Cooling device

Abstract

The utility model discloses a cooling device, which relates to the technical field of cooling devices, wherein the cooling device comprises a refrigeration component and a thermally conductive silicone pad, the refrigeration component comprises a back plate, a refrigeration component and a shell, the shell is formed with an opening and an inner cavity that are interconnected, the refrigeration component is arranged in the inner cavity, and the back plate is installed in the opening to cover the opening; the back plate forms a groove, the refrigeration component is installed in the groove, the refrigeration component fits with the thermally conductive silicone pad, and the thermally conductive silicone pad extends out of the groove. When it is needed to use, the user fits the thermally conductive silicone pad to the position where the user needs to cool down, and then starts the refrigeration component, so that the refrigeration component will cool down, and transfer the temperature to the thermally conductive silicone pad, the user's skin will exchange heat with the thermally conductive silicone pad, thereby cooling the user; the cooling device uses the thermally conductive silicone pad to fit the user's skin, and the thermally conductive silicone pad is a human skin-friendly material, which will greatly improve the wearing comfort of the user.

Description

Technical Field

[0001] The utility model relates to the technical field of cooling devices, in particular to a cooling device. Background Art

[0002] In the prior art, human body temperature is cooled mainly by physical cooling and drug cooling. Drug cooling can only be used periodically and cannot be used for a long time because of the toxic side effects of the drug itself and its influence on the body. Contact physical cooling devices commonly used include ice packs, ice caps and fever-reducing patches, etc. The temperature of these devices cannot be controlled and they are uncomfortable to wear, so they cannot be worn for a long time.

[0003] Therefore, it is necessary to provide a new cooling device to solve the above technical problems. Utility Model Content

[0004] The main purpose of the utility model is to provide a cooling device, aiming to improve the technical problems in the prior art that the cooling devices are uncomfortable to wear and cannot be worn for a long time.

[0005] In order to achieve the above-mentioned purpose, the cooling device proposed by the utility model comprises:

[0006] A refrigeration assembly, the refrigeration assembly comprising a back plate, a refrigeration component and a shell, the shell is formed with an opening and an inner cavity that are interconnected, the refrigeration component is arranged in the inner cavity, and the back plate is installed on the opening to cover the opening;

[0007] A thermally conductive silicone pad is formed on the back plate to form a groove, the refrigeration component is installed in the groove, the refrigeration component is fitted with the thermally conductive silicone pad, and the thermally conductive silicone pad extends out of the groove.

[0008] In one embodiment, the refrigeration component includes a semiconductor condensing sheet, and the refrigeration assembly also includes a circuit board, a power interface is provided on the circuit board, the circuit board is arranged in the inner cavity, the power interface is used to connect to an external power supply, the semiconductor condensing sheet includes a cold end and a hot end, the cold end of the semiconductor condensing sheet is in contact with the thermal conductive silicone pad, and the circuit board is electrically connected to the semiconductor condensing sheet.

[0009] In one embodiment, the refrigeration component further includes a heat sink, and the heat sink is attached to the hot end of the semiconductor condenser.

[0010] In one embodiment, the refrigeration component further includes a fan, which is mounted on the inner wall of the housing, and the fan is attached to the heat sink, and the fan is electrically connected to the circuit board.

[0011] In one embodiment, the refrigeration component also includes a shock-absorbing spring. A mounting groove is formed on the fan. The shock-absorbing spring is installed in the mounting groove. One end of the shock-absorbing spring abuts against the bottom of the mounting groove, and the other end of the shock-absorbing spring abuts against the inner wall of the outer shell.

[0012] In one embodiment, there are multiple installation slots, and there are multiple shock-absorbing springs. The number of the multiple shock-absorbing springs is equal to the number of the multiple installation slots, and they are arranged in a one-to-one correspondence.

[0013] In one embodiment, the cooling device also includes a connecting component and a connecting wire, the connecting component includes a first connecting belt, a second connecting belt and a third connecting belt, the number of the refrigeration components and the thermal conductive silicone pads is at least two, and they are arranged one by one, and the two refrigeration components are electrically connected through a connecting wire; the two ends of the third connecting belt are respectively connected to the two shells, one end of the first connecting belt is connected to one shell, the first end of the second connecting belt is connected to the other shell, and the other end of the first connecting belt is connected to the second end of the second connecting belt.

