Double-end die bonder

Abstract

The utility model is suitable for the technical field of semiconductor production, and provides a double-head die bonder, which comprises a workbench, an adjusting platform, a die supply working group, a clamp mechanism and a die bonding structure. The two adjusting platforms are arranged on the workbench, the two adjusting platforms have the freedom degree of moving in the horizontal direction relative to the workbench, the two crystal supply working groups are arranged on the two adjusting platforms respectively, and the positions of the whole crystal supply working groups can be adjusted when the positions of the adjusting platforms are changed. When the size of the product is changed, the position of the adjusting platform is adjusted to change the overall position of the crystal supply working groups, so that the distance between the two crystal supply working groups on the double-head die bonder is matched with the size of the product. And under the condition that the size of the product is reduced, the two crystal supply working groups can still keep synchronous and equally-divided operation on the product, so that the production capacity of the product is ensured. Therefore, the double-end die bonder can be suitable for die bonding production of products of various sizes, and the applicability of the double-end die bonder is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor production, and in particular relates to a double-head crystal bonding machine. Background Art

[0002] A die bonder is one of the devices used in semiconductor device manufacturing. Its function is to connect semiconductor wafers with other components. In order to improve the efficiency of die bonding, most die bonders adopt a double-head structure, which can work on two parts of the product at the same time during the die bonding process. However, the existing double-head die bonders can only process products of a specific size, resulting in the technical problem of poor applicability of the double-head die bonders. Utility Model Content

[0003] The utility model aims to provide a double-headed crystal bonding machine, aiming to solve the technical problem that the double-headed crystal bonding machine in the prior art can only process products of a specific size and has poor applicability.

[0004] The utility model is implemented as follows: a double-headed crystal bonding machine comprises:

[0005] Workbench;

[0006] There are two adjustment platforms, which are arranged on the workbench opposite to each other, and both of them have the freedom to move in the horizontal direction relative to the workbench;

[0007] A crystal supply working group, which is two in number and is respectively arranged on the two adjustment platforms, and is used to provide a crystal ring, and remove the wafers on the crystal ring and transport them to the crystal retrieval position;

[0008] A fixture mechanism, disposed on the workbench and located in the area between the two adjustment platforms, for fixing the product and moving the product to a die-fixing position; and

[0009] There are two crystal fixing structures, which are arranged on the workbench at intervals. The crystal fixing structures are used to transport the wafer on the crystal taking position to the product on the crystal fixing position.

[0010] In an optional embodiment, a translation mechanism is provided between the adjustment platform and the workbench, and the translation mechanism is used to adjust the position of the adjustment platform.

[0011] In an optional embodiment, the translation mechanism includes a first sliding part, a second sliding part and a translation force unit, the first sliding part is arranged on the workbench, the second sliding part is connected to the adjustment platform and is slidably connected to the first sliding part, the body of the translation force unit is arranged on the workbench or the adjustment platform, and the driving end of the translation force unit is connected to the other of the workbench or the adjustment platform.

[0012] In an optional embodiment, the crystal supply working group includes a crystal ring feeding mechanism, a crystal ring transporting mechanism, a crystal ring rotating platform and a pin mechanism, wherein the crystal ring feeding mechanism is used to accommodate and store the crystal ring, the crystal ring rotating platform is used to support the crystal ring and place the wafer on the crystal ring in a crystal retrieval position, the crystal ring transporting mechanism is used to transport the crystal ring from the crystal ring feeding mechanism to the crystal ring rotating platform, and the pin mechanism is used to separate the wafer from the crystal ring.

[0013] In an optional embodiment, the crystal ring rotation platform includes a rotating frame, a rotating frame bracket and a crystal ring translation assembly, the crystal ring translation assembly is arranged on the adjustment platform, the rotating frame bracket is arranged on the crystal ring translation assembly, the rotating frame is rotatably arranged on the rotating frame bracket, and is used to support the crystal ring and adjust the horizontal angle of the crystal ring.

[0014] In an optional embodiment, the ejector mechanism includes an ejector assembly, an ejector support, an ejector translation module and an ejector lifting module, the ejector translation module is arranged between the adjustment platform and the ejector support, the ejector translation module is used to adjust the horizontal position of the ejector support, the ejector lifting module is arranged on the ejector support, the ejector assembly is arranged at the driving end of the ejector lifting module, and the ejector assembly can reciprocate in the vertical direction under the action of the ejector lifting module.

