A coating jig

Abstract

The utility model relates to the technical field of coating machines and coating machine accessories, and specifically to a coating jig, including: a first positioning module, provided with at least one slot for enclosing a crystalline silicon substrate; a carrier module, arranged in the first positioning module and located below the slot, suitable for supporting the crystalline silicon substrate; a second positioning module, arranged in each slot in a one-to-one correspondence, and slidably connected to the first positioning module along the length direction of the slot; the size of the second positioning module is adapted to the size of the slot, and the second positioning module slides with the slot in the slot, suitable for enclosing and clamping the crystalline silicon substrate with the slot; wherein the top surface of the second positioning module is flush with the top surface of the first positioning module. The utility model solves the technical problem that the existing platform needs to adjust multiple components simultaneously to clamp the crystalline silicon substrate during the adjustment process, the adjustment method is complicated, and deviations are prone to occur, resulting in inaccurate positioning, which affects the coating effect.

Description

Technical Field

[0001] The utility model relates to the technical field of coating machines and coating machine accessories, in particular to a coating jig. Background Art

[0002] As a precise wet coating technology, the working principle is that the slurry is squeezed and sprayed along the gap of the coating die under a certain pressure and flow rate and transferred to the substrate. Compared with other coating methods, it has many advantages, such as fast coating speed, high precision, and uniform wet thickness; the coating system is closed, which can prevent pollutants from entering during the coating process, high slurry utilization, stable slurry properties, and can adapt to different slurry viscosities and solid content ranges. In order to apply the slurry to the surface of the substrate more evenly and accurately, the substrate is usually placed on a flat marble platform or other planes with high flatness to ensure the uniformity of the coating, and finally the slurry is applied to the surface of the substrate through the die.

[0003] In the related art, the existing platform usually includes a platform body, a pre-coating area module, a finishing module and two clamping modules. The pre-coating area module, the finishing module and the two clamping modules are slidably connected to the platform body to enclose and clamp the crystalline silicon substrate. However, during the adjustment process, multiple components need to be adjusted at the same time to clamp the crystalline silicon substrate. The adjustment method is complicated and deviations are prone to occur, resulting in inaccurate positioning, which affects the coating effect. Utility Model Content

[0004] The utility model provides a coating jig, which solves the technical problems that the existing platform needs to adjust multiple components simultaneously to clamp the crystalline silicon substrate during the adjustment process, the adjustment method is complicated, and deviations are prone to occur, resulting in inaccurate positioning, which affects the coating effect.

[0005] In view of this, the utility model provides a coating jig, comprising:

[0006] A first positioning module is provided with at least one slot for enclosing the crystalline silicon substrate;

[0007] A carrier module, disposed in the first positioning module and located below the slot, suitable for supporting the crystalline silicon substrate;

[0008] The second positioning module is arranged in each of the grooves in a one-to-one correspondence, and is slidably connected to the first positioning module along the length direction of the groove; the size of the second positioning module is adapted to the size of the groove, and the second positioning module slides with the groove in the groove, suitable for enclosing and clamping the crystalline silicon substrate with the groove; wherein the top surface of the second positioning module is arranged flush with the top surface of the first positioning module.

[0009] Optionally, the first positioning module includes a base plate and a first compensation plate; the first compensation plate is connected to the top of the base plate through a plurality of support columns; the slot is arranged on the first compensation plate; the carrier module and the second positioning module are both arranged on the top of the base plate.

[0010] Optionally, a plurality of lifting rings for lifting are provided along the periphery of the top of the base plate.

[0011] Optionally, the thickness of the side wall of the groove is smaller than the thickness of the crystalline silicon substrate, and a first inclined surface is provided at the bottom of the side wall of the groove, and the first inclined surface is gradually inclined from top to bottom toward a side away from the carrier module.

[0012] Optionally, the second positioning module is slidably connected to the first positioning module via an adjustment component; the adjustment component is arranged on the first positioning module, and the output end of the adjustment component is connected to the second positioning module, suitable for driving the second positioning module to reciprocate along the length direction of the slot.

