A chip carrier
By designing a grain carrier with a hollow structure, the problem of metal debris on the grain surface affecting the packaging process is solved, and automatic cleaning of the grain surface and improvement of packaging yield is achieved.
Patent Information
- Application Number
- CN202421324088.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-11
- Publication Date
- 2025-04-08
- Estimated Expiration
- 2034-06-11
AI Technical Summary
When cutting the wafer to obtain the grain, metal debris may exist on the surface of the grain, which will affect the circuit function of the wafer product during the subsequent packaging process.
A grain carrier is designed, which includes a carrier plate and a grain storage tank. The bottom of the groove is a hollow structure, which can facilitate the metal debris on the surface of the grain to escape through the hollow structure.
Through the design of the hollow structure, automatic non-contact cleaning of metal debris on the grain surface is achieved, and the packaging yield of wafer products is improved.
Smart Images
Figure CN222734956U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of integrated circuits, and in particular to a crystal carrier. Background Art
[0002] Wafer products have relatively high requirements for heat dissipation, and metal heat dissipation is usually used to dissipate heat from the wafer. This requires the use of a back side metal (BSM) process to prepare a metal layer on the back of the wafer to facilitate welding between the wafer and the metal heat sink; or an interface heat dissipation material layer is prepared on the back of the wafer to dissipate heat from the wafer. This also requires the use of a back side metal process in combination with a metal material, such as pure indium, to prepare a metal layer on the back of the wafer as an interface heat dissipation material layer.
[0003] A wafer generally includes multiple integrated circuits, and the wafer needs to be cut to obtain the corresponding integrated circuit grains. Because there is a metal layer on the back of the wafer, there may be metal debris on the surface of the grains after the wafer is cut to obtain the grains. The metal debris will affect the circuit function of the wafer product in the subsequent packaging process. Utility Model Content
[0004] In view of this, an embodiment of the present invention provides a die carrier to facilitate cleaning of metal debris on the surface of the die.
[0005] In order to achieve the above-mentioned purpose, the implementation method of the utility model adopts the following technical solutions:
[0006] An embodiment of the utility model provides a grain carrier, comprising: a carrier plate, on which a grain accommodating groove is provided, and the bottom of the grain accommodating groove is a hollow structure; wherein the number of the grain accommodating grooves is at least two, the at least two grain accommodating grooves are arranged adjacent to each other and spaced apart, and the length directions of the at least two grain accommodating grooves are consistent.
[0007] According to a specific implementation of the utility model, the grain carrier also includes a cofferdam integrally formed with the carrier plate, the cofferdam is located at the edge of the upper surface of the carrier plate and extends circumferentially along the edge of the upper surface of the carrier plate; the grain accommodating groove is arranged on the upper surface of the carrier plate.
[0008] According to a specific implementation of the present invention, a preset distance exists between the bottom surface of the die receiving groove and the upper surface of the carrier plate in a direction perpendicular to the bottom surface of the die receiving groove.
[0009] According to a specific implementation of the utility model, the bottom of the grain receiving groove includes a cross-shaped support structure located in the central portion, and oblique support structures located at the four corners of the bottom of the groove.
[0010] According to a specific implementation of the present invention, the grain accommodating groove has a first accommodating margin in the length direction and / or has a second accommodating margin in the width direction.
[0011] According to a specific implementation of the utility model, a notch mark is provided on the outer side of the cofferdam.
[0012] The grain carrier provided by the embodiment of the utility model has a grain receiving groove on the carrier plate of the grain carrier, and the bottom of the grain receiving groove is a hollow structure, which can facilitate metal debris on the surface of the grain in the grain receiving groove to separate from the grain surface through the hollow structure. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] In order to more clearly illustrate the implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0014] Figure 1 It is a front view of an embodiment of a die carrier of the utility model;
[0015] Figure 2 for Figure 1 A schematic diagram of the structure of the die carrier as seen from the rear view angle;
[0016] Figure 3 It is a schematic flow chart of an embodiment of a method for manufacturing a die carrier of the utility model;
[0017] Figure 4 It is a schematic flow chart of an implementation method of a grain cleaning method of the utility model. DETAILED DESCRIPTION
[0018] The embodiments of the present utility model are described in detail below with reference to the accompanying drawings.
[0019] It should be clear that the described implementations are only part of the implementations of the utility model, not all of the implementations. Based on the implementations in the utility model, all other implementations obtained by ordinary technicians in the field without creative work are within the scope of protection of the utility model.