[0015] In an optional embodiment, the crystal ring transport mechanism includes a transport support, a horizontal telescopic unit, a clamping structure and a transport rotation unit. The transport support is fixed on the adjustment platform, the horizontal telescopic unit is connected to the transport support, and the clamping structure is arranged at the driving end of the horizontal telescopic unit. The clamping structure is used to clamp or loosen the crystal ring. The clamping structure can move under the action of the horizontal telescopic unit to drive the crystal ring to move in the horizontal direction. The transport rotation unit is arranged between the horizontal telescopic unit and the transport support, and is used to adjust the angle of the horizontal telescopic unit in the horizontal direction.

[0016] In an optional embodiment, the crystal ring feeding mechanism includes a crystal ring holding bin and a lifting assembly. The crystal ring holding bin has a plurality of mounting structures for placing crystal rings. The mounting structures are arranged at intervals along the vertical direction. The lifting assembly is arranged between the crystal ring holding bin and the adjustment platform for adjusting the height of the crystal ring holding bin in the vertical direction.

[0017] In an optional embodiment, the crystal bonding structure includes a crystal bonding support, a crystal bonding position module, a crystal bonding power unit and a swing arm assembly. The crystal bonding support is arranged on the workbench, the crystal bonding power unit is movably connected to the crystal bonding support through the crystal bonding position module, and the swing arm assembly is connected to the driving end of the crystal bonding power unit.

[0018] In an optional embodiment, the clamp mechanism includes a clamp base, a first clamp translation part, a second clamp translation part and a clamp frame, the clamp base is arranged on the workbench, the first clamp translation part is slidably arranged on the clamp base, the second clamp translation part is slidably arranged on the first clamp translation part, and the sliding direction of the first clamp translation part and the sliding direction of the second clamp translation part are arranged at an angle, the clamp frame is arranged on the second clamp translation part, and the clamp frame is used to clamp and fix the product.

[0019] The technical effect of the utility model relative to the prior art is as follows: two adjustment platforms are arranged on the workbench, both adjustment platforms have the freedom to move in the horizontal direction relative to the workbench, and two crystal supply working groups are arranged on the two adjustment platforms respectively, and the position of the entire crystal supply working group can be adjusted when the position of the adjustment platform changes. Compared with the crystal bonding machine in the prior art, which directly installs the various parts of the crystal supply working group on the workbench, the double-headed crystal bonding machine changes the overall position of the crystal supply working group by adjusting the position of the adjustment platform when the size of the product changes, so that the distance between the two crystal supply working groups on the double-headed crystal bonding machine keeps matching the size of the product. When the product size becomes smaller, the two crystal supply working groups can still keep synchronization with the product and evenly share the work, ensuring the production capacity of the product. The double-headed crystal bonding machine can be applied to the crystal bonding production of products of various sizes, improving the applicability of the double-headed crystal bonding machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments of the utility model or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 It is a structural schematic diagram of a double-head die bonding machine provided by an embodiment of the utility model;

[0022] Figure 2 It is a structural schematic diagram of a workbench used in an embodiment of the utility model;

[0023] Figure 3 It is a structural schematic diagram of the adjustment platform adopted in the embodiment of the utility model;

[0024] Figure 4 It is a structural schematic diagram of a crystal supply working group adopted in an embodiment of the utility model;

[0025] Figure 5 It is a structural schematic diagram of the crystal ring rotating platform used in the embodiment of the utility model;

[0026] Figure 6 It is a structural schematic diagram of the ejector mechanism used in the embodiment of the utility model;

[0027] Figure 7 It is a structural schematic diagram of a crystal ring transport mechanism used in an embodiment of the utility model;

[0028] Figure 8 It is a structural schematic diagram of the crystal ring feeding mechanism used in the embodiment of the utility model;

[0029] Fig. 9 It is a structural schematic diagram of the crystal bonding structure adopted in the embodiment of the utility model;

[0030] Fig.10 It is a structural schematic diagram of the camera mechanism used in the embodiment of the utility model;

[0031] Fig.11 It is a structural schematic diagram of the clamp mechanism used in the embodiment of the utility model.

