A nano copper foil heat diffuser

Abstract

The present application relates to the technical field of thermal diffusion sheets, and in particular to a nano copper foil thermal diffusion sheet, comprising a copper foil base layer and at least one group of heat dissipation nano coatings arranged in sequence from bottom to top, wherein the heat dissipation nano coating comprises a heat dissipation silicone layer and a nano particle coating, wherein the heat dissipation silicone layer is connected to the copper foil base layer, and a plurality of grooves are arranged at intervals on a side of the heat dissipation silicone layer in contact with the nano particle coating. The nano copper foil thermal diffusion sheet of this structure has good heat dissipation, and at the same time, the nano particle coating and the copper foil base layer are stably connected, and the problem of decreased bonding strength between the nano particle coating and the copper foil base layer will not occur when used for a long time in a high temperature environment.

Description

Technical Field

[0001] The present application relates to the technical field of heat diffusion sheets, and in particular to a nano copper foil heat diffusion sheet. Background Art

[0002] Nano copper foil heat diffusers have excellent thermal conductivity, good flexibility and machining performance, and have broad application prospects in the field of electronic equipment heat dissipation. Nano copper foil heat diffusers can effectively improve the heat dissipation performance of equipment (such as handheld mobile electronic devices, laptops, and chip modules, etc.), ensure the stable operation of the equipment and extend its service life.

[0003] At present, nano copper foil heat diffusers mainly include a copper foil base layer and a layer of nano coating covering the surface of the copper foil base layer. The nano coating is composed of nanoparticles with good thermal conductivity, in which the nanoparticles are closely arranged to form a continuous heat conduction network, further improving the thermal conductivity of the nano copper foil heat diffuser. However, when the nano copper foil heat diffuser is used for a long time in a high temperature environment, the heat dissipation efficiency will decrease. The main reason is that when it is used in a long-term high temperature environment, the bonding strength between the nanoparticle coating and the copper foil base layer decreases, which makes the heat dissipation performance of the nano copper foil heat diffuser decrease. Utility Model Content

[0004] In order to solve the problem that the bonding strength between the nanoparticle coating and the copper foil base layer decreases during long-term use in a high-temperature environment, the present application provides a nano copper foil heat diffuser.

[0005] The present application provides a nano copper foil heat diffuser, which adopts the following technical solution:

[0006] A nano copper foil heat diffuser comprises a copper foil base layer and at least one group of heat dissipation nano coatings arranged in sequence from bottom to top, wherein the heat dissipation nano coating comprises a heat dissipation silicone layer and a nano particle coating, the heat dissipation silicone layer is connected to the copper foil base layer, and a plurality of grooves are arranged at intervals on a side of the heat dissipation silicone layer in contact with the nano particle coating.

[0007] By adopting the above technical scheme, the nano copper foil heat diffusion sheet has good heat dissipation performance, and can greatly improve the bonding strength of the nano particle coating and the copper foil base layer under long-term use in a high temperature environment, greatly extending the service life of the nano copper foil heat diffusion sheet. The silicone heat dissipation layer has good thermal conductivity, adhesion and high temperature resistance. The present application adopts a silicone heat dissipation layer to stably connect the nano particle coating and the copper foil base layer to prevent the nano copper foil heat diffusion sheet from being used in a high temperature environment for a long time. The phenomenon of the bonding strength of the nano particle coating and the copper foil base layer decreases. At the same time, the heat dissipation silicone layer is arranged with a plurality of grooves at intervals on the side in contact with the nano particle coating, and the nano particle coating will be partially embedded in the grooves, which increases the contact area between the nano particle coating and the heat dissipation silicone layer, making the silicone heat dissipation layer and the nano particle coating more stably bonded, and the other side of the heat dissipation silicone layer is stably connected to the copper foil base layer, so that the bonding strength of the nano particle coating and the copper foil base layer will be further improved, increasing the stability of the nano copper foil heat diffusion sheet when used in a high temperature environment.

[0008] Optionally, the depth of the groove does not exceed 1 / 2 of the thickness of the heat dissipating silicone layer.

[0009] By adopting the above technical solution, the depth of the groove is further optimized, the contact area between the heat dissipating silicone layer and the nanoparticle coating is appropriately increased, the bonding strength between the nanoparticle coating and the heat dissipating silicone layer is improved, and at the same time, the structural stability of the heat dissipating silicone layer is prevented from being affected by the groove being too deep.