[0013] Optionally, the adjustment component includes a driving member, a base and a slider; the base is arranged on the first positioning module, and the slider is slidably connected to the base along the length direction of the slot; the driving member is arranged on the base, and the output end of the driving member is connected to the slider, suitable for driving the slider to slide reciprocatingly along the length direction of the slot; the second positioning module is arranged on the slider.

[0014] Optionally, the second positioning module includes a second compensation plate and a support plate; the second compensation plate is connected to the output end of the adjustment component through the support plate; the size of the second compensation plate is adapted to the size of the groove, and the second compensation plate slides with the groove in the groove, and is suitable for enclosing and clamping the crystalline silicon substrate with the groove.

[0015] Optionally, the thickness of the second compensation plate toward the groove is less than the thickness of the crystalline silicon substrate, and a second inclined surface is provided at the bottom of the second compensation plate toward the groove, and the second inclined surface is gradually inclined from top to bottom toward a side away from the carrier module.

[0016] Optionally, the second positioning module also includes an adjustment plate and a plurality of adjustment screws; the adjustment plate is arranged at the bottom of the second compensation plate; the plurality of adjustment screws sequentially penetrate the second compensation plate and the adjustment plate, and the adjustment screws are threadedly connected to the adjustment plate, and the bottom of the adjustment screws is rotatably connected to the support plate.

[0017] Optionally, a group of the carrier modules is correspondingly provided below each of the slots, and each group of the carrier modules includes a carrier and a height adjustment mechanism; the carrier is located below the slots and is suitable for supporting the crystalline silicon substrate; the height adjustment mechanism is provided in the first positioning module, and the adjustment end of the height adjustment mechanism is connected to the carrier and is suitable for adjusting the height of the carrier;

[0018] And / or, the slots are provided in plurality, and the plurality of slots are arranged side by side and spaced apart.

[0019] The technical solution of the utility model has the following advantages:

[0020] In the present embodiment, when the crystalline silicon substrate needs to be coated, the silicon crystal substrate is placed in the groove and supported by the carrier module. It is only necessary to slide the second positioning module on the first positioning module toward the inner side of the groove, so that the second positioning module can jointly enclose and clamp the crystalline silicon substrate in the groove to position it in the groove. The adjustment method is simple and convenient, and the production efficiency is high. The crystalline silicon substrate is limited by the cooperation of the groove and the second positioning module, so that the crystalline silicon substrate is accurately arranged, the accuracy of coating on the crystalline silicon substrate is improved, the coating effect is improved, and the phenomenon of coating dislocation caused by inaccurate positioning of the crystalline silicon substrate during the coating process is avoided. At the same time, the groove and the second positioning module enclose and cover the peripheral side of the crystalline silicon substrate, and the peripheral side of the crystalline silicon substrate is sealed to And compensation, to avoid the slurry flowing to the back of the crystalline silicon substrate through the peripheral side of the crystalline silicon substrate when coating the crystalline silicon substrate, the coating width of the coating die head can be increased so that the slurry can completely cover the entire coating surface of the crystalline silicon substrate, thereby improving the coating effect. In addition, the top surfaces of the first positioning module and the second fixed module are both arranged flush, and are also kept flush with the coating surface of the crystalline silicon substrate during installation, thereby improving the uniformity of coating and further improving the coating effect; secondly, the number of slots can be set to 1, 2, 3 or more, that is, one slot can be set to cooperate with a group of second positioning modules to coat one crystalline silicon substrate, or multiple slots can be set and multiple crystalline silicon substrates can be enclosed and clamped by multiple groups of second positioning modules to be coated at the same time, thereby improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 A top view of a coating jig when the number of slots provided by the utility model is one;

[0023] Figure 2 A schematic structural diagram of a first positioning module when the number of slots provided by the utility model is one;

[0024] Figure 3 A top view of the first positioning module when the number of slots provided by the utility model is one;

[0025] Figure 4 for Figure 3 Sectional view at AA;

[0026] Figure 5 for Figure 4 Enlarged view of point B in the middle;

[0027] Figure 6 A schematic diagram of the structure of the second positioning module provided by the utility model;

[0028] Figure 7 A top view of the second positioning module provided by the utility model;

[0029] Figure 8 A schematic diagram of the structure of the platform module provided by the utility model;

[0030] Fig. 9 A top view of the platform module provided by the utility model;

[0031] Fig.10 for Fig. 9 Sectional view at CC;

[0032] Fig.11 A schematic diagram of a coating jig clamping a crystalline silicon substrate when the number of grooves provided by the utility model is one;

[0033] Fig.12 A schematic diagram of coating a crystalline silicon substrate with a coating jig when the number of grooves provided by the utility model is one;

[0034] Fig.13 A top view of a coating jig when the number of slots provided by the utility model is two;

[0035] Fig.14 A top view of a coating jig provided by the utility model when the number of slots is three.

