A monitoring terminal main control board convenient for heat dissipation

Abstract

The utility model discloses a monitoring terminal main control board that is easy to dissipate heat, including a board frame, a main control board, an air-cooling heat dissipation mechanism, an oil-cooling mechanism, a water-cooling mechanism and a heat conduction mechanism. A first mounting groove is provided on the top of the board frame, and a second mounting groove is provided on the outside of the first mounting groove. The main control board is clamped and fixed to the inner wall of the first mounting groove, and the air-cooling heat dissipation mechanism is slidably connected to the inner wall of the second mounting groove and is clamped and fixed to the surface of the board frame; the oil-cooling mechanism is fixedly connected to the inner wall of the board frame and contacts the bottom of the main control board, the water-cooling mechanism is arranged on the surface of the oil-cooling mechanism, and the heat conduction mechanism is clamped and fixed to the surface of the board frame, and one end of the heat conduction mechanism penetrates into the interior of the board frame and is slidably connected to the inner wall of the oil-cooling mechanism. As a result, the device integrates a variety of heat dissipation methods into one, and can quickly and effectively dissipate the heat of the main control board when the main control board is in a high-power operating state, thereby ensuring the stability of the performance of the main control board and increasing the service life of the main control board, and having a good use effect.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of a main control board, in particular to a monitoring terminal main control board which is convenient for heat dissipation. Background Art

[0002] With the rapid development of information technology, monitoring equipment is increasingly used in various fields. As the core component of the monitoring system, the stability and reliability of the monitoring terminal main control board are directly related to the normal operation of the entire monitoring system. However, with the improvement of the integration and function of the main control board, its power consumption also increases accordingly, especially when it is running at high power, the heat generated by the main control board will rise sharply.

[0003] Heat dissipation has always been one of the key challenges in electronic equipment design. In the monitoring terminal main control board, if the heat cannot be dissipated in a timely and effective manner, the temperature of the main control board will rise, which will in turn affect the performance and life of the electronic components inside it. Long-term operation in a high temperature environment may even cause component damage or system failure, seriously affecting the stability and safety of the monitoring system.

[0004] At present, the heat dissipation method of the main control board of the monitoring terminal is mainly air cooling. The air cooling method is relatively simple and the heat dissipation effect is limited. Under high-power operation, the heat generated by the main control board may far exceed the heat dissipation capacity of the fan, resulting in poor heat dissipation effect. Utility Model Content

[0005] The utility model aims to solve one of the technical problems in the related art at least to a certain extent.

[0006] To this end, the purpose of the utility model is to propose a monitoring terminal main control board that is easy to dissipate heat, integrating multiple heat dissipation methods, and can quickly and effectively dissipate heat for the main control board when the main control board is running at high power, thereby ensuring the stable performance of the main control board and increasing the service life of the main control board.

[0007] To achieve the above-mentioned purpose, the utility model proposes a monitoring terminal main control board that is easy to dissipate heat, including a board frame, a main control board, an air-cooled heat dissipation mechanism, an oil-cooling mechanism, a water-cooling mechanism and a heat conduction mechanism, wherein a first mounting groove is provided on the top of the board frame, and a second mounting groove is provided on the outer side of the first mounting groove, and the first mounting groove and the second mounting groove are respectively connected to the inside of the board frame; the main control board is clamped and fixed to the inner wall of the first mounting groove, and the air-cooled heat dissipation mechanism is slidably connected to the inner wall of the second mounting groove and is clamped and fixed to the surface of the board frame; the oil-cooling mechanism is fixedly connected to the inner wall of the board frame and contacts with the bottom of the main control board, the water-cooling mechanism is arranged on the surface of the oil-cooling mechanism, and one end of the water-cooling mechanism passes through the outside of the board frame; the heat conduction mechanism is clamped and fixed to the surface of the board frame, and one end of the heat conduction mechanism passes through the inside of the board frame and is slidably connected to the inner wall of the oil-cooling mechanism.

[0008] The utility model discloses a monitoring terminal main control board which is convenient for heat dissipation and integrates a plurality of heat dissipation methods. When the main control board is in a high-power operation state, the main control board can still be quickly and effectively cooled, thereby ensuring the stability of the performance of the main control board and prolonging the service life of the main control board, and having a good use effect.

[0009] In addition, the monitoring terminal main control board that is easy to dissipate heat according to the above application may also have the following additional technical features:

[0010] Specifically, the air-cooling heat dissipation mechanism includes a fan frame, a first elastic clip, a small fan and a large fan, wherein the fan frame is slidably connected to the inner wall of the second mounting groove, and is clamped and fixed to the surface of the board frame by the first elastic clip; the small fan and the large fan are respectively arranged on the inner wall of the fan frame, and the small fan and the large fan are respectively located on the top side of the main control board and the bottom side of the main control board.