[0010] Preferably, the thickness of the nanoparticle coating in each group of heat dissipation nano-coatings is not completely equal.

[0011] By adopting the above technical solution, the heat dissipation effect of the nano copper foil heat diffuser is further improved. The thickness of the nanoparticle coating in each group of heat dissipation nano coating is not completely equal, forming a multi-layer heat dissipation structure, each layer has different heat dissipation performance, and can more finely control the heat dissipation effect of the nano copper foil heat diffuser under different temperature gradients, thereby improving its practicality.

[0012] Preferably, the thickness of the heat dissipation silica gel layer in each group of heat dissipation nano coatings is not completely equal.

[0013] By adopting the above technical solution, the structural stability and heat dissipation effect of the nano copper foil heat diffuser are further improved. The thickness of the heat dissipation silicone layer in each group of heat dissipation nano coating is adjusted according to different requirements, so that the nano copper foil heat diffuser has a wider application range.

[0014] Preferably, the thickness of the heat dissipating silica gel layer is 1 / 10-1 / 8 of the thickness of the nanoparticle coating layer.

[0015] By adopting the above technical solution, the thickness ratio of the heat dissipation silicone layer and the nano-particle coating is optimized, and the bonding strength between the nano-particle coating and the copper foil base layer is improved, while ensuring that the nano-copper foil thermal diffuser has good heat dissipation performance. If the thickness of the heat dissipation silicone layer is too thick, it will affect the heat dissipation performance of the nano-copper foil thermal diffuser; if the thickness of the heat dissipation silicone layer is too thin, the bonding strength between the nano-particle coating and the heat dissipation silicone layer will decrease, and the high temperature resistance of the silicone heat dissipation layer will also decrease, affecting the bonding strength between the heat dissipation silicone layer and the copper foil base layer, reducing the stability of the nano-copper foil thermal diffuser in a high temperature environment, and affecting its heat dissipation effect.

[0016] Preferably, the heat dissipation silicone layer has a thickness of 5-10 μm.

[0017] By adopting the above technical solution, the good thermal conductivity of the nano copper foil heat diffuser is ensured without excessively increasing the thickness of the overall structure.

[0018] Preferably, the average particle size of the nanoparticles in the nanoparticle coating is 5-100 nm.

[0019] By adopting the above technical solution, the average particle size of the nanoparticles in the nanoparticle coating is optimized, firstly to ensure that the nanoparticles can be closely arranged to form a continuous and efficient heat conduction network; secondly, the nanoparticle coating can be stably bonded to the heat dissipation silicone layer. If the average particle size of the nanoparticles is too large, the bonding stability of the nanoparticle coating and the heat dissipation silicone layer will be reduced.

[0020] Preferably, the thermal conductivity of the heat dissipating silicone layer is at least 1.5 W / (mK).

[0021] By adopting the above technical solution, the thermal conductivity of the heat dissipating silicone layer is optimized, ensuring that heat can be quickly and effectively transferred from the nanoparticle coating to the copper foil base layer, and finally dissipated to the external environment, achieving efficient heat dissipation.

[0022] Preferably, the nanoparticle coating is a graphene nanoparticle layer, a carbon tube nanoparticle layer, an aluminum oxide nanocoating, a boron nitride nanocoating, a graphite nanocoating, a silicon carbide nanocoating, a magnesium oxide nanocoating or an aluminum nitride nanocoating.

[0023] The above-mentioned nanoparticle layers all have good thermal conductivity and stability, which can further enhance the overall heat dissipation effect of the nano-copper foil thermal diffuser. At the same time, the types of nano-particle layers are optimized, so that the nano-copper foil thermal diffuser has different heat dissipation capabilities, which enables it to have a wider range of applications and greatly improves its practicality.

[0024] In summary, the present application includes at least one of the following beneficial technical effects:

[0025] 1. The present application increases the contact area between the nanoparticle coating and the heat dissipation silicone layer and improves the connection stability between the heat dissipation silicone layer and the nanoparticle coating by providing a heat dissipation silicone layer with grooves, and then utilizes the connection stability between the heat dissipation silicone layer and the copper foil base layer to improve the bonding strength between the copper foil base layer and the nanoparticle coating, so that the nano copper foil thermal diffusion sheet can maintain good bonding strength even in a high temperature environment and has a good heat dissipation effect. That is, this structural design can maintain stable heat dissipation performance in a high temperature environment and effectively prevents a reduction in heat dissipation efficiency due to a decrease in bonding strength. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic structural diagram of a nano copper foil heat diffuser in Example 1.

