Novel corrosion frame suitable for acid corrosion of monocrystalline silicon wafer

Abstract

The utility model belongs to the field of acid corrosion of semiconductor silicon wafers, and particularly relates to a novel corrosion frame suitable for acid corrosion of monocrystalline silicon wafers, which comprises four positioning grooves symmetrically arranged on two sides of a frame, four rolling shafts are arranged between two sides of the frame, two ends of each rolling shaft are connected with a movable module, and the movable module is connected with the positioning grooves. The movable modules are arranged in the corresponding positioning grooves in a sliding mode, and a plurality of grooves are formed in the rolling shaft in the axial direction; the acid corrosion rack has the following advantages: (1) the silicon wafer is limited through the four rolling shafts during acid corrosion, so that the silicon wafer is prevented from falling off the corrosion rack; (2) the effect of changing the distance between the rolling shafts can be achieved through the movable module which is arranged in the module track in a sliding manner, so that silicon wafers with different specifications and sizes can be processed without replacing a corrosion frame with a corresponding specification, and the cost is greatly reduced; and (3) the rolling shaft is not directly abraded with the corrosion frame any more, and when abrasion is caused by long-term work, only the movable module needs to be replaced, and the whole corrosion frame does not need to be replaced.

Description

Technical Field

[0001] The utility model belongs to the field of acid corrosion of semiconductor silicon slices, in particular to a new type of corrosion rack suitable for acid corrosion of single crystal silicon slices. Background Art

[0002] After cutting, grinding and other mechanical processing, the surface of semiconductor silicon wafers will produce surface damage layers and deformation due to mechanical stress. Acid etching is usually used to eliminate the surface damage layer and optimize the surface deformation to prepare the surface for polishing. The surface of the acid-etched silicon wafer has the advantages of low roughness, low metal ion residue, and not easy to absorb impurities. The existing acid etching processing methods are mainly divided into fully automatic acid etching and semi-automatic acid etching. The fully automatic acid etching processing route has the advantages of stable process operation, high production capacity, and simple manual operation. The semi-automatic acid etching processing route has the advantages of low operating cost, stable product yield, simple equipment structure, and good reliability.

[0003] The semi-automatic acid etching processing route is mainly: cleaning → loading → pickling → acid etching → cleaning → unloading. When executing the above process, the etching rack is used as a carrier to carry out pickling, etching, cleaning and other processing on the silicon wafer. The existing patent with announcement number CN203941888U discloses an etching rack, which drives the silicon wafer to rotate in the etching liquid through the transmission cooperation of a driving motor, a gear set, and a roller during the etching process to ensure that the surface of the silicon wafer is in uniform contact with the etching liquid. However, the etching rack has the following shortcomings: (1) The etching rack is only equipped with two rollers to carry and drive the silicon wafer, and there is a risk that the silicon wafer is easy to fall off during the etching process (the main reasons for falling off are: the thickness becomes thinner during the acid etching process, resulting in poor bearing capacity of the rollers, turbulent fluidity of the etching liquid, and shaking during semi-automatic lifting and lowering, etc.); (2) The etching rack is provided with positioning grooves with fixed spacing, which cannot meet the etching requirements of silicon wafers of different specifications and sizes. Therefore, when facing the processing of silicon wafers of various specifications and sizes, it is necessary to prepare a sufficient number of etching racks to meet the processing requirements; (3) The ends of the rollers are directly installed in the positioning grooves, and the two will wear during the rotation, resulting in the need to replace the etching rack regularly. Utility Model Content

[0004] The utility model aims to provide a novel etching rack suitable for acid etching of single crystal silicon wafers to solve the problems raised in the above background technology.

[0005] The purpose of this utility model is to adopt the following technical solutions to achieve:

[0006] According to the utility model, a new etching rack suitable for acid etching of single crystal silicon wafers is provided, comprising four positioning grooves symmetrically arranged on both sides of the rack, four rollers are arranged between the two sides of the rack, the two ends of the rollers are connected to the movable modules, and the movable modules are slidably arranged in the corresponding positioning grooves;

[0007] The roller is provided with a plurality of grooves along the axial direction, and the roller is driven by a driving device on the frame.