[0032] Description of reference numerals:

[0033] 1. Workbench;

[0034] 2. Adjust the platform;

[0035] 3. Translation mechanism;

[0036] 31. first sliding part; 32. second sliding part; 33. translation force unit;

[0037] 4. Crystal supply working group;

[0038] 41. Crystal ring rotating platform;

[0039] 411, rotating frame; 412, rotating frame bracket; 413, crystal ring translation assembly; 4131, crystal ring base; 4132, first crystal ring part; 4133, second crystal ring part; 414, rotating power unit;

[0040] 42. Crystal ring transport mechanism;

[0041] 421, transport support; 422, horizontal telescopic unit; 423, transport rotation unit; 424, clamping structure; 4241, first clamping part; 4242, second clamping part; 4243, clamping drive unit;

[0042] 43. Crystal ring feeding mechanism;

[0043] 431. crystal ring containing chamber; 432. lifting assembly; 433. mounting structure;

[0044] 44. Ejector mechanism;

[0045] 441, ejector assembly; 442, ejector support; 443, needle translation module; 444, ejector lifting module;

[0046] 5. Solid crystal structure;

[0047] 51. Crystal bonding support; 52. Crystal bonding position module; 53. Crystal bonding power unit; 54. Swing arm assembly;

[0048] 6. Camera mechanism;

[0049] 61. Photographic lens; 62. Lens adjustment mechanism;

[0050] 7. Clamping mechanism;

[0051] 71. fixture base; 72. first fixture translation part; 73. second fixture translation part; 74. fixture frame;

[0052] 8. Crystal ring. DETAILED DESCRIPTION

[0053] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0054] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0055] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0056] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0057] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0058] Please refer to Figures 1 to 4 As shown, in an embodiment of the utility model, a double-headed crystal bonder is provided, and the double-headed crystal bonder includes a workbench 1, an adjustment platform 2, a crystal supply working group 4, a clamping mechanism 7, and a crystal bond structure 5. There are two adjustment platforms 2, and the two adjustment platforms 2 are relatively arranged on the workbench 1, and the two adjustment platforms 2 have the freedom to move in the horizontal direction relative to the workbench 1. There are two groups of crystal supply working groups 4, and the two crystal supply working groups 4 are respectively arranged on the two adjustment platforms 2. The crystal supply working group 4 is used to provide a crystal ring, and remove the wafers on the crystal ring and transport them to the crystal retrieval position. The clamping mechanism 7 is arranged on the workbench 1, and is located in the area between the two adjustment platforms 2, and is used to fix the product and move the product to the crystal bond position. There are two crystal bond structures 5, and the two crystal bond structures 5 are arranged on the workbench 1 at intervals, and are respectively located on both sides of the clamping mechanism 7, and the crystal bond structure 5 is used to transport the wafers on the crystal retrieval position to the product located at the crystal bond position.

[0059] Specifically, the workbench 1 refers to a supporting component with a certain height, and the workbench 1 may have an installation plane for installing equipment and components. The adjustment platform 2 refers to a component with a certain area, and the adjustment platform 2 may also have an installation plane for installing equipment and components. The crystal supply working group 4 refers to a working group composed of multiple mechanisms, and its function is to transport the crystal ring to the crystal retrieval position and separate the wafer from the crystal ring. During the working process of the crystal supply working group 4, the wafer can be separated from the crystal ring after the crystal ring is transported to the crystal retrieval position; or the wafer can be separated from the crystal ring and then transported to the crystal retrieval position, which is selected according to the production process. The crystal fixing structure 5 refers to a mechanism that transports the wafer from the crystal retrieval position to the crystal fixing position and fixes it on the product, and the clamping mechanism 7 refers to a component structure that can clamp and fix the product and adjust the position of the product.

[0060] The product may refer to a product such as an LED (Light Emitting Diode) product or a PCB (Printed Circuit Board) board, and the chip can be mounted to a designated position on the product through the die bonding structure 5. In addition, the die picking position and the die bonding position refer to virtual positions on the device, and the control system of the device sets the coordinates of the die picking position and the die bonding position according to production requirements, which will not be described in detail here.

[0061] The double-headed crystal bonding machine provided in the embodiment of the utility model is provided with two adjustment platforms 2 on the workbench 1. Both adjustment platforms 2 have the freedom to move relative to or opposite to each other in the horizontal direction relative to the workbench 1, and two crystal supply working groups 4 are respectively provided on the two adjustment platforms 2. When the position of the adjustment platform 2 is changed, the position of the entire crystal supply working group 4 can be adjusted. Compared with the crystal bonding machine in the prior art, in which each part of the crystal supply working group 4 is directly installed on the workbench 1, the double-headed crystal bonding machine provided in the embodiment of the utility model can change the overall position of the crystal supply working group 4 by adjusting the position of the platform 2 when the size of the product changes, so that the distance between the two crystal supply working groups 4 on the double-headed crystal bonding machine keeps matching with the size of the product. When the size of the product becomes smaller, the two crystal supply working groups 4 can still keep the product synchronized and evenly share the work, so as to ensure the production capacity of the product, so that the double-headed crystal bonding machine can be applied to the crystal bonding production of products of various sizes, thereby improving the applicability of the double-headed crystal bonding machine.

