Sound box pairing device based on sound box wire and system thereof

Abstract

The utility model belongs to the technical field of communication, and relates to a sound box pairing device and system based on a sound box line, and the device comprises an audio line, a first earphone seat, a second earphone seat, a first inserted audio line detection circuit, a second inserted audio line detection circuit, a first serial port half-duplex conversion circuit, and a second serial port half-duplex conversion circuit. According to the technical scheme provided by the invention, through a mode of combining the audio cable, the earphone seat and the serial port half-duplex conversion circuit, automatic pairing can be realized by inserting the two heads of the audio cable into the sound box to be subjected to TWS pairing, the operation is simple and rapid, and the production test efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and more specifically, to a speaker pairing device based on a speaker cable and a system thereof. Background Art

[0002] TWS (True Wireless Stereo) transforms the wired connection between the left and right channels of previous Bluetooth headsets into a wireless connection, thereby achieving true wireless separation of the left and right channels.

[0003] Currently, wireless speakers that can be used in pairs are sold either individually or as a pair. For individual speakers, if the user needs two speakers to experience the stereo effect after pairing, they need to purchase two speakers separately and pair them themselves. Alternatively, if two paired speakers become mismatched, they also need to be paired again.

[0004] As more and more Bluetooth speakers or conference speakers are paired with another wireless speaker, the current general pairing method is often to notify the speaker's main control chip through a combination of buttons or long press the button, and the speaker enters the TWS pairing mode under the control of the main control chip. This is a wireless transmission command pairing method. When this pairing method is used during the production process, TWS pairing cannot be completed due to signal interference or insufficient power, or when multiple devices turn on TWS pairing at the same time, they cannot connect to the speakers they want to pair, resulting in low production test efficiency and extremely inconvenient button operation. Utility Model Content

[0005] The technical problem to be solved by the embodiments of the present application is that there is signal interference in the existing pairing method in production, and pairing cannot be completed under the condition of signal interference. When multiple devices turn on TWS pairing at the same time, they cannot connect to the speakers they want to pair with, resulting in low production efficiency and inconvenient TWS pairing operation.

[0006] In order to solve the above technical problems, the embodiment of the present application provides a speaker pairing device based on a speaker cable, which uses serial port half-duplex communication to realize TWS pairing of two speakers, and adopts the following technical solution:

[0007] It includes an audio line, a first earphone seat, a second earphone seat, a first audio line insertion detection circuit, a second audio line insertion detection circuit, a first serial port half-duplex conversion circuit and a second serial port half-duplex conversion circuit;

[0008] The audio cable is connected to the first headphone socket and the second headphone socket respectively, so as to connect the paired first speaker and the second speaker;

[0009] The first earphone socket is connected to the first audio line insertion detection circuit, and the second earphone socket is connected to the second audio line insertion detection circuit;

[0010] The first audio line insertion detection circuit is connected to the GPIO port of the first main control chip of the first speaker, and the second audio line insertion detection circuit is connected to the GPIO port of the second main control chip of the second speaker; the first audio line insertion detection circuit is used to detect whether the first earphone socket is inserted with an audio line, and the second audio line insertion detection circuit is used to detect whether the second earphone socket is inserted with an audio line, and determines whether to insert the audio line according to the level change detected by the GPIO port of the first main control chip and / or the second main control chip to perform serial port half-duplex communication;

[0011] The first serial port half-duplex conversion circuit is connected to the first main control chip, and the second serial port half-duplex conversion circuit is connected to the second main control chip, and is used to process the data signal sent by the first main control chip and transmit it to the second main control chip through the first headphone socket, the audio cable, the second headphone socket and the second serial port half-duplex conversion circuit during the speaker serial port half-duplex communication.

[0012] Furthermore, the first headphone socket is provided with a serial port data transceiver pin 2, a GND pin 1, an audio line detection pin 6, a first ESD tube and a second ESD tube; the serial port data transceiver pin 2 is connected to the first serial port half-duplex conversion circuit and is grounded through the first ESD tube; the audio line detection pin 6 is connected to the first audio line insertion detection circuit and is grounded through the second ESD tube.

