Etching equipment

Abstract

The utility model discloses etching equipment. The etching equipment comprises a vacuum infiltration device which comprises an infiltration tank and a vacuum mechanism, wherein the vacuum mechanism is connected with the infiltration tank and is used for vacuumizing the infiltration tank; in the alkali corrosion device, a first temperature control assembly is used for controlling alkali liquor in an alkali liquor tank to be at a preset first temperature value, and a first bubbling assembly is used for generating bubbles in the alkali liquor; and / or the acid corrosion device comprises an acid liquor tank, a second temperature control assembly and a second bubbling assembly, the second temperature control assembly is used for controlling the temperature value of the acid liquor in the acid liquor tank not to exceed a preset second temperature value, and the second bubbling assembly is used for generating bubbles in the acid liquor; and the carrying device is used for carrying the materials treated by the vacuum infiltration device to at least one of the alkali corrosion device and the acid corrosion device. Through the mode, the etching equipment provided by the utility model can customize the optimal wet etching process adaptive to the glass substrate based on requirements, and can greatly improve the pore-forming efficiency of the glass substrate.

Description

Technical Field

[0001] This application relates to the field of wet etching technology for glass substrates, and in particular to an etching apparatus. Background Technology

[0002] TGV (Through Glass Vias) technology needs to balance factors such as cost, efficiency, and quality, and must meet a series of requirements including high speed, high precision, narrow pitch, smooth sidewalls, good perpendicularity, and low cost. One of the main difficulties restricting the development of through glass via technology is the TGV technology itself.

[0003] For many years, industry and academia have been dedicated to developing low-cost, rapid, and scalable hole-forming technologies, resulting in at least seven background technologies for various processes, including sandblasting, photosensitive glass, focused discharge, plasma etching, laser ablation, electrochemical and laser-induced etching, each with its own advantages and disadvantages.

[0004] In comparison, laser-induced etching technology first uses pulsed lasers to induce glass modification using laser processing equipment, and then uses wet etching equipment to selectively etch through the glass with an etchant to form through-holes. It has significant advantages, including fast hole formation, the ability to create high-density, high aspect ratio through-holes, and no damage to the through-holes, and has already been applied. However, existing wet etching equipment suffers from slow hole formation efficiency. Utility Model Content

[0005] This application mainly provides an etching apparatus to solve the problem of slow hole formation efficiency in existing etching equipment.

[0006] To solve the above-mentioned technical problems, this application adopts the following technical solution: providing an etching device. The etching device includes: a vacuum wetting device, comprising an wetting tank and a vacuum mechanism, wherein the wetting tank contains a wetting liquid, and the vacuum mechanism is connected to the wetting tank and used to evacuate the wetting tank; an alkaline etching device, comprising an alkaline solution tank, a first temperature control component, and a first bubbling component, wherein the first temperature control component controls the alkaline solution in the alkaline solution tank to a preset first temperature value, and the first bubbling component is disposed at the bottom of the alkaline solution tank to generate bubbles in the alkaline solution; and / or an acid etching device, comprising an acid solution tank, a second temperature control component, and a second bubbling component, wherein the second temperature control component controls the acid solution in the acid solution tank to not exceed a preset second temperature value, and the second bubbling component is disposed at the bottom of the acid solution tank to generate bubbles in the acid solution; and a conveying device for conveying the material processed by the vacuum wetting device to at least one of the alkaline etching device and the acid etching device.

[0007] In some embodiments, the vacuum impregnation device further includes a first ultrasonic component and a first circulation component. The first ultrasonic component is disposed on the wall of the impregnation tank and is used to perform ultrasonic cleaning on the material. The first circulation component is connected to the impregnation tank and is used to enable the impregnation liquid in the impregnation tank to form an internal circulation and filter the impregnation liquid.

[0008] In some embodiments, the vacuum mechanism of the vacuum impregnation apparatus is connected to the impregnation tank at the upper part of the impregnation tank.

[0009] In some embodiments, the alkaline etching apparatus further includes a second ultrasonic component disposed on the bottom and side walls of the alkaline solution tank to accelerate the etching process of the material.

