An electronic device
By setting the heat dissipation member on the side of the bracket facing the functional module in the electronic device, the problem of poor heat dissipation effect of the functional module is solved, and a more efficient heat dissipation effect is achieved and the user experience is improved.
Patent Information
- Application Number
- CN202420912443.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-28
- Publication Date
- 2025-04-08
- Estimated Expiration
- 2034-04-28
AI Technical Summary
The heat dissipation components of functional modules in existing electronic devices have poor heat dissipation effects, which leads to the inability to effectively dissipate heat from functional modules, causing the fuselage to become hot and hot, and the user experience is poor.
By disassembling the pressing member from the bracket, the heat dissipation member is arranged on the side of the bracket facing the functional module, so that the heat of the functional module does not need to pass through the bracket when dissipating heat, but directly dissipates heat through the heat dissipation member.
Improve the heat dissipation efficiency of the heat dissipation components to the functional module, avoid heat accumulation, and improve user experience.
Smart Images
Figure CN222736472U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the technical field of electronic devices, and in particular to an electronic device. Background Art
[0002] In electronic devices, since heat is easily generated in the functional modules and the heat accumulates to form hot spots in the entire machine, it is often necessary to design a heat dissipation treatment for the functional modules.
[0003] At present, the heat dissipation effect of the heat dissipation components of the functional modules in the related technology is poor, so that the heat generated by the functional modules cannot be dissipated well, which often easily causes the body to heat up and the user experience is not good. Utility Model Content
[0004] In order to overcome the problems existing in the related art, the present disclosure provides an electronic device.
[0005] According to a first aspect of the present disclosure, there is provided a
[0006] An electronic device, comprising:
[0007] Functional modules and brackets;
[0008] A heat sink, disposed on a side of the bracket facing the functional module;
[0009] A pressing piece is used to abut against the functional module, and the pressing piece is arranged on the heat sink, and the heat sink is located between the bracket and the pressing piece.
[0010] In a possible implementation, the functional module is at least one of the following:
[0011] Speakers, microphones, batteries, circuit boards.
[0012] In a possible implementation manner, the pressing piece is provided with an avoidance area, and the avoidance area is used to avoid the air leakage hole of the functional module.
[0013] In a possible implementation, the pressing piece includes:
[0014] ontology;
[0015] At least one extension portion, each of the extension portions is connected to the main body, the avoidance area is formed between two adjacent extension portions, and the two adjacent extension portions are connected by arc transition.
[0016] In a possible implementation manner, the pressing piece includes four extending portions, and the four extending portions are evenly distributed along the circumferential direction of the body.
[0017] In a possible implementation manner, the pressing part includes one or more laminated combinations of silicone parts, rubber parts, plastic soft rubber parts, and polyurethane parts.
[0018] In a possible implementation, the pressing piece is configured as a sheet, block or special-shaped structure.
[0019] In a possible implementation manner, the pressing piece is adhesively connected to the heat sink;
[0020] and / or,
[0021] The heat sink is bonded to the bracket.
[0022] In a possible implementation manner, the bracket includes a first area and a second area, the first area is used to install the functional module, and the second area is used to install the circuit board;
[0023] The heat dissipation element covers the first area and the second area.
[0024] In a possible implementation manner, the heat sink includes a first heat sink, a second heat sink, and a third heat sink that are connected to each other, the area of the first heat sink is larger than the area of the second heat sink, and the area of the first heat sink is larger than the area of the third heat sink;
[0025] The second heat dissipation portion is disposed at the circuit board, and the third heat dissipation portion is disposed at the functional module.
[0026] In a possible implementation, the heat sink includes one or more combinations of a boron nitride sheet, a graphene sheet, a graphite sheet, a silicone sheet, and a temperature equalizer.
[0027] In a possible implementation manner, a relief portion is provided in a region on the heat sink for mounting the pressing member, and the relief portion is at least partially connected to the relief region.
[0028] In a possible implementation manner, the functional module is disposed on the top and / or bottom of the electronic device.