[0062] In one embodiment, see Figure 2 and Figure 3A translation mechanism 3 is provided between the adjustment platform 2 and the workbench 1, and the translation mechanism 3 is used to adjust the position of the platform 2. Specifically, the translation mechanism 3 refers to a component mechanism that can drive one component to move horizontally relative to another component. The setting of the translation mechanism 3 can make the position adjustment of the adjustment platform 2 more convenient, and also make the use of the double-head die bonder more convenient.

[0063] In one embodiment, see Figure 2 and Figure 3 The translation mechanism 3 includes a first sliding part 31, a second sliding part 32 and a translation force unit 33. The first sliding part 31 is arranged on the workbench 1, the second sliding part 32 is connected to the adjustment platform 2 and is slidably connected to the first sliding part 31, the body of the translation force unit 33 is arranged on the workbench 1 or the adjustment platform 2, and the driving end of the translation force unit 33 is connected to the other of the workbench 1 or the adjustment platform 2. Specifically, the first sliding part 31 can be a structure such as a slide rail, a slide groove, etc., as a match, the second sliding part 32 can be a slider structure; the first sliding part 31 can also be a slider, as a match, the second sliding part 32 can be a structure such as a slide rail, a slide groove, etc. The translation force unit 33 refers to a component structure that can drive a component to move in a straight line. The translation force unit 33 can be a cylinder, a hydraulic cylinder or an electric push rod. The translation force unit 33 can also be a combination structure of a lead screw and a motor, and works by driving the motor to rotate the lead screw. The body of the translational force unit 33 can be arranged on the workbench 1 or on the adjustment platform 2. For example, when the body of the translational force unit 33 is arranged on the workbench 1, the driving end of the translational force unit 33 needs to be connected to the adjustment platform 2. The sliding connection between the adjustment platform 2 and the workbench 1 is realized by the cooperation of the first sliding part 31 and the second sliding part 32. At the same time, the translational force unit 33 can be used to push the adjustment platform 2 to move relative to the workbench 1, making it more convenient to adjust the position of the adjustment platform 2, further improving the convenience of using the double-head die bonder.

[0064] In an alternative embodiment, see Figure 2 and Figure 3 The two adjustment platforms 2 can move toward or away from each other in the same direction, and a position marking structure is also set on the workbench 1. The position marking structure can be a ruler, or a mark corresponding to the size of a commonly used product. By setting the position marking structure, the moving distance of the adjustment platform 2 can be marked, making the adjustment of the equipment more precise.

[0065] In a specific embodiment, see Figure 2 and Figure 3The first sliding part 31 is a slide rail arranged on the workbench 1, and the second sliding part 32 is a slider connected to the bottom surface of the adjustment platform 2, and the slider is slidably connected to the slide rail. The body of the translation force unit 33 is arranged on the adjustment platform 2 and the driving end is connected to the workbench 1.

[0066] Among them, there are multiple slide rails, and multiple adjustment platforms 2 are all arranged along the first direction. At the same time, multiple sliders are slidably arranged on each slide rail. By using multiple slide rails and multiple sliders slidably arranged on each slide rail, multiple support points can be formed to make the installation of the adjustment platform 2 more stable.

[0067] In one embodiment, see Figure 4 The crystal supply working group 4 includes a crystal ring feeding mechanism 43, a crystal ring transporting mechanism 42, a crystal ring rotating platform 41 and a pin mechanism 44. The crystal ring feeding mechanism 43 is used to accommodate and store the crystal ring. The crystal ring rotating platform 41 is used to support the crystal ring and place the wafer on the crystal ring in the crystal retrieval position. The crystal ring transporting mechanism 42 is used to transport the crystal ring from the crystal ring feeding mechanism 43 to the crystal ring rotating platform 41. The pin mechanism 44 is used to separate the wafer from the crystal ring. Specifically, during the production process, the crystal ring is stored in the crystal ring feeding mechanism 43. The crystal ring transporting mechanism 42 can take the crystal ring with the wafer from the crystal ring feeding mechanism 43 and place it on the crystal ring rotating platform 41. It can also take the empty crystal ring from the crystal ring rotating platform 41 and place it in the crystal ring feeding mechanism 43. After the crystal ring is placed and fixed on the crystal ring rotating platform 41, the ejector mechanism 44 can separate the wafer on the crystal ring from the crystal ring so that the crystal bonding structure 5 can grab it and transport it to the crystal bonding position for crystal bonding, making the use of the entire crystal supply working group 4 more convenient.