[0010] In some embodiments, the alkaline corrosion apparatus further includes a second circulation component and an alkaline auxiliary tank, wherein the second circulation component is connected between the alkaline tank and the alkaline auxiliary tank, and the first temperature control component is disposed in the alkaline auxiliary tank;

[0011] The second circulation component is used to enable the alkali solution in the alkali solution tank to form an internal circulation and filter the alkali solution, and to exchange alkali solution between the alkali solution tank and the alkali auxiliary tank, so as to regulate the temperature and concentration of the alkali solution in the alkali solution tank.

[0012] In some embodiments, the acid etching apparatus further includes a third ultrasonic component disposed on the bottom and side walls of the acid bath to accelerate the etching process of the material.

[0013] In some embodiments, the acid etching apparatus further includes a third circulation component, an acid auxiliary tank, and an automatic replenishment component, wherein the third circulation component is connected to the acid tank, the acid auxiliary tank, and the automatic replenishment component;

[0014] The third circulation component is used to enable the acid in the acid tank to form an internal circulation and filter the acid, and to transfer the acid in the acid tank to the acid auxiliary tank for temporary storage, and to form an external circulation between the acid tank and the automatic replenishment component to replenish the concentration of the acid in the acid tank.

[0015] In some embodiments, the etching equipment further includes a rinsing device disposed between the alkaline etching device and the acid etching device, the rinsing device being used to rinse the material after acid etching or alkaline etching treatment;

[0016] The rinsing device includes a rinsing tank, a spray component, a bubbling component, and a drain component. The spray component is located at the top of the rinsing tank and is used to spray cleaning liquid onto the material. The bubbling component is located at the bottom of the rinsing tank and is used to generate bubbles during material cleaning to accelerate the liquid flow on the material surface. The drain component is located on the rinsing tank and is used to drain the liquid accumulated in the rinsing tank after detecting that the resistivity of the rinsing liquid exceeds a preset value.

[0017] In some embodiments, the rinsing device further includes a rinsing sub-tank, a temperature control device, and a liquid supply device. The rinsing sub-tank is connected to the rinsing tank and is used to supply liquid to the spray element. The temperature control device is disposed in the rinsing sub-tank and is used to regulate the liquid temperature in the rinsing sub-tank to a set temperature. The liquid supply device is connected to the rinsing sub-tank and is used to supply liquid to the rinsing sub-tank in a metered manner.

[0018] In some embodiments, the etching equipment further includes a drying device disposed between the alkaline etching device and the vacuum impregnation device, for sequentially preheating the cleaned material at medium temperature and drying it at high temperature.

[0019] The beneficial effects of this application are as follows: Unlike the prior art, this application discloses an etching apparatus. The etching apparatus provided by this application adds a vacuum wetting device before the alkaline etching device or the acid etching device to remove impurities on the glass substrate and eliminate air from the micropores formed by laser-induced modification. This allows liquid to enter the micropores formed by laser-induced modification on the glass substrate, enabling the chemical substances in the wet process to rapidly enter the micropores and react, thus greatly improving the etching efficiency.

[0020] The etching equipment provided in this application can select acid, alkali, acid-then-alkali, or alkali-then-acid wet etching processes, and simultaneously match auxiliary functions such as bubbling and temperature control. It can customize the optimal wet etching process to suit the glass substrate based on the requirements, which can greatly improve the hole formation efficiency of the glass substrate. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0022] Figure 1 This is a schematic diagram of the structure of an embodiment of the etching equipment provided in this application;

[0023] Figure 2 for Figure 1A schematic diagram of the Z-axis mechanism and chuck of the conveying device in the etching equipment shown;

[0024] Figure 3 Is it like this? Figure 1 A schematic diagram of the vacuum wetting device in the etching equipment shown; Figure 4 Is it like this? Figure 1 A schematic diagram of the alkaline etching device in the etching equipment shown.