[0027] Figure 2 It is a schematic cross-sectional view of the layer structure of Part A in Example 1.

[0028] Figure 3 This is a schematic diagram of the structure of a nano copper foil heat diffuser in Example 2.

[0029] Figure 4 It is a schematic cross-sectional view of the layer structure of Part B in Example 2.

[0030] Explanation of the accompanying drawings: 1. Copper foil base layer; 2. Heat dissipation silicone layer; 3. Nanoparticle coating; 4. Groove; 5. First heat dissipation silicone layer; 6. First nanoparticle coating; 7. Second heat dissipation silicone layer; 8. Second nanoparticle coating; 9. Second groove; 10. Third groove; 11. First groove. DETAILED DESCRIPTION

[0031] The following is combined with Figure 1-4 This application is described in further detail.

[0032] The present application embodiment discloses a nano copper foil heat diffuser. Figure 1 The nano copper foil heat diffuser includes a copper foil base layer 1 and a heat dissipation nano coating arranged in sequence from bottom to top, wherein the heat dissipation nano coating includes a heat dissipation silicone layer 2 and a nano particle coating 3, and the heat dissipation silicone layer 2 is connected to the copper foil base layer 1.

[0033] Reference Figure 2, a plurality of grooves 4 are arranged at intervals on one side of the heat dissipation silicone layer 2 in contact with the nanoparticle coating 3, and the shapes and depths of these grooves 4 may be different. Among them, the depth of the groove 4 does not exceed 1 / 2 of the thickness of the heat dissipation silicone layer 2. The depth of the groove 4 may be 1 / 2, 1 / 3, 1 / 4, 1 / 5, 1 / 6 or 1 / 7 of the thickness of the heat dissipation silicone layer 2. In this embodiment, the thermal conductivity of the heat dissipation silicone layer 2 is 1.5 W / (mK). Optionally, in other embodiments, the thermal conductivity of the heat dissipation silicone layer 2 may be 2W / (mK), 2.5W / (mK), 3W / (mK), 3.5W / (mK), 4W / (mK), 4.5W / (mK), 5W / (mK) or 5.5W / (mK).

[0034] In this embodiment, the thickness of the heat dissipation silicone layer 2 is 5 μm. Optionally, in other embodiments, the thickness of the heat dissipation silicone layer 2 may be 12 μm, 14 μm, 16 μm, 18 μm or 20 μm. In this embodiment, the thickness of the heat dissipation silicone layer 2 is 1 / 10 of the thickness of the nanoparticle coating 3, and the thickness of the nanoparticle coating 3 is 50 μm. Optionally, in other embodiments, the thickness of the heat dissipation silicone layer 2 is 1 / 9 or 1 / 8 of the thickness of the nanoparticle coating 3.

[0035] In the present embodiment, the nanoparticle layer is a graphene nanoparticle layer. Optionally, in other embodiments, the nanoparticle layer can be a carbon tube nanoparticle layer, an aluminum oxide nanocoating, a boron nitride nanocoating, a graphite nanocoating, a silicon carbide nanocoating, a magnesium oxide nanocoating or an aluminum nitride nanocoating. In the present embodiment, the average particle size of the nanoparticles in the graphene nanoparticle layer is 5nm. Optionally, in other embodiments, the average particle size of the nanoparticles in the graphene nanoparticle layer can be 10nm, 20nm, 30nm, 40nm, 50nm, 60nm, 70nm, 80nm, 90nm or 100nm.

[0036] The implementation principle of a nano copper foil heat diffuser in the embodiment of the present application is as follows: through the viscosity of the silicone heat dissipation layer, the nano particle coating 3 and the copper foil base layer 1 can be stably connected, and at the same time, by utilizing the high temperature resistance of the silicone heat dissipation layer, the nano particle coating 3 and the copper foil base layer 1 can maintain good bonding performance even when they are in a high temperature environment for a long time. By setting a groove 4 near the nano particle coating 3 in the heat dissipation silicone layer 2, the contact area between the nano particle coating 3 and the heat dissipation silicone layer 2 is increased, thereby improving the bonding strength between the nano particle coating 3 and the heat dissipation silicone layer 2, and the other side of the heat dissipation silicone is stably connected to the copper foil base layer 1, thereby improving the bonding strength between the nano particle coating 3 and the copper foil base layer 1, which can effectively prevent the situation where the bonding strength between the nano particle coating 3 and the copper foil base layer 1 decreases due to long-term use in a high temperature environment.