[0013] Further, the first audio line insertion detection circuit includes a pull-up resistor, a pull-down resistor, a current limiting resistor and a first capacitor;

[0014] The first end of the pull-up resistor is connected to the first main control chip and the first end of the current limiting resistor respectively, and the second end of the pull-up resistor is connected to the working power supply;

[0015] The first end of the pull-down resistor is connected to the 4th pin of the first headphone socket, and the second end of the pull-down resistor is grounded;

[0016] The second end of the current limiting resistor is connected to the audio line detection 6 pin;

[0017] A first end of the first capacitor is connected to a first end of the current limiting resistor, and a second end of the first capacitor is grounded.

[0018] Furthermore, the first serial port half-duplex conversion circuit includes a data sending module and a data receiving module;

[0019] The data sending module is connected to the first main control chip and the serial port data receiving and transmitting pin 2 respectively, and is used to process the data signal sent by the first main control chip and transmit it to the first earphone socket through the serial port data receiving and transmitting pin 2;

[0020] The data receiving module is connected to the first main control chip and the serial port data transceiver pin 2 respectively, and is used to receive the data signal sent by the second main control chip and transmit it to the first main control chip.

[0021] Further, the data sending module includes a first transistor, a first resistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor and a serial port sending pin of a main control chip;

[0022] The base of the first transistor is connected to the first end of the second resistor, the collector of the first transistor is respectively connected to the first end of the third resistor and the first end of the fourth resistor, and the emitter of the first transistor is grounded;

[0023] A first end of the first resistor is connected to the working power supply, and a second end of the first resistor is connected to a common connection point of the first end of the fifth resistor and the second end of the second resistor;

[0024] The first end of the third resistor is connected to the first end of the fourth resistor and the collector of the first transistor respectively, and the second end of the third resistor is connected to the working power supply;

[0025] The second end of the fourth resistor is connected to the data receiving module and the serial port data receiving and transmitting pin 2 of the first earphone socket respectively;

[0026] The second end of the fifth resistor is connected to the serial port sending pin of the main control chip.

[0027] Further, the data receiving module includes a sixth resistor, a seventh resistor, an eighth resistor, a second transistor and a serial port receiving pin of the main control chip;

[0028] The first end of the sixth resistor is connected to the working power supply, and the second end of the sixth resistor is connected to the first end of the eighth resistor and the collector of the second transistor respectively;

[0029] The first end of the seventh resistor is connected to the second end of the fourth resistor and the serial port data receiving and transmitting pin 2 of the first headphone socket, and the second end of the seventh resistor is connected to the base of the second transistor;

[0030] The second end of the eighth resistor is connected to the serial port receiving pin of the main control chip;

[0031] The emitter of the second transistor is grounded.

[0032] Furthermore, the audio cable adopts a three-section audio cable or a four-section audio cable.

[0033] Furthermore, the audio cable is provided with a first plug and a second plug connected by wire, the first plug is connected to the first earphone socket, and the second plug is connected to the second earphone socket;

[0034] The first plug includes the first GPIO audio line detection pin, the first serial port data transceiver pin and the first ground pin; the second plug includes the second GPIO audio line detection pin, the second serial port data transceiver pin and the second ground pin.

[0035] Furthermore, the first headphone socket and the second headphone socket adopt the same circuit structure, the first audio line insertion detection circuit and the second audio line insertion detection circuit adopt the same circuit structure, and the first serial port half-duplex conversion circuit and the second serial port half-duplex conversion circuit adopt the same circuit structure.

[0036] In order to solve the above technical problems, the embodiment of the present application further provides a speaker pairing system based on a speaker cable, which adopts the following technical solution:

[0037] A pairing speaker is included, wherein the pairing speaker is provided with a speaker pairing device based on a speaker line as described above, wherein the pairing speaker includes a first speaker and a second speaker, wherein the first speaker is provided with a first earphone socket, a first inserted audio line detection circuit, a first serial port half-duplex conversion circuit and a first main control chip, wherein the first main control chip is connected to the first inserted audio line detection circuit via a GPIO port, and the first main control chip is connected to the first serial port half-duplex conversion circuit via a data sending pin and a data receiving pin;

[0038] The second speaker is provided with a second headphone socket, a second audio line insertion detection circuit, a second serial port half-duplex conversion circuit and a second main control chip. The second main control chip is connected to the second audio line insertion detection circuit through the GPIO port, and the second main control chip is connected to the second serial port half-duplex conversion circuit through a data sending pin and a data receiving pin.