[0025] Figure 5 Is it like this? Figure 1 The diagram shows the structure of the acid etching device in the etching equipment. Detailed Implementation

[0026] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0027] The terms "first," "second," and "third" used in the embodiments of this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0028] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0029] This application provides an etching apparatus 100, see reference. Figure 1 , Figure 1 This is a schematic diagram of an embodiment of the etching equipment provided in this application.

[0030] In this embodiment, the etching equipment 100 includes a vacuum wetting device 10, a drying device 20, an alkaline etching device 30, a rinsing device 40, an acid etching device 50, and a conveying device 60. The vacuum wetting device 10, the drying device 20, the alkaline etching device 30, the rinsing device 40, and the acid etching device 50 can be arranged in a row or in a ring, or arranged in any order. The conveying device 60 is used to convey materials between the vacuum wetting device 10, the drying device 20, the alkaline etching device 30, the rinsing device 40, and the acid etching device 50.

[0031] In other embodiments, the etching apparatus 100 may also include a vacuum wetting device 10, a drying device 20, a rinsing device 40, and a conveying device 60, as well as one of an alkaline etching device 30 and an acid etching device 50.

[0032] In this embodiment, the material is a glass substrate, which has been pre-modified by pulsed laser, so that the corrosion rate at the modified location is faster than that at other locations, and it is more easily corroded by the etching solution to form through holes.

[0033] Furthermore, the etching equipment 100 may also include a basket loading device 70, which contains a basket containing multiple glass substrates arranged side by side. The basket fully loaded with glass substrates is transported as a whole by a transport device 60.

[0034] Once the flower basket feeding device 70 is installed in the set position, it will trigger a sensing signal, and the conveying device 60 will automatically take the material from the flower basket feeding device 70.

[0035] In this embodiment, the vacuum impregnation device 10, drying device 20, alkaline etching device 30, rinsing device 40 and acid etching device 50 are arranged side by side in sequence, and the conveying device 60 is arranged on the same side of the vacuum impregnation device 10, drying device 20, alkaline etching device 30, rinsing device 40 and acid etching device 50.

[0036] The conveying device 60 includes an X-axis mechanism, a Z-axis mechanism 61, and a chuck 62. See also... Figure 2 , Figure 2 for Figure 1The diagram shows the structure of the Z-axis mechanism and the chuck of the conveying device in the etching equipment. The X-axis mechanism covers the workstations of the basket loading device 70, vacuum impregnation device 10, drying device 20, alkaline etching device 30, rinsing device 40, and acid etching device 50. The Z-axis mechanism 61 is connected to the X-axis mechanism, and the chuck 62 is installed on the drive end of the Z-axis mechanism 61. The Z-axis mechanism 61 is used to drive the chuck 62 to move up and down. The chuck 62 is used to pick up and put down the basket. Through the cooperation of the X-axis mechanism and the Z-axis mechanism 61, the chuck 62 can pick up and put down materials at any workstation between the basket loading device 70, vacuum impregnation device 10, drying device 20, alkaline etching device 30, rinsing device 40, and acid etching device 50.

[0037] See Figure 3 , Figure 3 Is it like this? Figure 1 The diagram shows the structure of the vacuum impregnation device in the etching equipment. The vacuum impregnation device 10 includes an impregnation tank 11 and a vacuum mechanism 12. The impregnation tank 11 is filled with an impregnation liquid, and the vacuum mechanism 12 is connected to the impregnation tank 11 and is used to evacuate the impregnation tank 11.

[0038] The vacuum wetting device 10 is the first step of the etching equipment 100. The transport device 60 transports the material-carrying basket in the basket loading device 70 to the vacuum wetting device 10 to remove impurities on the glass substrate and remove air from the micropores formed by laser-induced modification. This allows liquid to enter the micropores formed by laser-induced modification on the glass substrate, so that the chemical substances in the wet process can quickly enter the micropores and react, which can greatly improve the etching efficiency.

[0039] Specifically, the material-carrying basket is placed in the impregnation tank 11 and automatically sealed after it enters. The impregnation liquid is injected into the tank, and at the same time, the vacuum mechanism 12 evacuates the impregnation tank 11 to form a vacuum environment. This effectively removes air from the micropores of the glass substrate, allowing the solution to enter the micropores. As a result, the chemical substances in the subsequent wet process can quickly enter the micropores to prepare the required micropores.

