Thermally conductive substrate, heat dissipation mechanism
By designing closed circulating evaporation sections and condensation sections in the thermal conduction matrix of the electronic component heat dissipation device, the problems of slow thermal conductivity and poor reflux of coolant are solved, and efficient cooling liquid flow and heat dissipation performance are achieved.
Patent Information
- Application Number
- CN202420645429.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-29
- Publication Date
- 2025-04-08
- Estimated Expiration
- 2034-03-29
AI Technical Summary
Traditional electronic component heat dissipation devices have slower heat conduction, resulting in slower heat dissipation speed, and the existing coolant reflux design has a backflow phenomenon, resulting in poor heat dissipation effect.
A thermal conductivity matrix is designed with a closed circulating evaporation section and a condensation section inside. Through the design of the evaporation channel and the condensation channel, the reuse and efficient circulation of the coolant are realized, the flow rate of the coolant is increased, and the heat dissipation performance is improved.
Through the closed circulation and reflux structure, the flow rate and heat dissipation efficiency of the coolant are improved, the backflow of the coolant is avoided, the heat dissipation performance of the electronic components is enhanced, and the convenience of use is improved.
Smart Images
Figure CN222736461U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation device in the field of electronic components. Background Art
[0002] The heat dissipation device of electronic components is usually a metal heat sink, which is cut into the required size according to the size of the component. In special cases, ultra-high-power electronic components need to be equipped with cooling fans. Since traditional electronic packaging heat dissipation materials such as Ag, Cu, and A1 have a large thermal expansion coefficient, the expansion after heating can easily cause cyclic thermal stress to damage electronic components, which obviously cannot meet the requirements of current advanced electronic technology for packaging heat dissipation materials.
[0003] With the continuous development of modern science and technology electronics industry, electronic devices are becoming more and more integrated and consume more and more power. For example, GPU (graphics processor) is one of the most common high-power consumption components in electronic devices. They generate a lot of heat during operation, which needs to be dissipated through effective heat dissipation technology. Therefore, the heat dissipation problem is a key issue to be solved.
[0004] At present, the heat dissipation devices of electronic components are basically made of copper. Heat pipes are arranged inside the copper base, and heat is discharged through fans and the like. This type of heat dissipation device has slow heat conduction, which leads to slow heat dissipation and hinders the operation of electronic components. In order to accelerate heat dissipation, channels are also opened in the heat dissipation base to pass coolant to accelerate cooling. However, the coolant needs to be connected to the source of the coolant, which makes some electronic components inconvenient to use. If a closed coolant reflux design is used, the coolant flows slowly in the channel, and sometimes backflow occurs, resulting in poor heat dissipation. Utility Model Content
[0005] In view of the deficiencies of the prior art, the purpose of the utility model is to provide a heat-conducting substrate and a heat dissipation mechanism using the heat-conducting substrate.
[0006] The utility model discloses a heat-conducting substrate, wherein the heat-conducting substrate has a fluid channel inside, wherein the fluid channel is respectively connected to a fluid inlet and a fluid outlet on the heat-conducting substrate, wherein the heat-conducting substrate comprises a heat-absorbing evaporation portion and a condensation portion sequentially arranged along a first direction, wherein the fluid channel comprises an evaporation section and a condensation section sequentially arranged along the first direction and capable of circulating a coolant, wherein the evaporation section is correspondingly arranged in the heat-absorbing evaporation portion and comprises at least one evaporation channel; wherein the condensation section is correspondingly arranged in the condensation portion and comprises at least one condensation channel, wherein each of the evaporation channels is directly connected to the fluid inlet, wherein at least one of the evaporation channels is connected to the same condensation channel after being combined, wherein the condensation channel is connected to the fluid outlet, wherein the fluid inlet and the fluid outlet are connected to each other through a pipeline outside the heat-conducting substrate, and the radial cross-sectional area of the fluid inlet and any of the condensation channels is greater than the radial cross-sectional area of the evaporation channel.