[0039] The speaker pairing device based on the speaker cable provided in the present application includes an audio cable, a first headphone socket, a second headphone socket, a first audio cable insertion detection circuit, a second audio cable insertion detection circuit, a first serial port half-duplex conversion circuit and a second serial port half-duplex conversion circuit. By combining the audio cable, the headphone socket and the serial port half-duplex conversion circuit, the two ends of the audio cable can be inserted into the speakers to be TWS paired, so that automatic pairing can be achieved. The operation is simple and fast, which improves the production test efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the scheme in the present application, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0041] Figure 1 is a structural block diagram of an embodiment of a speaker pairing device based on a speaker line provided by the present application;

[0042] Figure 2 is a circuit schematic diagram of an embodiment of a speaker pairing device based on a speaker cable provided by the present application;

[0043] Figure 3 is a structural schematic diagram of an embodiment of an audio cable provided by the present application;

[0044] Figure 4 This is a circuit schematic diagram of another embodiment of the speaker pairing device based on the speaker cable provided in the present application. DETAILED DESCRIPTION

[0045] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of this application; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0046] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0047] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings.

[0048] In the embodiment of the present application, a speaker pairing device based on a speaker line is provided. Figure 1As shown, it includes an audio line 10, a first earphone socket 20, a second earphone socket 21, a first audio line insertion detection circuit 30, a second audio line insertion detection circuit 31, a first serial port half-duplex conversion circuit 40 and a second serial port half-duplex conversion circuit 41.

[0049] The audio cable 10 is connected to the first earphone socket 20 and the second earphone socket 21 respectively, for connecting the paired first speaker and the second speaker; the first earphone socket 20 is connected to the first inserted audio line detection circuit 30, and the second earphone socket 21 is connected to the second inserted audio line detection circuit 31.

[0050] The first audio line insertion detection circuit 30 is connected to the GPIO port of the first main control chip (not shown in the figure) of the first speaker, and the second audio line insertion detection circuit 31 is connected to the GPIO port of the second main control chip (not shown in the figure) of the second speaker; the first audio line insertion detection circuit 30 is used to detect whether the first earphone socket 20 is inserted into the audio line 10, and the second audio line insertion detection circuit 31 is used to detect whether the second earphone socket 21 is inserted into the audio line 10, and determines whether the audio line 10 is inserted according to the level change detected by the GPIO port of the first main control chip and / or the second main control chip to perform serial port half-duplex (UART) communication. If the audio line 10 is inserted, UART communication starts.

[0051] The first serial port half-duplex conversion circuit 40 is connected to the first main control chip, and the second serial port half-duplex conversion circuit 41 is connected to the second main control chip, and is used to process the pairing data signal sent by the first main control chip and transmit it to the second main control chip through the first earphone socket 20, the audio cable 10, the second earphone socket 21 and the second serial port half-duplex conversion circuit 41 during the speaker UART half-duplex communication.

[0052] In some embodiments, see Figure 2 As shown, the first earphone jack 20 is provided with 1 to 6 pins, wherein the used pins are: 1 pin is a ground pin GND (GND 1 pin), 2 pin is a UART DATA (serial port transceiver pin) pin (i.e., serial port transceiver data 2 pin), 6 pin is an AUX DET (audio line detection) pin (i.e., audio line detection 6 pin), and when no audio line is inserted, 6 pin is connected to 4 pin. 2 pin (UART DATA pin) of the first earphone jack 20 is also connected to a first ESD tube ESD1, and 6 pin of the first earphone jack 20 is also connected to a second ESD tube ESD2, which is used to prevent static electricity and surge, and play a role in protecting the circuit.

[0053] In some embodiments, the first headphone socket 20 is further provided with a third ESD tube and a fourth ESD tube, wherein pin 4 of the first headphone socket 20 is grounded through the third ESD tube ESD3; pin 3 of the first headphone socket 20 is grounded through the fourth ESD tube ESD4.