[0011] Specifically, the oil cooling mechanism includes a metal seat, a thermally conductive silicone pad, an air groove and a slot, wherein the metal seat is bolted to the top wall of the plate frame, and the thermally conductive silicone pad is arranged between the metal seat and the bottom of the main control board; the metal seat contains mineral oil; the air grooves are evenly opened on the surface of the metal seat and correspond to the position of the large fan; the slot is opened on the lower end surface of the metal seat.

[0012] Specifically, the water cooling mechanism includes a liquid inlet end, a liquid outlet end and an S-shaped pipe, wherein the liquid inlet end and the liquid outlet end are respectively arranged on the end surface of the metal base away from the slot, and the positions are corresponding; the S-shaped pipe is arranged inside the metal base, and is respectively connected with one end of the liquid inlet end and one end of the liquid outlet end; one end of the liquid inlet end and one end of the liquid outlet end respectively pass through the outside of the plate frame, and are connected with one end of an external water cooling hose.

[0013] Specifically, the heat conduction mechanism includes an L-shaped heat-conducting frame and heat dissipation holes, wherein an opening portion is provided on the surface of one side of the plate frame close to the inner wall of the rack, and a positioning seat is provided on one side of the top of the opening portion; the L-shaped heat-conducting frame is located inside the opening portion and contacts the inner wall of the rack; one end of the L-shaped heat-conducting frame is clamped and fixed to the positioning seat, and the other end of the L-shaped heat-conducting frame passes through the interior of the plate frame and is slidably connected to the inner wall of the slot; the heat dissipation holes are evenly arranged on the surface of one end of the L-shaped heat-conducting frame close to the positioning seat.

[0014] Specifically, a first circular hole and a second circular hole are respectively opened at positions of the plate frame corresponding to the positions of the small fan and the large fan, and dustproof nets are respectively arranged on inner walls of the first circular hole and the second circular hole.

[0015] Additional aspects and advantages of the present invention will be given in part in the following description and in part will become apparent from the following description or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0017] Figure 1 This is a schematic diagram of the structure of a monitoring terminal main control board that is easy to dissipate heat in the utility model;

[0018] Figure 2 This is a schematic diagram of the structure decomposition of a monitoring terminal main control board that is convenient for heat dissipation according to the utility model;

[0019] Figure 3 This is a schematic diagram of a board frame structure in a monitoring terminal main control board that is convenient for heat dissipation according to the utility model;

[0020] Figure 4 This is a schematic diagram of the structure of an air-cooled heat dissipation mechanism in a main control board of a monitoring terminal that is convenient for heat dissipation according to the utility model;

[0021] Figure 5 This is a schematic diagram of the structure of an oil cooling mechanism in a main control board of a monitoring terminal that is convenient for heat dissipation according to the utility model;

[0022] Figure 6 This is a schematic diagram of the structure of a water cooling mechanism in a main control board of a monitoring terminal that is convenient for heat dissipation according to the utility model;

[0023] Figure 7 This is a schematic diagram of the slot structure in a main control board of a monitoring terminal that is convenient for heat dissipation according to the utility model;

[0024] Figure 8The utility model is a schematic diagram of the structure of a heat conduction mechanism in a main control board of a monitoring terminal which is convenient for heat dissipation.

[0025] As shown in the figure:

[0026] 1. Board frame; 2. Main control board; 3. Air cooling mechanism; 4. Oil cooling mechanism; 5. Water cooling mechanism; 6. Heat conduction mechanism; 11. First installation slot; 12. Second installation slot;

[0027] 31. fan frame; 32. first elastic clamp; 33. small fan; 34. large fan;

[0028] 41. Metal seat; 42. Thermal conductive silicone pad; 43. Air slot; 44. Slot;

[0029] 51. Liquid inlet end; 52. Liquid outlet end; 53. S-shaped pipe;

[0030] 61. L-shaped heat conducting frame; 62. Heat dissipation hole;

[0031] 17. Positioning seat; 18. Opening; 15. First circular hole; 16. Second circular hole;

[0032] 13. Column; 14. Clamp hole. DETAILED DESCRIPTION

[0033] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limitations on the present invention. On the contrary, the embodiments of the present invention include all changes, modifications, and equivalents that fall within the spirit and connotation of the appended claims.

[0034] A monitoring terminal main control board that is easy to dissipate heat according to an embodiment of the utility model is described below in conjunction with the accompanying drawings.