[0029] The technical solution provided by the embodiments of the present disclosure may include the following beneficial effects: the present disclosure separates the pressing parts used for pressing the functional module from the bracket, so that the heat sink can be set on the side of the bracket facing the functional module, so that when the functional module dissipates heat, the heat does not need to pass through the bracket first, but can be directly dissipated through the heat sink, which is beneficial to improving the heat dissipation efficiency of the heat dissipation component to the functional module and avoiding heat accumulation.
[0030] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS
[0031] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.
[0032] Figure 1 is a three-dimensional exploded view of a heat dissipation assembly according to an exemplary embodiment.
[0033] Figure 2 is an exploded view of a heat dissipation assembly in a side view according to an exemplary embodiment.
[0034] Figure 3 is a schematic structural diagram of a pressing part according to an exemplary embodiment.
[0035] Figure 4 is a schematic structural diagram of a heat sink according to an exemplary embodiment. DETAILED DESCRIPTION
[0036] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.
[0037] In electronic devices, since heat is easily generated at the functional modules, forming hot spots of the whole device, it is often necessary to design heat dissipation treatment for the functional modules. At present, the heat dissipation effect of the heat dissipation components of the functional modules in the related technology is poor, so that the heat generated by the functional modules cannot be dissipated well, causing the body to heat up and the user experience to be poor.
[0038] In order to solve the above technical problems, the present disclosure provides an electronic device, in which a pressing piece used for pressing a functional module is separated from a bracket, so that a heat sink can be set on the side of the bracket facing the functional module. When the functional module dissipates heat, the heat does not need to pass through the bracket first, but can be directly dissipated through the heat sink, which is beneficial to improving the heat dissipation efficiency of the heat dissipation component to the functional module and avoiding heat accumulation.
[0039] According to an exemplary embodiment, Figure 1-Figure 2 As shown, an embodiment of the present disclosure provides an electronic device, which may be, for example, a mobile terminal, a tablet, a laptop computer, a smart watch, a smart bracelet, or other intelligent electronic device, and the functional module 40 may be, for example, a speaker, such as a speaker installed on the top, top, or side of the electronic device for making sound.
[0040] The electronic device comprises a bracket 10, a heat sink 20 and a pressing member 30. The bracket 10 is used to support and fix components such as a motherboard chip and a functional module 40 inside the electronic device. The bracket 10 can be made of materials such as resin, plastic, and metal.
[0041] In order to ensure the installation effect of the functional module 40 in the electronic device, the bracket 10 should be pressed against the functional module 40 to prevent the functional module 40 from shaking and ensure that the functional module 40 will not be misplaced when the electronic device moves violently. The present disclosure sets a pressing piece 30 to press against the functional module 40. The pressing piece 30 is set separately from the bracket 10. The pressing piece 30 directly contacts the functional module 40. The pressing piece 30 can be fixed on the bracket 10, so that the bracket 10 applies a pressing force to the pressing piece 30 to press the functional module 40.
[0042] The heat sink 20 is used to dissipate heat for the functional module 40 in the electronic device. The heat sink 20 is disposed on the side of the bracket 10 facing the functional module 40. The heat sink 20 is located between the bracket 10 and the pressing member 30. Figure 2 Taking the orientation shown in as an example, the functional module 40, the pressing part 30, the heat sink 20 and the bracket 10 are sequentially arranged from bottom to top. Since the pressing part 30 is separated from the bracket 10, compared with the method of setting the pressing part 30 and the bracket 10 as one body, the heat sink 20 originally arranged on the side of the bracket 10 away from the functional module 40 can be moved, and the heat sink 20 can be moved between the pressing part 30 and the bracket 10. The distance between the heat sink 20 and the functional module 40 is closer, so that the heat generated by the functional module 40 does not need to pass through the bracket 10 first and then be transferred to the heat sink 20, but can be directly dissipated through the heat sink 20, which has a better heat conduction effect, thereby improving the heat dissipation efficiency.
