Electronic component processing mold

Abstract

The utility model discloses an electronic component processing mold, comprising an upper mold base and a lower mold base, a shielding device is arranged on the outer side of the position between the upper mold base and the lower mold base, the shielding device comprises a sliding mechanism and a lifting mechanism, the sliding mechanism comprises an upper protection component installed on the outer surface of the top end of the upper mold base, and a lower protection component installed on the bottom end surface of the lower mold base, the upper protection component comprises an upper movable half frame and an upper baffle plate fixedly connected, and the lower protection component comprises a lower movable half frame and a lower baffle plate fixedly connected; the upper movable half frame, the lower movable half frame and the lifting cover plate form a hollow rectangular three-dimensional shielding box, the shielding box is fitted with the outer surface of the lower mold base and the surface of the upper mold base, the shielding box plays the role of shielding external dust and impurities, has a shielding function, and can prevent dust and impurities from falling on the mold in a circuit board component production environment with dust and impurities.

Description

Technical Field

[0001] The utility model belongs to the technical field of molds, and in particular relates to an electronic component processing mold. Background Art

[0002] Electronic components are components of electronic elements and small machines and instruments. They are often composed of several parts. They are the general term for electronic components such as circuit boards, capacitors, transistors, hairsprings, and springs. In the production and manufacturing process of circuit boards, there is a COF processing step, that is, a chip-on-film processing step, which is a grain soft film assembly technology that fixes the integrated circuit (IC) on the flexible circuit board. The COF mold is a commonly used processing machinery and equipment for completing COF processing. The patent application number CN202122641174.4, which has been authorized in China for utility models, discloses a flexible circuit board processing mold. The processing mold of the electronic component circuit board is a public device;

[0003] When the COF mold performs COF processing on electronic components on a circuit board, the circuit board is placed on the lower mold base, the upper mold base is pressed down, and the integrated circuit is installed on the circuit board; after the COF processing mold has been used for a period of time, the mold will be damaged by wear and tear. The wear and tear includes natural wear and abnormal wear. One of the reasons for abnormal wear is the wear and tear of dust and impurities. Dust and impurities fall on the mold surface. During operation, the mold parts are damaged by the friction of dust and impurities. The chip-on-film processing mold itself does not have a shielding function. In a production environment where dust and impurities are generated, the problem of dust and impurities falling on the mold cannot be avoided. For this reason, we propose an electronic component processing mold. Utility Model Content

[0004] The utility model aims to provide an electronic component processing mold to solve the problem that the flip chip processing mold itself does not have a shielding function and cannot prevent dust and impurities from falling on the mold as mentioned in the background art.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an electronic component processing mold, comprising an upper mold base and a lower mold base, a shielding device is provided on the outer side of the position between the upper mold base and the lower mold base, the shielding device comprises a sliding mechanism and a lifting mechanism, the sliding mechanism comprises an upper protective assembly installed on the outer surface of the top end of the upper mold base, and a lower protective assembly installed on the bottom end surface of the lower mold base, the upper protective assembly comprises an upper movable half frame and an upper baffle plate fixedly connected, the lower protective assembly comprises a lower movable half frame and a lower baffle plate fixedly connected, the top of the lower baffle plate is distributed on the outer side of the bottom end of the upper baffle plate, the lifting mechanism comprises a stabilizing block and a lifting cover plate installed on the side surface of the top end of the upper mold base, a positioning assembly is provided on the end of the stabilizing block, the positioning assembly comprises a fixedly connected contraction spring and a sliding block, and a pushing column slidably connected to the stabilizing block, the end of the pushing column is connected to the sliding block, and the surface of the sliding block facing away from the contraction spring is provided with a convex column of an integrated structure.

[0006] Preferably, the upper movable half frame and the upper baffle are of "U"-shaped structure, and a first positioning block of an integral structure is provided on the opposite surfaces of the upper movable half frame, and the outer surface of the upper mold base is provided with a rectangular first sliding groove cooperating with the first positioning block.

[0007] Preferably, the lower movable half frame and the lower baffle are of "U"-shaped structure, the bottom surface of the lower movable half frame is provided with a second positioning block of an integral structure, and the surface of the lower mold base is provided with a rectangular first sliding groove cooperating with the second positioning block.

[0008] Preferably, the outer surface of the lower baffle plate matches the outer surface of the upper baffle plate, the upper baffle plate has a concave positioning groove on its opposite surface, and the lower baffle plate has a raised positioning protrusion on its opposite surface that cooperates with the positioning groove.

[0009] Preferably, a rectangular passing groove is provided on the bottom surface at the middle position of the lower movable half frame.

[0010] Preferably, the stabilizing block is provided with a long hole for the lifting cover plate to pass through and a rectangular groove for the sliding block to move, and the two ends of the contraction spring are respectively connected to the stabilizing block and the sliding block.