[0037] Example 2

[0038] The present application embodiment discloses a nano copper foil heat diffuser. Figure 3 The nano copper foil thermal diffusion sheet includes a copper foil base layer 1 and a first heat dissipation nano coating and a second heat dissipation nano coating, which are arranged in sequence from bottom to top, wherein the first heat dissipation nano coating includes a first heat dissipation silicone layer 5 and a first nano particle coating 6, and the second heat dissipation nano coating includes a second heat dissipation silicone layer 7 and a second nano particle coating 8, the first heat dissipation silicone layer 5 is connected to the copper foil base layer 1, and the second heat dissipation silicone layer 7 is connected to the first nano particle coating 6 on a side away from the second nano particle coating 8.

[0039] Reference Figure 4 A plurality of first grooves 11 are arranged at intervals on the side where the first heat dissipation silicone layer 5 contacts the first nanoparticle coating 6. The shapes and depths of the first grooves 11 may be different. A plurality of second grooves 9 are arranged at intervals on the side where the second heat dissipation silicone layer 7 contacts the first nanoparticle coating 6. A plurality of third grooves 10 are arranged at intervals on the side where the second heat dissipation silicone layer 7 contacts the second nanoparticle coating 8. The second grooves 9 and the third grooves 10 are arranged in a staggered manner.

[0040] Among them, the depth of the first groove 11 does not exceed 1 / 2 of the thickness of the first heat dissipation silicone layer 5. The depth of the first groove 11 can be 1 / 2, 1 / 3, 1 / 4, 1 / 5, 1 / 6 or 1 / 7 of the thickness of the heat dissipation silicone layer 2. The depth of the second groove 9 does not exceed 1 / 2 of the thickness of the second heat dissipation silicone layer 7, the depth of the third groove 10 does not exceed 1 / 2 of the thickness of the first heat dissipation silicone layer 5, and the depth of the second groove 9 and the depth of the third groove 10 can be 1 / 2, 1 / 3, 1 / 4, 1 / 5, 1 / 6 or 1 / 7 of the thickness of the second heat dissipation silicone layer 7. Through such an arrangement. The stability of the connection between the copper foil base layer 1, the first heat dissipation silicone layer 5, the first nanoparticle coating 6, the second heat dissipation silicone layer 7 and the second nanoparticle coating 8 can be further improved, while ensuring the heat dissipation efficiency.

[0041] In this embodiment, the thermal conductivity of the first heat dissipation silicone layer 5 and the thermal conductivity of the second heat dissipation silicone layer 7 are both 1.6 W / (mK). Optionally, in other embodiments, the thermal conductivity of the first heat dissipation silicone layer 5 and the thermal conductivity of the second heat dissipation silicone layer 7 are 2.2 W / (mK), 2.7 W / (mK), 3.2 W / (mK), 3.7 W / (mK), 4.4 W / (mK), 4.7 W / (mK), 5.3 W / (mK) or 5.8 W / (mK). Optionally, the thermal conductivity of the first heat dissipation silicone layer 5 and the thermal conductivity of the second heat dissipation silicone layer 7 may also be different.

[0042] In this embodiment, the thickness of the first heat dissipation silicone layer 5 and the thickness of the second heat dissipation silicone layer 7 are both 8 μm. Optionally, in other embodiments, the thickness of the first heat dissipation silicone layer 5 and the thickness of the second heat dissipation silicone layer 7 may be 13 μm, 15 μm, 17 μm or 19 μm. Optionally, in other embodiments, the thickness of the first heat dissipation silicone layer 5 and the thickness of the second heat dissipation silicone layer 7 may also be different.

[0043] In this embodiment, the thickness of the first heat dissipation silicone layer 5 is 1 / 8 of the thickness of the first nanoparticle coating 6, and the thickness of the first nanoparticle coating 6 is 64 μm. Optionally, in other embodiments, the thickness of the first heat dissipation silicone layer 5 is 1 / 9 or 1 / 10 of the thickness of the first nanoparticle coating 6.