[0043] In the disclosed embodiment, a pressing piece is provided to press the functional module to improve the tightness of the connection. At the same time, since the pressing piece used to press the functional module is separated from the bracket, a heat sink can be provided on the side of the bracket facing the functional module. When the functional module dissipates heat, the heat does not need to pass through the bracket first, but can be directly dissipated through the heat sink, which is beneficial to improving the heat dissipation efficiency of the heat dissipation component to the functional module and avoiding heat accumulation.
[0044] In some embodiments, the functional module 40 includes at least one of the following: a speaker, a microphone, a battery, and a circuit board. In one embodiment, the functional module 40 includes a speaker, and the heat sink 20 is used to dissipate heat from the speaker; in another example, the functional module 40 includes a speaker and a circuit board, and the heat sink 20 is used to dissipate heat from the speaker and the circuit board; in yet another embodiment, the functional module 40 includes a speaker, a microphone, a battery, and a circuit board, and the heat sink 20 is used to dissipate heat from the speaker, microphone, battery, and circuit board at the same time. The embodiments of the present disclosure do not impose too many restrictions on which structures the heat sink 20 is specifically used to dissipate heat, and those skilled in the art can set it according to actual needs.
[0045] In some embodiments, the press-fitting part 30 is further provided with an avoidance area 31. For example, when the functional module 40 is set as a speaker, the avoidance area 31 is used to avoid the vent holes of the functional module 40 to avoid the blockage of the vent holes and the generation of noise, poor sound quality and other problems. Among them, a notch can be opened on the press-fitting part 30 to form the avoidance area 31. In order to better avoid the vent holes of the functional module 40, the shape and position of the through hole can correspond to the vent holes. Of course, it can be understood that the shape, position, number, area, etc. of the avoidance area 31 can be adaptively adjusted according to the setting method of the vent holes of the functional module 40, and the embodiments of the present disclosure do not impose too many restrictions on this.
[0046] In some embodiments, the pressing member 30 includes a body 301 and at least one extension 302. Figure 3 As shown, each extension portion 302 is connected to the main body 301, and the length of each extension portion 302 can be the same or different. An avoidance area 31 is formed between two adjacent extension portions 302, and the two adjacent extension portions 302 are connected by an arc transition to reduce the risk of breakage at the connection.
[0047] In one example, if Figure 3 As shown, the pressing piece 30 includes four extensions 302, and the four extensions 302 are evenly arranged along the circumference of the body 301. For example, the body 301 can be set to a circle, and the four extensions 302 are evenly arranged along the circumference. The body 301 can also be set to a rectangle, and the four extensions 302 are respectively arranged on the four sides of the rectangle, that is, the pressing piece 30 is a cross as a whole. The embodiment of the present disclosure does not impose too many restrictions on the specific shape of the pressing piece 301, and those skilled in the art can set it according to actual needs.
[0048] In some embodiments, Figure 2As shown, the bracket 10 includes a first area 101 and a second area 102, and the heat sink 20 covers the first area 101 and the second area 102. The first area 101 is used to install the functional module 40, and the second area 102 is used to install a circuit board (not shown in the figure). The circuit board can be a printed circuit board or a flexible circuit board, and the circuit board includes a chip. Since the heat sink 20 covers the first area 101 and the second area 102, the heat sink 20 can be used to dissipate heat for the functional module 40 and the chip and other components on the circuit board at the same time.
[0049] In the related art, since the pressing piece 30 and the bracket 10 are an integrated structure, the first side of the bracket 10 is pressed against the functional module 40. In order to dissipate the heat of the functional module 40, the first heat dissipation structure for heat dissipation has to be set on the second side of the bracket 10. The first side is opposite to the second side. A circuit board is set on the first side of the bracket 10, and the second heat dissipation structure for dissipating the heat of the circuit board is set on the first side. Therefore, the first heat dissipation structure and the second heat dissipation structure have to be bonded separately, which increases the bonding steps and bonding costs. In the embodiment of the present disclosure, since the pressing piece 30 is separated from the bracket 10 and set as an independent structure, the heat sink 20 can be moved from the second side of the bracket 10 to the first side, and the size of the heat sink 20 can be enlarged to cover the first area 101 and the second area 102 at the same time. At the same time, the functional module 40 and the circuit board are cooled. There is no need to set an additional heat dissipation structure for the circuit board and perform bonding operations. In other words, there is no need to perform two bonding steps for the heat sink, which reduces the installation cost of the heat dissipation assembly of the whole machine. Figure 2 Taking the orientation shown in as an example, the left part of the heat sink 20 is used to dissipate heat for the functional module 40, and the right part of the heat sink 20 is used to dissipate heat for the circuit board. At the same time, the area of the heat sink 20 can be equal to or greater than the sum of the areas of the first area 101 and the second area 102 to increase the heat dissipation area and achieve better heat dissipation effect.