[0011] Preferably, the surface of the lifting cover plate is provided with equidistantly distributed circular grooves, and the surface of the stabilizing block is provided with rectangular short holes for the push column to slide.

[0012] Preferably, the convex column is perpendicular to the sliding block, and the convex column is clearance-matched with the circular groove.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] In the utility model, the upper movable half frame, the lower movable half frame and the lifting cover plate constitute a hollow rectangular three-dimensional shielding box, which is fitted with the outer surface of the lower mold base and the surface of the upper mold base. The shielding box plays a role in shielding external dust and impurities, and has a shielding function. In the production environment of circuit board components with dust and impurities, dust and impurities can be prevented from falling on the mold. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of the utility model;

[0016] Figure 2 It is a three-dimensional structural schematic diagram of the lower baffle of the utility model;

[0017] Figure 3 It is a schematic cross-sectional structure diagram of the stabilizing block of the utility model;

[0018] In the figure: 1. lower die base; 2. upper die base; 3. upper movable half frame; 4. upper baffle; 5. lower movable half frame; 6. lower baffle; 7. stabilizing block; 8. lifting cover plate; 9. pushing column; 10. contraction spring; 11. sliding block; 31. first positioning block; 41. positioning groove; 51. second positioning block; 52. passing groove; 61. positioning protrusion; 111. protruding column. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] Example

[0021] See also Figures 1 to 3The utility model provides a technical solution: an electronic component processing mold, including an upper mold base 1 and a lower mold base 2. The mold realizes the function of mold closing under the action of external force, and then achieves the function of assembling electronic components of chips and circuit boards. The above principle is a public technology and is not described in detail in this application; a shielding device is provided on the outer side of the position between the upper mold base 1 and the lower mold base 2. The shielding device has the function of blocking external dust and impurities from falling into the mold surface. The shielding device includes a sliding mechanism and a lifting mechanism. The sliding mechanism has the function of sliding and adjusting the upper movable half frame 3 relative to the lower movable half frame 5. The lifting mechanism has the function of lifting and adjusting the lifting cover plate 8. The sliding mechanism includes an upper movable half frame 3 and an upper baffle 4 installed on the outer surface of the top end of the upper mold base 1, and a lower movable half frame 5 and a lower baffle 6 installed on the bottom end surface of the lower mold base 2. When the upper mold base 1 moves down and closes the mold with the lower mold base 2, the upper movable half frame 3 moves down. At this time, the lifting cover plate 8 moves up. The bottom end of the lifting cover plate 8 has a certain distance from the lower mold base 2. The half frame 5 and the lifting cover plate 8 do not affect the mold closing process; when the mold is not in the mold closing process, the lifting cover plate 8 moves down, and the lifting cover plate 8 and the upper moving half frame 3 and the lower moving half frame 5 block the outer side between the upper mold base 1 and the lower mold base 2 to prevent external dust from falling into the surface of the parts in the upper mold base 1 and the lower mold base 2; the top of the lower baffle plate 6 is distributed on the outer side of the bottom end of the upper baffle plate 4, and the lifting mechanism includes a stabilizing block 7 and a lifting cover plate 8 installed on the side surface of the top end of the upper mold base 1, and the lifting cover plate 8 plays the role of blocking the surface of one side of the mold, and a fixedly connected contraction spring 10 and a sliding block 11 are provided on the end of the stabilizing block 7, as well as a pushing column 9 slidably connected to the stabilizing block 7. The finger pushes the pushing column 9, the sliding block 11 moves and the contraction spring 10 is in a contracted state, which is conducive to adjusting the height position of the lifting cover plate 8, and the end of the pushing column 9 is connected to the sliding block 11. The surface of the sliding block 11 facing away from the contraction spring 10 is provided with a convex column 111 of an integrated structure, and the convex column 111 is embedded in the surface of the lifting cover plate 8 to realize the positioning of the lifting cover plate 8.

[0022] In this embodiment, the upper movable half frame 3 and the upper baffle 4 are of a "U"-shaped structure. The upper movable half frame 3 is installed on the outer side of the lower mold base 2. The upper movable half frame 3 plays a role in shielding dust. A first positioning block 31 of an integral structure is provided on the opposite surface of the upper movable half frame 3. The outer surface of the upper mold base 1 is provided with a rectangular first slide groove that cooperates with the first positioning block 31. The first positioning block 31 is embedded in the surface of the upper mold base 1 to limit the upper movable half frame 3. The lower movable half frame 5 and the lower baffle 6 are of a "U"-shaped structure. The bottom surface of the lower movable half frame 5 is provided with a second positioning block 51 of an integral structure. The surface of the lower mold base 2 is provided with a rectangular first slide groove that cooperates with the second positioning block 51. The second positioning block 51 is embedded in the surface of the lower mold base 2 to limit the lower movable half frame 5.