[0020] The embodiment of the utility model provides a crystal grain carrier, which can facilitate the cleaning of metal debris on the surface of the crystal grain.
[0021] The following combination Figures 1 to 4 The implementation mode of the utility model is further described.
[0022] Figure 1 This is a front view of an embodiment of the die carrier of the utility model, see Figure 1 As shown, the die carrier of this embodiment includes a carrier plate 1 , on which a plurality of dies can be placed.
[0023] A crystal grain receiving groove 2 is provided on the carrier plate 1, and the groove bottom 3 of the crystal grain receiving groove 2 is a hollow structure. The crystal grain can be placed in the crystal grain receiving groove 2, and the surface of the crystal grain with metal debris faces the groove bottom 3, so that the metal debris on the surface of the crystal grain can be easily cleaned, and the metal debris falling from the surface of the crystal grain can also fall from the hollow part 31 of the groove bottom 3, so as to clean the crystal grain carrier.
[0024] There are at least two grain receiving grooves 2, at least two grain receiving grooves 2 are arranged adjacently and spaced apart, and the length directions of at least two grain receiving grooves 2 are consistent. In this way, when transferring multiple grains to the grain carrier at the same time, it is convenient to align the grain transfer device with the at least two grain receiving grooves 2, so as to facilitate placing the multiple grains together in the grain receiving grooves 2 of the carrier 1.
[0025] In one embodiment, there are three die receiving grooves 2, the length direction of the three die receiving grooves 2 is consistent, and they are arranged at intervals in the central area of the carrier 1. This layout can effectively utilize the space of the carrier 1 and reduce the size of the die carrier.
[0026] In this embodiment, the die may also be referred to as a bare chip.
[0027] The grain carrier provided in this embodiment has a grain receiving groove 2 on the carrier plate 1 of the grain carrier, and the groove bottom 3 of the grain receiving groove 2 is a hollow structure, which can facilitate metal debris on the surface of the grain in the grain receiving groove 2 to escape from the grain surface through the hollow part 31 of the groove bottom 3.
[0028] In one embodiment, during the packaging process of the grains, the grains are transported by a conveying mechanism through a grain carrier. The vibration of the grain carrier during the conveying process by the conveying mechanism can cause metal debris on the surface of the grain in the grain receiving groove 2 to fall from the surface of the grain through the hollow portion 31, thereby achieving automatic non-contact cleaning.
[0029] Furthermore, at least part of the metal debris falling from the surface of the die falls directly through the hollow portion 31 and does not remain in the die carrier, so that the die carrier itself can be easily cleaned.
[0030] In one embodiment, 3,000 dies are packaged and tested, and the packaging yield is increased by 150 PPM (Part Per Million).
[0031] When transferring the die carriers, generally, multiple die carriers containing the die are first stacked vertically, and then the stacked die carriers are fixed with anti-static rubber bands. For example, the number of the aforementioned multiple die carriers may be 10.
[0032] See also Figure 1 and Figure 2 In order to increase the stability of multiple stacked die carriers during the transfer process, in one embodiment, the die carrier also includes a cofferdam 4 integrally formed with the carrier 1, the cofferdam 4 is located at the edge of the upper surface of the carrier 1, and extends circumferentially along the edge of the upper surface of the carrier 1; the die receiving groove 2 is provided on the upper surface of the carrier 1.
[0033] In this way, after the multiple die carriers are stacked in the vertical direction, the bottom of the upper die carrier is located in the cofferdam 4 of the adjacent lower die carrier. The cofferdam 4 is a kind of enclosure structure, which can limit the relative movement of the upper die carrier relative to the adjacent lower die carrier in the horizontal direction, thereby increasing the stability of the stacked multiple die carriers during the transfer process.
[0034] In one embodiment, the height of the cofferdam 4 is 0.4 mm-0.6 mm, and the width of the cofferdam 4 is 0.5 mm-1 mm.
[0035] In one embodiment, the bottom surface of the grain receiving groove 2 and the upper surface of the carrier 1 have a preset distance in a direction perpendicular to the bottom surface of the grain receiving groove 2. The bottom surface of the grain receiving groove 2 refers to the surface that supports the grain, and the preset distance between the bottom surface of the grain receiving groove 2 and the upper surface of the carrier 1 is greater than the thickness of the grain, so that the grain can be prevented from being damaged during the process of placing the grain into the grain receiving groove 2 and transferring the grain carrier. Exemplarily, the preset distance can be 730µm-770µm.