[0036] Description of reference numerals:

[0037] 1. First positioning module; 101. Slot; 102. Bottom plate; 103. First compensation plate; 104. Support column; 105. Hanging ring; 2. Carrier module; 201. Carrier; 202. Height adjustment mechanism; 203. Waste liquid tank; 204. Waste liquid port; 205. Air hole; 206. Sealing plate; 207. Sealing strip; 208. Cavity; 3. Second positioning module; 301. Second compensation plate; 302. Support plate; 303. Adjustment plate; 304. Adjustment screw; 305. Drive member; 306. Base; 307. Slider; 4. Crystalline silicon substrate. DETAILED DESCRIPTION

[0038] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0039] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0040] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0042] Example 1

[0043] See also Figures 1 to 14A coating jig provided in this embodiment includes: a first positioning module 1, provided with at least one slot 101 for enclosing a crystalline silicon substrate 4; a carrier module 2, arranged in the first positioning module 1 and located below the slot 101, suitable for supporting the crystalline silicon substrate 4; a second positioning module 3, arranged in each slot 101 in a one-to-one correspondence, that is, each slot 101 is correspondingly provided with a group of second positioning modules 3, and the second positioning modules 3 are slidably connected to the first positioning module 1 along the length direction of the slot 101; the size of the second positioning module 3 is adapted to the size of the slot 101, and the second positioning module 3 is slidably matched with the slot 101 in the slot 101, and is suitable for enclosing and clamping the crystalline silicon substrate 4 with the slot 101; wherein the top surface of the second positioning module 3 is arranged flush with the top surface of the first positioning module 1.

[0044] It should be noted that the groove 101 and the second positioning module 3 are enclosed to form a compensation cavity, and the side wall of the compensation cavity is adapted to the peripheral side of the crystalline silicon substrate 4, so as to improve the sealing performance; since the size of the second positioning module 3 is adapted to the size of the groove 101, the second positioning module 3 can be slidably fitted in the groove 101; the width of the groove 101 is adapted to the width of the crystalline silicon substrate 4.

[0045] In the present embodiment, when the crystalline silicon substrate 4 needs to be coated, the silicon crystal substrate is placed in the groove 101 and supported by the carrier module 2. It is only necessary to slide the second positioning module 3 on the first positioning module 1 toward the inner side of the groove 101, so that the second positioning module 3 can jointly enclose and clamp the crystalline silicon substrate 4 in the groove 101 to position it in the groove 101. The adjustment method is simple and convenient, and the production efficiency is high. The crystalline silicon substrate 4 is limited by the cooperation of the groove 101 and the second positioning module 3, so that the crystalline silicon substrate 4 is accurately arranged, the accuracy of coating on the crystalline silicon substrate 4 is improved, the coating effect is improved, and the phenomenon of coating dislocation caused by inaccurate positioning of the crystalline silicon substrate 4 during the coating process is avoided. At the same time, the groove 101 and the second positioning module 3 are enclosed and coated on the peripheral side of the crystalline silicon substrate 4 to seal and compensate for the peripheral side of the crystalline silicon substrate 4. , to avoid the slurry flowing to the back side of the crystalline silicon substrate 4 through the peripheral side of the crystalline silicon substrate 4 when coating the crystalline silicon substrate 4, the coating width of the coating die head can be increased so that the slurry can completely cover the entire coating surface of the crystalline silicon substrate 4, thereby improving the coating effect. In addition, the top surfaces of the first positioning module 1 and the second fixed module are both flush with each other, and are also kept flush with the coating surface of the crystalline silicon substrate 4 during installation, thereby improving the uniformity during coating and further improving the coating effect; secondly, the number of slots 101 can be set to 1, 2, 3 or more, that is, one slot 101 can be set to cooperate with a group of second positioning modules 3 to coat one crystalline silicon substrate 4, or multiple slots 101 can be set and multiple groups of second positioning modules 3 can be used to enclose and clamp multiple crystalline silicon substrates 4 for coating at the same time, thereby improving production efficiency and having a wide range of applications. The specific selection can be made according to actual conditions.

