A cooling device for producing waterproof roll material

Abstract

The utility model relates to the technical field of cooling and forming of waterproof coiled materials, specifically a cooling device for producing waterproof coiled materials, comprising: a semiconductor refrigeration plate is installed at the bottom of a cooling pool, a water-cooled heat sink is located below the semiconductor refrigeration plate, a water pump, a fan, a pool water radiator and a semiconductor radiator are arranged inside the heat dissipation chamber, the water pump is fixedly installed on the side wall of the heat dissipation chamber, a plurality of air guide holes are opened at the bottom of the heat dissipation chamber and the air guide holes are located directly below the fan, and a pool water radiator and a semiconductor radiator are arranged above the fan; the beneficial effect is: the cooling device adopts a circulating cooling scheme, with the help of a water pump to extract hot water, and discharges cold water through the radiator to dissipate heat, and cools the pool water together with the semiconductor heat sink, greatly reducing water consumption, and drying the moisture on the surface of the coiled material through heat exchange between the radiator and the fan, effectively utilizing heat while facilitating subsequent processes.

Description

Technical Field

[0001] The utility model relates to the technical field of cooling and forming waterproof coiled materials, in particular to a cooling device for producing waterproof coiled materials. Background Art

[0002] Waterproofing rolls are mainly used in building walls, roofs, tunnels, roads, landfills, etc. to protect against rainwater and groundwater leakage. The temperature of waterproofing rolls is high before rolling, so they need to be cooled before rolling to prevent wrinkling and deformation of the waterproofing rolls and ensure the quality of the waterproofing rolls.

[0003] In the prior art, a cooling method using a flowing water pool is usually used. Even if the coil passes through flowing water to achieve the purpose of cooling, this cooling method consumes a lot of water and easily causes water to accumulate on the surface of the waterproof coil, which is not conducive to subsequent processes. Therefore, the utility model proposes a cooling device for producing waterproof coils to solve the above problems. Utility Model Content

[0004] The utility model aims to provide a cooling device for producing waterproof coiled materials, so as to solve the problems of large water consumption and water accumulation on the surface of waterproof coiled materials proposed in the above-mentioned background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a cooling device for producing waterproof coiled materials, comprising: a cooling pool and a heat dissipation chamber, a semiconductor refrigeration plate is installed at the bottom of the cooling pool, a water-cooled heat dissipation plate is below the semiconductor refrigeration plate, the top of the heat dissipation chamber is an air outlet, a water pump, a fan, a pool water radiator and a semiconductor radiator are arranged inside the heat dissipation chamber, the water pump is fixedly installed on the side wall of the heat dissipation chamber, a plurality of air guide holes are opened at the bottom of the heat dissipation chamber and the air guide holes are located directly below the fan, and the pool water radiator and the semiconductor radiator are installed above the fan.

[0006] Preferably, four pairs of guide columns are fixedly installed on the inner wall of the cooling pool, a slide groove is opened at one end of the guide column, a hydraulic rod is arranged at the lower end of the slide groove, a spring is arranged at the upper end of the slide groove, a slider is arranged in the slide groove, a bearing is embedded in the slider, the bearing is nested and connected with the rotating shaft of the guide roller, one side of the spring is fixedly connected to the upper end of the slide groove, and the other side is connected to the upper end of the slider, the hydraulic rod is fixedly installed at the lower end of the slide groove, and the push rod at the upper end of the hydraulic rod is connected to the lower end of the slider.

[0007] Preferably, a non-slip silicone pad is fixedly installed on the surface of the guide roller, and the guide roller shaft is connected to the servo motor.

[0008] Preferably, a water outlet is provided at the upper end of the side wall of the cooling pool, one end of the water outlet is provided with a filter screen, and the other end is connected to a water pump through a pipeline, and the water pump is connected to a pool water radiator through a pipeline.

[0009] Preferably, a pool water inlet is provided at the bottom end of the side wall of the cooling pool, and the pool water inlet is connected to a pool water radiator through a pipeline.

[0010] Preferably, the water-cooled heat sink has a heat dissipation path inside, in which there is coolant, one end of the heat dissipation path is connected to a water outlet of the heat sink, and the other end is connected to a water inlet of the heat sink.

[0011] Preferably, the water outlet of the heat sink is connected to a water pump via a pipeline, the water pump is connected to a semiconductor radiator via a pipeline, and the end of the semiconductor radiator away from the water pump is connected to a water inlet of the heat sink.