[0008] By means of the above technical solution, the utility model has the following advantages:

[0009] (1) During acid etching, four rollers are used to limit the silicon wafer to prevent it from falling off the etching rack;

[0010] (2) By sliding the movable module in the module track, the roller spacing can be changed, so that silicon wafers of different sizes can be processed without replacing the etching rack of the corresponding specifications, which greatly reduces the cost;

[0011] (3) The rollers no longer directly wear against the corrosion rack. When long-term operation causes wear, only the movable module needs to be replaced without replacing the entire corrosion rack.

[0012] Furthermore, at least two module rails extending in the vertical direction are provided in the positioning groove, and the movable module is slidably matched with the corresponding module rails.

[0013] Advantages: Setting two or more module tracks allows the movable module belt rollers to adjust the spacing at the same time to adapt to the acid etching processing of silicon wafers of different specifications and sizes.

[0014] Furthermore, a module track is provided in the positioning groove, the movable module is slidably matched with the module track, and the movable module can be limited at any position on the module track by a fastener.

[0015] Advantages: By setting a module track, the movable module can be limited to different positions and the spacing between rollers can be adjusted to accommodate silicon wafers of different specifications and sizes.

[0016] Furthermore, a main gear is provided at the output end of the driving device, one end of the roller is connected to a driven gear, and the main gear is meshed with four driven gears at the same time.

[0017] Advantages: The transmission method is through gear meshing, which is simple to install and easy to replace once it is worn.

[0018] Furthermore, the main gear is a step pulley.

[0019] Advantages: The tower wheel has a multi-layer gear structure and can adapt to multiple driven gears in different positions at the same time. The driven gears in different positions can mesh with the teeth of different levels on the tower wheel, making the spacing adjustment more convenient.

[0020] Furthermore, a handle is provided on the upper portion of the frame.

[0021] Advantages: Used to put in or take out the corrosion rack to prevent the corrosive liquid from touching the human skin and causing damage.

[0022] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented according to the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a three-dimensional schematic diagram of a new type of etching rack suitable for acid etching of single crystal silicon wafers in the utility model.

[0024] Figure 2 yes Figure 1 Enlarged view of middle Ⅰ.

[0025] Figure 3 , 4 The utility model is a side view of a novel etching rack suitable for acid etching of single crystal silicon wafers.

[0026] [Reference Signs]

[0027] 1. Frame; 2. Positioning slot; 3. Movable module; 4. Module track; 5. Roller; 501. Groove; 6. Driven gear; 7. Main gear; 8. Driving device; 9. Handle. DETAILED DESCRIPTION

[0028] The features and exemplary embodiments of various aspects of the utility model will be described in detail below. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the utility model. However, it is obvious to those skilled in the art that the utility model can be implemented without the need for some of these specific details. The following description of the embodiment is only to provide a better understanding of the utility model by showing an example of the utility model. In the accompanying drawings and the following description, at least part of the known and prior art is not shown to avoid unnecessary ambiguity to the utility model; and, for clarity, the size and shape of the part may be exaggerated. The features or characteristics described below can be combined in one or more embodiments in any suitable manner. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or quantity.

[0029] The utility model provides Figure 1-3A novel etching rack suitable for acid etching of single crystal silicon wafers shown in the figure comprises four positioning grooves 2 symmetrically arranged on both sides of a rack 1, three module rails 4 extending in the vertical direction are arranged in the positioning grooves 2, four rollers 5 are arranged between the two sides of the rack 1, both ends of the rollers 5 are connected to the movable modules 3, and the movable modules 3 are slidably arranged in the corresponding module rails 4;

[0030] The above-mentioned novel etching rack suitable for acid etching of single crystal silicon wafers is driven by four rollers 5, and the inverted trapezoidal limiting structure formed by the four rollers 5 on the silicon wafer ensures that the silicon wafer cannot fall out of the etching rack; there are twelve movable modules 3, and the positions of the rollers 5 are adjusted to adapt to the acid etching processing of silicon wafers of different specifications and sizes. In other embodiments of the utility model, only one module track 4 can be opened in the positioning groove 2, and the movable module 3 and the module track 4 are slidably matched, and the movable module 3 can be limited at any position on the module track 4 by fasteners (such as spring pins), and the spacing between the rollers 5 can also be adjusted to adapt to silicon wafers of different specifications and sizes.