[0035] like Figure 1-Figure 8As shown, a monitoring terminal main control board that is easy to dissipate heat in an embodiment of the utility model includes a board frame 1, a main control board 2, an air-cooling heat dissipation mechanism 3, an oil-cooling mechanism 4, a water-cooling mechanism 5 and a heat conduction mechanism 6, wherein a first mounting groove 11 is provided on the top of the board frame 1, and a second mounting groove 12 is provided on the outer side of the first mounting groove 11, and the first mounting groove 11 and the second mounting groove 12 are respectively connected to the inside of the board frame 1; the main control board 2 is snap-fitted and fixed to the inner wall of the first mounting groove 11, and the air-cooling heat dissipation mechanism 3 is slidably connected to the inner wall of the second mounting groove 12, and is snap-fitted and fixed to the surface of the board frame 1; the oil-cooling mechanism 4 is fixedly connected to the inner wall of the board frame 1 and contacts with the bottom of the main control board 2, and the water-cooling mechanism 5 is arranged on the surface of the oil-cooling mechanism 4, and one end of the water-cooling mechanism 5 passes through the outside of the board frame 1; the heat conduction mechanism 6 is snap-fitted and fixed to the surface of the board frame 1, and one end of the heat conduction mechanism 6 passes through the inside of the board frame 1 and is slidably connected to the inner wall of the oil-cooling mechanism 4.

[0036] It should be noted that a column 13 is disposed on the inner wall of the first installation groove 11 described in this embodiment, and the positioning pins at the bottom of the main control board 2 are clamped and fixed to the column 13 .

[0037] Specifically, the device firstly sets an oil cooling mechanism 4, which contacts the bottom of the main control board 2 and dissipates the heat of the main control board 2 by heat conduction, and then sets an air cooling heat dissipation mechanism 3, which dissipates the top of the main control board 2 and the oil cooling mechanism 4 respectively, and then sets a water cooling mechanism 5, which is set at the lower end of the oil cooling mechanism 4, and cools the mineral oil inside the oil cooling mechanism 4 while causing a temperature difference, realizing convection circulation, and further improving the heat dissipation effect. In order to further accelerate the cooling of the oil cooling mechanism 4, the device is also provided with a heat conduction mechanism 6, which causes the temperature of the surface of the oil cooling mechanism 4 to the inner wall of the frame by heat conduction, and further improves the heat dissipation effect by increasing the heat dissipation area, and the use effect is good.

[0038] The device integrates multiple heat dissipation methods, and can quickly and effectively dissipate heat for the main control board 2 when the main control board 2 is in high-power operation state, thereby ensuring stable performance of the main control board 2 and increasing the service life of the main control board 2, and having a good use effect.

[0039] In one embodiment of the present invention, Figure 4 As shown, the air-cooling heat dissipation mechanism 3 includes a fan frame 31, a first elastic clip 32, a small fan 33 and a large fan 34, wherein the fan frame 31 is slidably connected to the inner wall of the second mounting groove 12, and is clamped and fixed to the surface of the board frame 1 by the first elastic clip 32; the small fan 33 and the large fan 34 are respectively arranged on the inner wall of the fan frame 31, and the small fan 33 and the large fan 34 are respectively located on the top side of the main control board 2 and the bottom side of the main control board 2.

[0040] It should be noted that the small fan 33 and the large fan 34 described in this embodiment respectively include an extraction fan and an exhaust fan. The exhaust fan draws external air and blows it toward the metal seat 41 and the inside of the air groove 43. The extraction fan draws air from the inside of the air groove 43 and exhausts it to the outside of the plate frame 1. The extraction fan and the exhaust fan cooperate with each other to accelerate the flow rate of air passing through the inner wall of the air groove 43, thereby improving the heat dissipation effect of the metal seat 41.

[0041] It should also be noted that a clamping hole 14 is provided on the surface of the plate frame 1 and is clamped and fixed with the first elastic clamping member 32 .

[0042] Specifically, the small fan 33 is used to dissipate heat from the top of the main control board 2 , and the large fan 34 is used to dissipate heat from the metal seat 41 .

[0043] In one embodiment of the present invention, Figure 5 As shown, the oil cooling mechanism 4 includes a metal seat 41, a thermal conductive silicone pad 42, an air groove 43 and a slot 44, wherein the metal seat 41 is bolted to the top wall of the board frame 1, and a thermal conductive silicone pad 42 is arranged between the metal seat 41 and the bottom of the main control board 2; the metal seat 41 has mineral oil built in; the air grooves 43 are evenly opened on the surface of the metal seat 41 and correspond to the position of the large fan 34; the slot 44 is opened on the lower end surface of the metal seat 41.