[0068] In an alternative embodiment, see Figure 4 The crystal ring feeding mechanism 43, the crystal ring transporting mechanism 42 and the crystal ring rotating platform 41 can be distributed in a triangle, that is, the crystal ring feeding mechanism 43, the crystal ring transporting mechanism 42 and the crystal ring rotating platform 41 are respectively arranged at the three vertices of the triangle, saving the space occupied by the crystal supply working group 4.

[0069] In one embodiment, see Figure 5The crystal ring rotating platform 41 includes a rotating frame 411, a rotating frame support 412 and a crystal ring translation assembly 413. The crystal ring translation assembly 413 is arranged on the adjustment platform 2, and the rotating frame support 412 is arranged on the crystal ring translation assembly 413. The rotating frame 411 is rotatably arranged on the rotating frame support 412, and is used to support the crystal ring and adjust the horizontal angle of the crystal ring. Specifically, the rotating frame 411 refers to a component that can support the crystal ring, and a placement area matching the shape of the crystal ring is arranged on the rotating frame 411. In addition, a support platform for supporting the crystal ring is also arranged on the side wall of the placement area, which can facilitate the separation operation of the wafer by the ejector mechanism 44 while supporting the crystal ring. The rotating frame support 412 refers to a component with a certain volume, which can support the rotating frame 411. The crystal ring translation assembly 413 refers to a mechanism that can adjust the horizontal position of the component, wherein the rotating frame support 412 is installed on the crystal ring translation assembly 413. The horizontal position of the crystal ring placed on the rotating frame 411 can be adjusted by the crystal ring translation assembly 413. At the same time, the rotating frame 411 is rotatably arranged on the rotating frame bracket 412. The horizontal angle of the crystal ring can be adjusted by rotating the rotating frame 411, making the crystal ring rotating platform 41 more convenient to use.

[0070] In an alternative embodiment, see Figure 5 The crystal ring translation assembly 413 may include a crystal ring base 4131, a first crystal ring portion 4132 and a second crystal ring portion 4133. The first crystal ring portion 4132 is slidably disposed on the crystal ring base 4131, and the second crystal ring portion 4133 is slidably disposed on the first crystal ring portion 4132, and the sliding directions of the first crystal ring portion 4132 and the second crystal ring portion 4133 are disposed at an angle. The rotating frame bracket 412 is disposed on the second crystal ring portion 4133, and the position adjustment of the rotating frame bracket 412 in the horizontal direction can be achieved by sliding the first crystal ring portion 4132 and the second crystal ring portion 4133, and the structure is simple.

[0071] In addition, a sliding unit is provided between the first crystal ring part 4132 and the crystal ring base 4131 and between the first crystal ring part 4132 and the second crystal ring part 4133. The sliding unit generally adopts a slide rail and slider structure, which can make the sliding more stable. A driving unit is also provided between the first crystal ring part 4132 and the crystal ring base 4131 and between the first crystal ring part 4132 and the second crystal ring part 4133. The driving unit can be a motor screw structure, or a linear motor, cylinder or hydraulic cylinder structure. The setting of the driving unit can make the adjustment of the entire crystal ring translation assembly 413 more automated.

[0072] In another alternative embodiment, see Figure 5A rotating power unit 414 is also provided on the rotating frame bracket 412, wherein the rotating power unit 414 can be a motor, a hydraulic motor or other components that can output torque, and a transmission unit is also provided between the rotating power unit 414 and the rotating frame 411, and the transmission unit can be a gear drive, a belt drive or a chain drive, etc., so that the rotation of the rotating frame 411 is more convenient.

[0073] In one embodiment, see Figure 6 The ejector mechanism 44 includes an ejector assembly 441, an ejector support 442, an ejector translation module 443 and an ejector lifting module 444. The ejector translation module 443 is arranged between the adjustment platform 2 and the ejector support 442, and is used to adjust the horizontal position of the ejector support 442. The ejector lifting module 444 is arranged on the ejector support 442. The ejector assembly 441 is arranged at the driving end of the ejector lifting module 444, and can reciprocate in the vertical direction under the action of the ejector lifting module 444. Specifically, the ejector assembly 441 refers to a component that can separate the wafer from the film of the crystal ring, and the ejector assembly 441 can include structures such as an ejector, an ejector seat and an ejector cap. The ejector support 442 refers to a block component with a certain volume, and its function is to install the ejector lifting module 444. The ejector lifting module 444 refers to a component used to drive the entire ejector assembly 441 to move in the vertical direction. The ejector lifting module 444 can be a cylinder, a hydraulic cylinder, or a combination of a motor and a crankshaft crank. The ejector translation module 443 refers to a component that can adjust the horizontal position of the ejector support 442, the ejector lifting module 444, and the ejector assembly 441. When working, the ejector assembly 441 can adjust the horizontal position under the action of the ejector translation module 443, so that the ejector assembly 441 is located below the rotating frame 411. Then, the ejector assembly 441 reciprocates in the vertical direction under the action of the ejector lifting module 444 to separate the wafers.