[0031] The roller 5 is provided with a plurality of grooves 501 along the axial direction, and the roller 5 is driven by a driving device 8 on the frame 1 .

[0032] See also Figure 4 The output end of the driving device 8 is provided with a main gear 7, one end of the roller 5 is connected to a driven gear 6, and the main gear 7 is meshed with four driven gears 6 at the same time. Furthermore, the main gear 7 is a tower wheel, and the tower wheel is a multi-layer gear structure, which can simultaneously adapt to multiple driven gears 6 at different positions. The driven gears 6 at different positions can mesh with different levels of teeth on the tower wheel, making the spacing adjustment more convenient. In other embodiments of the utility model, the transmission structure of the driving device 8 and the roller 5 can adopt other methods, such as belt drive.

[0033] A new type of etching rack suitable for acid etching of single crystal silicon wafers. The specific operation is as follows:

[0034] After adjusting the position of the roller 5 to match the size of the silicon wafer to be etched, the silicon wafer is installed in the groove 501 on the roller 5, and the four rollers 5 achieve a limiting effect on it; the etching rack is placed in the etching liquid through the handle 9, the driving device 8 is turned on, and the main gear 7 drives the four driven gears 6 to rotate, and at the same time drives the four rollers 5 to rotate, so that the silicon wafer in the groove 501 is evenly acid-etched; if silicon wafers of different sizes need to be processed, it is only necessary to change the position of the movable module 3 before the etching process, and then install the silicon wafer in the groove 501; if the movable module 3 is worn, the worn movable module 3 can be directly replaced.

[0035] The above is only a preferred embodiment of the present invention. Any technician familiar with the profession, without departing from the scope of the technical solution of the present invention, makes any simple modifications, equivalent changes and modifications to the above embodiments based on the technical essence of the present invention, which still fall within the scope of the technical solution of the present invention.

Claims

1. A new type of etching rack suitable for acid etching of single crystal silicon wafers, characterized by: It comprises four positioning grooves (2) symmetrically arranged on both sides of a frame (1), four rollers (5) are arranged between the two sides of the frame (1), both ends of the rollers (5) are connected to the movable modules (3), and the movable modules (3) are slidably arranged in the corresponding positioning grooves (2); The roller (5) is provided with a plurality of grooves (501) along the axial direction, and the roller (5) is driven by a driving device (8) on the frame (1).

2. A novel etching rack suitable for acid etching of single crystal silicon wafers according to claim 1, characterized in that: At least two module rails (4) extending in the vertical direction are arranged in the positioning groove (2), and the movable module (3) is slidably matched with the corresponding module rails (4).

3. A novel etching rack suitable for acid etching of single crystal silicon wafers according to claim 1, characterized in that: A module track (4) is provided in the positioning groove (2), the movable module (3) is slidably matched with the module track (4), and the movable module (3) can be limited at any position on the module track (4) by means of a fastener.

4. A novel etching rack suitable for acid etching of single crystal silicon wafers according to claim 1, characterized in that: The output end of the driving device (8) is provided with a main gear (7), one end of the roller (5) is connected to a driven gear (6), and the main gear (7) is meshed with four driven gears (6) at the same time.

5. A novel etching rack suitable for acid etching of single crystal silicon wafers according to claim 4, characterized in that: The main gear (7) is a step wheel.

6. A novel etching rack suitable for acid etching of single crystal silicon wafers according to claim 1, characterized in that: A handle (9) is provided on the upper part of the frame (1).

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