[0046] Example 2

[0047] As a further improvement to Example 1, Figure 2 and Figure 3 As shown, the first positioning module 1 includes a base plate 102 and a first compensation plate 103; the first compensation plate 103 is connected to the top of the base plate 102 through multiple support columns 104; the slot 101 is arranged on the first compensation plate 103; the carrier module 2 and the second positioning module 3 are both arranged on the top of the base plate 102.

[0048] It should be noted that the top surface of the first compensation plate 103 is flush with the top surface of the second positioning module 3 .

[0049] In this embodiment, a groove 101 is provided on the first compensation plate 103, and compensation is performed through the top end of the first compensation plate 103 facing the peripheral side of the crystalline silicon substrate 4, thereby improving the uniformity of slurry coating. At the same time, connection is performed through the support column 104 to ensure connection strength while reducing materials and saving costs.

[0050] Based on the above implementation, in a specific implementation, as Figure 2 and Figure 3 As shown, a plurality of lifting rings 105 for lifting are provided along the periphery of the top of the base plate 102 .

[0051] In this embodiment, the lifting ring 105 is provided to facilitate lifting installation, use and transportation.

[0052] Based on the above implementation, in a specific implementation, as Figure 3 and Figure 4 As shown, the sidewall thickness of the groove 101 is less than the thickness of the crystalline silicon substrate 4 , and a first inclined surface is provided at the bottom of the sidewall of the groove 101 , which is gradually inclined from top to bottom toward a side away from the carrier module 2 .

[0053] In the present embodiment, the thickness of the side wall of the groove 101 is set to be smaller than the thickness of the crystalline silicon substrate 4. When the slurry leaks from the gap between the groove 101 and the crystalline silicon substrate 4, since the top surface of the first positioning module 1 is flush with the coating surface of the crystalline silicon substrate 4, the leaked slurry will preferentially flow from the bottom of the side wall of the groove 101 to the first inclined surface, and then away from the crystalline silicon substrate 4. By changing the thickness of the side wall of the groove 101 and under the guidance of the first inclined surface, the leaked slurry is prevented from flowing along the side wall of the crystalline silicon substrate 4 to the back side, thereby affecting the coating effect.

[0054] Based on the above implementation, in a specific implementation, as Figure 6 and Figure 7As shown, the second positioning module 3 is slidably connected to the first positioning module 1 through an adjusting component; the adjusting component is arranged on the first positioning module 1, and the output end of the adjusting component is connected to the second positioning module 3, which is suitable for driving the second positioning module 3 to reciprocate along the length direction of the slot 101.

[0055] In this embodiment, the second positioning module 3 can be driven by the adjusting component to reciprocate along the length direction of the slot 101 so as to move toward the side close to the slot 101 to enclose and clamp the crystalline silicon substrate 4 or move toward the side away from the slot 101 to release or place the crystalline silicon substrate 4.

[0056] Based on the above implementation, in a specific implementation, as Figure 6 and Figure 7 As shown, the adjustment component includes a driving member 305, a base 306 and a slider 307; the base 306 is arranged on the first positioning module 1, and the slider 307 is slidably connected to the base 306 along the length direction of the slot 101; the driving member 305 is arranged on the base 306, and the output end of the driving member 305 is connected to the slider 307, which is suitable for driving the slider 307 to slide back and forth along the length direction of the slot 101; the second positioning module 3 is arranged on the slider 307.

[0057] In this embodiment, when the second positioning module 3 needs to be adjusted to slide, the driving member 305 drives the slider 307 to slide back and forth along the length direction of the slot 101 , thereby driving the second positioning module 3 to slide to enclose and clamp the crystalline silicon substrate 4 or place the crystalline silicon substrate 4 .

