Clamping device for semiconductor chip cutting

Abstract

The utility model discloses a clamping device for cutting a semiconductor chip, which structurally comprises connecting blocks, a parallel base, a clamping frame, a groove and a covering protector, the connecting blocks are welded on the left side and the right side of the parallel base, the center of the parallel base is fixedly connected with the clamping frame, the groove penetrates through the center of the clamping frame and the center of the parallel base, and the covering protector covers the clamping frame. The covering protector is positioned and connected with the parallel base and is communicated with the groove; according to the utility model, after the covering protector is further improved, the two groups of moving blocks can drive the covering part to move up and down according to the two groups of vertical plates and the sliding rails, so that the covering part can completely cover an electronic element area of a semiconductor chip and then can prevent dust and chippings generated during cutting of the cutting device from invading; the cleaning effect of the electronic component area is ensured, and electronic component damage caused by dust, high temperature and chippings is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor cutting and clamping, in particular to a clamping device for cutting semiconductor chips. Background Art

[0002] Semiconductor chips have the advantages of small size, low power consumption, reliable operation, and high production efficiency. After the production of semiconductor chips is completed, the excess material on the edge of the semiconductor chips needs to be cut by corresponding cutting devices and clamping devices, so that the area of ​​the semiconductor chips can be reduced, so as to meet the size effect of normal chips, and at the same time, the small area characteristics can be used to improve the convenience of chip assembly;

[0003] However, the existing clamping device still has the following defects: after the current clamping device firmly fixes the edge of the semiconductor chip in place, when the cutting device cuts the edge of the semiconductor, the dust and debris generated by it will be affected by the airflow in the space and the vibration caused by the movement of the device and will cover and invade the surface electronic components of the semiconductor chip. As a result, there are a large number of electronic components on the surface of the semiconductor chip, which are easily damaged or difficult to clean accurately after being invaded by dust and high-temperature debris. Therefore, it will reduce the normal power supply and use of the semiconductor chip after cutting. Utility Model Content

[0004] In view of the above problems, the utility model provides a clamping device for cutting semiconductor chips.

[0005] In order to achieve the above-mentioned purpose, the utility model is implemented through the following technical scheme: a clamping device for cutting semiconductor chips, whose structure includes: a connecting block, a parallel base, a clamping frame, a groove, and a covering protector, the connecting block is welded to the left and right sides of the parallel base, the center of the parallel base is fixedly connected to the clamping frame, the groove runs through the center of the clamping frame and the parallel base, and the covering protector is positioned and connected with the parallel base and communicates with the groove.

[0006] Furthermore, the covering protector is provided with a fixed block, a vertical plate, a slide rail, a movable block and a covering member, wherein the fixed block is embedded in the lower end center of the vertical plate, the surface center of the vertical plate and the slide rail are an integrated structure, the movable block is embedded in the slide rail, and the covering member is fixedly connected to the movable block.

[0007] Furthermore, the covering member is provided with a fitting wall, a protective frame, a connecting member, a through cavity, a flexible plate, and a fixed plate; the fitting wall and the lower end of the protective frame are an integrated structure; the left and right sides of the protective frame are fixedly connected to the connecting member; the through cavity runs through the center of the protective frame; the flexible plate covers the upper end of the through cavity and overlaps with the fixed plate while being fixedly connected to the protective frame.

[0008] Furthermore, the movable block is provided with a connecting end, a balancing block, a limiting ring, and a pulley. The connecting end and the balancing block are an integrated structure. The limiting ring is embedded in the side center of the balancing block, and the pulley is embedded in the side center of the balancing block through the limiting ring.

[0009] Furthermore, the fixed block is solid, the vertical plate carries a vertical slide rail, and the movable block is arranged on the left and right sides of the cover in a parallel position.

[0010] Furthermore, the fitting wall is in a square shape, the exterior of the protection frame is solid, the through cavity is opened in a vertical direction, and the area of ​​the flexible plate is consistent with the area of ​​the fixed plate.