[0054] In some embodiments, see Figure 2 As shown, the first inserted audio line detection circuit 30 includes a pull-up resistor R1, a pull-down resistor R2, a current limiting resistor R21 and a first capacitor C1. The first end of the pull-up resistor R1 is connected to the GPIO port of the first main control chip and the first end of the current limiting resistor R21, respectively, and the second end of the pull-up resistor R1 is connected to the working power supply VCC; the second end of the current limiting resistor R21 is connected to the audio line detection 6-pin AUX DET of the first earphone socket 20, the first end of the pull-down resistor R2 is connected to the 4-pin of the first earphone socket 20, and the second end of the pull-down resistor R2 is grounded; the first end of the first capacitor C1 is connected to the first end of the current limiting resistor R21, and the second end of the first capacitor C1 is grounded.

[0055] In this embodiment, the first earphone socket 20 and the second earphone socket 21 can adopt the same circuit structure. For details, see Figure 4 As shown, the second earphone jack 21 is provided with pins 1 to 6, wherein the used pins are: pin 1 is a ground pin GND, pin 2 is a UART DATA pin, and pin 6 is an audio line detection pin AUX DET. When no audio line is inserted, pins 6 and 4 are connected, and pin 2 (UART DATA pin) of the second earphone jack 21 is also connected with an electrostatic tube ESD7, and the audio line detection pin 6 AUX DET of the second earphone jack 21 is also connected with an electrostatic tube ESD8, which is used to prevent static electricity and surge, and play a role in protecting the circuit.

[0056] In some embodiments, the second headphone socket 21 is further provided with electrostatic tubes ESD5 and ESD6, wherein pin 4 of the second headphone socket 21 is grounded through ESD5; and pin 3 of the second headphone socket 21 is grounded through ESD6.

[0057] In some embodiments, see Figure 4As shown, the second insertion signal detection circuit 31 and the first insertion signal detection circuit 30 adopt the same circuit structure. Specifically, the second insertion audio line detection circuit 31 includes a pull-up resistor R19, a pull-down resistor R20, a resistor R22 and a second capacitor C2. The first end of the pull-up resistor R19 is respectively connected to the GPIO port of the second main control chip (not shown in the figure) and the first end of the resistor R22, and the second end of the pull-up resistor R19 is connected to the working power supply VCC; the second end of the resistor R22 is connected to the 6-pin detection pin AUX DET of the second earphone socket 21, the first end of the resistor R22 is connected to the second main control chip (not shown in the figure) and the first end of the resistor R19, the first end of the pull-down resistor R20 is connected to the 4-pin of the second earphone socket 21, and the second end of the pull-down resistor R20 is grounded; the first end of the second capacitor C2 is connected to the 6-pin detection pin AUX DET of the second earphone socket 21, and the second end of the second capacitor C2 is grounded.

[0058] The first inserted audio line detection circuit 30 cooperates with the first earphone socket 20 to realize the function of detecting whether the audio line 10 is inserted. Specifically, when the audio line 10 is not inserted into the first earphone socket 20, the 6-pin AUX DET and the 4-pin of the first earphone socket 20 are connected together, the detection pin 6-pin AUX DET is connected to the GPIO port of the first main control chip through the current limiting resistor R21, the working voltage VCC is connected to the detection pin 6-pin AUX DET of the first earphone socket 20 through the pull-up resistor R1 (100K), and the 4-pin of the first earphone socket 20 is grounded through the pull-down resistor R2 (10K). At this time, the detection pin 6-pin AUXDET of the first main control chip is a low level; when the audio line 10 is inserted into the first earphone socket 20, the 6-pin AUX DET and the 4-pin of the first earphone socket 20 will be disconnected, and the detection pin 6-pin AUX DET of the first main control chip will be disconnected. DET is at a high level. At this time, the first main control chip knows that the audio cable 10 has been inserted, and the serial port sending pin UART_TXD of the first main control chip sends a pairing data signal, which is processed by the first serial port half-duplex conversion circuit 40 and transmitted to pin 2 (UART_DATA) of the first earphone socket 20, and then transmitted to pin 2 (UART_DATA) of the second earphone socket 21 of the second speaker through the audio cable 10, and then processed by the second serial port half-duplex conversion circuit 41 and transmitted to the serial port receiving pin UART_RXD of the second main control chip. The second main control chip receives the data signal and realizes TWS pairing of the first speaker and the second speaker through serial port half-duplex communication.