[0012] Preferably, a controller is installed on one side of the outer wall of the cooling pool, and the controller is electrically connected to the semiconductor refrigeration plate, the fan, the water pump, the hydraulic rod, and the servo motor.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] 1. The utility model proposes a cooling device for producing waterproof coiled materials, which adopts a circulating cooling scheme, uses a water pump to extract hot water, dissipates heat through a radiator and discharges cold water, and cools the pool water together with a semiconductor heat sink, greatly reducing water consumption;

[0015] 2. The utility model proposes a cooling device for producing waterproof coiled materials. The coiled materials can be dragged into water by guide rollers that can move up and down. After cooling, the guide rollers rotate and squeeze to remove part of the water on the surface of the coiled materials. The moisture on the surface of the coiled materials is then dried by heat exchange between the radiator and the fan, which effectively utilizes heat and facilitates subsequent processes. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a side sectional view of the cooling device of the waterproof coiled material of the utility model;

[0017] Figure 2 It is an overall top view of the cooling device of the waterproof coiled material of the utility model;

[0018] Figure 3 This is a cross-sectional view of the pool water cooling device of the utility model;

[0019] Figure 4 This is a cross-sectional view of the semiconductor cooling device of the present utility model.

[0020] In the figure: 1. cooling pool; 2. guide column; 3. air outlet; 4. heat dissipation chamber; 5. guide roller; 6. semiconductor refrigeration plate; 7. water-cooled heat sink; 8. heat sink outlet; 9. heat sink inlet; 10. pool water radiator; 11. semiconductor radiator; 12. fan; 13. air guide hole; 14. water pump; 15. pool water outlet; 16. pool water inlet; 17. filter; 18. guide slope; 19. spring; 20. hydraulic rod; 21. controller. DETAILED DESCRIPTION

[0021] In order to make the purpose and technical solution of the utility model clearly and completely described, and the advantages more clearly understood, the embodiments of the utility model are further described in detail in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are part of the embodiments of the utility model, not all of the embodiments, and are only used to explain the embodiments of the utility model, and are not used to limit the embodiments of the utility model. All other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] In the description of the present utility model, it should be noted that the terms "center", "middle", "upper", "lower", "left", "right", "inner", "outer", "top", "bottom", "side", "vertical", "horizontal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "one", "first", "second", "third", "fourth", "fifth", "sixth" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0023] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0024] For the purpose of simplicity and illustration, the principles of the embodiments are mainly described by reference to examples. In the following description, many specific details are proposed to provide a thorough understanding of the embodiments. However, it is obvious that for those of ordinary skill in the art, these embodiments may not be limited to these specific details in practice. In some instances, known methods and structures are not described in detail to avoid making these embodiments unnecessarily difficult to understand. In addition, all embodiments can be used in combination with each other.

[0025] See also Figures 1 to 4 The utility model provides a technical solution: a cooling device for producing waterproof coiled materials, comprising: a cooling pool 1 and a heat dissipation chamber 4, a semiconductor refrigeration plate 6 is installed at the bottom of the cooling pool 1, the semiconductor refrigeration plate 6 can cool the liquid in the cooling pool 1, a water-cooled heat sink 7 is below the semiconductor refrigeration plate 6, the water-cooled heat sink 7 is used to take out the heat exchanged by the semiconductor refrigeration plate 6, the top of the heat dissipation chamber 4 is an air outlet 3, a water pump 14, a fan 12, a pool water radiator 10 and a semiconductor radiator 11 are arranged inside the heat dissipation chamber 4, the water pump 14 is fixedly installed on the side wall of the heat dissipation chamber 4, a plurality of air guide holes 13 are opened at the bottom of the heat dissipation chamber 4 and the air guide holes 13 are located directly below the fan 12, a pool water radiator 10 and a semiconductor radiator 11 are arranged above the fan 12, the structure of the pool water radiator 10 and the semiconductor radiator 11 is that a plurality of heat spreaders are arranged around the pipeline, the heat spreader material is made of red copper material with high thermal conductivity, the heat spreader is fin-shaped, the pool water radiator 10 and the semiconductor radiator 11 can conduct the heat of the liquid in the pipeline to the radiator surface;

[0026] Four pairs of guide columns 2 are fixedly installed on the inner wall of the cooling pool 1. A slide groove is opened at one end of the guide column 2. A hydraulic rod 20 is arranged at the lower end of the slide groove. A spring 19 is arranged at the upper end of the slide groove. A slider is arranged in the slide groove. The hydraulic rod 20, the spring 19 and the slider can only slide up and down synchronously in the slide groove. The bearing is embedded in the slider. The bearing is nested and connected with the rotating shaft of the guide roller 5. One side of the spring 19 is fixedly connected to the upper end of the slide groove, and the other side is connected to the upper end of the slider. The hydraulic rod 20 is fixedly installed at the lower end of the slide groove, and the push rod at the upper end of the hydraulic rod 20 is connected to the lower end of the slider.

