A chip film capacitor lead-out plate welding foot processing system

Abstract

The utility model discloses a lead-out plate welding foot processing system for a chip-type film capacitor, characterized in that it includes: a lower welding seat, an upper welding seat, a first positioning block and a second positioning block; the first positioning block is provided with a first placement groove for placing the lead-out plate, and the first welding head can be set against the bottom of the lead-out plate; the first positioning block can be moved and adjusted relative to the lower welding seat; the second positioning block is provided with a second placement groove for limiting the position of the copper wire; the second positioning block can be moved and adjusted relative to the first positioning block; the upper welding seat is connected with a moving mechanism to move the second welding head toward the first welding head and press the lead-out plate and the copper wire for welding. The utility model can ensure the precise position of the lead-out plate during installation at a relatively low cost, ensure the accuracy and minimization of the position of the soldering point, ensure the precise installation plate distance and flatness of such capacitor products, and avoid problems such as soldering plate deviation and soldering plate crookedness.

Description

Technical Field

[0001] The utility model relates to the technical field of capacitor production, in particular to a lead-out sheet welding foot processing system of a chip-type film capacitor. Background Art

[0002] Film capacitors in the field of new energy applications require various welding piece shapes and different sheet spacings due to different customer circuit installation design methods. They also need to be able to withstand pulse currents of thousands of amperes and effective currents of tens of amperes, so the appearance and performance of this type of capacitor must match. When manufacturing such film capacitors, the connection between the lead sheet and the core is generally made of several lead pins. The quality stability of the connection point is very important for the product's overcurrent performance. In addition, the number of finished product batches is large, and the number of lead sheets required is 2-3 times the number of finished products. Tens of thousands of lead sheets need to be welded every day. Therefore, it is necessary to design a processing system that can ensure the stable and efficient welding quality of the lead sheet and the tinned copper wire. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model provides a lead-out plate welding foot processing system for a chip-type film capacitor.

[0004] An embodiment of the utility model solves the technical problem by adopting a technical solution: a lead-out plate welding foot processing system of a chip-type film capacitor, comprising: a lower welding seat, an upper welding seat, a first positioning block and a second positioning block;

[0005] The lower welding seat and the upper welding seat are electrically connected to the inverter power supply; the lower welding seat is provided with a first welding head, and the upper welding seat is provided with a second welding head;

[0006] The first positioning block is provided with a first placement groove for placing the lead-out piece, and the first welding head can be placed under the lead-out piece; the first positioning block can be moved and adjusted relative to the lower welding seat; the second positioning block is provided with a second placement groove for limiting the position of the copper wire; the second positioning block can be moved and adjusted relative to the first positioning block;

[0007] The upper welding seat is connected with a moving mechanism so that the second welding head moves toward the first welding head and presses the lead-out sheet and the copper wire for welding.

[0008] Optionally, the first positioning block is provided with a first elongated hole and a second elongated hole; the first locking member can pass through the first elongated hole and lock the first positioning block to the lower welding seat; the first welding head can be passed through the second elongated hole.

[0009] Optionally, the second positioning block is provided with a third elongated hole; the second locking member can pass through the third elongated hole and lock the second positioning block to the first positioning block.

[0010] Optionally, the second positioning block is provided with a guide rib along the extension direction of the third elongated hole; the first positioning block is provided with a guide groove, and the guide rib can slide in the guide groove.

[0011] Optionally, the second positioning block is provided with a magnetic attraction member.

[0012] Optionally, the moving mechanism is a telescopic cylinder.

[0013] The beneficial effects of the utility model are as follows: the first positioning block can be slidably adjusted relative to the lower welding seat, and the second positioning block can be slidably adjusted relative to the first positioning block, so as to adjust the relative position of the lead-out piece relative to the first welding head, and the relative position of the copper wire and the lead-out piece; so as to ensure the accuracy of the point position of the lead-out piece and the tinned copper wire soldering point. A processing method that uses an inverter power supply to connect the two-pole soldering head for current heating, and fuses the lead-out piece and the tinned copper wire under the action of pressure and heat. The utility model has a simple structure and can ensure the precise position of the lead-out piece during installation at a relatively low cost, ensure the accuracy and minimization of the soldering point position, ensure the precise installation piece distance and flatness of such capacitor products, avoid problems such as solder piece deviation and solder piece crookedness, so that in application, it can better avoid connection abnormalities such as arcing and sparking, which is beneficial to the long-term reliability of thin-film capacitors in the new energy field.

