Wafer glue injection mold

Abstract

The utility model discloses a wafer glue injection mold, which belongs to the technical field of wafer processing, and comprises a front sealing ring, a rear sealing ring is arranged behind the front sealing ring, the rear sealing ring and the front sealing ring can form a circular ring in a surrounding manner, backing rings are arranged in the front sealing ring and the rear sealing ring, an upper wafer is arranged above the backing rings, and a lower wafer is arranged above the upper wafer. A lower wafer is arranged below the backing ring, a glue injection opening is formed in the front sealing ring, and fixing assemblies used for fixing the front sealing ring and the rear sealing ring are arranged on the outer sides of the front sealing ring and the rear sealing ring; in the specific implementation process, the upper wafer, the lower wafer, the front sealing ring and the rear sealing ring define a cavity, a temperature measuring device is placed in the cavity, the cavity is filled with high-temperature glue by injecting the high-temperature glue from the glue injection opening, the upper wafer and the lower wafer can be bonded together through the high-temperature glue, and after glue injection is completed, the temperature measuring device is placed in the cavity. And the bonded wafer can be obtained by detaching the front sealing ring and the rear sealing ring.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a wafer glue injection mold. Background Art

[0002] In the semiconductor industry, the commonly used detection method is thermal imaging detection. The advantage of this detection method is that it is easy to use, but the disadvantage is that it is easily disturbed by light and has a large detection error. In order to measure the temperature of the wafer more accurately, it is necessary to install the temperature measuring device inside the wafer, that is, after installing the temperature measuring device between the two wafers, the two wafers are bonded together with high-temperature glue. Therefore, it is necessary to provide a mold to assist in the realization of this processing technology. Utility Model Content

[0003] Purpose of the utility model: A wafer glue injection mold to solve the above-mentioned problems existing in the prior art.

[0004] In order to solve the above technical problems, the utility model provides a wafer injection mold, including a front sealing ring, a rear sealing ring is arranged behind the front sealing ring, the rear sealing ring can form a circular ring with the front sealing ring, gaskets are arranged inside the front sealing ring and the rear sealing ring, an upper wafer is arranged above the gasket, and a lower wafer is arranged below the gasket, a glue injection port is arranged on the front sealing ring, and fixing components for fixing the front sealing ring and the rear sealing ring are arranged on the outer sides of the front sealing ring and the rear sealing ring.

[0005] As a preferred solution, the fixing assembly consists of an upper fixing mold and a lower fixing mold. The upper fixing mold is arranged above the upper wafer, and the lower fixing mold is arranged below the lower wafer. The lower fixing mold is provided with a fixing groove for the front sealing ring and the rear sealing ring to be inserted.

[0006] As a preferred solution, a plurality of first fixing through holes are formed on the front sealing ring and the rear sealing ring, and second fixing through holes aligned one-to-one with the first fixing through holes are formed on the upper fixed mold and the lower fixed mold.

[0007] As a preferred solution, one end of the upper fixed mold and the lower fixed mold away from the glue injection port is configured to have a flat bottom.

[0008] As a preferred solution, the plurality of first fixing through holes and the plurality of second fixing through holes are equidistantly arranged circumferentially around the center of the upper wafer.

[0009] As a preferred solution, a wedge-shaped opening is provided at the contact point between the front sealing ring and the rear sealing ring.

[0010] As a preferred solution, the front sealing ring and the rear sealing ring are both made of high temperature resistant stainless steel.

[0011] Beneficial effects: The utility model relates to a wafer glue injection mold. When in use, the upper wafer, the lower wafer, the front sealing ring and the rear sealing ring form a cavity. A temperature measuring device is placed in the cavity. The cavity is filled with high-temperature glue by injecting high-temperature glue from the glue injection port. The high-temperature glue can bond the upper wafer and the lower wafer together. After the glue injection is completed, the front sealing ring and the rear sealing ring are disassembled to obtain the bonded wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is an exploded schematic diagram of the overall structure of the utility model.

[0013] Figure 2 It is a partial structural schematic diagram of the utility model.

[0014] Figure 3 It is an enlarged schematic diagram of the rear sealing ring structure of the utility model.

[0015] The reference numerals in the figure are: front sealing ring 1, rear sealing ring 2, gasket 3, upper wafer 4, lower wafer 5, glue injection port 6, upper fixing film 7, lower fixing film 8, fixing groove 9, second fixing through hole 10, first fixing through hole 11, wedge-shaped opening 12. DETAILED DESCRIPTION

[0016] In the following description, a large number of specific details are given to provide a more thorough understanding of the utility model. However, it is obvious to those skilled in the art that the utility model can be implemented without one or more of these details. In other examples, in order to avoid confusion with the utility model, some technical features known in the art are not described.

[0017] The applicant has found that in order to measure the temperature of the wafer more accurately, it is necessary to install a temperature measuring device inside the wafer, that is, after installing the temperature measuring device between the two wafers, the two wafers are bonded together with high-temperature glue. Therefore, a mold needs to be provided to assist in realizing this processing technology.