[0074] In one embodiment, see Figure 7The crystal ring transport mechanism 42 includes a transport support 421, a horizontal telescopic unit 422, a clamping structure 424 and a transport rotation unit 423. The transport support 421 is fixed on the adjustment platform 2, the horizontal telescopic unit 422 is connected to the transport support 421, the clamping structure 424 is used to clamp or loosen the crystal ring, the clamping structure 424 is arranged at the driving end of the horizontal telescopic unit 422, the clamping structure 424 can move under the action of the horizontal telescopic unit 422 to drive the crystal ring to move in the horizontal direction, and the transport rotation unit 423 is arranged between the horizontal telescopic unit 422 and the transport support 421, and is used to adjust the angle of the horizontal telescopic unit 422 in the horizontal direction. Specifically, the transport support 421 refers to a supporting component with a certain height. The horizontal telescopic unit 422 refers to a component that can adjust an object in the horizontal direction, and the horizontal telescopic unit 422 can be a cylinder, a hydraulic cylinder or an electric push rod, etc. The transport rotation unit 423 refers to a component that can drive an object to rotate, and the transport rotation unit 423 can be a rotating cylinder, etc. The clamping structure 424 refers to a component that can clamp and release an object. By setting the transport rotation unit 423 on the transport support 421, setting the horizontal telescopic unit 422 on the movable end of the transport rotation unit 423, and setting the clamping structure 424 on the driving end of the horizontal telescopic unit 422. When working, the horizontal telescopic unit 422 and the clamping structure 424 can be rotated to a position corresponding to the crystal ring feeding mechanism 43 by the transport rotation unit 423, and then the horizontal telescopic unit 422 drives the clamping structure 424 to approach the crystal ring feeding mechanism 43, and then the clamping structure 424 clamps the crystal ring. The transport rotation unit 423 then rotates the horizontal telescopic unit 422 and the clamping structure 424 to a position corresponding to the crystal ring rotating platform 41, and after the clamping structure 424 is opened, the crystal ring is placed on the crystal ring rotating platform 41, which can make the transport process of the crystal ring more convenient.

[0075] In an alternative embodiment, see Figure 7 The clamping structure 424 includes a first clamping portion 4241, a second clamping portion 4242 and a clamping drive unit 4243. The first clamping portion 4241 and the second clamping portion 4242 can move relative to each other. The clamping drive unit 4243 is used to drive the first clamping portion 4241 and the second clamping portion 4242 to move closer to or farther from each other. The first clamping portion 4241 and the second clamping portion 4242 can both be plate-shaped and arranged parallel to each other. The clamping drive unit 4243 can be a cylinder, a hydraulic cylinder or an electric push rod, etc., which can make the use of the entire clamping structure 424 simpler and more convenient.

[0076] In one embodiment, see Figure 8The crystal ring feeding mechanism 43 includes a crystal ring storage bin 431 and a lifting assembly 432. The crystal ring storage bin 431 has a plurality of mounting structures 433 for placing crystal rings. The mounting structures 433 are arranged at intervals in the vertical direction. The lifting assembly 432 is arranged between the crystal ring storage bin 431 and the adjustment platform 2 to adjust the height of the crystal ring storage bin 431 in the vertical direction. Specifically, the crystal ring storage bin 431 refers to a component with a certain storage space, and the mounting structure 433 refers to a structure that can support the crystal ring. The mounting structure 433 can be a boss or a crossbar arranged on the crystal ring storage bin 431. The lifting assembly 432 refers to a component that can adjust the height of an object in the vertical direction. The lifting assembly 432 is a cylinder, a hydraulic cylinder or an electric push rod, etc. The lifting assembly 432 can also be a structure composed of a support, a lifting slider, a lead screw and a motor, wherein the crystal ring storage bin 431 is connected to the lifting slider, the lead screw is rotatably arranged on the support, and can be rotated under the drive of the motor, and the lifting slider is threadedly connected to the lead screw. When the lead screw rotates, the lifting slider and the crystal ring storage bin 431 can be driven to move in the vertical direction together. The crystal ring is accommodated and installed by providing a crystal ring storage bin 431, and a plurality of installation structures 433 spaced in the vertical direction are provided in the crystal ring storage bin 431. During operation, when a crystal ring on a mounting structure 433 is taken away by the clamping structure 424, the vertical position of the crystal ring storage bin 431 can be adjusted by the lifting assembly 432 to facilitate the taking or placement of another crystal ring.

