Mounts, ionization assemblies, and plasma generation devices

Abstract

The utility model discloses a mounting seat, an ionization component and a plasma generating device, and relates to the field of plasma processing technology, wherein the mounting seat has an air inlet channel, a first electrode mounting groove and a second electrode mounting groove; the first electrode mounting groove and the second electrode mounting groove are located on both sides of the air inlet channel on the mounting seat; the first electrode mounting groove has a first opening connected to the air inlet channel, and the second electrode mounting groove has a second opening connected to the air inlet channel; a first preset spacing is reserved between the first electrode mounting groove and the second electrode mounting groove; the utility model adopts a reasonable design of the first preset spacing reserved between the first electrode mounting groove and the second electrode mounting groove, so that the process gas is transported through the air inlet channel to the position in the mounting seat that is best affected by the electric field generated by the first electrode and the second electrode for ionization.

Description

Technical Field

[0001] The utility model relates to the technical field of plasma processing, in particular to a mounting seat, an ionization component and a plasma generating device. Background Art

[0002] Plasma processing equipment is a device used to perform surface treatments such as plasma etching, deposition, and cleaning on wafers or circuit boards in a reaction chamber. The process gas is formed into plasma under the action of the electric field generated by the electrode through a plasma generating device. The plasma reacts with the surface of the wafer or circuit board in the reaction chamber, thereby performing plasma etching, deposition, and cleaning on the wafer or circuit board in the reaction chamber.

[0003] However, in the process of ionizing process gas to form plasma in the existing plasma generating device, the distribution of process gas delivered to the electrode is uneven, so that a large amount of process gas is delivered to the mounting seat and does not form plasma under the action of the electric field generated by the electrode, thereby affecting the efficiency of process gas forming plasma. Utility Model Content

[0004] The main purpose of the utility model is to provide a mounting seat, aiming to improve the efficiency of forming plasma from process gas.

[0005] To achieve the above-mentioned purpose, the utility model proposes a mounting seat, which has an air inlet channel, a first electrode mounting groove and a second electrode mounting groove, and the air inlet channel has an air inlet and an air outlet; the first electrode mounting groove and the second electrode mounting groove are located on both sides of the air inlet channel on the mounting seat; the first electrode mounting groove has a first opening connected to the air inlet channel, and the second electrode mounting groove has a second opening connected to the air inlet channel, and the first opening and the second opening are arranged opposite to each other; a first preset distance is reserved between the first electrode mounting groove and the second electrode mounting groove.

[0006] In one embodiment, the groove wall of the first electrode mounting groove is arranged in an arc shape; and / or the groove wall of the second electrode mounting groove is arranged in an arc shape.

[0007] In one embodiment, the mounting seat includes two side plates arranged opposite to each other, the first electrode mounting groove has a first through hole passing through the side plate, the second electrode mounting groove has a second through hole passing through the side plate, and the spacing between the first through hole and the second through hole on the same side plate is the first preset spacing.

[0008] In one embodiment, a first sealing groove is provided on the outer side surface of the side plate, the first sealing groove is arranged around the first through hole and the second through hole, and the first sealing groove is used for installing a first sealing member.

[0009] In one embodiment, the first preset distance is not less than 11 mm and not more than 14 mm.

[0010] In one embodiment, a second sealing groove is further provided on one side of the mounting seat where the air outlet is provided. The second sealing groove is arranged around the periphery of the air outlet, and the second sealing groove is used for installing a second sealing member.

[0011] In one embodiment, the air inlet passage further includes an air inlet section disposed near the air inlet port, the air inlet section includes an air inlet end and an air outlet end connected to each other, and a width of the air inlet end is greater than a width of the air outlet end.

[0012] In one embodiment, the width of the air inlet section gradually decreases from the air inlet end toward the air outlet end.

[0013] The utility model also provides an ionization component, including a power supply component;

[0014] A mounting base as described in any of the above embodiments; and

[0015] An electrode assembly, the electrode assembly comprising a first electrode and a second electrode, the first electrode being installed in the first electrode installation groove, and the second electrode being installed in the second electrode installation groove;

[0016] The first electrode and the second electrode are electrically connected to the power supply component, and the power supply component is used to periodically change the polarity of the power output to the first electrode and the second electrode.