[0018] To this end, the utility model provides a wafer glue injection mold, please refer to Figures 1 to 3The mold includes a front sealing ring 1, a rear sealing ring 2 is arranged behind the front sealing ring 1, and the rear sealing ring 2 can form a ring with the front sealing ring 1, a gasket 3 is arranged inside the front sealing ring 1 and the rear sealing ring 2, an upper wafer 4 is arranged above the gasket 3, and a lower wafer 5 is arranged below the gasket 3, a glue injection port 6 is arranged on the front sealing ring 1, and a fixing component for fixing the front sealing ring 1 and the rear sealing ring 2 is arranged on the outer side of the front sealing ring 1 and the rear sealing ring 2; in specific implementation, the upper wafer 4, the lower wafer 5, the front sealing ring 1 and the rear sealing ring 2 form a cavity, and a temperature measuring device is placed in the cavity. The cavity is filled with high-temperature glue by injecting high-temperature glue from the glue injection port 6, and the high-temperature glue can bond the upper wafer 4 to the lower wafer 5. After the glue injection is completed, the front sealing ring 1 and the rear sealing ring 2 are disassembled to obtain the bonded wafers.

[0019] Preferably, the fixing assembly consists of an upper fixing mold 7 and a lower fixing mold 8, the upper fixing mold 7 is arranged above the upper wafer 4, the lower fixing mold 8 is arranged below the lower wafer 5, and the lower fixing mold 8 is provided with a fixing groove 9 for the front sealing ring 1 and the rear sealing ring 2 to be inserted.

[0020] Preferably, the front sealing ring 1 and the rear sealing ring 2 are provided with a plurality of first fixing through holes 11, and the upper fixed mold 7 and the lower fixed mold 8 are provided with second fixing through holes 10 aligned one by one with the first fixing through holes 11; in specific implementation, small plugs are inserted into the first fixing through holes 11 and the second fixing through holes 10 to prevent the front sealing ring 1, the rear sealing ring 2 and the fixed assembly from rotating relative to each other.

[0021] Furthermore, in order to facilitate the glue injection, the combination of the upper fixed mold 7 and the lower fixed mold 8 needs to be erected, so the ends of the upper fixed mold 7 and the lower fixed mold 8 away from the glue injection port 6 are set to be flat.

[0022] Furthermore, the plurality of first fixing through holes 11 and the second fixing through holes 10 are equidistantly arranged in the circumferential direction around the center of the upper wafer 4 .

[0023] Preferably, a wedge-shaped opening 12 is provided at the contact point between the front sealing ring 1 and the rear sealing ring 2 ; after the glue injection is completed, the front sealing ring 1 and the rear sealing ring 2 can be separated more conveniently through the wedge-shaped opening 12 .

[0024] Preferably, the front sealing ring 1 and the rear sealing ring 2 are both made of high temperature resistant stainless steel.

[0025] The preferred embodiments of the present invention are described in detail above in conjunction with the accompanying drawings; however, the present invention is not limited to the specific details in the above embodiments. Within the technical concept of the present invention, various equivalent transformations can be made to the technical scheme of the present invention, and these equivalent transformations all belong to the protection scope of the present invention.

Claims

1. A wafer glue injection mold, characterized in that: include: Front seal ring; A rear sealing ring, which is arranged behind the front sealing ring and can form a ring with the front sealing ring; A gasket, arranged inside the front sealing ring and the rear sealing ring; an upper wafer, disposed above the pad ring; A lower wafer is arranged below the pad ring; A glue injection port, arranged on the front sealing ring; A fixing assembly is arranged on the outer sides of the front sealing ring and the rear sealing ring and is used for fixing the front sealing ring and the rear sealing ring.

2. A wafer glue injection mold according to claim 1, characterized in that: The fixing assembly comprises: An upper fixed mold, arranged above the upper wafer; A lower fixed mold, arranged below the lower wafer; A fixing groove is provided on the lower fixing mold and can be inserted into the front sealing ring and the rear sealing ring.

3. The wafer injection mold according to claim 2, characterized in that: The front sealing ring and the rear sealing ring are provided with a plurality of first fixing through holes, and the upper fixed mold and the lower fixed mold are provided with second fixing through holes which are aligned one by one with the first fixing through holes.

4. The wafer glue injection mold according to claim 2, characterized in that: One end of the upper fixed mold and the lower fixed mold away from the glue injection port is arranged to have a flat bottom.

5. The wafer glue injection mold according to claim 3, characterized in that: The plurality of first fixing through holes and the plurality of second fixing through holes are equidistantly arranged in a circumferential direction around the center of the upper wafer.

6. The wafer injection mold according to claim 1, characterized in that A wedge-shaped opening is provided at the contact point between the front sealing ring and the rear sealing ring.

7. The wafer glue injection mold according to claim 1, characterized in that: The front sealing ring and the rear sealing ring are both made of high-temperature resistant stainless steel.

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