[0007] A channel for the circulation of coolant is opened inside the heat-conducting substrate so that it is in direct contact with the coolant, which can be used in the heat dissipation mechanism of electronic components. The fluid channel in the substrate includes a closed evaporation section and a condensation section that can circulate and reflux. The evaporation section can absorb heat, and the coolant absorbs heat and evaporates to the condensation section. After the coolant is cooled in the condensation section, it flows into the evaporation section through an external pipeline to absorb heat, thereby realizing the reuse of the coolant without the need for new coolant to be introduced. The radial cross-sectional area of the fluid inlet and the condensation channel is larger than the radial cross-sectional area of the evaporation channel, and the cross-sectional area of the channel is reduced, which speeds up the flow rate of the coolant and improves the heat dissipation performance. Compared with the open coolant introduction in the prior art, the closed circulation reflux structure of the present application makes the use of electronic components more convenient and avoids waste.
[0008] The heat-conductive substrate material is preferably diamond, and more preferably polycrystalline diamond with a thermal conductivity of 2000 W / mK. Since diamond has extremely high thermal conductivity, the heat dissipation performance is greatly improved compared with traditional heat dissipation devices.
[0009] At least two of the evaporation channels are arranged in sequence along the first direction, and each of the evaporation channels extends as a whole along a second direction, and the second direction is arranged at an angle to the first direction.
[0010] At least two of the evaporation channels are arranged in parallel, and the second direction is perpendicular to the first direction.
[0011] The evaporation channel divides the single channel into two channels or multiple channels, increasing the channel density and coolant flow rate, thereby improving the heat dissipation performance.
[0012] In some embodiments, the evaporation channel is a tortuous structure.
[0013] In some embodiments, at least one of the evaporation channels is a planar spiral structure.
[0014] The condensation channel as a whole extends along a third direction, the third direction is arranged at an angle with the first direction, and the third direction is parallel to the second direction.
[0015] The condensation section includes more than two condensation channels, which are sequentially connected end to end, the first condensation channel is directly connected to the evaporation section, and the last condensation channel is directly connected to the fluid outlet.
[0016] In some embodiments, the condensation channel is a circuitous structure or a linear structure.
[0017] The tortuous and flat spiral structures can be evenly laid in the heat conductive matrix to make the coolant flow more evenly to achieve a better cooling effect.
[0018] The fluid inlet and the fluid outlet are both provided with pipe interfaces buried in the heat-conducting matrix, and a seal is provided between the pipe interface and the matrix. The pipe interface is a metal pipe, preferably a copper pipe, and the metal material has the characteristics of heat resistance, corrosion resistance, stability, and certain thermal conductivity. The seal is preferably a sealing ring that cooperates with the pipe interface to ensure that the refluxed coolant does not leak.
[0019] The condensation channel is also provided with an anti-backflow mechanism for preventing the condensate from flowing back.
[0020] The backflow prevention mechanism comprises a plurality of baffles, and the plurality of baffles are arranged on the inner wall of the condensation channel at intervals along the length direction thereof.
[0021] The baffle is arranged obliquely along the flow direction of the coolant in the evaporation channel.
[0022] The width of the baffle is sufficient to block 1 / 3-1 / 2 of the cross section of the channel.
[0023] In some embodiments, the baffle is an arc-shaped structure.
[0024] The anti-backflow mechanism design can accelerate the circulation of coolant, effectively prevent the coolant from flowing back after condensation, increase the coolant flow rate and improve the cooling effect.
[0025] Another aspect of the present invention provides a heat dissipation mechanism, comprising the above-mentioned heat-conducting substrate, and a cooling medium flowing in the heat-conducting substrate;
[0026] In some embodiments, the heat dissipation mechanism further includes a fan for achieving heat transfer with the heat-conductive substrate, whereby heat is transferred to the fan through the heat-conductive substrate and the heat is dissipated through the fan.