[0058] Specifically, this embodiment does not limit the specific structure of the driving member 305. The second driving member 305 is preferably a differential head, which is arranged on the base 306. The adjustment end of the differential head is connected to the slider 307. The adjustment is performed through the differential head to improve the adjustment accuracy. The driving member 305 can also be a cylinder, a hydraulic cylinder or a linear motor, etc., which can be selected according to actual conditions.

[0059] Based on the above implementation, in a specific implementation, as Figure 6 As shown, the second positioning module 3 includes a second compensation plate 301 and a support plate 302; the second compensation plate 301 is connected to the output end of the adjustment component through the support plate 302; the size of the second compensation plate 301 is adapted to the size of the groove 101, and the second compensation plate 301 slides with the groove 101 in the groove 101, and is suitable for enclosing and clamping the crystalline silicon substrate 4 with the groove 101.

[0060] It should be noted that the top surface of the second compensation plate 301 is flush with the top surface of the first positioning module 1 .

[0061] In this embodiment, the top of the second compensation plate 301 is faced to the peripheral side of the crystalline silicon substrate 4 to compensate, thereby improving the uniformity of slurry coating. At the same time, the size of the second compensation plate 301 is adapted to the size of the groove 101, so that the second compensation plate 301 can slide and fit in the groove 101, and enclose and clamp the crystalline silicon substrate 4 with the groove 101.

[0062] Specifically, the top surface of the second compensation plate 301 is flush with the top surface of the first compensation plate 103, so as to keep the compensation height on the peripheral side of the crystalline silicon substrate 4 flush, ensure the uniformity of the slurry coating during coating, and improve the coating effect.

[0063] Based on the above embodiment, in a specific embodiment, the thickness of the second compensation plate 301 at one end facing the groove 101 is less than the thickness of the crystalline silicon substrate 4, and a second inclined surface is provided at the bottom of the second compensation plate 301 at one end facing the groove 101, and the second inclined surface is gradually inclined from top to bottom toward the side away from the carrier module 2.

[0064] In this embodiment, the thickness of the end of the second compensation plate 301 facing the groove 101 is set to be smaller than the thickness of the crystalline silicon substrate 4. When the slurry leaks from the gap between the second compensation plate 301 and the crystalline silicon substrate 4, since the top surface of the second compensation plate 301 is flush with the coating surface of the crystalline silicon substrate 4, the leaked slurry will preferentially flow from the bottom of the side wall of the second compensation plate 301 to the second inclined surface, and then away from the crystalline silicon substrate 4. The thickness of the end of the second compensation plate 301 facing the groove 101 and the guidance of the second inclined surface can prevent the leaked slurry from flowing along the side wall of the crystalline silicon substrate 4 to the back side, thereby affecting the coating effect.

[0065] Based on the above implementation, in a specific implementation, as Figure 6 and Figure 7 As shown, the second positioning module 3 also includes an adjustment plate 303 and a plurality of adjustment screws 304; the adjustment plate 303 is arranged at the bottom of the second compensation plate 301; the plurality of adjustment screws 304 all pass through the second compensation plate 301 and the adjustment plate 303 in sequence, and the adjustment screws 304 are threadedly connected to the adjustment plate 303, and the bottom of the adjustment screws 304 is rotatably connected to the support plate 302.

[0066] In this embodiment, the height of the second compensation plate 301 can be fine-tuned by adjusting the screw 304. By rotating the adjusting screw 304, the adjusting plate 303 can move up and down along the adjusting screw 304 in cooperation with the thread of the adjusting screw 304, thereby improving the adjustment accuracy, so that the top surface of the second compensation plate 301 is flush with the top surface of the first positioning module 1 and the coating surface of the crystalline silicon substrate 4, thereby improving the coating effect.

[0067] Based on the above implementation, in a specific implementation, as Figure 8and Fig. 9 As shown, the carrier module 2 includes a carrier 201 and a height adjustment mechanism 202; the carrier 201 is located below the groove 101 and is suitable for supporting the crystalline silicon substrate 4; the height adjustment mechanism 202 is arranged in the first positioning module 1, and the adjustment end of the height adjustment mechanism 202 is connected to the carrier 201, which is suitable for adjusting the height of the carrier 201.