[0017] The utility model also proposes a plasma generating device, comprising a gas source conveying device and an ionization assembly as described in any of the above embodiments, wherein the mounting seat has an ionization chamber, the gas source conveying device is used to convey process gas to the ionization chamber, and the plasma generating device is provided with a diffusion channel, and the diffusion channel is arranged on the gas inlet side and / or gas outlet side of the ionization chamber.

[0018] The technical solution of the utility model adopts a reasonably designed first preset distance reserved between the first electrode mounting groove and the second electrode mounting groove, so that the process gas is transported through the air inlet channel to the position in the mounting seat that is best affected by the electric field generated by the first electrode and the second electrode for ionization, so that the process gas is more evenly distributed on the first electrode and the second electrode, thereby improving the efficiency of the process gas in forming plasma, thereby avoiding the problem that most of the process gas is transported above the electrode without being ionized. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0020] Figure 1 A structural cross-sectional view of an embodiment of a mounting base provided by the utility model;

[0021] Figure 2 A structural schematic diagram of another embodiment of the mounting base provided by the utility model;

[0022] Figure 3 A structural cross-sectional view of the mounting base provided by the utility model from another angle;

[0023] Figure 4 A schematic diagram of the structure of a bottom view of the mounting base provided by the utility model;

[0024] Figure 5 This is a structural cross-sectional view of the diffusion part of the plasma generating device provided by the utility model, which is arranged on the air inlet side of the ionization chamber;

[0025] Figure 6 It is a structural explosion diagram of another embodiment of the plasma generating device provided by the utility model;

[0026] Figure 7 This is a schematic diagram of the structure in which the diffusion parts in the plasma generating device provided by the utility model are respectively arranged on the air inlet side and the air outlet side of the ionization chamber;

[0027] Figure 8 This is a schematic diagram of the structure in which the diffusion part of the plasma generating device provided by the utility model is arranged on the gas outlet side of the ionization chamber;

[0028] Fig. 9 A schematic diagram of the connection of a power supply component, a polarity conversion circuit, a first electrode and a second electrode according to an embodiment of the present invention;

[0029] Fig.10 A connection diagram of another embodiment of the power supply component, polarity conversion circuit, first electrode and second electrode provided by the utility model.

[0030] Description of Figure Numbers:

[0031] 1. Mounting seat; 11. Air inlet; 12. Air outlet; 13. First electrode mounting groove; 131. First opening; 14. Second electrode mounting groove; 141. Second opening; 15. Side plate; 151. First through hole; 152. Second through hole; 153. First sealing groove; 16. Second sealing groove; 17. Ionization chamber; 2. Air inlet channel; 21. Ionization section; 22. Air inlet section; 221. Air inlet end; 222. Air outlet end; 3. Diffusion part; 31. Diffusion channel; 32. Diffusion plate; 4. Ionization assembly; 41. First electrode; 42. Second electrode; 43. Power supply assembly; 431. Power supply module; 432. Polarity conversion circuit.

[0032] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0034] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0035] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0036] Plasma processing equipment is a device used to perform surface treatments such as plasma etching, deposition, and cleaning on wafers or circuit boards in a reaction chamber. The process gas is formed into plasma under the action of the electric field generated by the electrode through a plasma generating device. The plasma reacts with the surface of the wafer or circuit board in the reaction chamber, thereby performing plasma etching, deposition, and cleaning on the wafer or circuit board in the reaction chamber.

[0037] However, in the process of conceiving and implementing this application, the inventor found that there are at least the following problems:

[0038] However, in the process of ionizing the process gas to form plasma in the existing plasma generating device, the distribution of the process gas delivered to the electrode is uneven, so that a large amount of process gas is delivered to the mounting seat 1 and does not form plasma under the action of the electric field generated by the electrode, thereby affecting the efficiency of the process gas in forming plasma.

[0039] The utility model provides a mounting seat 1.