[0059] The second audio line insertion detection circuit 31 cooperates with the second earphone socket 21 to realize the function of detecting whether the audio line 10 is inserted. The working principle is the same as above and will not be repeated here.

[0060] In some embodiments, the pins of the first earphone socket 20 also lead out to test points. Specifically, pin 4 leads to the first test point TP1, pin 2 leads to the third test point TP3, pin 6 leads to the fourth test point TP4, and the ground pin GND leads to the fifth test point TP5, which is convenient for the test pairing fixture to connect to the PCBA.

[0061] Correspondingly, the pins of the second earphone socket 21 also lead out to test points. Specifically, pin 4 leads to the sixth test point TP6, pin 2 leads to the eighth test point TP8, pin 6 leads to the ninth test point TP9, and the ground pin GND leads to the tenth test point TP10, which is convenient for the test pairing fixture to connect the PCBA (Printed Circuit Board Assembly).

[0062] In some embodiments, Figure 2 As shown, the first serial port half-duplex conversion circuit 40 includes a data sending module 401 and a data receiving module 402; the data sending module 401 is respectively connected to the first main control chip and the 2-pin serial port data receiving and transmitting 2 pins (UART DATA) of the first earphone socket 20, and is used to process the data signal sent by the first main control chip and transmit it to the 2 pins of the first earphone socket 20; the data receiving module 402 is respectively connected to the first main control chip and the 2 pins (UARTDATA) of the first earphone socket 20, and is used to receive the data signal sent by the second main control chip and transmit it to the first main control chip. In other words, the first serial port half-duplex conversion circuit 40 can process the sent data and the received data.

[0063] In some embodiments, Figure 2As shown, the data sending module 401 includes a first transistor Q1, a first resistor R3, a second resistor R4, a third resistor R5, a fourth resistor R6, a fifth resistor R15 and a serial port sending pin UART_TXD of the main control chip, wherein the base of the first transistor Q1 is connected to the first end of the second resistor R4, the collector of the first transistor Q1 is respectively connected to the first end of the third resistor R5 and the first end of the fourth resistor R6, and the emitter of the first transistor Q1 is grounded; the first end of the first resistor R3 is connected to the working power supply VCC, and the second end of the first resistor R3 is connected to the working power supply VCC. The first end of the second resistor R4 is connected to the base of the first transistor Q1, and the second end of the second resistor R4 is connected to the first end of the fifth resistor R15; the first end of the third resistor R5 is respectively connected to the first end of the fourth resistor R6 and the collector of the first transistor Q1, and the second end of the third resistor R5 is connected to the working power supply VCC; the second end of the fourth resistor R6 is respectively connected to the data receiving module 402 and the serial port data receiving and transmitting pin 2 UART DATA of the first earphone socket 20; the emitter of the first transistor Q1 is grounded, and the fifth resistor R15 is connected to the serial port sending pin UART_TXD of the first main control chip.

[0064] In some embodiments, Figure 2 As shown, the data receiving module 402 includes a sixth resistor R7, a seventh resistor R8, an eighth resistor R16, a second transistor Q2 and a serial port receiving pin UART_RXD of a main control chip; a first end of the sixth resistor R7 is connected to a working power supply VCC, and a second end is respectively connected to a first end of the eighth resistor R16 and a collector of the second transistor Q2; a second end of the seventh resistor R8 and a fourth resistor R6 is connected to pin UART DATA 2 of the first earphone socket 20, and a second end of the seventh resistor R8 is connected to a base of the second transistor Q2; an emitter of the second transistor Q2 is grounded, and a second end of the eighth resistor R16 is connected to a serial port receiving pin UART_RXD of the first main control chip.

[0065] In some embodiments, Figure 4 As shown, the second serial port half-duplex conversion circuit 41 adopts the same circuit structure as the first serial port half-duplex conversion circuit 40. Specifically, the second serial port half-duplex conversion circuit 41 includes a data sending module 411 and a data receiving module 412; the data sending module 411 is respectively connected to the second main control chip and the 2-pin UARTDATA of the second headphone socket 21; the data receiving module 412 is respectively connected to the second main control chip and the 2-pin UART DATA of the second headphone socket 21.