[0014] In one embodiment, the outer shell is formed with a plurality of heat dissipation grooves interconnected with the inner cavity.

[0015] In one embodiment, the refrigeration assembly further includes a switch, the housing is formed with a mounting hole interconnected with the inner cavity, the switch is mounted on the circuit board, and the switch extends out of the mounting hole.

[0016] In one embodiment, the heat sink includes an aluminum heat sink and a plurality of aluminum heat sink columns disposed on the aluminum heat sink, the aluminum heat sink is attached to the hot end of the semiconductor condenser, and the plurality of aluminum heat sink columns are evenly distributed.

[0017] In the above scheme, the cooling device includes a refrigeration component and a thermally conductive silicone pad. The refrigeration component includes a back plate, a refrigeration component and an outer shell. The outer shell is formed with an opening and an inner cavity that are interconnected. The refrigeration component is arranged in the inner cavity, and the back plate is installed on the opening to cover the opening; the back plate forms a groove, the refrigeration component is installed in the groove, the refrigeration component is fitted with the thermally conductive silicone pad, and the thermally conductive silicone pad extends out of the groove. Specifically, a refrigeration component is placed in the inner cavity, and then a back plate is installed in the opening, the inner cavity is sealed, and then a thermally conductive silicone pad is installed in the groove, thus completing the installation of the cooling device; when it is needed to be used, the user fits the thermally conductive silicone pad to the position where the user needs to cool down, generally the forehead, superficial temporal venous network, jugular vein and femoral vein, and then starts the refrigeration component, so that the refrigeration component will cool down and transfer the temperature to the thermally conductive silicone pad, and the user's skin will exchange heat with the thermally conductive silicone pad, thereby cooling the user; the utility model adopts a thermally conductive silicone pad to fit the user's skin, and the thermally conductive silicone pad is a skin-friendly material of the human body, which will greatly improve the wearing comfort of the user, so that the user can wear it for a long time without discomfort. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0019] Figure 1 An exploded view of an embodiment of a cooling device provided by the utility model;

[0020] Figure 2 An exploded view of an embodiment of a refrigeration component provided by the utility model.

[0021] Description of Figure Numbers:

[0022] 100. Cooling device; 1. Refrigeration component; 11. Back plate; 111. Groove; 12. Refrigeration component; 121. Semiconductor condenser; 122. Radiator; 122a. Aluminum heat sink; 122b. Aluminum heat sink; 123. Fan; 123a. Mounting slot; 124. Shock-absorbing spring; 13. Housing; 131. Heat sink; 132. Mounting hole; 14. Circuit board; 141. Power interface; 15. Switch; 2. Thermal conductive silicone pad; 3. Connection component; 31. First connection belt; 32. Second connection belt; 33. Third connection belt; 4. Connecting wire.

[0023] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0026] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0027] In the prior art, cooling devices for contact physical cooling include ice bags, ice caps, and cooling patches. The temperature of these devices is uncontrollable and they are uncomfortable to wear, so they cannot be worn for a long time.

[0028] See also Figure 1 and Figure 2The utility model proposes a cooling device 100, including a refrigeration component 1 and a thermally conductive silicone pad 2. The refrigeration component 1 includes a back plate 11, a refrigeration component 12 and a shell 13. The shell 13 is formed with an opening and an inner cavity that are interconnected. The refrigeration component 12 is arranged in the inner cavity, and the back plate 11 is installed on the opening to cover the opening; the back plate 11 forms a groove 111, and the refrigeration component 12 is installed in the groove 111. The refrigeration component 12 is fitted with the thermally conductive silicone pad 2, and the thermally conductive silicone pad 2 extends out of the groove 111. Specifically, the refrigeration component 12 is placed in the inner cavity, and then the back plate 11 is installed in the opening, the inner cavity is sealed, and then the thermal conductive silicone pad 2 is installed in the groove 111, so that the installation of the cooling device 100 is completed; when it is needed to use, the user fits the thermal conductive silicone pad 2 to the position where the user needs to cool down, generally the forehead, superficial temporal venous network, jugular vein and femoral vein, and then starts the refrigeration component 12, so that the refrigeration component 12 will cool down and transfer the temperature to the thermal conductive silicone pad 2, the user's skin will exchange heat with the thermal conductive silicone pad 2, and then the temperature will be transferred to the user's blood vessels, and the blood will flow throughout the body, thereby cooling the user; this embodiment uses the thermal conductive silicone pad 2 to fit the user's skin, and the thermal conductive silicone pad 2 is a skin-friendly material for the human body, which will greatly improve the user's wearing comfort, so that the user can wear it for a long time without discomfort.