[0040] See also Figures 1 to 3 In one embodiment of the utility model, the mounting seat 1 has an air inlet channel 2, a first electrode mounting groove 13 and a second electrode mounting groove 14, and the air inlet channel 2 has an air inlet port 11 and an air outlet port 12; the first electrode mounting groove 13 and the second electrode mounting groove 14 are located on both sides of the air inlet channel 2 on the mounting seat 1; the first electrode mounting groove 13 has a first opening 131 connected to the air inlet channel 2, and the second electrode mounting groove 14 has a second opening 141 connected to the air inlet channel 2, and the first opening 131 and the second opening 141 are arranged opposite to each other; a first preset spacing is reserved between the first electrode mounting groove 13 and the second electrode mounting groove 14;

[0041] The technical solution of the utility model adopts a first preset distance reserved between the first electrode mounting groove 13 and the second electrode mounting groove 14 by reasonably designing the process gas so as to be transported through the air inlet channel 2 to the position in the mounting seat 1 that is best affected by the electric field generated by the first electrode 41 and the second electrode 42 for ionization, so that the process gas is more evenly distributed on the first electrode 41 and the second electrode 42, thereby improving the efficiency of the process gas in forming plasma, thereby avoiding the problem that most of the process gas is transported above the electrodes without being ionized.

[0042] In this embodiment, the mounting seat 1 has an air inlet channel 2 extending along a first direction, the air inlet channel 2 has an air inlet port 11 and an air outlet port 12 connected to each other, and the air inlet channel 2 is arranged through the mounting seat 1 along the first direction. The mounting seat 1 has a first electrode mounting groove 13 and a second electrode mounting groove 14, the first electrode mounting groove 13 is used to mount the first electrode 41, and the second electrode mounting groove 14 is used to mount the second electrode 42. The air inlet channel 2 includes an ionization section 21, the first electrode mounting groove 13 and the second electrode mounting groove 14 are located on both sides of the ionization section 21 along the second direction, the first electrode mounting groove 13 has a first opening 131 connected to the air inlet channel 2, and the second electrode mounting groove 14 has a second opening 141 connected to the air inlet channel 2, the first opening 131 and the second opening 141 are arranged opposite to each other and face the ionization section 21, so that the process gas transported through the air inlet channel 2 is respectively located between the first electrode 41 and the second electrode 42, thereby improving the efficiency of ionizing the process gas to form plasma. A first preset spacing is reserved between the first electrode mounting groove 13 and the second electrode mounting groove 14 along the second direction. By adjusting the size of the first preset spacing, the distance between the first electrode mounting groove 13 and the second electrode mounting groove 14 relative to the air inlet channel 2 is adjusted to the optimal ionization position, so that the process gas is transported through the air inlet channel 2 to the position in the mounting seat 1 where the electric field generated by the first electrode 41 and the second electrode 42 is optimally ionized, so that the process gas is more evenly distributed on the first electrode 41 and the second electrode 42, so that the process gas is better ionized by the electric field, thereby improving the efficiency of the process gas forming plasma, thereby avoiding the problem that most of the process gas is transported to the top of the electrode without being ionized. Among them, the first direction intersects with the second direction, the first direction can be consistent with the up-down direction, and the second direction can be consistent with the left-right direction.

[0043] like Figures 1 to 3 As shown, in this embodiment, the groove wall of the first electrode installation groove 13 is arranged in an arc shape; and / or, the groove wall of the second electrode installation groove 14 is arranged in an arc shape.

[0044] In this embodiment, the groove wall of the first electrode mounting groove 13 is arranged in an arc shape, so that the first electrode 41 with a cylindrical shape is more closely fitted to the inner wall of the first electrode mounting groove 13, thereby improving the stability of the first electrode 41 installed in the first electrode mounting groove 13. The groove wall of the second electrode mounting groove 14 is arranged in an arc shape, so that the second electrode 42 with a cylindrical shape is more closely fitted to the inner wall of the second electrode mounting groove 14, thereby improving the stability of the second electrode 42 installed in the second electrode mounting groove 14.