[0066] Among them, Figure 4As shown, the data sending module 411 includes a transistor Q3, a resistor R9, a resistor R10, a resistor R11 and a resistor R12, and a resistor R17. One end of the resistor R9 is connected to the power supply VCC, and the other end is connected to the first ends of the resistors R10 and R17; the second end of the resistor R10 is connected to the base of the transistor Q3; the first end of the resistor R11 is connected to the working power supply VCC, and the second end of the resistor R11 is respectively connected to the first end of the resistor R12 and the collector of the transistor Q3; the second end of the resistor R12 is respectively connected to the resistor R14 in the data receiving module 412 and the 2-pin UART DATA of the second earphone socket 21; the emitter of the transistor Q3 is grounded, and the resistor R17 is connected to the serial port sending pin of the second main control chip.

[0067] like Figure 4 As shown, the data receiving module 412 includes a resistor R13, a resistor R14, a resistor R18 and a transistor Q4; the first end of the resistor R13 is connected to the working power supply VCC, and the second end of the resistor R13 is connected to the resistor R18 and the collector of the transistor Q4 respectively; the first end of the resistor R14 is connected to the 2-pin UART DATA of the second earphone socket 21, and the second end of the resistor R14 is connected to the base of the transistor Q4; the emitter of the transistor Q4 is grounded, and the resistor R18 is connected to the serial port receiving pin of the second main control chip

[0068] In this embodiment, the working principles of the first serial port half-duplex conversion circuit 40 and the second serial port half-duplex conversion circuit 41 are as follows:

[0069] Because it is a serial communication, the data sent is composed of binary, and the binary 1 represents a high level (3.3V) and 0 represents a low level (0V). When the serial port sending pin of the first main control chip sends data, if the sent data is a high level, the first main control chip sends the high level data signal to the first serial port half-duplex conversion circuit 40 through the data sending pin TXD, and the base of the transistor Q1 is at a high level, and the transistor Q1 is turned on. Since the emitter of the transistor Q1 is grounded, the collector of the transistor Q1 is in a low level state, and the low level data signal is transmitted to the 2-pin UART DATA of the first headphone socket 20, and then transmitted to the 2-pin UART DATA of the second headphone socket 21 through the audio line 10, and the 2-pin UART DATA transmits the low-level data signal to the second serial port half-duplex conversion circuit 41. At this time, the base of the transistor Q4 is in a low-level state, the transistor Q4 is cut off, and the collector of the transistor Q4 is high-level, and the high-level data signal is transmitted to the serial port receiving pin of the second main control chip; if the transmitted data is low-level, the first main control chip sends the low-level data signal to the first serial port half-duplex conversion circuit 40 through the data transmission pin TXD, the base of the transistor Q1 is low-level, the transistor Q1 is cut off, so that the collector of the transistor Q1 is in a high-level state, and the high-level data signal is transmitted to the 2-pin UART DATA of the headphone socket 20, and then transmitted to the 2-pin UART DATA of the second headphone socket 21 through the audio line 10, and the 2-pin UART DATA transmits the high-level data signal to the second serial port half-duplex conversion circuit 41. At this time, the base of the transistor Q4 is in a high-level state, the transistor Q4 is turned on, the collector of the transistor Q4 is at a low level, and the low-level data signal is transmitted to the serial port receiving pin of the second main control chip to complete the sending and receiving of data 1 or 0.

[0070] When the second main control chip sends data, the working principle is the same as above and will not be repeated here.

[0071] In some embodiments, the audio cable 10 uses three sections or four sections of audio cable. The specifications of the audio cable 10 need to be selected according to the pin connection of the headphone socket. Each section of the audio cable can be connected to the pin of the headphone socket one by one.

[0072] In some embodiments, Figure 3 As shown, the audio cable 10 is provided with a first plug 11 and a second plug 12 connected by wire, the first plug 11 is connected to a first earphone socket 20, and the second plug 12 is connected to a second earphone socket 21;

[0073] The first plug 11 includes a first GPIO detection audio pin 111, a first data pin URAT_DATA1 and a first ground pin GND; the second matching pin 12 includes a second GPIO detection audio pin 121, a second data pin URAT_DATA2 and a second ground pin GND.