[0068] In the present embodiment, the crystalline silicon substrate 4 is supported by the carrier 201 and the height of the carrier 201 can be adjusted by the height adjustment mechanism 202 to change the height of the crystalline silicon substrate 4 so that the coated surface of the crystalline silicon substrate 4 is flush with the top surfaces of the first positioning module 1 and the second positioning module 3. Different heights can also be adjusted according to the crystalline silicon substrates 4 of different thicknesses to ensure that the coated surface of the crystalline silicon wafer is flush with the top surfaces of the first positioning module 1 and the second positioning module 3, thereby increasing the flexibility of adjustment, being able to cope with a variety of working conditions, and having a wide range of applications.

[0069] Based on the above implementation, in a specific implementation, as Fig.13 and Fig.14 As shown, a plurality of slots 101 are provided, and the plurality of slots 101 are arranged side by side and spaced apart.

[0070] It should be noted that the plurality of slots 101 are arranged at intervals along a coating direction perpendicular to the coating die head.

[0071] In the present embodiment, by setting a plurality of slots 101, when it is necessary to coat a plurality of crystalline silicon substrates 4 at the same time, the plurality of crystalline silicon substrates 4 can be placed in the slots 101, and enclosed and clamped in the slots 101 by the second positioning module 3, and at the same time, the coating range of the coating die head is expanded to coat a plurality of crystalline silicon substrates at the same time, thereby improving production efficiency. Specifically, the number of slots 101 can be selected to be 2, 3, 4 or more, and the number of the second positioning module 3 and the carrier module 2 can be correspondingly set to be 2, 3, 4 or more, which can be selected according to actual conditions.

[0072] In one embodiment, if Fig.13 As shown, the number of the slots 101 is set to 2, and the number of the second positioning modules 3 and the stage modules 2 is correspondingly set to 2, so that two crystalline silicon substrates 4 can be placed for coating at the same time, thereby improving production efficiency.

[0073] As a convertible implementation method, it can also be, for example Fig.14 As shown, the number of the slots 101 is set to 3, and the number of the second positioning modules 3 and the stage modules 2 is correspondingly set to 3, so that 3 crystalline silicon substrates 4 can be placed for coating at the same time, thereby improving production efficiency.

[0074] As a convertible implementation method, it can also be, for example Figures 1 to 3The groove 101 is provided with a single crystalline silicon substrate 4 which can be coated separately.

[0075] Specifically, the present embodiment does not limit the structure of the slot 101 , and the slot 101 may be arranged in a U-shaped opening or in a rectangular shape, and the specific selection may be made according to actual conditions.

[0076] Specifically, this embodiment does not limit the specific structure of the height adjustment mechanism 202. The height adjustment mechanism 202 is preferably a precision lifting platform to facilitate fine adjustment and improve adjustment accuracy. The height adjustment mechanism 202 can also be a cylinder or a hydraulic cylinder.

[0077] Specifically, Fig. 9 As shown, a recovery part is arranged around the side of the carrier 201, a waste liquid tank 203 is arranged on the top of the recovery part around the carrier 201, a waste liquid port 204 is arranged in the waste liquid tank 203, a liquid discharge port connected to the waste liquid port 204 is arranged on the outer periphery of the recovery part, and the position of the waste liquid tank 203 corresponds to the edge of the crystalline silicon substrate 4. By arranging the waste liquid tank 203 around the side of the carrier 201, it is convenient to collect the liquid leaked during the coating process, and discharge it to the liquid discharge port through the waste liquid port 204, and then connect to the external equipment for recycling and treatment to avoid polluting the equipment.

[0078] Specifically, Fig.10 As shown, a cavity 208 is provided in the carrier 201, a plurality of air holes 205 communicating with the cavity 208 are provided on the top of the carrier 201, and a plurality of air path joints communicating with the cavity 208 are provided on the peripheral side of the carrier 201, and the air path joints are suitable for connecting to an external negative pressure device to adsorb the crystalline silicon substrate 4 through the air holes 205. After the crystalline silicon substrate 4 is positioned on the carrier 201, negative pressure is provided by the external negative pressure device, and negative pressure is generated by connecting the cavity 208 and the air holes 205 through the air path joints, which adsorbs the crystalline silicon substrate 4, fixes it on the carrier 201, and improves stability.