[0045] like Figure 2 and Figure 6As shown, in this embodiment, the mounting seat 1 includes two side plates 15 arranged opposite to each other along a third direction, the first electrode mounting groove 13 and the second electrode mounting groove 14 are extended along the third direction, the first electrode mounting groove 13 has a first through hole 151 penetrating the side plate 15, the second electrode mounting groove 14 has a second through hole 152 penetrating the side plate 15, and the spacing between the first through hole 151 and the second through hole 152 on the same side plate 15 is a first preset spacing; wherein the first direction, the second direction, and the third direction intersect with each other.

[0046] In this embodiment, the spacing between the outer hole walls closest to the first through hole 151 and the second through hole 152 on the same side plate 15 is a first preset spacing, which can be set to D1. By adjusting the value of the first preset spacing, the layout between the first electrode mounting groove 13 and the second electrode mounting groove 14 and the air inlet channel 2 is adjusted, so that the process gas is transported to the best position between the first electrode 41 and the second electrode 42 for ionization, thereby improving the efficiency of the process gas ionization to form plasma. The first direction, the second direction, and the third direction intersect each other, the first direction can be consistent with the up-down direction, the second direction can be consistent with the left-right direction, and the third direction can be consistent with the front-back direction.

[0047] like Figure 2 and Figure 6 As shown, in this embodiment, a first sealing groove 153 is provided on the outer side of the side plate 15 . The first sealing groove 153 is arranged around the first through hole 151 and the second through hole 152 . The first sealing groove 153 is used to install a first sealing member.

[0048] In this embodiment, the first sealing groove 153 of the side plate 15 is arranged around the first through hole 151 and the second through hole 152, and the first sealing member is installed on the first sealing groove 153, thereby improving the sealing performance of the mounting base 1 and preventing the process gas in the mounting base 1 from leaking out.

[0049] like Figure 1 As shown, in this embodiment, the dimension of the first preset spacing along the second direction is not less than 11 mm and not more than 14 mm.

[0050] In this embodiment, the first preset spacing may be 11 mm, 12 mm, 13 mm, or 14 mm in the second direction. Within this range, the width of the first preset spacing may allow the process gas to be transported to the optimal position between the first electrode 41 and the second electrode 42 for ionization, thereby improving the efficiency of ionizing the process gas to form plasma.

[0051] In this embodiment, the first preset distance may preferably be 12.11 mm, thereby further improving the efficiency of ionizing the process gas to form plasma.

[0052] like Figure 1 , Figure 3 and Figure 4 As shown, in this embodiment, a second sealing groove 16 is also provided on one side of the mounting seat 1 where the air outlet 12 is provided. The second sealing groove 16 is arranged around the periphery of the air outlet 12 and is used to install a second sealing member.

[0053] In this embodiment, the mounting seat 1 is installed on the reaction chamber, and the plasma is transported from the mounting seat 1 to the outer surface of the wafer or circuit board in the reaction chamber through the gas outlet 12 for etching, deposition, cleaning and other treatments. By arranging the mounting seat 1 on one side of the gas outlet 12, a second sealing groove 16 is arranged on the periphery of the gas outlet 12, and a second sealing member is installed on the second sealing groove 16, thereby improving the sealing performance of the mounting seat 1, thereby preventing the plasma in the mounting seat 1 from leaking out.

[0054] like Figure 1 , Figure 3 and Figure 5 As shown, in this embodiment, the air inlet channel 2 also includes an air inlet section 22 arranged near the air inlet port 11, and the air inlet section 22 includes an air inlet end 221 and an air outlet end 222 that are interconnected, and the width of the air inlet end 221 is greater than the width of the air outlet end 222.

[0055] In this embodiment, the air inlet channel 2 further includes an air inlet section 22 disposed near the air inlet port 11, and the air inlet section 22 is connected to the ionization section 21, so as to facilitate the process gas to be transported to the ionization section 21 through the air inlet section 22. The air inlet section 22 includes an air inlet end 221 and an air outlet end 222 that are interconnected, the air inlet end 221 can be connected to the gas source delivery device, and the air outlet end 222 is connected to the ionization section 21. The width of the air inlet end 221 is greater than the width of the air outlet end 222, so as to increase the pressure on the process gas, thereby increasing the delivery speed of the process gas to the ionization section 21, and thus improving the delivery efficiency of the process gas.