[0011] Furthermore, the connecting end has a magnetic attraction property, the balancing block is a solid rectangular parallelepiped, and the limiting ring is a circular shape with a diameter greater than the diameter of the pulley. Beneficial Effects

[0012] Compared with the prior art, the utility model has the following beneficial effects:

[0013] 1. After the utility model is further improved through the covering protector, it can enable the two groups of moving blocks to drive the covering member to move up and down based on the two groups of vertical plates and the slide rails, so that after the covering member completely covers the electronic component area of ​​the semiconductor chip, it can prevent the invasion of dust and debris generated by the cutting device during cutting, thereby ensuring the cleanliness of the electronic component area and avoiding damage to the electronic components caused by dust, high temperature and debris.

[0014] 2. After the utility model is further improved through the moving block, the cooperation of the solid balancing block can improve the up and down sliding balance of the cover and prevent the occurrence of tilting. Then the limiting ring on the side of the balancing block can determine the position of the pulley, so that after the semiconductor chip is cut, it can directly fall into the inside of the cover. Finally, the effect of the pulley driving the balancing block to rotate can change the position of the cover, so that the semiconductor chip can fall out from the inside of the cover and be removed. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 The utility model is a schematic structural diagram of a clamping device for cutting semiconductor chips.

[0016] Figure 2 The utility model is a three-dimensional structural schematic diagram of an improved covering protector.

[0017] Figure 3 The utility model is a three-dimensional structural schematic diagram of an improved cover.

[0018] Figure 4The utility model is a three-dimensional structural schematic diagram of an improved movable block.

[0019] In the figure: connecting block -1, parallel base -2, clamping frame -3, groove -4, cover protector -5, fixed block -51, vertical plate -52, slide rail -53, moving block -54, cover -55, fitting wall -551, protection frame -552, connecting piece -553, through cavity -554, flexible plate -555, fixed plate -556, connecting end -541, balancing block -542, limiting ring -544, pulley -545. DETAILED DESCRIPTION

[0020] The technical solution of the utility model will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0021] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance. Example

[0022] like Figure 1-Figure 4 As shown, the utility model provides a clamping device for cutting semiconductor chips.

[0023] See also Figure 1 The utility model provides a clamping device for cutting semiconductor chips, comprising: a connecting block 1, a parallel base 2, a clamping frame 3, a groove 4, and a covering protector 5. The connecting block 1 is welded to the left and right sides of the parallel base 2, the center of the parallel base 2 is fixedly connected to the clamping frame 3, the groove 4 runs through the center of the clamping frame 3 and the parallel base 2, and the covering protector 5 is positioned and connected with the parallel base 2 and communicates with the groove 4.

[0024] See also Figure 2The utility model provides a clamping device for cutting semiconductor chips, comprising: the cover protector 5 is provided with a fixed block 51, a vertical plate 52, a slide rail 53, a moving block 54, and a cover 55, the fixed block 51 is embedded in the lower end center of the vertical plate 52, the surface center of the vertical plate 52 and the slide rail 53 are an integrated structure, the moving block 54 is embedded in the slide rail 53, and the cover 55 is fixedly connected to the moving block 54; the fixed block 51 is solid, the vertical plate 52 carries a vertical slide rail 53, and the moving block 54 is arranged on the left and right sides of the cover 55 in a parallel position;

[0025] The fixed block 51 can improve the stability of the vertical fixation of the vertical plate 52 through its solid shape, and the vertical slide rail 53 on the vertical plate 52 can allow the movable block 54 to slide up and down in a vertical direction. The movable block 54 is connected to the cover 55 in a parallel direction to ensure that the cover 55 can move vertically up and down in a stable state.