[0074] It should be noted that the components in this application, including transistors, resistors, capacitors, and ESD tubes, etc., and their corresponding device parameters can be debugged and selected according to actual conditions, and are not limited here.

[0075] The present application also provides a speaker pairing system based on a speaker line, including a paired speaker, wherein the paired speaker is provided with a speaker pairing device based on a speaker line as described above, wherein the paired speaker includes a first speaker and a second speaker, wherein the first speaker is provided with a first earphone socket 20, a first inserted audio line detection circuit 30, a first serial port half-duplex conversion circuit 40 and a first main control chip, wherein the first main control chip is connected to the first inserted audio line detection circuit 30 via a GPIO port, and the first main control chip is connected to the first serial port half-duplex conversion circuit 40 via a main control chip serial port sending pin UART_TXD and a main control chip serial port receiving pin UART_RXD;

[0076] The second speaker is provided with a second earphone socket 21, a second inserted audio line detection circuit 31, a second serial port half-duplex conversion circuit 41 and a second main control chip. The second main control chip is connected to the second inserted audio line detection circuit 31 through the GPIO port, and the second main control chip is connected to the second serial port half-duplex conversion circuit 41 through the main control chip serial port sending pin UART_TXD and the main control chip serial port receiving pin UART_RXD.

[0077] The speaker pairing device and system based on the speaker cable provided in the present application, through the combination of the audio cable, the headphone socket and the serial port half-duplex conversion circuit, can realize automatic pairing by inserting the two ends of the audio cable into the speakers to be TWS paired. The operation is simple and fast, which improves the efficiency of TWS pairing of production speakers.

[0078] Obviously, the embodiments described above are only some embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to perform equivalent replacement of some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of this application, directly or indirectly used in other related technical fields, is similarly within the scope of patent protection of this application.

Claims

1. A speaker pairing device based on a speaker cable, characterized in that: include: An audio line, a first earphone socket, a second earphone socket, a first audio line insertion detection circuit, a second audio line insertion detection circuit, a first serial port half-duplex conversion circuit, and a second serial port half-duplex conversion circuit; The audio cable is connected to the first headphone socket and the second headphone socket respectively, so as to connect the paired first speaker and the second speaker; The first earphone socket is connected to the first audio line insertion detection circuit, and the second earphone socket is connected to the second audio line insertion detection circuit; The first audio line insertion detection circuit is connected to the GPIO port of the first main control chip of the first speaker, and the second audio line insertion detection circuit is connected to the GPIO port of the second main control chip of the second speaker; the first audio line insertion detection circuit is used to detect whether the first earphone socket is inserted with an audio line, and the second audio line insertion detection circuit is used to detect whether the second earphone socket is inserted with an audio line, and determines whether to insert the audio line according to the level change detected by the GPIO port of the first main control chip and / or the second main control chip to perform serial port half-duplex communication; The first serial port half-duplex conversion circuit is connected to the first main control chip, and the second serial port half-duplex conversion circuit is connected to the second main control chip, and is used to process the data signal sent by the first main control chip and transmit it to the second main control chip through the first headphone socket, the audio cable, the second headphone socket and the second serial port half-duplex conversion circuit during the speaker serial port half-duplex communication.

2. The speaker pairing device based on a speaker cable according to claim 1, characterized in that: The first headphone socket is provided with serial port data transceiver pin 2, GND pin 1, audio line detection pin 6, a first ESD tube and a second ESD tube; the serial port data transceiver pin 2 is connected to the first serial port half-duplex conversion circuit and is grounded through the first ESD tube; the audio line detection pin 6 is connected to the first audio line insertion detection circuit and is grounded through the second ESD tube.

3. The speaker pairing device based on speaker cable according to claim 2, characterized in that: The first audio line insertion detection circuit includes a pull-up resistor, a pull-down resistor, a current limiting resistor and a first capacitor; The first end of the pull-up resistor is connected to the first main control chip and the first end of the current limiting resistor respectively, and the second end of the pull-up resistor is connected to the working power supply; The first end of the pull-down resistor is connected to the 4th pin of the first headphone socket, and the second end of the pull-down resistor is grounded; The second end of the current limiting resistor is connected to the audio line detection 6 pin; A first end of the first capacitor is connected to a first end of the current limiting resistor, and a second end of the first capacitor is grounded.