[0027] Compared with the prior art, the heat-conducting substrate of the utility model and the heat dissipation mechanism using the heat-conducting substrate can be used for the heat dissipation device of electronic components. By opening a coolant flow channel in the heat-conducting substrate and dividing the flow channel into a circulated evaporation section and a condensation section, the number and cross-sectional size of the evaporation channels and condensation channels in the evaporation section and the condensation section are designed, which greatly increases the flow rate of the coolant in the flow channel and improves the heat dissipation performance. At the same time, an anti-backflow mechanism is added in the condensation channel to prevent the condensate from flowing back, increase the coolant flow rate, and effectively improve the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0029] Figure 1 This is a schematic diagram of the internal structure of the heat-conducting substrate of Example 1 of the present utility model;
[0030] Figure 2 This is a schematic diagram of the internal structure of the heat-conducting substrate of Example 2 of the present utility model;
[0031] Figure 3 It is a schematic diagram of the internal structure of a diamond substrate on which polycrystalline silicon is deposited during the preparation process of one embodiment of the utility model;
[0032] Figure 4 It is a schematic diagram of the appearance structure of the heat dissipation mechanism of the utility model. DETAILED DESCRIPTION
[0033] The present invention will be more fully understood through the following specific embodiments that should be read together with the accompanying drawings. Detailed embodiments of the present invention are disclosed herein; however, it should be understood that the disclosed embodiments are only exemplary of the present invention, and the present invention can be embodied in various forms. Therefore, the specific functional details disclosed herein should not be interpreted as limiting, but only as the basis of the claims and as a representative basis for teaching those skilled in the art to adopt the present invention in different ways in any appropriate detailed embodiment.
[0034] Example 1
[0035] like Figure 1As shown, a heat-conducting substrate 1 of an embodiment of the utility model includes a heat-absorbing evaporation portion 2 and a condensation portion 3 along a first direction, and a fluid channel is provided inside the heat-conducting substrate 1, and the fluid channel is respectively connected to a fluid inlet 4 and a fluid outlet 5 on the heat-conducting substrate 1, and the fluid channel includes an evaporation section arranged opposite to the heat-absorbing evaporation portion 2, and a condensation section arranged opposite to the condensation portion 3.
[0036] Among them, the evaporation section includes an evaporation channel 6 with a double channel and a circuitous structure arranged along the second direction as a whole, and the condensation section includes two linear condensation channels 7 arranged along the third direction. The two condensation channels 7 are connected end to end in sequence, and each evaporation channel 6 converges into the same condensation channel 7, and the fluid inlet 4 and the fluid outlet 5 are connected by a pipeline outside the heat-conducting substrate 1, thereby realizing the circulation of the evaporation section and the condensation section.
[0037] The first direction is perpendicular to the second direction, and the second direction is parallel to the third direction.
[0038] The radial cross-sectional areas of the fluid inlet 4 and the condensation channel 7 are larger than the radial cross-sectional areas of the evaporation channels 6, which can increase the flow rate of the coolant and improve the heat dissipation performance.
[0039] The fluid inlet 4 and the fluid outlet 5 are both provided with copper pipe interfaces buried in the heat-conducting substrate 1, and a seal is provided between the pipe interface and the substrate. Copper material has the characteristics of heat resistance, corrosion resistance, stability, and certain thermal conductivity. The seal is preferably a sealing ring that cooperates with the pipe interface to ensure that the refluxed coolant does not leak.
[0040] Among them, a backflow prevention mechanism for preventing the condensate from flowing back is also provided in the condensation channel 7. The backflow prevention mechanism includes a plurality of baffles 8, which are arranged on the inner wall of the condensation channel 7 at intervals along the length direction of the condensation channel 7. The baffles 8 are arranged in an arc shape along the flow direction of the coolant in the evaporation channel 6. The width of the baffles 8 is sufficient to block 1 / 2 of the cross section of the channel.
[0041] The anti-backflow mechanism design can accelerate the circulation of coolant, effectively prevent the coolant from flowing back after condensation, increase the coolant flow rate and improve the cooling effect.