[0023] In this embodiment, the outer surface of the lower baffle plate 6 is consistent with the outer surface of the upper baffle plate 4, and a concave positioning groove 41 is provided on the opposite surface of the upper baffle plate 4. A raised positioning protrusion 61 that cooperates with the positioning groove 41 is provided on the opposite surface of the lower baffle plate 6. The positioning protrusion 61 is embedded in the outer surface of the upper baffle plate 4, so that the upper baffle plate 4 is positioned and slides vertically.

[0024] In this embodiment, a rectangular passing groove 52 is provided on the bottom surface of the middle position of the lower movable half frame 5, which does not affect the passing of the circuit board.

[0025] In this embodiment, the stabilizing block 7 is provided with a long hole for the lifting cover 8 to pass through and a rectangular groove for the sliding block 11 to move, which does not affect the lifting process of the lifting cover 8. The two ends of the contraction spring 10 are respectively connected to the stabilizing block 7 and the sliding block 11. The surface of the lifting cover 8 is provided with equidistantly distributed circular grooves, and the surface of the stabilizing block 7 is provided with a rectangular short hole for the push column 9 to slide. The boss 111 is perpendicular to the sliding block 11, and the boss 111 is matched with the circular groove clearance. The boss 111 is embedded in the surface of the lifting cover 8 to realize the positioning of the lifting cover 8.

[0026] To sum up, the upper movable half frame 3, the lower movable half frame 5 and the lifting cover plate 8 form a hollow rectangular three-dimensional shielding box, which is fitted with the outer surface of the lower mold base 1 and the surface of the upper mold base 2. The shielding box plays a role in shielding external dust and impurities, and has a shielding function. In the production environment of circuit board components with dust and impurities, it can prevent dust and impurities from falling on the mold.

[0027] Although the embodiments of the present invention have been shown and described (see the above detailed description for details), it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An electronic component processing mold, comprising an upper mold base (1) and a lower mold base (2), characterized in that: A shielding device is provided on the outer side of the position between the upper die base (1) and the lower die base (2), and the shielding device comprises a sliding mechanism and a lifting mechanism, the sliding mechanism comprises an upper protection component mounted on the outer surface of the top end of the upper die base (1), and a lower protection component mounted on the bottom end surface of the lower die base (2), the upper protection component comprises an upper movable half frame (3) and an upper baffle (4) which are fixedly connected, the lower protection component comprises a lower movable half frame (5) and a lower baffle (6) which are fixedly connected, the top end of the lower baffle (6) being distributed on the upper baffle ( 4) on the outside of the bottom end, the lifting mechanism includes a stabilizing block (7) and a lifting cover (8) installed on the side surface of the top end of the upper mold base (1), a positioning component is provided on the end of the stabilizing block (7), and the positioning component includes a fixedly connected contraction spring (10) and a sliding block (11), and a pushing column (9) slidably connected to the stabilizing block (7), the end of the pushing column (9) is connected to the sliding block (11), and the surface of the sliding block (11) facing away from the contraction spring (10) is provided with a convex column (111) of an integral structure.

2. The electronic component processing mold according to claim 1, characterized in that: The upper movable half frame (3) and the upper baffle (4) are of a "U"-shaped structure. The opposing surfaces of the upper movable half frame (3) are provided with first positioning blocks (31) of an integral structure. The outer surface of the upper mold base (1) is provided with a rectangular first sliding groove that cooperates with the first positioning block (31).

3. The electronic component processing mold according to claim 1, characterized in that: The lower movable half frame (5) and the lower baffle (6) are of a "U"-shaped structure. The bottom surface of the lower movable half frame (5) is provided with a second positioning block (51) of an integral structure, and the surface of the lower mold base (2) is provided with a rectangular first sliding groove that cooperates with the second positioning block (51).

4. The electronic component processing mold according to claim 1, characterized in that: The outer surface of the lower baffle (6) matches the outer surface of the upper baffle (4), the upper baffle (4) is provided with a concave positioning groove (41) on the opposite surface, and the lower baffle (6) is provided with a convex positioning protrusion (61) that cooperates with the positioning groove (41) on the opposite surface.

5. The electronic component processing mold according to claim 1, characterized in that: A rectangular passing groove (52) is provided on the bottom surface at the middle position of the lower movable half frame (5).

6. The electronic component processing mold according to claim 1, characterized in that: The stabilizing block (7) is provided with a long hole for the lifting cover plate (8) to pass through and a rectangular groove for the sliding block (11) to move. The two ends of the contraction spring (10) are respectively connected to the stabilizing block (7) and the sliding block (11).

7. The electronic component processing mold according to claim 1, characterized in that: The surface of the lifting cover plate (8) is provided with circular grooves distributed at equal intervals, and the surface of the stabilizing block (7) is provided with rectangular short holes for the push column (9) to slide.

8. The electronic component processing mold according to claim 7, characterized in that: The convex column (111) is perpendicular to the sliding block (11), and the convex column (111) is clearance-matched with the circular groove.

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