[0056] like Figure 1 , Figure 3 and Figure 5 As shown, in this embodiment, the width of the air inlet section 22 gradually decreases from the air inlet end 221 toward the air outlet end 222 .

[0057] In this embodiment, by setting the width of the air inlet section 22 to gradually decrease from the air inlet end 221 toward the air outlet end 222, the pressure on the process gas is further increased, thereby further increasing the delivery speed of the process gas to the ionization section 21, and further improving the delivery efficiency of the process gas.

[0058] The utility model also proposes an ionization component 4, which includes a power supply component 43, a mounting seat 1 and an electrode component. The specific structure of the mounting seat 1 refers to the above embodiment. Since the ionization component 4 adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here. Among them, the electrode assembly includes a first electrode 41 and a second electrode 42, the first electrode 41 is installed in the first electrode mounting groove 13, and the second electrode 42 is installed in the second electrode mounting groove 14; the first electrode 41 and the second electrode 42 are electrically connected to the power supply component 43, and the power supply component 43 is used to periodically change the polarity of the power output to the first electrode 41 and the second electrode 42.

[0059] like Fig. 9 and Fig.10 As shown, in this embodiment, the ionization component 4 includes a power supply component 43 and a first electrode 41 and a second electrode 42 electrically connected to the power supply component 43, and the power supply component 43 includes a power module 431 and a polarity conversion circuit 432. The polarity conversion circuit 432 has an input end, a first output end and a second output end. The input end of the polarity conversion circuit 432 is connected to the output end of the power supply module 431, the first output end of the polarity conversion circuit 432 is electrically connected to the first electrode 41, and the second output end of the polarity conversion circuit 432 is electrically connected to the second electrode 42. The polarity conversion circuit 432 is used to periodically convert the polarity of the power supply output from the power supply module 431 to the first electrode 41 and the second electrode 42, so that the diffusion direction of the plasma in the reaction chamber changes from unidirectional to bidirectional. Through periodic conversion, the plasma processing efficiency is higher, and the surface of each wafer / circuit board in the reaction chamber reacts evenly, and the processing effect is better.

[0060] In this embodiment, the power module 431 is used to generate a high-frequency electromagnetic field. That is, the power module 431 can be a radio frequency power supply for outputting an alternating current signal, and the polarity conversion circuit 432 is an electromagnetic coupler, and the alternating current signal can achieve polarity switching through the electromagnetic coupler. The electromagnetic coupler can be a transformer, a mutual inductor, or a rotary transformer. Of course, in other embodiments, the power module 431 can use two DC power supplies of different polarities, and the first electrode 41 and the second electrode 42 are periodically switched through the switching power module 431. The polarity conversion circuit 432 periodically changes the polarity of the power supply output to the first electrode 41 and the second electrode 42, so that the positive and negative polarities of the first electrode 41 and the second electrode 42 are periodically changed, which can avoid the problem of uneven plasma treatment caused by a single positive and negative electrode, and further improve the uniformity of the treatment. This solution can be used in conjunction with a long strip of the first electrode 41 and the second electrode 42, and the solution of spacing in the horizontal direction can improve the efficiency of ionization and the uniformity of the plasma.

[0061] The utility model also proposes a plasma generating device, which includes a gas source conveying device and an ionization component 4. The specific structure of the ionization component 4 refers to the above embodiment. Since the plasma generating device adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here. Among them, the mounting seat 1 is provided with an ionization chamber 17, the gas source conveying device is used to convey the process gas to the ionization chamber 17, and the plasma generating device is provided with a diffusion channel 31, which is provided on the air inlet side and / or the air outlet side of the ionization chamber 17.