[0044] It should be noted that the metal seat 41 described in this embodiment is provided with a placement groove for accommodating the thermal conductive silicone pad 42 .

[0045] It can be extended that a micro circulation pump and a circulation pipeline can be arranged on the surface of the metal seat 41, so as to further increase the convection circulation rate of the mineral oil inside the metal seat 41 and further improve the heat dissipation performance.

[0046] Specifically, the heat of the main control board 2 is transferred to the metal seat 41 through the thermally conductive silicone pad 42 , and the heat is dissipated by the metal seat 41 and the mineral oil inside the metal seat 41 .

[0047] In one embodiment of the present invention, Figure 1 and Figure 5-Figure 6 As shown, the water cooling mechanism 5 includes a liquid inlet terminal 51, a liquid outlet terminal 52 and an S-shaped pipe 53, wherein the liquid inlet terminal 51 and the liquid outlet terminal 52 are respectively arranged on the end surface of the metal seat 41 away from the slot 44, and the positions are corresponding; the S-shaped pipe 53 is arranged inside the metal seat 41, and is respectively connected with one end of the liquid inlet terminal 51 and one end of the liquid outlet terminal 52; one end of the liquid inlet terminal 51 and one end of the liquid outlet terminal 52 respectively pass through the outside of the plate frame 1, and are connected with one end of the external water cooling hose.

[0048] Specifically, the structure and connection relationship of the water cooling mechanism 5 are further explained. The water cooling mechanism 5 is used to cool the mineral oil inside the metal seat 41 to further improve the heat dissipation performance of the mineral oil. At the same time, an S-shaped pipe 53 is provided at the lower end of the metal seat 41, which is beneficial to the temperature difference of the mineral oil inside the metal seat 41, thereby causing a certain degree of natural convection. The hotter oil will rise due to the decrease in density, while the colder oil will sink, forming a convection cycle, which helps to distribute and dissipate heat.

[0049] In one embodiment of the present invention, Figure 1-Figure 2 and Figure 8 As shown, the heat conduction mechanism 6 includes an L-shaped heat-conducting frame 61 and heat dissipation holes 62, wherein an opening portion 18 is provided on the surface of one side of the board frame 1 close to the inner wall of the frame, and a positioning seat 17 is provided on the top side of the opening portion 18; the L-shaped heat-conducting frame 61 is located inside the opening portion 18 and contacts the inner wall of the frame; one end of the L-shaped heat-conducting frame 61 is clamped and fixed with the positioning seat 17, and the other end of the L-shaped heat-conducting frame 61 passes through the inside of the board frame 1 and is slidably connected to the inner wall of the slot 44; the heat dissipation holes 62 are evenly provided on the surface of one end of the L-shaped heat-conducting frame 61 close to the positioning seat 17.

[0050] It should be noted that the L-shaped heat conducting frame 61 described in this embodiment is made of copper or aluminum.

[0051] Specifically, the structure and connection relationship of the heat conduction mechanism 6 are further explained. The L-shaped heat conducting frame 61 conducts the heat on the metal seat 41 to the frame by heat conduction, further increasing the heat dissipation area and achieving good use effect. Inserting one end of the L-shaped heat conducting frame 61 into the slot 44 is beneficial to the temperature difference of the mineral oil inside the metal seat 41, thereby causing a certain degree of natural convection. The hotter oil will rise due to the reduced density, while the colder oil will sink, forming a convection cycle to help distribute and dissipate heat.

[0052] In one embodiment of the present invention, Figure 3 As shown, the surface of the plate frame 1 is provided with a first circular hole 15 and a second circular hole 16 at positions corresponding to the positions of the small fan 33 and the large fan 34, and the inner walls of the first circular hole 15 and the second circular hole 16 are provided with dustproof nets (not shown in the figure).

[0053] Specifically, the first circular hole 15 and the second circular hole 16 are designed to facilitate air intake and exhaust, and the dustproof net design effectively prevents dust from entering the interior of the board frame 1 and adhering to the surface of the metal seat 41, further improving the heat dissipation performance of the metal seat 41.

[0054] In summary, the embodiment of the utility model is a monitoring terminal main control board that is easy to dissipate heat. The device integrates multiple heat dissipation methods into one. When the main control board 2 is in a high-power operating state, it can still quickly and effectively dissipate the heat of the main control board 2, thereby ensuring the stable performance of the main control board 2 while increasing the service life of the main control board 2, and the use effect is good.