4. The speaker pairing device based on speaker cable according to claim 2, characterized in that: The first serial port half-duplex conversion circuit includes a data sending module and a data receiving module; The data sending module is connected to the first main control chip and the serial port data receiving and transmitting pin 2 respectively, and is used to process the data signal sent by the first main control chip and transmit it to the first earphone socket through the serial port data receiving and transmitting pin 2; The data receiving module is connected to the first main control chip and the serial port data transceiver pin 2 respectively, and is used to receive the data signal sent by the second main control chip and transmit it to the first main control chip.

5. The speaker pairing device based on speaker cable according to claim 4, characterized in that: The data sending module includes a first transistor, a first resistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor and a serial port sending pin of a main control chip; The base of the first transistor is connected to the first end of the second resistor, the collector of the first transistor is respectively connected to the first end of the third resistor and the first end of the fourth resistor, and the emitter of the first transistor is grounded; The first end of the first resistor is connected to the working power supply, and the second end of the first resistor is connected to a common connection point of the first end of the fifth resistor and the second end of the second resistor; The first end of the third resistor is connected to the first end of the fourth resistor and the collector of the first transistor respectively, and the second end of the third resistor is connected to the working power supply; The second end of the fourth resistor is connected to the data receiving module and the serial port data receiving and transmitting pin 2 of the first earphone socket respectively; The second end of the fifth resistor is connected to the serial port sending pin of the main control chip.

6. The speaker pairing device based on speaker cable according to claim 5, characterized in that: The data receiving module includes a sixth resistor, a seventh resistor, an eighth resistor, a second transistor and a serial port receiving pin of a main control chip; The first end of the sixth resistor is connected to the working power supply, and the second end of the sixth resistor is connected to the first end of the eighth resistor and the collector of the second transistor respectively; The first end of the seventh resistor is connected to the second end of the fourth resistor and the serial port data receiving and transmitting pin 2 of the first headphone socket, and the second end of the seventh resistor is connected to the base of the second transistor; The second end of the eighth resistor is connected to the serial port receiving pin of the main control chip; The emitter of the second transistor is grounded.

7. The speaker pairing device based on a speaker cable according to any one of claims 1 to 6, characterized in that: The audio cable adopts a three-section audio cable or a four-section audio cable.

8. The speaker pairing device based on a speaker cable according to any one of claims 1 to 6, characterized in that: The audio cable is provided with a first plug and a second plug connected by wire, the first plug is connected to the first earphone socket, and the second plug is connected to the second earphone socket; The first plug includes a first GPIO audio line detection pin, a first serial port data transceiver pin and a first ground pin; the second plug includes a second GPIO audio line detection pin, a second serial port data transceiver pin and a second ground pin.

9. The speaker pairing device based on a speaker cable according to any one of claims 1 to 6, characterized in that: The first headphone socket and the second headphone socket adopt the same circuit structure, the first audio line insertion detection circuit and the second audio line insertion detection circuit adopt the same circuit structure, and the first serial port half-duplex conversion circuit and the second serial port half-duplex conversion circuit adopt the same circuit structure.

10. A speaker pairing system based on a speaker cable, comprising paired speakers, characterized in that: The paired speakers are provided with a speaker pairing device based on a speaker line as described in any one of claims 1 to 9, wherein the paired speakers include a first speaker and a second speaker, the first speaker is provided with a first earphone socket, a first inserted audio line detection circuit, a first serial port half-duplex conversion circuit and a first main control chip, the first main control chip is connected to the first inserted audio line detection circuit through a GPIO port, and the first main control chip is connected to the first serial port half-duplex conversion circuit through a data sending pin and a data receiving pin; The second speaker is provided with a second headphone socket, a second audio line insertion detection circuit, a second serial port half-duplex conversion circuit and a second main control chip. The second main control chip is connected to the second audio line insertion detection circuit through the GPIO port, and the second main control chip is connected to the second serial port half-duplex conversion circuit through a data sending pin and a data receiving pin.

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