[0077] In one embodiment, see Fig. 9 The crystal bonding structure 5 includes a crystal bonding support 51, a crystal bonding position module 52, a crystal bonding power unit 53 and a swing arm assembly 54. The crystal bonding support 51 is arranged on the workbench 1. The crystal bonding power unit 53 is movably connected to the crystal bonding support 51 through the crystal bonding position module 52, and the swing arm assembly 54 is connected to the driving end of the crystal bonding power unit 53. The crystal bonding support 51 refers to a supporting component with a certain height. The crystal bonding support 51 can be a columnar, block-shaped or a combination of multiple shapes. The crystal bonding position module 52 refers to a component that can adjust the horizontal position of an object. The crystal bonding power unit 53 is arranged on the movable end of the crystal bonding position module 52. The crystal bonding power unit 53 refers to a component that can output torque. The crystal bonding power unit 53 can be a crystal bonding motor. In order to ensure the normal and long-term use of the crystal bonding motor, a crystal bonding heat dissipation component is also arranged outside the crystal bonding motor. The swing arm assembly 54 refers to a swing arm structure with a certain length. The end of the swing arm assembly 54 can be moved by swinging the swing arm assembly 54 to realize the transportation of the wafer.

[0078] In addition, the setting of the crystal bonding position module 52 can adjust the horizontal position of the crystal bonding power unit 53 and the swing arm assembly 54. When the position of the adjustment platform changes, the position of the crystal bonding power unit 53 and the swing arm assembly 54 can also be adjusted through the crystal bonding position module 52, making the use of the crystal bonding machine more convenient.

[0079] In an alternative embodiment, see Fig. 9 The swing arm assembly 54 includes a swing arm and a nozzle assembly disposed at the end of the swing arm. The nozzle assembly is used to suck the wafer by negative pressure. The swing arm swings back and forth under the drive of the crystal bonding power unit 53 to drive the nozzle assembly to reciprocate between the crystal removal position and the crystal bonding position.

[0080] In one embodiment, see Figure 4 and Fig.10 A camera mechanism 6 is also provided on the adjustment platform 2. The camera mechanism 6 includes a shooting lens 61 and a lens adjustment mechanism 62. The shooting angle of the shooting lens 61 can be adjusted by the lens adjustment mechanism 62, so that the camera mechanism 6 can more conveniently capture the offset state during the crystal retrieval process.

[0081] In one embodiment, see Fig.11 The clamp mechanism 7 includes a clamp base 71, a first clamp translation part 72, a second clamp translation part 73 and a clamp frame 74. The clamp base 71 is arranged on the workbench 1, the first clamp translation part 72 is slidably arranged on the clamp base 71, the second clamp translation part 73 is slidably arranged on the first clamp translation part 72, and the sliding direction of the first clamp translation part 72 and the sliding direction of the second clamp translation part 73 are arranged at an angle. The clamp frame 74 is arranged on the second clamp translation part 73, and the clamp frame 74 is used to clamp and fix the product. Specifically, the position adjustment of the clamp frame 74 can be achieved by sliding the first clamp translation part 72 and the second clamp translation part 73, so that the position adjustment of the product is more convenient. In addition, a sliding unit is arranged between the clamp base 71 and the first clamp translation part 72 and between the first clamp translation part 72 and the second clamp translation part 73. The sliding unit can be a slide rail slider structure or a roller sliding structure. A driving unit is provided between the clamp base 71 and the first clamp translation part 72 and between the first clamp translation part 72 and the second clamp translation part 73. The driving unit may be a motor screw structure, or a linear motor, cylinder or hydraulic cylinder structure, making the clamp mechanism 7 more convenient to use.

[0082] The above are only preferred embodiments of the present invention, and only specifically describe the technical principles of the present invention. These descriptions are only for the purpose of explaining the principles of the present invention, and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanation here, any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention, and other specific implementation methods of the present invention that can be associated with by technicians in this field without creative labor, should be included in the scope of protection of the present invention.