[0029] The cooling device 100 can be generally used in the medical industry to cool down patients with high body temperature to maintain normal body temperature. Generally speaking, it can be used to cool down the brain of patients with severe heat stroke and those who have been in a coma for a long time after resuscitation, etc. It can also be used for other patients who need emergency cooling and whose body temperature is difficult to lower.

[0030] Furthermore, the size of the thermally conductive silicone pad 2 is 2cm*3cm.

[0031] Furthermore, the first connecting belt 31, the second connecting belt 32 and the third connecting belt 33 are all elastic belts. Due to the difference in user body shapes, this setting can meet the needs of different users; at the same time, the third connecting belt 33 can adjust its length, so that the cooling position can be adjusted.

[0032] See also Figure 1 and Figure 2In one embodiment, the refrigeration component 12 includes a semiconductor condensing sheet 121, and the refrigeration assembly 1 also includes a circuit board 14. A power interface 141 is provided on the circuit board 14. The circuit board 14 is arranged in the inner cavity. The power interface 141 is used to connect to an external power supply. The semiconductor condensing sheet 121 includes a cold end and a hot end. The cold end of the semiconductor condensing sheet 121 is attached to the thermal conductive silicone pad 2, and the circuit board 14 is electrically connected to the semiconductor condensing sheet 121. When cooling is required, the circuit board 14 is connected to the external power supply through the power interface 141, so that the cold end of the semiconductor condensing sheet 121 will cool down and then transfer the temperature to the thermal conductive silicone pad 2, and the user's skin will exchange heat with the thermal conductive silicone pad 2, thereby cooling the user; when cooling is not required, the circuit board 14 disconnects the external power supply, so that the cold end of the semiconductor condensing sheet 121 will no longer cool, and the temperature will rise to the same as the external ambient temperature; the semiconductor condensing sheet 121 has excellent thermal conductivity and electrical insulation properties, which can ensure the normal transfer of temperature; and the cooling temperature of the semiconductor condensing sheet 121 can be adjusted to adjust the cooling value that the cooling device 100 can achieve.

[0033] Furthermore, a rechargeable lithium battery may be provided on the circuit board 14 , so that there is no need to connect to an external power source, and thus there is no power cord to restrict the user's actions, and the user can move freely when using the cooling device 100 .

[0034] See also Figure 1 and Figure 2 In one embodiment, the refrigeration component 12 further includes a radiator 122, and the radiator 122 is attached to the hot end of the semiconductor condensation sheet 121. When cooling is required, the circuit board 14 is connected to the external power supply through the power interface 141, so that the cold end of the semiconductor condensation sheet 121 will cool down, and then transfer the temperature to the thermal conductive silicone pad 2, and the user's skin will exchange heat with the thermal conductive silicone pad 2, thereby cooling the user, and the hot end of the semiconductor condensation sheet 121 will generate heat during operation. Since the hot end of the semiconductor condensation sheet 121 is attached to the radiator 122, the radiator 122 will dissipate the heat emitted by the hot end of the semiconductor condensation sheet 121, so that the semiconductor condensation sheet 121 can be guaranteed to operate for a long time, and the semiconductor condensation sheet 121 will be protected from being damaged due to excessive temperature.

[0035] Furthermore, the size of the heat sink 122 is 100 mm*70 mm.

[0036] See also Figure 1 and Figure 2In one embodiment, the refrigeration component 12 further includes a fan 123, which is mounted on the inner wall of the housing 13, and the fan 123 is attached to the radiator 122, and the fan 123 is electrically connected to the circuit board 14. When cooling is required, the circuit board 14 is connected to the external power supply through the power interface 141, so that the cold end of the semiconductor condensation sheet 121 will be cooled and cooled, and then the temperature will be transferred to the thermal conductive silicone pad 2, and the user's skin will exchange heat with the thermal conductive silicone pad 2, thereby cooling the user, and the hot end of the semiconductor condensation sheet 121 will generate heat during operation. Since the hot end of the semiconductor condensation sheet 121 is attached to the radiator 122, the radiator 122 will dissipate the heat emitted by the hot end of the semiconductor condensation sheet 121, and then the fan 123 is attached to the radiator 122, and the fan 123 will also rotate synchronously, so that the radiator 122 will dissipate the heat, further improving the efficiency of heat dissipation.