[0079] Specifically, Fig.10 As shown, the stage 201 includes a stage body and a sealing plate 206. A groove is concavely provided at the bottom of the stage body. The sealing plate 206 is detachably connected to the bottom of the stage body. The sealing plate 206 and the groove enclose a cavity 208. The sealing plate 206 and the stage body enclose the cavity 208, which is convenient for installation and disassembly, so as to be cleaned.

[0080] Specifically, Fig.10 As shown, a sealing strip 207 is provided at the bottom of the carrier body and on the outer periphery of the groove to improve the sealing performance.

[0081] The specific working principle of the coating jig provided in this embodiment is as follows: when the crystalline silicon substrate 4 needs to be coated, the top surface of the second compensation plate 301 is adjusted to be flush with the top surface of the first compensation plate 103 by adjusting the screw 304, the silicon crystal substrate is placed in the slot 101, and supported by the carrier 201. The height of the carrier 201 can be adjusted by the height adjustment mechanism 202 according to the thickness of the silicon crystal substrate, so that the coating surface of the silicon crystal substrate is flush with the top surfaces of the first compensation plate 103 and the second compensation plate 301, and then the second compensation plate 301 is driven by the slider 307 of the driving member 305. The second compensation plate 301 slides toward the inner side of the groove 101, so that the second compensation plate 301 encloses and clamps the crystalline silicon substrate 4 in the groove 101, and positions it in the groove 101. At the same time, the crystalline silicon substrate 4 is adsorbed and fixed through the air hole 205. Then, the coating width of the coating die head is set to be greater than the width of the crystalline silicon substrate 4. Then, the coating die head is moved from one side of the second compensation plate 301 to the other side of the second compensation plate 301 for coating, so that the crystalline silicon substrate 4 is completely coated. The adjustment method is simple and convenient, and the production efficiency is high. The crystalline silicon substrate 4 is limited by the cooperation of the groove 101 and the second compensation plate 301, so that the crystalline silicon substrate 4 is coated. The first compensation plate 103 and the second compensation plate 301 are precisely positioned to improve the accuracy of coating on the crystalline silicon substrate 4, improve the coating effect, and avoid the phenomenon of coating dislocation caused by inaccurate positioning of the crystalline silicon substrate 4 during the coating process. At the same time, the first compensation plate 103 and the second compensation plate 301 are enclosed and coated on the peripheral side of the crystalline silicon substrate 4, and the peripheral side of the crystalline silicon substrate 4 is sealed and compensated to avoid the slurry flowing to the back of the crystalline silicon substrate 4 through the peripheral side of the crystalline silicon substrate 4 when coating the crystalline silicon substrate 4. The coating width of the coating die head can be increased so that the slurry can completely cover the entire coating surface of the crystalline silicon substrate 4, thereby improving the coating effect. In addition, the first The top surfaces of the compensation plate 103 and the second compensation plate 301 are both flush with each other, and are also kept flush with the coating surface of the crystalline silicon substrate 4 during installation, which improves the uniformity of coating and further improves the coating effect; secondly, the number of slots 101 can be set to 1, 2, 3 or more, that is, one slot 101 can be set to cooperate with a group of second positioning modules 3 to coat one crystalline silicon substrate 4, or multiple slots 101 can be set and multiple groups of second positioning modules 3 can be used to enclose and clamp multiple crystalline silicon substrates 4 for coating at the same time, which improves production efficiency and has a wide range of applications. The specific selection can be made according to actual conditions. It solves the technical problem that the existing platform needs to adjust multiple components to clamp the crystalline silicon substrate 4 at the same time during the adjustment process, the adjustment method is complicated, and it is easy to have deviations, resulting in inaccurate positioning, which affects the coating effect.

[0082] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention of the utility model.