[0050] In some embodiments, the pressing part 30 includes a flexible part to better abut against the functional module 40. Since the pressing part 30 is a flexible part, it will deform when squeezed by external force, making the connection between the pressing part 30 and the functional module 40 and the heat sink 20 tighter. While playing a pressing role, it can also prevent hard materials from damaging the functional module 40 or the heat sink 20.
[0051] In some embodiments, the pressing part 30 includes one or more laminated combinations of silicone parts, rubber parts, plastic soft rubber parts, and polyurethane parts. In one example, the pressing part 30 is set as a silicone part. In another example, the pressing part 30 is set as a laminated structure of a layer of rubber parts and a layer of plastic soft rubber parts. In another example, the pressing part 30 is set as a laminated structure of a layer of silicone parts, a layer of polyurethane parts, and a layer of silicone parts stacked in sequence. In another example, the pressing part 30 is set as a laminated structure of a layer of silicone parts, a layer of rubber parts, a layer of plastic soft rubber parts, and a layer of polyurethane parts stacked. It can be understood that the pressing part 30 can also include other flexible materials, or the outer layer of the hard material is coated with a flexible material. The embodiments of the present disclosure do not impose too many restrictions on the specific material and the stacking setting method of the pressing part 30, and those skilled in the art can choose according to actual needs.
[0052] In some embodiments, the pressing piece 30 is configured as a sheet, block or special-shaped structure. Figure 3 As shown, in the embodiment of the present disclosure, the press-fitting part 30 is set as a sheet structure, and the press-fitting part 30 is also provided with an avoidance area 31 for avoiding the air leakage hole of the functional module 40. In one example, the side of the functional module 40 facing the press-fitting part 30 is a rectangular surface, and the air leakage holes are set at the four vertex positions. Therefore, in order to avoid the air leakage holes of the functional module 40, the body of the press-fitting part 30 in the embodiment of the present disclosure is a partially hollowed-out rectangular sheet, and the four corners of the rectangular sheet are all provided with a quarter-circular avoidance area 31, so that the press-fitting part 30 is a cross shape as a whole. Of course, it can be understood that the press-fitting part 30 can also be set as a block structure, so that there is enough gap between the air leakage hole of the functional module 40 and the heat sink 20 for air leakage. The shape of the press-fitting part 30 can also be adaptively adjusted according to the specific shape of the functional module 40 and the air leakage hole, and set to an irregular special-shaped structure such as a star shape, a cross shape, a corrugated shape, etc. The embodiment of the present disclosure does not impose too many restrictions on this.
[0053] In some embodiments, the press-fitting part 30 is bonded to the heat sink 20, and / or the heat sink 20 is bonded to the bracket 10. In one example, the press-fitting part 30 is bonded to the heat sink 20, and a first adhesive layer (not shown in the figure) is provided between the heat sink 20 and the press-fitting part 30. In another example, the heat sink 20 is bonded to the bracket 10, and a second adhesive layer (not shown in the figure) is provided between the bracket 10 and the heat sink 20. In yet another example, the press-fitting part 30 is bonded to the heat sink 20, and the heat sink 20 is bonded to the bracket 10, that is, a first adhesive layer is provided between the heat sink 20 and the press-fitting part 30, and a second adhesive layer is provided between the bracket 10 and the heat sink 20. Among them, the material selection of the first adhesive layer and the second adhesive layer can be the same or different, and the first adhesive layer and the second adhesive layer can be selected from thermoplastic adhesives, thermosetting adhesives, pressure-sensitive adhesives, optical glues and other adhesives, and the embodiments of the present disclosure do not impose any special restrictions on this.