[0036] In one embodiment, the bottom 3 of the grain receiving groove 2 includes a cross-shaped support structure 32 located in the center. In this way, the cross-shaped support structure 32 can effectively support the main body of the grain in the grain receiving groove 2.
[0037] In one embodiment, the bottom 3 of the crystal grain receiving groove 2 further includes oblique support structures 33 located at the four corners of the bottom 3. In this way, the two ends of the oblique support structure 33 are respectively located on two adjacent groove edges of the bottom 3, which can effectively support the four corners of the crystal grain in the crystal grain receiving groove 2, which is beneficial to protecting the integrity of the crystal grain.
[0038] In one embodiment, the hypotenuse of the M-shaped support structure 32 can be connected to the corresponding oblique support structure 33. In this way, compared with the hypotenuse of the M-shaped support structure 32 being directly connected to the edge of the groove bottom 3, the technical solution of this embodiment can provide a larger hollow portion 31 while uniformly supporting the grains in the grain receiving groove 2, making it easier to clean the metal debris on the surface of the grain through the hollow portion 31.
[0039] Among them, the portion on the bottom 3 of the grain receiving groove 2 except the cross-shaped support structure 32 and the oblique support structure 33 is a hollow portion 31 .
[0040] In one embodiment, the grain carrier can vibrate itself to cause metal debris on the surface of the grain in the grain receiving groove 2 of the grain carrier to fall off from the hollow portion 31 of the groove bottom 3 of the grain receiving groove 2, thereby cleaning the metal debris on the surface of the grain.
[0041] In order to increase the ability of the grain carrier to clean metal debris on the surface of the grain, in one embodiment, the grain receiving groove 2 has a first accommodation margin in the length direction. The first accommodation margin is the difference between the length value of the grain receiving groove 2 and the length value of the grain, wherein the length value of the grain receiving groove 2 is greater than the length value of the grain, so that the grain can be easily shaken in the length direction of the grain receiving groove 2, thereby increasing the ability of the grain carrier to clean metal debris on the surface of the grain. An exemplary first accommodation margin is 0.1mm-0.3mm.
[0042] In one embodiment, the grain receiving groove 2 has a second accommodation margin in the width direction. The second accommodation margin is the difference between the width value of the grain receiving groove 2 and the width value of the grain, wherein the width value of the grain receiving groove 2 is greater than the width value of the grain, so that the grain can be easily shaken in the width direction of the grain receiving groove 2, thereby increasing the grain carrier's ability to clean metal debris on the surface of the grain. An exemplary second accommodation margin is 0.1 mm-0.3 mm.
[0043] In one embodiment, the grain receiving groove 2 has a first accommodation margin in the length direction and a second accommodation margin in the width direction. In this way, the first accommodation margin and the second accommodation margin allow the grain to have free swaying space in the grain receiving groove 2, thereby increasing the grain carrier's ability to clean metal debris on the grain surface.
[0044] In one embodiment, a notch mark 5 is provided on the outer side of the cofferdam 4. The notch mark 5 can be a direction identification mark, so that during the transfer process of the die carrier, the die carrier can be easily positioned to improve the transfer efficiency of the die carrier.
[0045] In one embodiment, the notch mark 5 can be used to mark the length direction of the at least two die receiving grooves 2 , so that the die transfer device can position the die carrier and place multiple die in the die receiving grooves 2 at one time.
[0046] Figure 3 FIG. 1 is a flow chart of an embodiment of a method for manufacturing a die carrier, see Figure 3 As shown, this embodiment provides a method for manufacturing a die carrier, comprising:
[0047] S110, filling the substrate into a prefabricated mold, and obtaining a carrier plate having a preset shape by molding;
[0048] S120, machining a grain receiving groove on the carrier plate based on the size of the target grain;
[0049] S130, hollowing out the bottom of the grain accommodating groove.
[0050] The manufacturing method of the grain carrier provided in this embodiment is provided with a grain receiving groove on the carrier plate of the grain carrier, and the bottom of the grain receiving groove is a hollow structure, which can facilitate the metal debris on the surface of the grain in the grain receiving groove to separate from the surface of the grain through the hollow structure.
[0051] In one embodiment, the method for manufacturing a grain carrier further includes: while filling the substrate into a prefabricated mold and obtaining a carrier plate having a preset shape by molding, a cofferdam extending circumferentially along the edge of the upper surface of the carrier plate is formed by molding at an edge position of the upper surface of the carrier plate.