[0037] See also Figure 1 and Figure 2 In one embodiment, the cooling component 12 further includes a shock absorbing spring 124. A mounting groove 123a is formed on the fan 123. The shock absorbing spring 124 is mounted in the mounting groove 123a, and one end of the shock absorbing spring 124 abuts against the bottom of the mounting groove 123a, and the other end of the shock absorbing spring 124 abuts against the inner wall of the housing 13. When installing the fan 123, the shock absorbing spring 124 is installed in the mounting groove 123a, and then the two ends of the shock absorbing spring 124 abut against the bottom of the mounting groove 123a and the inner wall of the housing 13. In this way, when the user is wearing the cooling device 100 and is moving, the shock absorbing spring 124 can provide buffering to protect the fan 123 from colliding with the housing 13, and protect the housing 13 and the fan 123 from being damaged due to the collision.

[0038] See also Figure 1 and Figure 2 In one embodiment, the number of the mounting grooves 123a is multiple, the number of the shock absorbing springs 124 is multiple, and the number of the multiple shock absorbing springs 124 and the multiple mounting grooves 123a are equal and arranged one by one. By arranging multiple shock absorbing springs 124, further buffering can be performed, and the possibility of damage to the housing 13 and the fan 123 can be further reduced.

[0039] See also Figure 1 and Figure 2In one embodiment, the cooling device 100 further includes a connecting component 3 and a connecting wire 4. The connecting component 3 includes a first connecting belt 31, a second connecting belt 32 and a third connecting belt 33. The number of refrigeration components 1 and thermally conductive silicone pads 2 is at least two, and they are arranged one by one. The two refrigeration components 1 are electrically connected through the connecting wire 4; the two ends of the third connecting belt 33 are respectively connected to the two shells 13, one end of the first connecting belt 31 is connected to one shell 13, the first end of the second connecting belt 32 is connected to the other shell 13, and the other end of the first connecting belt 31 is connected to the second end of the second connecting belt 32. By setting at least two refrigeration components 1 and thermally conductive silicone pads 2, multiple positions can be cooled at the same time, which can greatly improve the cooling efficiency and enable users to reach normal body temperature faster. And when only one refrigeration component 1 needs to be used, the other refrigeration component 1 can be removed, and then the first connecting belt and the second connecting belt can be installed at both ends of one refrigeration component 1, and then the connecting wire 4 can be removed. In this way, the circuit board only controls one refrigeration component 1. In this way, when there is no need to use multiple refrigeration components 1, the weight of the cooling device 100 worn by the user can be reduced.

[0040] See also Figure 1 and Figure 2 In one embodiment, the housing 13 is formed with a plurality of heat dissipation slots 131 interconnected with the inner cavity. When cooling is required, the circuit board 14 is connected to the external power supply through the power interface 141, so that the cold end of the semiconductor condensation sheet 121 will cool down, and then transfer the temperature to the thermal conductive silicone pad 2, and the user's skin will exchange heat with the thermal conductive silicone pad 2, thereby cooling the user, and the hot end of the semiconductor condensation sheet 121 will generate heat during operation. Since the hot end of the semiconductor condensation sheet 121 is attached to the radiator 122, the radiator 122 will dissipate the heat emitted by the hot end of the semiconductor condensation sheet 121, and then the fan 123 is attached to the radiator 122, and the fan 123 will also rotate synchronously, which will dissipate the heat of the radiator 122 and discharge the heat from the heat dissipation slot 131, so that all the heat in the inner cavity can be discharged from the heat dissipation slot 131, ensuring that the temperature in the entire inner cavity will not be too high.

[0041] See also Figure 1 and Figure 2 In one embodiment, the refrigeration assembly 1 further includes a switch 15, the housing 13 is formed with a mounting hole 132 that is interconnected with the inner cavity, the switch 15 is mounted on the circuit board 14, and the switch 15 extends out of the mounting hole 132. By providing the switch 15, the user can turn on and off the cooling device 100 by himself, further improving the user's comfort.