Claims

1. A coating jig, characterized in that: include: A first positioning module (1) is provided with at least one slot (101) for enclosing a crystalline silicon substrate (4); A carrier module (2) is arranged in the first positioning module (1) and is located below the slot (101), and is suitable for supporting the crystalline silicon substrate (4); The second positioning module (3) is arranged in each of the slots (101) in a one-to-one correspondence, and is slidably connected to the first positioning module (1) along the length direction of the slot (101); the size of the second positioning module (3) is adapted to the size of the slot (101), and the second positioning module (3) is slidably matched with the slot (101) in the slot (101), and is suitable for enclosing and clamping the crystalline silicon substrate (4) with the slot (101); wherein the top surface of the second positioning module (3) is arranged flush with the top surface of the first positioning module (1).

2. The coating jig according to claim 1, characterized in that: The first positioning module (1) comprises a base plate (102) and a first compensation plate (103); the first compensation plate (103) is connected to the top of the base plate (102) via a plurality of support columns (104); the slot (101) is arranged on the first compensation plate (103); the carrier module (2) and the second positioning module (3) are both arranged on the top of the base plate (102).

3. The coating jig according to claim 2, characterized in that: The top of the bottom plate (102) is provided with a plurality of lifting rings (105) along its periphery for lifting.

4. The coating jig according to claim 1, characterized in that: The thickness of the side wall of the groove (101) is less than the thickness of the crystalline silicon substrate (4), and a first inclined surface is provided at the bottom of the side wall of the groove (101), and the first inclined surface is gradually inclined from top to bottom toward a side away from the carrier module (2).

5. The coating jig according to claim 1, characterized in that: The second positioning module (3) is slidably connected to the first positioning module (1) via an adjusting component; the adjusting component is arranged on the first positioning module (1), and the output end of the adjusting component is connected to the second positioning module (3), and is suitable for driving the second positioning module (3) to reciprocate along the length direction of the slot (101).

6. The coating jig according to claim 5, characterized in that: The adjustment component comprises a driving member (305), a base (306) and a slider (307); the base (306) is arranged on the first positioning module (1), and the slider (307) is slidably connected to the base (306) along the length direction of the slot (101); the driving member (305) is arranged on the base (306), and the output end of the driving member (305) is connected to the slider (307), and is suitable for driving the slider (307) to slide back and forth along the length direction of the slot (101); the second positioning module (3) is arranged on the slider (307).

7. The coating jig according to claim 5, characterized in that: The second positioning module (3) comprises a second compensation plate (301) and a support plate (302); the second compensation plate (301) is connected to the output end of the adjustment component via the support plate (302); the size of the second compensation plate (301) is adapted to the size of the slot (101); the second compensation plate (301) is slidably matched with the slot (101) in the slot (101), and is suitable for enclosing and clamping the crystalline silicon substrate (4) with the slot (101).

8. The coating jig according to claim 7, characterized in that: The thickness of the end of the second compensation plate (301) facing the groove (101) is less than the thickness of the crystalline silicon substrate (4), and a second inclined surface is provided at the bottom of the end of the second compensation plate (301) facing the groove (101), and the second inclined surface is gradually inclined from top to bottom toward a side away from the carrier module (2).

9. The coating jig according to claim 7, characterized in that: The second positioning module (3) further comprises an adjustment plate (303) and a plurality of adjustment screws (304); the adjustment plate (303) is arranged at the bottom of the second compensation plate (301); the plurality of adjustment screws (304) all pass through the second compensation plate (301) and the adjustment plate (303) in sequence, and the adjustment screws (304) are threadedly connected to the adjustment plate (303), and the bottom of the adjustment screws (304) is rotatably connected to the support plate (302).

10. The coating jig according to any one of claims 1 to 9, characterized in that: A group of the carrier modules (2) is correspondingly arranged below each of the slots (101), and each group of the carrier modules (2) comprises a carrier (201) and a height adjustment mechanism (202); the carrier (201) is located below the slots (101) and is suitable for supporting the crystalline silicon substrate (4); the height adjustment mechanism (202) is arranged in the first positioning module (1), and the adjustment end of the height adjustment mechanism (202) is connected to the carrier (201) and is suitable for adjusting the height of the carrier (201); And / or, the slot (101) is provided in plurality, and the plurality of slots (101) are arranged side by side and spaced apart.

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