[0044] In this embodiment, the thickness of the second heat dissipation silicone layer 7 is 1 / 8 of the thickness of the second nanoparticle coating 8, and the thickness of the second nanoparticle coating 8 is 64 μm. Optionally, in other embodiments, the thickness of the second heat dissipation silicone layer 7 is 1 / 9 or 1 / 10 of the thickness of the second nanoparticle coating 8. Optionally, in other embodiments, the thickness of the first nanoparticle coating 6 and the thickness of the second nanoparticle coating 8 may also be different.

[0045] In this embodiment, the first nanoparticle layer and the second nanoparticle layer are both aluminum oxide nanocoatings. Optionally, in other embodiments, the first nanoparticle layer and the second nanoparticle layer can be carbon tube nanoparticle layers, graphene nanoparticle layers, boron nitride nanocoatings, graphite nanocoatings, silicon carbide nanocoatings, magnesium oxide nanocoatings, or aluminum nitride nanocoatings. Optionally, in other embodiments, the first nanoparticle layer and the second nanoparticle layer can be made of different materials.

[0046] In the present embodiment, the average particle size of nanoparticles in the first graphene nano particle layer and the average particle size of nanoparticles in the second graphene nano particle layer are 10nm, optionally, in other embodiments, the average particle size of nanoparticles in the first graphene nano particle layer and the average particle size of nanoparticles in the second graphene nano particle layer can be 15nm, 25nm, 35nm, 45nm, 55nm, 65nm, 75nm, 85nm or 95nm.Optionally, in other embodiments, the average particle size of nanoparticles in the first graphene nano particle layer and the average particle size of nanoparticles in the second graphene nano particle layer can be different.

[0047] The implementation principle of a nano copper foil heat diffuser in the embodiment of the present application is different from that in embodiment 1 in that a group of second heat dissipation nano coatings is added to further improve the heat dissipation effect of the nano copper foil heat diffuser. At the same time, a plurality of second grooves 9 are arranged at intervals on the side where the second heat dissipation silicone layer 7 contacts the first nano particle coating 6, and a plurality of third grooves 10 are arranged at intervals on the side where the second heat dissipation silicone layer 7 contacts the second nano particle coating 8. The second grooves 9 and the third grooves 10 are arranged in a staggered manner to improve the bonding stability of the first heat dissipation nano coating and the second heat dissipation nano coating, and effectively prevent the problem of decreased bonding strength of the multi-layer nano copper foil heat diffuser.

[0048] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A nano copper foil heat diffuser, characterized in that: The invention comprises a copper foil base layer (1) and at least one group of heat dissipation nano coatings arranged in sequence from bottom to top, wherein the heat dissipation nano coating comprises a heat dissipation silicone layer (2) and a nano particle coating (3), the heat dissipation silicone layer (2) is connected to the copper foil base layer (1), and a plurality of grooves (4) are arranged at intervals on a side of the heat dissipation silicone layer (2) in contact with the nano particle coating (3).

2. The nano copper foil heat diffuser according to claim 1, characterized in that: The depth of the groove (4) does not exceed 1 / 2 of the thickness of the heat dissipating silicone layer (2).

3. The nano copper foil heat diffuser according to claim 2, characterized in that: The thickness of the nanoparticle coating (3) in each group of heat dissipation nano-coatings is not completely equal.

4. The nano copper foil heat diffuser according to claim 2, characterized in that: The thickness of the heat dissipation silica gel layer (2) in each group of heat dissipation nano coatings is not completely equal.

5. The nano copper foil heat diffuser according to claim 3, characterized in that: The thickness of the heat dissipation silica gel layer (2) is 1 / 10 to 1 / 8 of the thickness of the nanoparticle coating (3).

6. The nano copper foil heat diffuser according to claim 1, characterized in that: The heat dissipation silica gel layer (2) has a thickness of 5-10 μm.

7. The nano copper foil heat diffuser according to claim 1, characterized in that: The average particle size of the nanoparticles in the nanoparticle coating (3) is 5-100 nm.

8. The nano copper foil heat diffuser according to claim 1, characterized in that: The thermal conductivity of the heat dissipating silicone layer (2) is at least 1.5 W / (mK).

9. The nano copper foil heat diffuser according to claim 7, characterized in that: The nanoparticle coating is a graphene nanoparticle layer, a carbon tube nanoparticle layer, an aluminum oxide nanocoating, a boron nitride nanocoating, a graphite nanocoating, a silicon carbide nanocoating, a magnesium oxide nanocoating or an aluminum nitride nanocoating.

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