[0040] The connection hole between the vacuum system 12 and the immersion tank 11 is located at the upper part of the immersion tank, above the surface of the immersion liquid.

[0041] Furthermore, the vacuum impregnation device 10 also includes a first ultrasonic component 13 and a first circulation component 14. The first ultrasonic component 13 is disposed on the impregnation tank 11 and is used to perform ultrasonic cleaning on the material. The first circulation component 14 is connected to the impregnation tank 11 and is used to make the impregnation liquid in the impregnation tank 11 form an internal circulation and filter the cleaning liquid.

[0042] The first ultrasonic component 13 and the first circulation component 14 are used together to clean the glass substrate using the immersion liquid in the immersion tank 11, thereby removing surface dirt and impurities from the glass substrate.

[0043] Specifically, the first ultrasonic component 13 is disposed on the side wall and bottom wall of the immersion tank 11, so that ultrasonic waves can be sent three-dimensionally towards the glass substrate from multiple directions, which can effectively remove stains and impurities on the glass substrate.

[0044] The first circulation component 14 is a circulation filtration system, which includes a pipe, a liquid pump and a filter. The liquid pump is connected to the inlet and outlet of the impregnation tank 11 through the pipe. The filter is installed on the pipe so that when the impregnation liquid in the impregnation tank 11 forms an internal circulation through the pipe, it also filters the impregnation liquid, thereby reducing the impurity content in the impregnation liquid, purifying the impregnation liquid and improving the cleanliness of the glass substrate.

[0045] See Figure 4 , Figure 4 Is it like this? Figure 1 The diagram shows the structure of the alkaline etching device in the etching equipment shown.

[0046] The alkaline corrosion device 30 includes an alkaline solution tank 31, a first temperature control component 32, and a first bubbling component 33. The first temperature control component 32 is used to control the alkaline solution in the alkaline solution tank 31 to be at a preset first temperature value. The first bubbling component 33 is located at the bottom of the alkaline solution tank 31 and is used to generate bubbles in the alkaline solution.

[0047] Alkali etching device 30 can be used as the second process of etching equipment 100. The transport device 60 transports the material basket after being treated by vacuum wetting device 10 to alkali etching device 30 so as to use the alkaline solution in alkaline etching device 30 to etch the glass substrate to form through holes.

[0048] Specifically, the alkaline solution tank 31 contains an alkaline solution for etching the glass substrate, and a material carrier basket is placed inside the alkaline solution tank 31. The first temperature control component 32 includes a heating element, a temperature measuring element, and a temperature controller. The temperature controller is communicatively connected to the temperature measuring element and the heating element. The temperature measuring element can be placed in the alkaline solution tank 31 to detect the temperature of the alkaline solution. Based on the obtained liquid temperature, the temperature controller adjusts the heating power of the heating element so that the liquid temperature of the alkaline solution in the alkaline solution tank 31 can be maintained at a preset first temperature value. This first temperature value is the optimal temperature for alkaline etching, thereby greatly improving the alkaline etching efficiency, that is, improving the efficiency of forming through holes on the glass substrate.

[0049] The first bubbling component 33 is disposed at the bottom of the alkaline solution tank 31 and is used to generate bubbles in the alkaline solution, so that bubbles are formed on the surface of the glass substrate immersed in the alkaline etching solution until the bubbles emerge from the liquid surface; by adjusting the bubbling speed to match the flow rate of the alkaline solution in the alkaline solution tank 31, the uniformity of etching of each glass substrate in the basket can be maximized.

[0050] Furthermore, the alkaline etching device 30 also includes a second ultrasonic component 34, which is disposed on the bottom wall and side wall of the alkaline solution tank 31, thereby transmitting ultrasonic waves three-dimensionally towards the glass substrate from multiple directions to accelerate the alkaline etching reaction process, that is, to accelerate the etching process of the glass substrate.