[0042] See also Figure 1 and Figure 2In one embodiment, the heat sink 122 includes an aluminum heat sink 122a and a plurality of aluminum heat sink columns 122b disposed on the aluminum heat sink 122a. The aluminum heat sink 122a is attached to the hot end of the semiconductor condenser sheet 121, and the plurality of aluminum heat sink columns 122b are evenly distributed. The aluminum heat sink 122a and the aluminum heat sink columns 122b are used for heat dissipation. Aluminum alloy has a high thermal conductivity and can quickly conduct heat to the surface of the heat sink to improve heat dissipation efficiency. Aluminum alloy is lighter than traditional copper materials, which can reduce the overall weight of the device and improve portability. Aluminum alloy materials are relatively cheap and have relatively low manufacturing costs, which are suitable for large-scale production and application.

[0043] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A cooling device, characterized in that: include: A refrigeration assembly, the refrigeration assembly comprising a back plate, a refrigeration component and a shell, the shell is formed with an opening and an inner cavity that are interconnected, the refrigeration component is arranged in the inner cavity, and the back plate is installed on the opening to cover the opening; A thermally conductive silicone pad is formed on the back plate to form a groove, the refrigeration component is installed in the groove, the refrigeration component is fitted with the thermally conductive silicone pad, and the thermally conductive silicone pad extends out of the groove.

2. The cooling device according to claim 1, characterized in that: The refrigeration component includes a semiconductor condensing sheet, and the refrigeration assembly also includes a circuit board. The circuit board is provided with a power interface. The circuit board is arranged in the inner cavity. The power interface is used to connect to an external power supply. The semiconductor condensing sheet includes a cold end and a hot end. The cold end of the semiconductor condensing sheet is in contact with the thermally conductive silicone pad, and the circuit board is electrically connected to the semiconductor condensing sheet.

3. The cooling device according to claim 2, characterized in that: The refrigeration component further comprises a heat sink, and the heat sink is attached to the hot end of the semiconductor condensing plate.

4. The cooling device according to claim 3, characterized in that: The refrigeration component further includes a fan, which is installed on the inner wall of the shell, and the fan is attached to the radiator, and the fan is electrically connected to the circuit board.

5. The cooling device according to claim 4, characterized in that: The refrigeration component also includes a shock-absorbing spring. A mounting groove is formed on the fan. The shock-absorbing spring is installed in the mounting groove, and one end of the shock-absorbing spring abuts against the bottom of the mounting groove, and the other end of the shock-absorbing spring abuts against the inner wall of the shell.

6. The cooling device according to claim 5, characterized in that: The number of the installation slots is multiple, the number of the shock absorbing springs is multiple, the number of the multiple shock absorbing springs is equal to the number of the multiple installation slots, and they are arranged in one-to-one correspondence.

7. The cooling device according to any one of claims 1 to 6, characterized in that: The cooling device also includes a connecting component and a connecting wire, the connecting component includes a first connecting belt, a second connecting belt and a third connecting belt, the number of the refrigeration components and the thermal conductive silicone pads is at least two, and they are arranged in a one-to-one correspondence, and the two refrigeration components are electrically connected through a connecting wire; the two ends of the third connecting belt are respectively connected to the two shells, one end of the first connecting belt is connected to one of the shells, the first end of the second connecting belt is connected to the other shell, and the other end of the first connecting belt is connected to the second end of the second connecting belt.

8. The cooling device according to claim 1, characterized in that: The outer shell is formed with a plurality of heat dissipation grooves which are interconnected with the inner cavity.

9. The cooling device according to claim 2, characterized in that: The refrigeration assembly further includes a switch. The housing is formed with a mounting hole which is interconnected with the inner cavity. The switch is mounted on the circuit board, and the switch extends out of the mounting hole.

10. The cooling device according to claim 3, characterized in that: The heat sink comprises an aluminum heat sink and a plurality of aluminum heat sink columns arranged on the aluminum heat sink. The aluminum heat sink is attached to the hot end of the semiconductor condenser, and the plurality of aluminum heat sink columns are evenly distributed.

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