[0026] See also Figure 3 The utility model provides a clamping device for cutting semiconductor chips, including: the covering member 55 is provided with a fitting wall 551, a protective frame 552, a connecting member 553, a through cavity 554, a flexible board 555, and a fixed board 556; the fitting wall 551 and the lower end of the protective frame 552 are an integrated structure; the left and right sides of the protective frame 552 are fixedly connected with the connecting member 553; the through cavity 554 runs through the center of the protective frame 552; the flexible board 555 covers the upper end of the through cavity 554 and overlaps with the fixed board 556 and is fixedly connected with the protective frame 552; the fitting wall 551 is in a square shape; the outside of the protective frame 552 is solid; the through cavity 554 is opened in a vertical direction; the area of ​​the flexible board 555 is consistent with the area of ​​the fixed board 556;

[0027] The fitting wall 551 can match the shape of the component through its square shape, the protective frame 552 can prevent the invasion of dust and debris according to its solid external shape, the through cavity 554 can allow the semiconductor chip to be embedded through its vertical arrangement, and the flexible board 555 can overlap with the fixed board 556 through its own area, thereby protecting the electronic components on the surface of the semiconductor chip.

[0028] See also Figure 4The utility model provides a clamping device for cutting semiconductor chips, comprising: the moving block 54 is provided with a connecting end 541, a balancing block 542, a limiting ring 544, and a pulley 545, the connecting end 541 and the balancing block 542 are an integrated structure, the limiting ring 544 is embedded in the side center of the balancing block 542, and the pulley 545 is embedded in the side center of the balancing block 542 through the limiting ring 544; the connecting end 541 has a magnetic attraction property, the balancing block 542 is a solid rectangular parallelepiped, the limiting ring 544 is a circular shape and its diameter is greater than the diameter of the pulley 545;

[0029] The connecting end 541 is made of magnetic metal material so as to improve the firmness of connection with the component. The balancing block 542 can improve the stability of connection with the component through its solid rectangular shape. The limiting ring 544 can match the shape of the pulley 545 through its circular shape, thereby allowing the pulley 545 to rotate inside the limiting ring 544.

[0030] The working principle of the utility model is described as follows:

[0031] First, the parallel base 2 of the clamping device is fixed in the cutting device by the connection block 1, so that when the semiconductor chip falls into the groove 4 area through the clamping frame 3, the electronic component area of ​​the semiconductor chip is in a downward parallel effect, and the back of the semiconductor chip is exposed upward, so that it can be connected with the cutter of the cutting device, so that after the semiconductor chip is fixed inside the clamping frame 3, its electronic component area can be covered and protected by the covering protector 5, and finally the dust and debris generated by the cutter of the cutting device from the back edge of the semiconductor chip will not invade the electronic component area of ​​the semiconductor chip, so protection can be achieved, and after the semiconductor chip is cut, its area is reduced and it can fall from the groove 4 area into the covering protector 5, completing the effect of stable clamping and receiving, so that the cutting safety factor and stability of the semiconductor chip can be improved;

[0032] Second: the two sets of vertical plates 52 of the cover protector 5 can be installed on both sides of the surface of the parallel base 2 through the fixed block 51, and then the moving block 54 inside the slide rail 53 can drive the cover 55 to slide up through the cutting equipment electronic control before cutting the semiconductor chip, so as to gradually approach the center of the groove 4 area, and finally the cover 55 covers the electronic component area of ​​the semiconductor chip to achieve a protective effect, avoiding debris and dust pollution that affects the normal use of the electronic components in the later stage;

[0033] Third: the protective frame 552 of the cover 55 can be attached to the surface excess area of ​​the semiconductor element through the attachment wall 551, and at the same time form a corresponding spacing effect with the electronic component area. For this reason, the electronic components of the semiconductor chip will enter the through cavity 554 area of ​​the protective frame 552 and contact the flexible board 555. Finally, after the semiconductor chip is cut, the semiconductor chip will fall as a whole to the surface of the flexible board 555. According to the rubber flexibility of the flexible board 555, the electronic components can be prevented from being damaged due to contact with the electronic components. Then, the flexible board 555 can be installed in the protective frame 552 through the fixing plate 556 of the same shape to achieve a stable use effect. The connecting pieces 553 on the left and right sides of the protective frame 552 can be fixedly connected with the moving block 54 through a rectangular shape, and a stable parallel up and down sliding effect can be achieved according to the same shape.