[0051] Furthermore, the alkali corrosion device 30 also includes a second circulation component 35 and an alkali auxiliary tank 36. The second circulation component 35 is connected between the alkali tank 31 and the alkali auxiliary tank 36, and the heating element in the first temperature control component 32 is disposed in the alkali auxiliary tank 36. The second circulation component 35 is used to enable the alkali solution in the alkali tank 31 to form an internal circulation and filter the alkali solution, and to exchange the alkali solution between the alkali tank 31 and the alkali auxiliary tank 36, so as to regulate the temperature and concentration of the alkali solution in the alkali tank 31.

[0052] The second circulation component 35 includes a pipe, a centrifugal pump, and a filter. The centrifugal pump is connected to the inlet and outlet of the alkali tank 31 through the pipe. The centrifugal pump provides power so that the alkali in the alkali tank 31 forms an internal circulation through the pipe, thereby regulating the flow rate of the alkali in the alkali tank 31 to promote the alkali corrosion reaction. The filter is installed on the pipe to filter the alkali and prevent impurities from affecting the efficiency of the alkali corrosion reaction.

[0053] Furthermore, the pipes in the second circulation component 35 are also connected to the alkali auxiliary tank 36 to form an external circulation between the alkali tank 31 and the alkali auxiliary tank 36, so as to use the alkali in the alkali auxiliary tank 36 to regulate the temperature and concentration of the alkali in the alkali tank 31.

[0054] The alkali auxiliary tank 36 is mainly used for the supply of raw solution in the alkali solution tank 31. After the raw solution is supplied in the alkali solution tank 31 through external circulation, the chemical ions in the internal circulation alkali solution are gradually consumed as the glass substrate is etched. The concentration can be detected by the feedback of the concentration meter and the level meter. When the concentration of chemical ions drops to a certain value, the second circulation component 35 replenishes the ion concentration to the alkali solution tank 31 through external circulation.

[0055] See Figure 5 , Figure 5 Is it like this? Figure 1 The diagram shows the structure of the acid etching device in the etching equipment.

[0056] The acid etching device 50 includes an acid tank 51, a second temperature control component 52, and a second bubbling component 53. The second temperature control component 52 is used to control the acid in the acid tank 51 to not exceed a preset second temperature value. The second bubbling component 53 is located at the bottom of the acid tank 51 and is used to generate bubbles in the acid.

[0057] The acid etching device 50 can be used as the second process of the etching equipment 100. The transport device 60 transports the material basket after being treated by the vacuum wetting device 10 to the acid etching device 50 so that the acid solution in the acid etching device 50 can be used to etch the glass substrate to form through holes or promote the formation of through holes.

[0058] In the process of forming through holes by wet etching on a glass substrate, at least one of the alkaline etching device 30 and the acid etching device 50 can participate in the etching process. Their specific selection and order can be set based on the material or process requirements of the glass substrate.

[0059] For example, for etching a glass substrate of a certain type of material, the alkaline etching device 30 can be used alone as the etching process, and the alkaline etching device 30 can be used as the second process; for etching a glass substrate of another type of material, the acid etching device 50 can be used alone as the etching process, and the acid etching device 50 can be used as the second process; for glass substrates of another type of material, the alkaline etching device 30 and the acid etching device 50 can be used in combination as the etching process, with the alkaline etching device 30 and the acid etching device 50 serving as the second and fourth processes in sequence, or the acid etching device 50 and the alkaline etching device 30 serving as the second and fourth processes in sequence.

[0060] In other words, the conveying device 60 can be used to convey the material treated by the vacuum wetting device 10 to at least one of the alkaline etching device 30 and the acid etching device 50 for etching.

[0061] Specifically, the acid bath 51 contains acid for etching the glass substrate, and a material carrier basket is placed inside the acid bath 51. The second temperature control component 52 is located at the bottom of the acid bath 52 and can directly regulate the liquid temperature inside the acid bath 52 to ensure that it does not exceed a preset second temperature value, thereby balancing the heat generated during acid etching and greatly improving the acid etching efficiency, that is, improving the efficiency of forming through holes on the glass substrate.