Claims

1. A double-head die bonding machine, characterized in that: include: Workbench; There are two adjustment platforms, which are arranged on the workbench opposite to each other, and both of them have the freedom to move in the horizontal direction relative to the workbench; A crystal supply working group, which is two in number and is respectively arranged on the two adjustment platforms, and is used to provide a crystal ring, and remove the wafers on the crystal ring and transport them to the crystal retrieval position; A fixture mechanism, disposed on the workbench and located in the area between the two adjustment platforms, for fixing the product and moving the product to a die-fixing position; and There are two crystal fixing structures, which are arranged on the workbench at intervals. The crystal fixing structures are used to transport the wafer on the crystal taking position to the product on the crystal fixing position.

2. The double-head die bonder according to claim 1, characterized in that: A translation mechanism is provided between the adjustment platform and the workbench, and the translation mechanism is used to adjust the position of the adjustment platform.

3. The double-head die bonder according to claim 2, characterized in that: The translation mechanism includes a first sliding part, a second sliding part and a translation force unit, the first sliding part is arranged on the workbench, the second sliding part is connected to the adjustment platform and is slidably connected to the first sliding part, the body of the translation force unit is arranged on the workbench or the adjustment platform, and the driving end of the translation force unit is connected to the other one of the workbench or the adjustment platform.

4. The double-head die bonder according to any one of claims 1 to 3, characterized in that: The crystal supply working group includes a crystal ring feeding mechanism, a crystal ring transporting mechanism, a crystal ring rotating platform and a pin mechanism. The crystal ring feeding mechanism is used to accommodate and store the crystal ring. The crystal ring rotating platform is used to support the crystal ring and place the wafer on the crystal ring in the crystal retrieval position. The crystal ring transporting mechanism is used to transport the crystal ring from the crystal ring feeding mechanism to the crystal ring rotating platform. The pin mechanism is used to separate the wafer from the crystal ring.

5. The double-head die bonder according to claim 4, characterized in that: The crystal ring rotation platform includes a rotating frame, a rotating frame bracket and a crystal ring translation assembly. The crystal ring translation assembly is arranged on the adjustment platform, the rotating frame bracket is arranged on the crystal ring translation assembly, the rotating frame is rotatably arranged on the rotating frame bracket, and is used to support the crystal ring and adjust the horizontal angle of the crystal ring.

6. The double-head die bonder according to claim 5, characterized in that: The ejector mechanism includes an ejector assembly, an ejector support, an ejector translation module and an ejector lifting module. The ejector translation module is arranged between the adjustment platform and the ejector support. The ejector translation module is used to adjust the horizontal position of the ejector support. The ejector lifting module is arranged on the ejector support. The ejector assembly is arranged at the driving end of the ejector lifting module, and the ejector assembly can reciprocate in the vertical direction under the action of the ejector lifting module.

7. The double-head die bonder according to claim 6, characterized in that: The crystal ring transport mechanism includes a transport support, a horizontal telescopic unit, a clamping structure and a transport rotation unit. The transport support is fixed on the adjustment platform, the horizontal telescopic unit is connected to the transport support, the clamping structure is arranged at the driving end of the horizontal telescopic unit, the clamping structure is used to clamp or loosen the crystal ring, and the clamping structure can move under the action of the horizontal telescopic unit to drive the crystal ring to move in the horizontal direction. The transport rotation unit is arranged between the horizontal telescopic unit and the transport support, and is used to adjust the angle of the horizontal telescopic unit in the horizontal direction.

8. The double-head die bonder according to claim 7, characterized in that: The crystal ring feeding mechanism includes a crystal ring containing bin and a lifting assembly. The crystal ring containing bin has a plurality of mounting structures for placing crystal rings. The mounting structures are arranged at intervals along the vertical direction. The lifting assembly is arranged between the crystal ring containing bin and the adjustment platform for adjusting the height of the crystal ring containing bin in the vertical direction.

9. The double-head die bonder according to any one of claims 1 to 3, characterized in that: The crystal bonding structure includes a crystal bonding support, a crystal bonding position module, a crystal bonding power unit and a swing arm assembly. The crystal bonding support is arranged on the workbench, the crystal bonding power unit is movably connected to the crystal bonding support through the crystal bonding position module, and the swing arm assembly is connected to the driving end of the crystal bonding power unit.

10. The double-head die bonder according to any one of claims 1 to 3, characterized in that: The clamp mechanism includes a clamp base, a first clamp translation part, a second clamp translation part and a clamp frame, the clamp base is arranged on the workbench, the first clamp translation part is slidably arranged on the clamp base, the second clamp translation part is slidably arranged on the first clamp translation part, and the sliding direction of the first clamp translation part and the sliding direction of the second clamp translation part form an angle, the clamp frame is arranged on the second clamp translation part, and the clamp frame is used to clamp and fix the product.

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