[0014] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0016] Figure 1 This is a schematic diagram of the structure of the lead-out plate welding foot processing system of the utility model;

[0017] Figure 2 for Figure 1 Another perspective of the lead-out solder leg processing system;

[0018] Figure 3 for Figure 1 Schematic diagram of the decomposition of the lead-out plate welding foot processing system;

[0019] Figure 4 for Figure 1 Cross-sectional view of the lead-out solder leg processing system.

[0020] Description of main component symbols:

[0021] 10. Lower welding seat; 11. First welding head; 20. Upper welding seat; 21. Second welding head; 30. First positioning block; 31. First placement groove; 32. First long hole; 33. Second long hole; 34. Guide groove; 40. Second positioning block; 41. Second placement groove; 42. Third long hole; 43. Guide rib; 50. First locking piece; 60. Second locking piece; 70. Lead-out piece; 80. Copper wire. DETAILED DESCRIPTION

[0022] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.

[0023] In the description of the present utility model, the meaning of "more than" is more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0024] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0025] In the present invention, unless otherwise clearly defined, the words "set", "install", "connect" and the like should be understood in a broad sense, for example, they can be directly connected or indirectly connected through an intermediate medium; they can be fixedly connected or detachably connected or integrally formed; they can be mechanically connected; they can be the internal connection of two elements or the interaction relationship between two elements. Those skilled in the art can reasonably determine the specific meanings of the above words in the present invention in combination with the specific content of the technical solution.

[0026] Example

[0027] Reference Figures 1 to 4 The utility model proposes a welding foot processing system for a lead-out sheet 70 of a chip-type film capacitor, comprising: a lower welding seat 10, an upper welding seat 20, a first positioning block 30 and a second positioning block 40;

[0028] The lower welding seat 10 and the upper welding seat 20 are electrically connected to the inverter power supply; the lower welding seat 10 is provided with a first welding head 11, and the upper welding seat 20 is provided with a second welding head 21;

[0029] The first positioning block 30 is provided with a first placement groove 31 for placing the lead-out piece 70, and the first welding head 11 can be placed under the lead-out piece 70; the first positioning block 30 can be moved and adjusted relative to the lower welding seat 10; the second positioning block 40 is provided with a second placement groove 41 for limiting the copper wire 80; the second positioning block 40 can be moved and adjusted relative to the first positioning block 30;

[0030] The upper welding seat 20 is connected to a moving mechanism so that the second welding head 21 moves toward the first welding head 11 and presses the lead-out piece 70 and the copper wire 80 for welding.

[0031] In the utility model, the first positioning block 30 can be slidably adjusted relative to the lower welding seat 10, and the second positioning block 40 can be slidably adjusted relative to the first positioning block 30, so as to adjust the relative position of the lead-out piece 70 relative to the first welding head 11, and the relative position of the copper wire 80 and the lead-out piece 70; so as to ensure the accuracy of the point position of the lead-out piece 70 and the tinned copper wire 80. A processing method using an inverter power supply to connect the two-pole welding head for current heating, and melting the lead-out piece 70 and the tinned copper wire 80 under the action of pressure and heat. The utility model has a simple structure and can ensure the precise position of the lead-out piece 70 during installation at a relatively low cost, ensure the accuracy and minimization of the position of the soldering point, ensure the precise installation distance and flatness of such capacitor products, avoid problems such as soldering piece deviation and soldering piece crookedness, so that in application, it can better avoid connection abnormalities such as arcing and sparking, which is beneficial to the long-term reliability of thin-film capacitors in the new energy field.

[0032] In this embodiment, the first positioning block 30 is provided with a first elongated hole 32 and a second elongated hole 33; the first locking member 50 can pass through the first elongated hole 32 and lock the first positioning block 30 to the lower welding seat 10; the first welding head 11 can pass through the second elongated hole 33. The position of the first positioning block 30 on the lower welding seat 10 can be conveniently adjusted by using the first elongated hole 32 and the second elongated hole 33.