[0052] In one embodiment, the bottom of the grain receiving groove is hollowed out, including: hollowing out the bottom of the grain receiving groove to form a cross-shaped support structure in the central portion of the bottom of the grain receiving groove, and forming oblique support structures at the four corners of the bottom.
[0053] In one embodiment, a grain accommodating groove is processed on the carrier based on the size of the target grain, including: based on the length and width of the target grain, the grain accommodating groove is processed on the carrier to form an accommodating space with a first accommodating margin in the length direction of the grain accommodating groove, and / or, to form an accommodating space with a second accommodating margin in the width direction of the grain accommodating groove.
[0054] The implementation principle and technical effect of the manufacturing method of the die carrier provided in this embodiment are basically the same as the implementation principle and technical effect of the corresponding die carrier in the aforementioned embodiment, and will not be repeated here.
[0055] Figure 4 FIG. 1 is a flow chart of an embodiment of a method for cleaning a die. Figure 4As shown, this embodiment provides a method for cleaning a die, comprising:
[0056] S210, cutting the wafer along the scribing lines to form a plurality of crystal grains separated from each other, wherein the scribing lines are used to separate different crystal grains on the wafer, and alignment marks may be set on the scribing lines.
[0057] S220, transferring the die to a die carrier; wherein the die carrier is the die carrier described in any of the above embodiments. The die transfer device can apply negative pressure to the die to suck the target die, and then move the target die to the top of the die carrier by swinging the arm, stop applying negative pressure, and transfer the target die to the die carrier. The surface of the die with residual metal debris faces the hollow structure of the die receiving groove of the die carrier.
[0058] S230, transferring the grain carrier storing the grain to the target position through a transfer mechanism; wherein the transfer mechanism generates vibration during the transfer process. The transfer mechanism may naturally generate vibration during the transfer process, for example, the transfer mechanism may be a belt drive mechanism, and the movement of each part of the belt drive mechanism may naturally generate vibration. The transfer mechanism may also generate vibration during the transfer process in a preset manner, for example, a speed bump may be provided in the transfer direction of the transfer mechanism, and the transfer mechanism may generate vibration when passing through the speed bump.
[0059] The grain cleaning method provided in this embodiment generates vibration when the transmission mechanism transfers the grain carrier to the target position. The transmission mechanism can transfer the vibration to the grain carrier. When the grain carrier vibrates, it can drive the grain in the grain carrier to vibrate, so that the metal debris on the surface of the grain is separated from the grain and falls from the hollow part of the grain receiving groove of the grain carrier, thereby cleaning the grain.
[0060] The grain carrier provided by the embodiment of the utility model has a grain containing groove on the carrier plate of the grain carrier, and the bottom of the grain containing groove is a hollow structure. This makes it easy to automatically and non-contact clean the metal debris remaining on the surface of the grain in the grain carrier during the transmission of the grain carrier. At the same time, at least part of the metal debris falling from the surface of the grain directly falls through the hollow part and does not remain in the grain carrier. This makes it easy to clean the grain carrier itself.
[0061] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.
[0062] Each embodiment in this specification is described in a related manner, and the same or similar parts between the various embodiments can be referenced to each other, and each embodiment focuses on the differences from other embodiments.
[0063] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the utility model should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.
Claims
1. A die carrier, characterized in that: It includes a carrier plate, on which a grain accommodating groove is provided, and the bottom of the grain accommodating groove is a hollow structure; wherein the number of the grain accommodating grooves is at least two, the at least two grain accommodating grooves are arranged adjacent to each other at intervals, and the length directions of the at least two grain accommodating grooves are consistent.
2. The die carrier according to claim 1, characterized in that: It also includes a cofferdam integrally formed with the carrier, the cofferdam is located at the edge of the upper surface of the carrier and extends circumferentially along the edge of the upper surface of the carrier; the grain accommodating groove is arranged on the upper surface of the carrier.
3. The die carrier according to claim 2, characterized in that: A preset distance exists between the bottom surface of the die receiving groove and the upper surface of the carrier plate in a direction perpendicular to the bottom surface of the die receiving groove.
4. The die carrier according to claim 1, characterized in that: The bottom of the crystal grain accommodating groove comprises a cross-shaped support structure located in the central part and oblique support structures located at the four corners of the bottom of the groove.
5. The die carrier according to claim 1, characterized in that: The crystal grain accommodating groove has a first accommodating margin in the length direction and / or has a second accommodating margin in the width direction.
6. The die carrier according to claim 2, characterized in that: A notch mark is provided on the outer side of the cofferdam.