[0055] In the description of this specification, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0056] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0057] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in this field can change, modify, replace and deform the above embodiments within the scope of the present invention.

Claims

1. A monitoring terminal main control board that is easy to dissipate heat, characterized in that: It comprises a board frame (1), a main control board (2), an air cooling mechanism (3), an oil cooling mechanism (4), a water cooling mechanism (5) and a heat conduction mechanism (6), wherein: A first mounting groove (11) is provided on the top of the plate frame (1), and a second mounting groove (12) is provided on the outer side of the first mounting groove (11), and the first mounting groove (11) and the second mounting groove (12) are respectively connected to the inside of the plate frame (1); The main control board (2) is fixedly connected to the inner wall of the first installation groove (11), and the air-cooling heat dissipation mechanism (3) is slidably connected to the inner wall of the second installation groove (12) and is fixedly connected to the surface of the board frame (1); The oil cooling mechanism (4) is fixedly connected to the inner wall of the plate frame (1) and is in contact with the bottom of the main control board (2); the water cooling mechanism (5) is arranged on the surface of the oil cooling mechanism (4); one end of the water cooling mechanism (5) passes through the outside of the plate frame (1); The heat conduction mechanism (6) is fixedly connected to the surface of the plate frame (1), one end of the heat conduction mechanism (6) penetrates into the interior of the plate frame (1) and is slidably connected to the inner wall of the oil cooling mechanism (4).

2. The monitoring terminal main control board for heat dissipation according to claim 1 is characterized in that: The air-cooling heat dissipation mechanism (3) comprises a fan frame (31), a first elastic clamp (32), a small fan (33) and a large fan (34), wherein: The fan frame (31) is slidably connected to the inner wall of the second mounting groove (12), and is fixedly connected to the surface of the plate frame (1) by means of the first elastic clamp (32); The small fan (33) and the large fan (34) are respectively arranged on the inner wall of the fan frame (31); the small fan (33) and the large fan (34) are respectively located on one side of the top of the main control board (2) and one side of the bottom of the main control board (2).

3. The monitoring terminal main control board for heat dissipation according to claim 2 is characterized in that: The oil cooling mechanism (4) comprises a metal seat (41), a heat-conducting silicone pad (42), an air groove (43) and a slot (44), wherein: The metal seat (41) is bolted to the top wall of the plate frame (1), and the heat-conducting silicone pad (42) is arranged between the metal seat (41) and the bottom of the main control board (2); The metal seat (41) is internally filled with mineral oil; The air grooves (43) are evenly arranged on the surface of the metal seat (41) and correspond to the positions of the large fans (34); The slot (44) is provided on the lower end surface of the metal seat (41).

4. The monitoring terminal main control board for heat dissipation according to claim 3 is characterized in that: The water cooling mechanism (5) comprises a liquid inlet end (51), a liquid outlet end (52) and an S-shaped pipe (53), wherein: The liquid inlet end (51) and the liquid outlet end (52) are respectively arranged on an end surface of the metal seat (41) away from the slot (44), and the positions thereof correspond to each other; The S-shaped pipe (53) is arranged inside the metal seat (41) and is respectively connected to one end of the liquid inlet end (51) and one end of the liquid outlet end (52); One end of the liquid inlet end (51) and one end of the liquid outlet end (52) respectively penetrate the outside of the plate frame (1) and are connected to one end of an external water cooling hose.

5. The monitoring terminal main control board for heat dissipation according to claim 3 is characterized in that: The heat conduction mechanism (6) comprises an L-shaped heat conduction frame (61) and heat dissipation holes (62), wherein: An opening (18) is provided on a surface of one side of the plate frame (1) close to the inner wall of the frame, and a positioning seat (17) is provided on one side of the top of the opening (18); The L-shaped heat-conducting frame (61) is located inside the opening (18) and is in contact with the inner wall of the frame; One end of the L-shaped heat-conducting frame (61) is fixedly connected to the positioning seat (17), and the other end of the L-shaped heat-conducting frame (61) penetrates into the interior of the plate frame (1) and is slidably connected to the inner wall of the slot (44); The heat dissipation holes (62) are evenly arranged on a surface of one end of the L-shaped heat conducting frame (61) close to the positioning seat (17).

6. The monitoring terminal main control board for heat dissipation according to claim 2 is characterized in that: A first circular hole (15) and a second circular hole (16) are respectively provided on the surface of the plate frame (1) at positions corresponding to the positions of the small fan (33) and the large fan (34); and dustproof nets are respectively provided on the inner walls of the first circular hole (15) and the second circular hole (16).

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