[0062] The second temperature control component 52 includes a heat exchanger, a temperature sensor, and a temperature controller. The temperature controller is communicatively connected to the heat exchanger and the temperature sensor. The temperature sensor is used to detect the liquid temperature in the acid bath 51. The temperature controller adjusts the heat exchange efficiency of the heat exchanger based on the obtained liquid temperature to accurately control the liquid temperature in the bath below the second temperature value, thereby balancing the heat generated during acid etching.

[0063] The second bubbling assembly 53 is also located at the bottom of the acid tank 51. It is used to generate bubbles in the acid solution, so that bubbles are formed on the surface of the glass substrate immersed in the acid etching solution until the bubbles emerge from the liquid surface. By adjusting the bubbling speed to match the flow rate of the acid solution in the acid tank 51, the uniformity of etching of each glass substrate in the basket can be maximized.

[0064] Furthermore, the acid etching device 50 also includes a third ultrasonic component 54, which is disposed on the bottom wall and side wall of the acid bath 51, so as to send ultrasonic waves three-dimensionally towards the glass substrate from multiple directions to accelerate the acid etching reaction process, that is, to accelerate the etching process of micropores on the glass substrate.

[0065] The acid etching device 50 also includes a third circulation component 55, an acid auxiliary tank 56, and an automatic replenishment component 57. The third circulation component 55 connects the acid tank 51, the acid auxiliary tank 56, and the automatic replenishment component 57. The third circulation component 55 is used to form an internal circulation of acid in the acid tank 51 and filter the acid, and to transfer the acid in the acid tank 51 to the acid auxiliary tank 56 for temporary storage, and to form an external circulation between the acid tank 51 and the automatic replenishment component 57 to replenish the concentration of acid in the acid tank 51.

[0066] The third circulation component 55 includes a pipe, a diaphragm pump, and a filter. The diaphragm pump is connected to the inlet and outlet of the acid tank 51 through the pipe. The diaphragm pump provides power so that the acid in the acid tank 51 forms an internal circulation through the pipe, thereby regulating the acid flow rate in the acid tank 51 to promote the acid corrosion reaction. The filter is installed on the pipe to filter the passing acid and prevent impurities from affecting the efficiency of the acid corrosion reaction.

[0067] Furthermore, the pipes in the third circulation component 55 are also connected to the acid auxiliary tank 56 to form a temporary storage circulation system between the acid tank 51 and the acid auxiliary tank 56, so that the acid in the acid tank 51 can be temporarily stored in the acid auxiliary tank 56 during equipment maintenance and repair.

[0068] The pipes in the third circulation component 55 are also connected to the automatic replenishment component 57 to form an external circulation between the acid tank 51 and the automatic replenishment component 57, so as to use the automatic replenishment component 57 to supply the original solution in the acid tank 51.

[0069] Specifically, the automatic replenishment unit 57 includes a raw solution tank and a metering pump. The metering pump draws liquid from the raw solution tank and automatically replenishes the acid tank 51. After the raw solution is first mixed through external circulation in the acid tank 51, the concentration of chemical ions in the internally circulating acid is gradually consumed as the glass substrate product is etched. At this time, based on the feedback from the concentration meter and level meter in the acid tank 51, the automatic replenishment unit 57 can be activated to replenish the ion concentration through external circulation.

[0070] Continue reading Figure 1 The rinsing device 40 is disposed between the alkaline etching device 30 and the acid etching device 50. The rinsing device 40 is used to rinse the glass substrate after acid etching or alkaline etching treatment. The rinsing device 40 includes a rinsing tank 41, a spray element 42, a bubble element 43, and a drain element. The spray element 42 is disposed at the top of the rinsing tank 41 and is used to spray cleaning liquid onto the glass substrate. The bubble element 43 is disposed at the bottom of the rinsing tank 41 and is used to generate bubbles during the cleaning of the glass substrate to accelerate the liquid flow on the surface of the glass substrate. The drain element is disposed on the rinsing tank 41 and is used to drain the liquid accumulated in the rinsing tank 41 after the resistivity of the rinsing liquid is detected to exceed a preset value.