[0027] A controller 21 is installed on one side of the outer wall of the cooling pool 1. The controller 21 is electrically connected to the semiconductor refrigeration plate 6, the fan 12, the water pump 14, the hydraulic rod 20, and the servo motor. The controller 21 can control the stroke of the hydraulic rod 20, the speed of the servo motor, the cooling power of the semiconductor refrigeration plate 6, the opening and closing of the water pump, and the opening and closing of the fan 12;

[0028] The surface of the guide roller 5 is fixedly installed with an anti-skid silicone pad, which can prevent the coil and the guide roller 5 from slipping during underwater work. The guide roller 5 shaft is connected to the servo motor. Figure 1The figure shows the initial position of the hydraulic rod 20. When the coil is feeding, the first three pairs of hydraulic rods 20 push upwards, so that the first three pairs of guide rollers 5 are on the same horizontal plane, the spring 19 is compressed, and the servo motor is started to rotate the upper guide roller 5 and the lower guide roller 5 in opposite directions, and the coil is pushed in by the guide slope 18. The rotation of the guide roller 5 drives the coil to move forward, so that the coil passes through the middle of each pair of guide rollers 5. When the coil is completely moved to the top of the cooling pool 1, the servo motor is turned off, and the first three pairs of guide rollers 5 are lowered below the liquid surface for cooling. After cooling, the first three pairs of guide rollers 5 are raised, and the servo motor is turned on. The hydraulic rod 20 under the fourth pair of guide rollers 5 is raised. At this time, the spring 19 is compressed, and the guide rollers 5 are clamped toward each other, so that the cooled coil passes through the fourth pair of guide rollers 5. The surface water of the coil is removed under the pressure. At the same time, with the rotation of the guide rollers 5, the coil connected behind continues to move forward, and the cooling process is completed successively.

[0029] Specifically, there is a heat dissipation guide inside the water-cooled heat sink 7, and there is coolant in the heat dissipation guide. One end of the heat dissipation guide is connected to the heat sink water outlet 8, and the other end is connected to the heat sink water inlet 9. The heat sink water outlet 8 is connected to the water pump 14 through a pipeline. One end of the semiconductor radiator 11 is connected to the water pump 14, and the other end is connected to the heat sink water inlet 9. The upper part of the semiconductor refrigeration plate 6 is in contact with the liquid in the cooling pool 1, and the semiconductor refrigeration plate 6 can realize heat exchange. The semiconductor refrigeration plate 6 transfers the heat of the upper liquid to the water-cooled heat sink 7 below the semiconductor refrigeration plate 6. The water pump 14 drives the coolant to flow, thereby taking out the heat of the water-cooled heat sink 7. Then the coolant is pumped into the semiconductor radiator 11, and the fan 12 below blows air upward to take away the heat in the coolant. The cooled coolant then flows into the water-cooled heat sink 7 through the heat sink water inlet 9 for circulation refrigeration, thereby achieving a better cooling effect.

[0030] Secondly, the pool water heated by the coil will flow upward due to its lighter specific gravity. A pool water outlet 15 is provided at the upper end of the side wall of the cooling pool 1. A filter screen 17 is provided at one end of the pool water outlet 15, and the other end is connected to a water pump 14 through a pipeline. The water pump 14 is connected to the pool water radiator 10. Under the action of the water pump 14, the high-temperature water flows out of the pool water outlet 15 through the filter screen 17, and flows into the pool water radiator 10 through the pipeline. The fan 12 below blows air upward to take away the heat in the pool water. The cooled pool water then enters the cooling pool 1 through the pool water inlet 16.

[0031] After the coil is cooled, the guide roller 5 is raised to lift the coil out of the water. The guide roller 5 rotates while squeezing the coil to remove some water on the surface of the coil and send the coil to the top of the air outlet 3. The fan 12 blows the heat of the pool water radiator 10 and the semiconductor radiator 11 out of the air outlet 3 to dry the remaining water on the surface of the cooled coil.

