Mobile phone heat dissipation component

Abstract

The utility model discloses a mobile phone heat dissipation component, comprising: a metal layer, a heat conduction layer and a packaging layer; the metal layer is arranged between the heat conduction layer and the packaging layer. The mobile phone heat dissipation component of the utility model is connected to the mobile phone by arranging the heat conduction layer, and the metal layer is used as the base material of the heat conduction layer and the packaging layer. Compared with the prior art, the heat conduction performance of the component is better, the internal material is not layered, and no edge wrapping is required, which increases the effective heat dissipation area and improves the heat dissipation performance.

Description

Technical Field

[0001] The utility model relates to the field of mobile phone accessories, in particular to a mobile phone heat dissipation component. Background Art

[0002] As smartphones become full-screen and have higher requirements for brightness, power consumption is also increasing. Usually, a graphite sheet is added to the iron frame on the back of the backlight to dissipate heat. However, the graphite sheet is prone to delamination, so it needs to be edge-wrapped, but edge wrapping will reduce the heat dissipation capacity of the graphite sheet.

[0003] Therefore, there is an urgent need to propose a heat dissipation component for efficient heat dissipation of smart phones. Utility Model Content

[0004] The purpose of the utility model is to overcome the deficiencies in the prior art and provide a heat dissipation component for smart phones to dissipate heat efficiently.

[0005] The purpose of this utility model is achieved through the following technical solutions:

[0006] A mobile phone heat dissipation component comprises: a metal layer, a heat-conducting layer and a packaging layer; the metal layer is arranged between the heat-conducting layer and the packaging layer.

[0007] In one embodiment, the metal layer is a copper foil layer.

[0008] In one embodiment, the thickness tolerance of the copper foil layer is 10%.

[0009] In one embodiment, the copper foil layer has a thickness of 0.025 mm.

[0010] In one embodiment, the metal layer is an aluminum foil layer.

[0011] In one embodiment, the packaging layer is a ceramic layer.

[0012] In one embodiment, the ceramic layer preferably has a thickness of 0.02 mm.

[0013] In one embodiment, the ceramic layer is a nano-ceramic layer.

[0014] In one embodiment, the heat conductive layer is an acrylate layer.

[0015] In one embodiment, the thickness of the acrylate layer is 0.01 mm.

[0016] Compared with the prior art, the utility model has at least the following advantages:

[0017] 1. The mobile phone heat dissipation component of the utility model is connected to the mobile phone by setting a heat-conducting layer. The metal layer serves as the base material of the heat-conducting layer and the packaging layer. Compared with the prior art, the thermal conductivity of the component is better, the internal material is not layered, and no edge wrapping is required, which increases the effective heat dissipation area and improves the heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.

[0019] Figure 1 The figure is a schematic structural diagram of a mobile phone heat dissipation assembly in one embodiment of the utility model.

[0020] Reference numerals:

[0021] Mobile phone heat dissipation component 10, metal layer 20, heat conduction layer 30, packaging layer 40. DETAILED DESCRIPTION

[0022] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.

[0023] The present application proposes a mobile phone heat dissipation component 10, including a metal layer 20, a heat-conducting layer 30 and a packaging layer 40. The metal layer 20 is used, and the heat-conducting layer 30 is used to export the heat generated by the smart phone when it is working to the heat-conducting layer 30, and the packaging layer 40 is used to seal the metal layer 20 and the heat-conducting layer 30 to protect the internal structure. Specifically, the metal layer 20 is arranged between the heat-conducting layer 30 and the packaging layer 40. The mobile phone heat dissipation component 10 of the present application is connected to the mobile phone by setting a heat-conducting layer 30, and the metal layer 20 serves as the substrate of the heat-conducting layer 30 and the packaging layer 40. Compared with the prior art, the thermal conductivity of the component is better, the internal material is not layered, and no edge wrapping is required, which increases the effective heat dissipation area and improves the heat dissipation performance.

[0024] It should be noted that the mobile phone heat dissipation component 10 is arranged on the back of the mobile phone, and the heat on the back of the mobile phone is conducted to the metal layer 20 through the heat conductive layer 30, and then the heat generated by the mobile phone is conducted to the outside through the packaging layer 40.

[0025] In one embodiment, the metal layer 20 is a copper foil layer, which is made of metal copper. The copper foil has excellent thermal conductivity, can quickly conduct the heat on the mobile phone vertically to the outside, and has strong corrosion resistance. In another embodiment, considering the cost issue, the copper foil layer of the metal layer 20 is replaced by an aluminum foil layer to reduce the cost while meeting the characteristics of thermal conductivity and corrosion resistance. Preferably, the thickness of the copper foil layer is 0.025 mm to ensure the thinness of the mobile phone heat dissipation component 10. Further, the thickness tolerance of the copper foil layer is 10%.

[0026] In one embodiment, the encapsulation layer 40 is a ceramic layer, which creates the original touch of the mobile phone, and does not need to be edged on the metal layer 20, thereby improving the heat dissipation efficiency. Preferably, the thickness of the ceramic layer is 0.02 mm.

[0027] Furthermore, traditional ceramics are hard enough, but have the disadvantage of being very brittle and easily damaged. Therefore, the ceramic layer is set to be a nano-ceramic layer. The nano-ceramic layer is made of nano-ceramics, and nano-ceramics have a certain superplasticity and can be deformed, which can protect the mobile phone to a certain extent.

[0028] The heat conducting layer 30 is an acrylate layer, which is made of acrylate material. Acrylic acid has excellent heat resistance and water resistance, strong chemical stability, and high thermal conductivity, and can fully conduct the heat generated in the mobile phone to the metal layer 20. Preferably, the thickness of the acrylate layer is 0.01 mm.

[0029] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A mobile phone heat dissipation component, characterized in that: include: Metal layer, thermal conductive layer and packaging layer; The metal layer is arranged between the heat-conducting layer and the packaging layer, the metal layer is a copper foil layer, the packaging layer is a ceramic layer, and the heat-conducting layer is an acrylate layer.

2. The mobile phone heat dissipation assembly according to claim 1, characterized in that: The thickness tolerance of the copper foil layer is 10%.

3. The mobile phone heat dissipation assembly according to claim 1, characterized in that: The thickness of the copper foil layer is 0.025 mm.

4. The mobile phone heat dissipation assembly according to claim 1, characterized in that: The metal layer is an aluminum foil layer.

5. The mobile phone heat dissipation assembly according to claim 1, characterized in that: The preferred thickness of the ceramic layer is 0.02 mm.

6. The mobile phone heat dissipation assembly according to claim 1, characterized in that: The ceramic layer is a nano ceramic layer.

7. The mobile phone heat dissipation assembly according to claim 1, characterized in that: The thickness of the acrylic layer is 0.01 mm.

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