[0071] Specifically, the spray unit 42 can be several spray pipes installed on the rinsing tank 41, each spray pipe having evenly arranged conical nozzles that spray the glass substrates in the basket in a crisscross pattern. The spray water pressure, flow rate, and spray direction angle are all adjustable to ensure a full-coverage cleaning effect. The bubbling unit 43 is mainly used to accelerate the liquid flow on the surface of each glass substrate in the basket to achieve a uniform cleaning effect. The drainage unit includes a rapid drainage unit and a water quality detection unit. When the water quality detection unit detects that the resistivity of the rinsing liquid exceeds a preset value during the spray cleaning process, the rapid drainage unit installed at the bottom of the rinsing tank 41 can initiate the rapid discharge of pure water.

[0072] The rinsing device 40 also includes a rinsing sub-tank 45, a temperature control device, and a liquid supply device. The volume of the rinsing sub-tank 45 is the same as that of the rinsing tank 41. The rinsing sub-tank 45 is connected to the rinsing tank 41 and is used to supply liquid to the spray element 42. The temperature control device is set in the rinsing sub-tank 45 and is used to regulate the liquid temperature in the rinsing sub-tank 45 to a set temperature. The liquid supply device is connected to the rinsing sub-tank 45 and is used to supply liquid to the rinsing sub-tank 45 in a metered manner.

[0073] The spray unit 42 uses a cleaning solution at a preset temperature provided by the rinsing sub-tank 45 to clean the glass substrate in the flower basket.

[0074] Specifically, when cleaning the glass substrate after acid etching or alkaline etching in the rinsing device 40, the temperature of the cleaning solution is selected according to the temperature of the glass etching solution. This avoids excessive temperature difference during the cleaning process, which could cause cracks in the glass substrate due to a sudden drop in temperature.

[0075] The rinsing device 40 serves as the third step in the etching equipment 100, or it can be repeated as the fifth step when both the alkaline etching device 30 and the acid etching device 50 participate in the etching process.

[0076] like Figure 1 As shown, the drying device 20 is located between the alkaline etching device 30 and the vacuum impregnation device 10, and is used to perform medium-temperature preheating and high-temperature drying on the cleaned glass substrate in sequence.

[0077] As the final step in the etching equipment 100, the drying device 20 generates circulating hot air from top to bottom in the tank, with a temperature of up to 130°C. After preheating the cleaned glass substrate at a medium temperature, it is then dried at a high temperature until the water vapor on the surface of the glass substrate and inside the through holes formed on the glass substrate is evaporated.

[0078] The etching equipment provided in this application adds a vacuum wetting device before the alkaline etching device or acid etching device. This device removes impurities from the glass substrate and eliminates air from the micropores formed by laser-induced modification. It also allows liquid to enter the micropores formed by laser-induced modification on the glass substrate, enabling the chemical substances in the wet etching process to rapidly enter the micropores and react, thus greatly improving etching efficiency. Combined with subsequent acid-alkali etching, it can improve the quality of the pores. The etching equipment provided in this application can select acid, alkali, acid-then-alkali, or alkali-then-acid wet etching processes, and simultaneously match auxiliary functions such as bubbling, temperature control, and ultrasound. It can customize the optimal wet etching process to suit the glass substrate based on requirements, greatly improving the pore formation efficiency and effect of the glass substrate, and achieving the preparation of glass micropores with micron-sized pores and an aspect ratio greater than 50:1.

[0079] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. An etching apparatus characterized by, The etching equipment comprises: a vacuum infiltration device, comprising an infiltration tank and a vacuum mechanism, the infiltration tank containing an infiltration liquid, and the vacuum mechanism being connected to the infiltration tank and being used for vacuumizing the infiltration tank; an alkali etching device, comprising an alkali tank, a first temperature control assembly and a first bubbling assembly, the first temperature control assembly being used for controlling the alkali liquid in the alkali tank to be at a preset first temperature value, and the first bubbling assembly being arranged at the bottom of the alkali tank and being used for generating bubbles in the alkali liquid; and / or an acid etching device, comprising an acid tank, a second temperature control assembly and a second bubbling assembly, the second temperature control assembly being used for controlling the acid liquid in the acid tank to be not higher than a preset second temperature value, and the second bubbling assembly being arranged at the bottom of the acid tank and being used for generating bubbles in the acid liquid; a conveying device, used for conveying the material processed by the vacuum infiltration device to at least one of the alkali etching device and the acid etching device.