[0062] like Figure 5 , Figure 7 and Figure 8 As shown, in this embodiment, the mounting seat 1 may be installed with a diffusion part 3, and the diffusion part 3 includes a diffusion plate 32, and a diffusion channel 31 is formed inside the diffusion part 3. A plurality of diffusion holes are provided on the diffusion plate 32, and the process gas or plasma is diffused through the plurality of diffusion holes and then transported to the equipment of the next process, thereby improving the transportation efficiency of the process gas or plasma. The diffusion part 3 may be arranged on the air inlet side of the ionization chamber 17, that is, above the ionization chamber 17, and the diffusion channel 31 is connected to the gas source conveying device, so that the process gas is diffused through the diffusion plate 32 in the diffusion channel 31, so that the process gas is more evenly distributed in the ionization chamber 17, so that the process gas ionizes more plasma. The diffusion part 3 may be arranged on the air outlet side of the ionization chamber 17, that is, below the ionization chamber 17, and the diffusion channel 31 is connected to the ionization chamber 17, so that the plasma is diffused through the diffusion plate 32 in the diffusion channel 31, so that the plasma is more evenly distributed in the reaction chamber, thereby improving the efficiency of plasma processing wafers or circuit boards. The diffusion portion 3 can be simultaneously arranged on the outlet side and the inlet side of the ionization chamber 17, that is, on the upper and lower sides of the ionization chamber 17, so that the process gas is diffused through the diffusion plate 32 in the diffusion channel 31, so that the process gas is more evenly distributed in the ionization chamber 17, so that the process gas is ionized into more plasma; at the same time, the plasma is diffused through the diffusion plate 32 in the diffusion channel 31, so that the plasma is more evenly distributed in the reaction chamber, thereby improving the efficiency of plasma processing wafers or circuit boards.

[0063] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A mounting seat, characterized in that: The mounting seat has an air inlet channel, a first electrode mounting groove and a second electrode mounting groove, and the air inlet channel has an air inlet and an air outlet; The first electrode mounting groove and the second electrode mounting groove are located on both sides of the air inlet passage on the mounting seat; The first electrode mounting groove has a first opening connected to the air intake channel, and the second electrode mounting groove has a second opening connected to the air intake channel. The first opening and the second opening are arranged opposite to each other; a first preset distance is reserved between the first electrode mounting groove and the second electrode mounting groove.

2. The mounting seat according to claim 1, characterized in that: The groove wall of the first electrode installation groove is arranged in an arc shape; and / or the groove wall of the second electrode installation groove is arranged in an arc shape.

3. The mounting seat according to claim 1, characterized in that: The mounting seat includes two side plates arranged opposite to each other, the first electrode mounting groove has a first through hole penetrating the side plate, the second electrode mounting groove has a second through hole penetrating the side plate, and the spacing between the first through hole and the second through hole on the same side plate is the first preset spacing.

4. The mounting seat according to claim 3, characterized in that: A first sealing groove is provided on the outer side surface of the side plate. The first sealing groove is arranged around the periphery of the first through hole and the second through hole. The first sealing groove is used for installing a first sealing member.

5. The mounting seat according to claim 1, characterized in that: The first preset spacing is not less than 11 mm and not more than 14 mm.

6. The mounting seat according to claim 1, characterized in that: A second sealing groove is also provided on one side of the mounting seat where the air outlet is provided. The second sealing groove is arranged around the periphery of the air outlet, and the second sealing groove is used for installing a second sealing member.

7. The mounting seat according to claim 1, characterized in that: The air inlet passage also includes an air inlet section arranged close to the air inlet port, the air inlet section includes an air inlet end and an air outlet end connected to each other, and the width of the air inlet end is greater than the width of the air outlet end.

8. The mounting seat according to claim 7, characterized in that: The width of the air inlet section gradually decreases from the air inlet end toward the air outlet end.

9. An ionization component, characterized in that: include: Power supply components; The mounting seat as claimed in any one of claims 1 to 8; as well as An electrode assembly, the electrode assembly comprising a first electrode and a second electrode, the first electrode being installed in the first electrode installation groove, and the second electrode being installed in the second electrode installation groove; The first electrode and the second electrode are electrically connected to the power supply component, and the power supply component is used to periodically change the polarity of the power output to the first electrode and the second electrode.

10. A plasma generating device, characterized in that: It comprises a gas source delivery device and the ionization assembly as claimed in claim 9, wherein the mounting seat has an ionization chamber, the gas source delivery device is used to deliver process gas to the ionization chamber, and the plasma generating device is provided with a diffusion channel, which is arranged on the gas inlet side and / or gas outlet side of the ionization chamber.

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