[0042] Example 2
[0043] like Figure 2 As shown, a heat-conducting substrate 1 of another embodiment of the utility model includes a heat-absorbing evaporation portion 2 and a condensation portion 3 along a first direction, and a fluid channel is provided inside the heat-conducting substrate 1, and the fluid channel is respectively connected to a fluid inlet 4 and a fluid outlet 5 on the heat-conducting substrate 1, and the fluid channel includes an evaporation section arranged opposite to the heat-absorbing evaporation portion 2, and a condensation section arranged opposite to the condensation portion 3.
[0044] Among them, the evaporation section includes an evaporation channel 6 with a planar spiral structure arranged as a whole along the second direction, and the condensation section includes two linear condensation channels 7 arranged along the third direction. The two condensation channels 7 are connected end to end in sequence, and the evaporation channels 6 converge into the same condensation channel 7, and the fluid inlet 4 and the fluid outlet 5 are connected through a pipeline outside the heat-conducting substrate 1, thereby realizing the circulation of the evaporation section and the condensation section.
[0045] The first direction is perpendicular to the second direction, and the second direction is parallel to the third direction.
[0046] The radial cross-sectional area of the fluid inlet 4 and the condensation channel 7 is larger than the radial cross-sectional area of the evaporation channel 6, and the radial cross-sectional area gradually decreases from the fluid inlet 4 to the condensation channel 7, which can increase the flow rate of the coolant and improve the heat dissipation performance.
[0047] The fluid inlet 4 and the fluid outlet 5 are both provided with copper pipe interfaces buried in the heat-conducting substrate 1, and a seal is provided between the pipe interface and the substrate. Copper material has the characteristics of heat resistance, corrosion resistance, stability, and certain thermal conductivity. The seal is preferably a sealing ring that cooperates with the pipe interface to ensure that the refluxed coolant does not leak.
[0048] Among them, a backflow prevention mechanism for preventing the condensate from flowing back is also provided in the condensation channel 7. The backflow prevention mechanism includes a plurality of baffles 8, which are arranged on the inner wall of the condensation channel 7 at intervals along the length direction of the condensation channel 7. The baffles 8 are arranged in an arc shape along the flow direction of the coolant in the evaporation channel 6. The width of the baffles 8 is sufficient to block 1 / 3 of the cross section of the channel.
[0049] The anti-backflow mechanism design can accelerate the circulation of coolant, effectively prevent the coolant from flowing back after condensation, increase the coolant flow rate and improve the cooling effect.
[0050] The material of the heat-conducting substrate 1 in the above embodiment is polycrystalline diamond with a thermal conductivity of 2000W / mK. Diamond has extremely high thermal conductivity. Compared with traditional heat dissipation devices, the heat dissipation performance is greatly improved. The method of preparing the above heat-conducting substrate 1 using diamond material is as follows:
[0051] S1: using MPCVD (microwave plasma chemical vapor deposition) equipment in an atmosphere of methane and hydrogen, microwave plasma excites carbon atoms in the gas to grow a first diamond substrate;
[0052] S2: Using photolithography on the surface of the first diamond substrate to make a shape pattern of the fluid channel;
[0053] S3: Protecting the area of the first diamond substrate except the fluid channel and the baffle with photoresist, and etching the surface of the fluid channel with oxygen plasma, so that a groove area appears on the surface of the fluid channel after etching;
[0054] S4: depositing polysilicon 11 in the fluid channel with the groove area on the surface by chemical vapor deposition, such as Figure 3 As shown, the groove area etched by oxygen plasma is filled with polysilicon 11;
[0055] S5: removing the photoresist on the surface of the first diamond substrate, the polysilicon 11 on the surface of the first diamond substrate covered by the photoresist is stripped off along with the photoresist, the polysilicon 11 in the etched groove area is retained, the first diamond substrate is placed in the MPCVD device, and the second diamond substrate is continuously grown on the surface of the first diamond substrate, so that the groove area of the polysilicon 11 is covered inside the two diamond substrates;
[0056] S6: Using a chemical etching method, the two diamond substrates are immersed in a strong acid solution to remove the polysilicon 11 inside, thereby obtaining a heat-conducting substrate made of diamond material with a fluid channel inside.