[0034] Fourth: the solid balancing block 542 of the moving block 54 can achieve a stable up and down sliding effect through the rectangular shape, and then the connecting end 541 at one end of the balancing block 542 can be directly embedded in the connecting piece 553 through a solid form to complete the fixed connection with the cover 55, and then the limiting ring 544 at the side center of the balancing block 542 can determine the position of the pulley 545, so that after the semiconductor chip is cut and falls into the cover 55, the pulley 545 will drive the balancing block 542 to rotate, so that after the position of the cover 55 is changed, the semiconductor chip will fall out downward with the centrifugal force, and the effect of quick removal can be achieved, thereby further improving the use effect of the clamping device.

[0035] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0036] Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the utility model is limited by the appended claims rather than the above description, so it is intended to include all changes within the meaning and scope of the equivalent elements of the claims in the utility model. Any reference numerals in the claims should not be regarded as limiting the claims involved.

Claims

1. A clamping device for cutting semiconductor chips, the structure of which comprises: A connecting block (1), a parallel base (2), a clamping frame (3), a groove (4), and a cover protector (5), characterized in that: the connecting block (1) is welded to the left and right sides of the parallel base (2), the center of the parallel base (2) is fixedly connected to the clamping frame (3), the groove (4) runs through the center of the clamping frame (3) and the parallel base (2), and the cover protector (5) is positioned and connected to the parallel base (2) and communicates with the groove (4); The cover protector (5) is provided with a fixed block (51), a vertical plate (52), a slide rail (53), a moving block (54), and a cover member (55); the fixed block (51) is embedded in the center of the lower end of the vertical plate (52); the center of the surface of the vertical plate (52) and the slide rail (53) are an integrated structure; the moving block (54) is embedded in the slide rail (53); and the cover member (55) is fixedly connected to the moving block (54).

2. A semiconductor chip cutting clamping device according to claim 1, characterized in that: The covering member (55) is provided with a fitting wall (551), a protective frame (552), a connecting member (553), a through cavity (554), a flexible plate (555), and a fixing plate (556); the fitting wall (551) and the lower end of the protective frame (552) are an integrated structure; the left and right sides of the protective frame (552) are fixedly connected to the connecting member (553); the through cavity (554) runs through the center of the protective frame (552); the flexible plate (555) covers the upper end of the through cavity (554) and overlaps with the fixing plate (556) while being fixedly connected to the protective frame (552).

3. A semiconductor chip cutting clamping device according to claim 1, characterized in that: The moving block (54) is provided with a connecting end (541), a balancing block (542), a limiting ring (544), and a pulley (545); the connecting end (541) and the balancing block (542) are an integrated structure; the limiting ring (544) is embedded in the center of the side of the balancing block (542); and the pulley (545) is embedded in the center of the side of the balancing block (542) through the limiting ring (544).

4. A semiconductor chip cutting clamping device according to claim 1, characterized in that: The fixed block (51) is solid, the vertical plate (52) carries a vertical slide rail (53), and the movable block (54) is arranged on the left and right sides of the cover (55) in a parallel position.

5. A semiconductor chip cutting clamping device according to claim 2, characterized in that: The fitting wall (551) is in a square shape, the exterior of the protection frame (552) is solid, the through cavity (554) is opened in a vertical direction, and the area of ​​the flexible plate (555) is consistent with that of the fixed plate (556).

6. A semiconductor chip cutting clamping device according to claim 3, characterized in that: The connecting end (541) has a magnetic attraction property, the balancing block (542) is in the form of a solid rectangular parallelepiped, and the limiting ring (544) is in a circular shape and has a diameter greater than that of the pulley (545).

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