[0054] In some embodiments, the heat dissipation element 20 includes a first heat dissipation portion 201, a second heat dissipation portion 202, and a third heat dissipation portion 203. Figure 1 , 2 As shown in FIG. 4 , the first heat dissipation portion 201 , the second heat dissipation portion 202 and the third heat dissipation portion 203 are connected in sequence.
[0055] In one example, the first heat dissipation portion 201 is disposed at a battery (not shown in the figure) for dissipating heat from the battery, the second heat dissipation portion 202 is disposed at a circuit board for dissipating heat from the circuit board, and the third heat dissipation portion 203 is disposed at a functional module 40 for dissipating heat from the functional module 40. The first heat dissipation portion 201 may be in a regular shape such as a rectangle or a trapezoid, the third heat dissipation portion 203 may be in a regular or irregular shape, and the second heat dissipation portion 202 may be in an irregular shape to avoid other electronic devices on the circuit board.
[0056] In one example, the first heat dissipation portion 201 can be bent toward the circuit board relative to the second heat dissipation portion 202 and the third heat dissipation portion 203, and the first heat dissipation portion 201 can be bent to the other side of the circuit board away from the functional module 40 to dissipate heat for electronic devices on the other side of the circuit board.
[0057] In one example, the area of the first heat dissipation portion 201 is larger than the area of the second heat dissipation portion 202, and the area of the first heat dissipation portion 201 is larger than the area of the third heat dissipation portion 203. In addition, the area of the first heat dissipation portion 201 may also be larger than the sum of the areas of the second heat dissipation portion 202 and the third heat dissipation portion 203. By increasing the heat dissipation area, the purpose of improving the heat dissipation efficiency and the heat dissipation effect can be achieved.
[0058] In some embodiments, the heat sink 20 includes one or more combinations of a boron nitride sheet, a graphene sheet, a graphite sheet, a silicone sheet, and a temperature-averaging plate. In one example, the heat sink 20 includes a graphite sheet. In another example, the heat sink 20 includes a graphite sheet and a silicone sheet, the graphite sheet is arranged on a side close to the functional module 40, and the silicone sheet is arranged on a side close to the bracket 10, and the graphite sheet and the silicone sheet are bonded to each other. In another example, the heat sink 20 includes a graphite sheet, a graphene sheet, and a temperature-averaging plate, and along the direction from the functional module 40 to the bracket 10, that is, Figure 2 In the direction from bottom to top shown in the figure, the heat sink 20 is stacked with graphite sheets, graphene sheets and temperature balancing plates in sequence to achieve a better heat dissipation effect. Of course, it is understandable that the number of layers and specific materials of the heat sink 20 can also be combined in other ways. The specific number of layers of the heat sink 20 and the selection of the material sequence between the layers can be set by those skilled in the art according to actual needs, and the embodiments of the present disclosure do not impose too many restrictions on this.
[0059] In some embodiments, a region on the heat sink 20 for mounting the press-fitting member 30 is provided with an avoidance portion (not shown in the figure), and the avoidance portion is at least partially connected to the avoidance region 31. The avoidance portion can be arranged opposite to the avoidance region 31, and the shape and area of the avoidance portion can be consistent with the avoidance region 31, or the area can be slightly smaller than the area of the avoidance region 31. For example, since the side of the functional module 40 facing the press-fitting member 30 is a rectangular surface, and air leakage holes are arranged at the four vertex positions, in order to avoid the air leakage holes of the functional module 40, the press-fitting member 30 is a partially hollowed rectangular sheet, and the four corners of the rectangular sheet are provided with a quarter-circular avoidance region 31, and the avoidance portion of the heat sink 20 is also provided with four notches at the position corresponding to the avoidance region 31. It is worth mentioning that since a pressing piece 30 is arranged between the heat sink 20 and the functional module 40, the pressing piece 30 has a certain thickness, so that there is a gap between the heat sink 20 and the functional module 40, and an avoidance area 31 has been arranged on the pressing piece 30 to avoid the air leakage hole of the functional module 40. Therefore, even if the avoidance part is not arranged on the heat sink 20, it will not affect the air leakage and heat dissipation of the functional module 40 too much. In other words, the avoidance part may not be arranged on the heat sink 20 to reduce the processing steps of the heat sink 20 and reduce the production cost.