[0057] Utilizing the above-mentioned heat-conductive substrate 1, the utility model provides a heat dissipation mechanism, which can be used for heat dissipation of electronic components 9, including the above-mentioned heat-conductive substrate 1, and a cooling medium flowing in the heat-conductive substrate 1, and also including a fan 10 that realizes heat transfer with the heat-conductive substrate 1, heat is transferred to the fan 10 through the heat-conductive substrate 1, and the heat is dissipated through the fan.
[0058] Although the utility model has been described with reference to illustrative embodiments, it will be understood by those skilled in the art that various other changes, omissions and / or additions may be made without departing from the spirit and scope of the utility model, and the elements of the embodiments may be replaced by substantial equivalents. In addition, many modifications may be made without departing from the scope of the utility model to adapt specific situations or materials to the teachings of the utility model. Therefore, it is not intended herein to limit the utility model to the disclosed specific embodiments for performing the utility model, but it is intended that the utility model will include all embodiments within the scope of the appended claims. In addition, unless specifically stated, any use of the terms first, second, etc. does not indicate any order or importance, but uses the terms first, second, etc. to distinguish one element from another element.
Claims
1. A heat-conducting substrate, wherein the heat-conducting substrate has a fluid channel inside, and the fluid channel is respectively connected to a fluid inlet and a fluid outlet on the heat-conducting substrate, characterized in that: The heat-conducting substrate includes a heat-absorbing evaporation portion and a condensation portion sequentially arranged along a first direction, and the fluid channel includes an evaporation section and a condensation section sequentially arranged along the first direction and capable of circulating a coolant, the evaporation section is correspondingly arranged in the heat-absorbing evaporation portion and includes at least one evaporation channel; the condensation section is correspondingly arranged in the condensation portion and includes at least one condensation channel, wherein each of the evaporation channels is directly connected to the fluid inlet, at least one of the evaporation channels is connected to the same condensation channel after being converged, the condensation channel is connected to the fluid outlet, the fluid inlet and the fluid outlet are connected through a pipeline outside the heat-conducting substrate, and the radial cross-sectional area of the fluid inlet and any of the condensation channels is larger than the radial cross-sectional area of the evaporation channel.
2. The thermally conductive substrate according to claim 1, characterized in that: At least two of the evaporation channels are arranged in sequence along the first direction, and each of the evaporation channels extends as a whole along a second direction, and the second direction is arranged at an angle to the first direction.
3. The thermally conductive substrate according to claim 2, characterized in that: At least two of the evaporation channels are arranged in parallel, and the second direction is perpendicular to and intersects with the first direction.
4. The thermally conductive substrate according to claim 2 or 3, characterized in that: The evaporation channel is a circuitous structure.
5. The thermally conductive substrate according to claim 1, characterized in that: At least one of the evaporation channels is a planar spiral structure.
6. The thermally conductive substrate according to claim 1, characterized in that: The condensation channel extends as a whole along a third direction, and the third direction is arranged at an angle with the first direction.
7. The thermally conductive substrate according to claim 1 or 6, characterized in that: The condensation section includes more than two condensation channels, which are sequentially connected end to end, the first condensation channel is directly connected to the evaporation section, and the last condensation channel is directly connected to the fluid outlet.
8. The thermally conductive substrate according to claim 7, characterized in that: The condensation channel is a circuitous structure or a linear structure.
9. The thermally conductive substrate according to claim 1, characterized in that: The condensation channel is also provided with an anti-backflow mechanism to prevent the condensate from flowing back; And / or, the backflow prevention mechanism comprises a plurality of baffles, and the plurality of baffles are arranged on the inner wall of the condensation channel at intervals along the length direction thereof; And / or, the baffle is arranged obliquely along the flow direction of the coolant in the evaporation channel; And / or, the baffle width is sufficient to block 1 / 3-1 / 2 of the channel cross section.
10. A heat dissipation mechanism, characterized in that: The invention comprises a heat-conducting matrix as claimed in any one of claims 1 to 9, and a cooling medium flowing in the heat-conducting matrix; And / or, it also includes a fan for achieving heat transfer with the heat-conducting substrate.