[0033] Specifically, the second positioning block 40 is provided with a third elongated hole 42; the second locking member 60 can pass through the third elongated hole 42 and lock the second positioning block 40 to the first positioning block 30. The third elongated hole 42 can be used to conveniently adjust the relative position of the second positioning block 40 relative to the first positioning block 30, thereby adjusting the relative position of the lead-out piece 70 and the copper wire 80.

[0034] Furthermore, the second positioning block 40 is provided with a guide rib 43 along the extension direction of the third long hole 42; the first positioning block 30 is provided with a guide groove 34, and the guide rib 43 can slide in the guide groove 34. By using the guide rib 43 and the guide groove 34, the second positioning block 40 can be slidably adjusted along a straight line relative to the first positioning block 30, and it is not easy to cause deviation or deflection.

[0035] In some embodiments, in order to ensure that the copper wire 80 is firmly fixed in place, the second positioning block 40 is provided with a magnetic attraction member.

[0036] In some embodiments, the moving mechanism is a telescopic cylinder, which can quickly move the upper welding seat 20 for welding.

[0037] Through the above scheme, the lead pin processing of the lead plate 70 of the chip-type lead capacitor can ensure the precise position of the lead plate 70 during installation at a relatively low cost, ensure the accurate and firm connection between the lead plate 70 and the core, minimize the solder joints, ensure the precise installation plate spacing and flatness of such capacitor products, avoid problems such as welding plate deviation and welding plate crookedness, so that in application, it can better avoid connection abnormalities such as arcing and sparking, which is beneficial to the long-term reliability of thin-film capacitors in the new energy field.

[0038] Of course, the present invention is not limited to the above-mentioned embodiments, and technicians familiar with the field may make equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications and substitutions are all included in the scope defined by the claims of this application.

Claims

1. A lead-out plate welding foot processing system for a chip film capacitor, characterized in that: include: A lower welding seat (10), an upper welding seat (20), a first positioning block (30) and a second positioning block (40); The lower welding seat (10) and the upper welding seat (20) are electrically connected to an inverter power supply; the lower welding seat (10) is provided with a first welding head (11), and the upper welding seat (20) is provided with a second welding head (21); The first positioning block (30) is provided with a first placement groove (31) for placing the lead-out piece (70), and the first welding head (11) can be placed under the lead-out piece (70); the first positioning block (30) can be moved and adjusted relative to the lower welding seat (10); the second positioning block (40) is provided with a second placement groove (41) for limiting the position of the copper wire (80); the second positioning block (40) can be moved and adjusted relative to the first positioning block (30); The upper welding seat (20) is connected to a moving mechanism so that the second welding head (21) moves toward the first welding head (11) and presses the lead-out piece (70) and the copper wire (80) for welding.

2. The lead-out soldering foot processing system of a chip type film capacitor according to claim 1, characterized in that: The first positioning block (30) is provided with a first elongated hole (32) and a second elongated hole (33); the first locking member (50) can pass through the first elongated hole (32) and lock the first positioning block (30) to the lower welding seat (10); the first welding head (11) can be passed through the second elongated hole (33).

3. The lead-out plate welding foot processing system of the chip type film capacitor according to claim 1, characterized in that: The second positioning block (40) is provided with a third elongated hole (42); the second locking member (60) can pass through the third elongated hole (42) and lock the second positioning block (40) to the first positioning block (30).

4. The lead-out plate welding foot processing system of the chip type film capacitor according to claim 3 is characterized in that: The second positioning block (40) is provided with a guide rib (43) along the extension direction of the third elongated hole (42); the first positioning block (30) is provided with a guide groove (34), and the guide rib (43) can slide in the guide groove (34).

5. The lead-out plate welding foot processing system of the chip type film capacitor according to claim 1, characterized in that: The second positioning block (40) is provided with a magnetic attraction member.

6. The lead-out plate welding foot processing system of the chip type film capacitor according to claim 1, characterized in that: The moving mechanism is a telescopic cylinder.

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