2. The etching apparatus of claim 1, wherein, The vacuum mechanism of the vacuum infiltration device is in communication with the infiltration tank at the upper part of the infiltration tank.

3. The etching apparatus of claim 1, wherein, The vacuum infiltration device further comprises a first ultrasonic assembly and a first circulating assembly, the first ultrasonic assembly being arranged on the tank wall of the infiltration tank and being used for ultrasonic cleaning of the material, and the first circulating assembly being connected to the infiltration tank and being used for forming internal circulation of the infiltration liquid in the infiltration tank and filtering the infiltration liquid.

4. The etching apparatus of claim 1, wherein, The alkali etching device further comprises a second ultrasonic assembly, the second ultrasonic assembly being arranged on the bottom wall and the side wall of the alkali tank and being used for accelerating the etching process of the material.

5. The etching apparatus of claim 4, wherein, The alkali etching device further comprises a second circulating assembly and an alkali auxiliary tank, the second circulating assembly being connected between the alkali tank and the alkali auxiliary tank, and the first temperature control assembly being arranged in the alkali auxiliary tank; wherein the second circulating assembly is used for forming internal circulation of the alkali liquid in the alkali tank and filtering the alkali liquid, and exchanging the alkali liquid between the alkali tank and the alkali auxiliary tank, so as to regulate the temperature and the concentration of the alkali liquid in the alkali tank.

6. The etching apparatus of claim 1, wherein, The acid etching device further comprises a third ultrasonic assembly, the third ultrasonic assembly being arranged on the bottom wall and the side wall of the acid tank and being used for accelerating the etching process of the material.

7. The etching apparatus of claim 6, wherein, The acid etching device further comprises a third circulating assembly, an acid auxiliary tank and an automatic liquid supplementing member, the third circulating assembly being connected to the acid tank, the acid auxiliary tank and the automatic liquid supplementing member; wherein the third circulating assembly is used for forming internal circulation of the acid liquid in the acid tank and filtering the acid liquid, and transferring the acid liquid in the acid tank to the acid auxiliary tank for temporary storage, and forming external circulation between the acid tank and the automatic liquid supplementing member, so as to supplement the concentration of the acid liquid in the acid tank.

8. The etching apparatus of claim 1, wherein, The etching equipment further comprises a rinsing device, the rinsing device being arranged between the alkali etching device and the acid etching device and being used for rinsing the material processed by the acid etching or the alkali etching. The flushing device comprises a flushing tank, a spraying part, a bubbling part and a liquid draining part. The spraying part is arranged on the top of the flushing tank and used for spraying cleaning liquid to the material. The bubbling part is arranged on the bottom of the flushing tank and used for generating bubbles to accelerate the liquid flow on the surface of the material during the cleaning. The liquid draining part is arranged on the flushing tank and used for draining the accumulated liquid in the flushing tank when the resistivity of the flushing liquid exceeds the preset value.

9. The etching apparatus of claim 8, wherein, The flushing device further comprises a flushing auxiliary tank, a temperature control part and a liquid supplying part. The flushing auxiliary tank is connected with the flushing tank and used for supplying liquid to the spraying part. The temperature control part is arranged in the flushing auxiliary tank and used for regulating the liquid temperature in the flushing auxiliary tank to the set temperature. The liquid supplying part is connected with the flushing auxiliary tank and used for quantitatively supplying liquid to the flushing auxiliary tank.

10. The etching apparatus of claim 8, wherein, The etching device further comprises a drying device arranged between the alkali corrosion device and the vacuum infiltration device and used for sequentially performing medium temperature preheating and high temperature drying on the cleaned material.

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