[0032] Working principle: In actual operation, before the coil is fed, the water pump 14 and the semiconductor refrigeration plate 6 are turned on to reduce the temperature of the cooling pool 1, and then the first three pairs of hydraulic rods 20 are pushed upward to make the first three pairs of guide rollers 5 on the same horizontal plane, the spring 19 is compressed, and the servo motor is started to make the upper guide roller 5 and the lower guide roller 5 rotate in opposite directions, and the coil is pushed in by the guide slope 18. The rotation of the guide roller 5 drives the coil to move forward, so that the coil passes through the middle of each pair of guide rollers 5. When the coil is completely moved to the top of the cooling pool 1, the servo motor is turned off, and the first three pairs of guide rollers 5 are lowered below the liquid level. The coil is cooled, and the first three pairs of guide rollers 5 are raised after cooling, and the servo motor is turned on. The hydraulic rod 20 under the fourth pair of guide rollers 5 is raised, and the spring 19 is compressed at this time, and the guide rollers 5 are clamped toward each other, so that the cooled coil passes through the fourth pair of guide rollers 5, and the surface water of the coil is removed under the action of pressure. At the same time, with the rotation of the guide rollers 5, the coil connected behind continues to move forward, and the cooling process is completed successively and the coil is sent to the top of the air outlet 3. The fan 12 blows out the heat of the pool water radiator 10 and the semiconductor radiator 11 from the air outlet 3, and the residual water on the surface of the cooled coil is dried.

[0033] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A cooling device for producing waterproof coiled material, comprising: A cooling pool (1) and a heat dissipation chamber (4), characterized in that: a semiconductor refrigeration plate (6) is installed at the bottom of the cooling pool (1), a water-cooled heat dissipation plate (7) is located below the semiconductor refrigeration plate (6), the top of the heat dissipation chamber (4) is an air outlet (3), a water pump (14), a fan (12), a pool water radiator (10) and a semiconductor radiator (11) are arranged inside the heat dissipation chamber (4), the water pump (14) is fixedly installed on the side wall of the heat dissipation chamber (4), a plurality of air guide holes (13) are opened at the bottom of the heat dissipation chamber (4) and the air guide holes (13) are located directly below the fan (12), and the pool water radiator (10) and the semiconductor radiator (11) are installed above the fan (12).

2. A cooling device for producing waterproof coiled material according to claim 1, characterized in that: Four pairs of guide columns (2) are fixedly mounted on the inner wall of the cooling pool (1), a slide groove is formed at one end of the guide column (2), a hydraulic rod (20) is arranged at the lower end of the slide groove, a spring (19) is arranged at the upper end of the slide groove, a slider is arranged in the slide groove, a bearing is embedded in the slider, the bearing is nested and connected with the rotating shaft of the guide roller (5), one side of the spring (19) is fixedly connected to the upper end of the slide groove, and the other side is connected to the upper end of the slider, the hydraulic rod (20) is fixedly mounted at the lower end of the slide groove, and a push rod at the upper end of the hydraulic rod (20) is connected to the lower end of the slider.

3. A cooling device for producing waterproof coiled material according to claim 2, characterized in that: An anti-skid silicone pad is fixedly mounted on the surface of the guide roller (5), and the rotating shaft of the guide roller (5) is connected to a servo motor.

4. A cooling device for producing waterproof coiled material according to claim 3, characterized in that: A pool water outlet (15) is provided at the upper end of the side wall of the cooling pool (1), a filter screen (17) is provided at one end of the pool water outlet (15), and the other end is connected to a water pump (14) via a pipeline, and the water pump (14) is connected to a pool water radiator (10) via a pipeline.

5. A cooling device for producing waterproof coiled material according to claim 4, characterized in that: A pool water inlet (16) is provided at the bottom end of the side wall of the cooling pool (1), and the pool water inlet (16) is connected to the pool water radiator (10) via a pipeline.

6. A cooling device for producing waterproof coiled material according to claim 1, characterized in that: The water-cooled heat sink (7) has a heat dissipation path inside, in which there is coolant, one end of the heat dissipation path is connected to the heat sink water outlet (8), and the other end is connected to the heat sink water inlet (9).

7. A cooling device for producing waterproof coiled material according to claim 6, characterized in that: The heat sink water outlet (8) is connected to a water pump (14) via a pipeline, the water pump (14) is connected to a semiconductor radiator (11) via a pipeline, and the end of the semiconductor radiator (11) away from the water pump (14) is connected to a heat sink water inlet (9).

8. A cooling device for producing waterproof coiled material according to claim 4, characterized in that: A controller (21) is installed on one side of the outer wall of the cooling pool (1), and the controller (21) is electrically connected to the semiconductor refrigeration plate (6), the fan (12), the water pump (14), the hydraulic rod (20), and the servo motor.

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