[0060] In some embodiments, the functional module 40 is arranged at the top and / or bottom of the electronic device. In one example, the functional module is arranged at the top of the electronic device. In another example, the functional module 40 is arranged at the bottom of the electronic device. In yet another example, the functional module 40 is arranged at both the top and the bottom of the electronic device. It is worth noting that when the functional module 40 is arranged at both the top and the bottom of the electronic device, a heat dissipation component can be arranged at the functional module 40 at the top and the bottom of the electronic device. Since the functional module 40 at the top of the electronic device is more likely to generate and accumulate heat, and the functional module 40 at the bottom of the electronic device has a relatively smaller demand for heat dissipation, therefore, in order to save production costs, a heat dissipation component can also be arranged only at the functional module 40 at the top of the electronic device, and no heat dissipation component can be arranged at the functional module 40 at the bottom of the electronic device.
[0061] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the embodiments disclosed herein. The present disclosure is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The description and examples are to be considered exemplary only, and the true scope and spirit of the present disclosure are indicated by the following claims.
[0062] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims
1. An electronic device, characterized in that: The electronic device comprises: Functional modules and brackets; A heat sink, disposed on a side of the bracket facing the functional module; A pressing piece is used to abut against the functional module, and the pressing piece is arranged on the heat sink, and the heat sink is located between the bracket and the pressing piece.
2. The electronic device according to claim 1, characterized in that: The functional module is at least one of the following: Speakers, microphones, batteries, circuit boards.
3. The electronic device according to claim 1, characterized in that: The pressing piece is provided with an avoidance area, and the avoidance area is used to avoid the air leakage hole of the functional module.
4. The electronic device according to claim 3, characterized in that: The pressing piece comprises: ontology; At least one extension portion, each of the extension portions is connected to the main body, the avoidance area is formed between two adjacent extension portions, and the two adjacent extension portions are connected by arc transition.
5. The electronic device according to claim 4, characterized in that: The pressing piece includes four extending portions, and the four extending portions are evenly distributed along the circumferential direction of the body.
6. The electronic device according to claim 1, characterized in that: The pressed parts include one or a combination of multiple laminated layers of silicone parts, rubber parts, plastic soft rubber parts, and polyurethane parts.
7. The electronic device according to claim 1, characterized in that: The pressing piece is configured as a sheet, block or special-shaped structure.
8. The electronic device according to any one of claims 1 to 7, characterized in that: The pressing piece is adhesively connected to the heat sink; and / or, The heat sink is bonded to the bracket.
9. The electronic device according to any one of claims 1 to 7, characterized in that: The bracket includes a first area and a second area, the first area is used to install the functional module, and the second area is used to install the circuit board; The heat dissipation element covers the first area and the second area.
10. The electronic device according to any one of claims 1 to 7, characterized in that: The heat sink comprises a first heat sink, a second heat sink and a third heat sink connected to each other, the area of the first heat sink is larger than the area of the second heat sink, and the area of the first heat sink is larger than the area of the third heat sink; The second heat dissipation portion is disposed at the circuit board, and the third heat dissipation portion is disposed at the functional module.
11. The electronic device according to any one of claims 1 to 7, characterized in that: The heat sink includes one or more combinations of a boron nitride layer, a graphene sheet, a graphite sheet, a silicone sheet, and a temperature equalizing plate.
12. The electronic device according to claim 3, characterized in that: An escape portion is provided in an area on the heat sink for mounting the pressing member, and the escape portion is at least partially connected to the escape area.
13. The electronic device according to claim 1, characterized in that: The functional module is arranged on the top and / or bottom of the electronic device.