip, skipping the internal LDO. That is, a voltage conversion module is used to replace the low-voltage difference linear regulator module to power several sub-units set inside the system-level chip module, so as to further improve efficiency and reduce power consumption.

[0058] An embodiment of the present application also provides an electronic device, which is controlled based on a control signal output by the system-on-chip module in the chip packaging module as described above.

[0059] In the embodiments of the present application, the electronic device can be various devices containing chips. The device provided in the embodiments of the present application adopts a relatively independent voltage conversion module outside the package of a traditional system-on-chip (SOC) module, thereby being able to provide a more stable low voltage to several sub-units inside the system-on-chip module, and through relatively independent separate power supply, the design difficulty of the power supply for the system-on-chip module is simplified, and the power supply efficiency and conversion efficiency of the power supply are improved.

[0060] As a preferred embodiment of the present application, since the efficiency of the DC-DC (switching power supply) circuit is higher than that of the LDO, the switching power supply can use a high-frequency switching method to adjust the output voltage. By storing energy through inductance and capacitance, high-efficiency energy conversion can be achieved and energy loss can be reduced. LDO consumes excess voltage through devices to generate heat, and its efficiency is relatively low. The SOC chip and the high-performance DC-DC can be integrated into a module, and multiple DC-DCs can provide multiple low voltages to the module chip to improve the efficiency of the entire module. At the same time, by making it into a module, in addition to greatly improving the efficiency of the power supply, the design complexity of the external circuit board is also reduced.

[0061] It is understood that the terms "first", "second", etc. used in this application may be used herein to describe various elements, but unless otherwise specified, these elements are not limited by these terms. These terms are only used to distinguish a first element from another element. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element without departing from the scope of this application.

[0062] Those skilled in the art will understand that Figures 1 to 3 The structure or module shown in the figure is merely a block diagram of a partial structure related to the present application scheme, and does not constitute a limitation on the hardware or software equipment to which the present application scheme is applied. Specifically, it may include more or fewer components than shown in the figure, or combine certain components, or have a different component arrangement.

[0063] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0064] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A chip packaging module, characterized in that: The chip packaging module comprises: System-on-chip modules and voltage conversion modules; The system-on-chip module is internally provided with a plurality of sub-units, and the sub-units at least include a CPU core unit, a RAM memory unit and an IO output unit; The voltage conversion module is used to convert the power supply voltage into the power supply voltage required by a plurality of sub-units inside the system-level chip.

2. The chip packaging module according to claim 1, characterized in that: The chip packaging module also includes: Clock module and memory module; The clock module is connected to the system-on-chip module and is used to provide a system clock input to the system-on-chip module; The memory module is connected to the system-on-chip module and is used to provide data storage space.

3. The chip packaging module according to claim 1, characterized in that: The voltage conversion module includes a plurality of voltage conversion units; When there are three voltage conversion units, they are recorded as a first voltage conversion unit, a second voltage conversion unit and a third voltage conversion unit. The first voltage conversion unit is used to power the CPU core unit, the second voltage conversion unit is used to power the RAM memory unit, and the third voltage conversion unit is used to power the IO output unit.

4. The chip packaging module according to claim 1, characterized in that: A low voltage drop linear regulator module is also provided inside the system-level chip module; The low voltage drop linear regulator module is used to supply power to the CPU core unit, the RAM memory unit and the IO output unit.

5. The chip packaging module according to claim 4, characterized in that: The low dropout linear regulator module comprises: A first low voltage dropout linear regulator unit, a second low voltage dropout linear regulator unit and a third low voltage dropout linear regulator unit, wherein the first low voltage dropout linear regulator unit is used to power the CPU core unit, the second low voltage dropout linear regulator unit is used to power the RAM memory unit, and the third low voltage dropout linear regulator unit is used to power the IO output unit.

6. The chip packaging module according to claim 4, characterized in that: The input of the low voltage drop linear regulator module is a direct current power supply or an alternating current power supply.

7. The chip packaging module according to claim 1, characterized in that: The voltage conversion module is connected to the module power supply and is provided with voltage input by the module power supply. The voltage conversion module is used to provide a DC power supply voltage output to a plurality of sub-units inside the system-level chip.

8. The chip packaging module according to claim 7, characterized in that: The module power supply is used to provide a DC voltage input to the voltage conversion module.

9. The chip packaging module according to claim 4, characterized in that: The voltage conversion module is used to replace the low voltage difference linear regulator module to supply power to a plurality of sub-units arranged inside the system-on-chip module.

10. An electronic device, characterized in that: The electronic device is built with the chip packaging module according to any one of claims 1 to 8, and the packaging module is used to control the operation mode of the electronic device.

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