Self-cleaning low-power flow chip bonding structure

Abstract

The utility model discloses a self-cleaning low-power consumption flow chip bonding structure, which relates to the technical field of bonding structures and comprises a tool bit assembly, a rubber ball sleeve is mounted on the outer wall of the lower side of the tool bit assembly, a lower ring sleeve is mounted at the lower end of the rubber ball sleeve, and the lower ring sleeve is in sliding connection with the tool bit assembly. A downward pressing ring piece is installed at the bottom end of the tool bit assembly, an air outlet pipe and an air suction pipe which are arranged in the vertical direction are arranged in the tool bit assembly, a movable pipe is arranged at the lower end of the air suction pipe, a ball connector is arranged between the air suction pipe and the movable pipe, and the movable pipe is communicated with the interior of the air suction pipe. A single-point local position full-coating auxiliary mode is adopted, the whole process does not actively interfere with the bonding process, other positions on the substrate are prevented from being polluted due to the sputtering problem in the operation process, the two steps of air outlet and air suction are additionally arranged on the basis, and the method is mainly used for sucking out removed pollutants such as an oxide layer in time.

Description

Technical Field

[0001] The utility model relates to the technical field of bonding structures, in particular to a self-cleaning low-power consumption flow chip bonding structure. Background Art

[0002] Flow chips are part of the semiconductor production field, and chip bonding in the semiconductor production field uses high pressure, high temperature, laser and other means to achieve atomic diffusion, melt bonding and other reactions between the metallization layer of the chip and the substrate, thereby forming an electrical / mechanical connection.

[0003] The bonding process is explained as follows: the ideal bonding pressure should maximize the transmission of the lateral vibration of the splitter to the interface. When the power and bonding time are certain, the pressure is too small, the friction between the aluminum wire and the interface is insufficient, the surface oxide layer is difficult to remove, and the plastic deformation is insufficient, the welding is not strong, and sometimes it will cause the splitter to stick to the aluminum wire, causing the knife to get dirty quickly. If the pressure is too high, the aluminum wire will be greatly deformed and damaged, resulting in poor bonding quality. Special attention should be paid to the ramp time here, and it should be particularly noted that in the process of removing the oxide layer, the removed oxide layer may be sputtered to other positions on the substrate, causing secondary or even multiple contamination. This not only affects the bonding process at other positions, but also requires an additional cleaning process. This application proposes a solution. Utility Model Content

[0004] The purpose of the utility model is to provide a self-cleaning, low-power flow chip bonding structure. With respect to the current flow chip bonding process, during the process of removing the oxide layer, the oxide layer during the removal process may be sputtered to other positions on the substrate, causing secondary or even multiple contamination.

[0005] The purpose of the utility model can be achieved by the following technical solutions: a self-cleaning low-power flow chip bonding structure, comprising a cutter head assembly, a rubber ball sleeve is installed on the lower outer wall of the cutter head assembly, a lower ring sleeve is installed at the lower end of the rubber ball sleeve, and the lower ring sleeve is slidably connected to the cutter head assembly;

[0006] A lower pressure ring is installed at the bottom end of the cutter head assembly, and an air outlet pipe and an air suction pipe arranged in a vertical direction are provided in the cutter head assembly, a movable pipe is provided at the lower end of the air suction pipe, and a ball head interface is provided between the air suction pipe and the movable pipe, the movable pipe is connected to the inside of the air suction pipe, and the lower end of the movable pipe is open, and a horizontally arranged limit plate is installed on the inner wall position of the lower ring sleeve corresponding to the movable pipe.

[0007] It is further configured as follows: the lower pressure ring piece is arranged in a mirror-symmetrical manner along a vertical plane of the center point of the cutter head assembly, and the cross section of the lower pressure ring piece is in an arc shape facing outward.

[0008] It is further configured as follows: the air outlet pipe and the air suction pipe are arranged in mirror symmetry along the vertical plane of the center point of the cutter head assembly, and the linear direction between the air outlet pipe and the air suction pipe is perpendicular to the linear direction between the two lower pressure ring sheets.

[0009] It is further configured that: the bottom ends of the movable pipe and the air suction pipe are higher than the bottom end plane of the cutter head assembly.

[0010] It is further configured as follows: a pushing groove is provided in the limiting piece, the cross section of the pushing groove is elliptical, and the short diameter of the pushing groove matches the outer wall of the movable tube.

[0011] The utility model has the following beneficial effects:

[0012] 1. The whole process is applied to the bonding process of the flow chip. On the basis of not actively interfering with the bonding process, a full-coverage auxiliary method of a single-point local position is adopted. Its essence is to use the lower ring to cover the single-point position in the bonding process. The purpose is to avoid contamination of other positions on the substrate due to sputtering of the bonding wire during the operation;

[0013] 2. In combination with the above content, two more processes of air outlet and air suction are added. The two processes are carried out synchronously. The air suction process cooperates with the movement process of the lower ring sleeve. Specifically, the air suction angle is changed during the air suction process. The purpose is to promptly suck out pollutants such as the removed oxide layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0015] Figure 1 This is a structural schematic diagram of a self-cleaning low-power flow chip bonding structure proposed by the utility model;

[0016] Figure 2 A cross-sectional view of a lower ring sleeve in a self-cleaning low-power flow chip bonding structure proposed by the utility model;

[0017] Figure 3 This is a structural schematic diagram of a cutter head assembly in a self-cleaning, low-power flow chip bonding structure proposed by the utility model;

[0018] Figure 4 It is a cross-sectional view of the cutter head assembly corresponding to the lower ring sleeve in a self-cleaning low-power flow chip bonding structure proposed by the utility model;

[0019] Figure 5 This is a schematic structural diagram of an air suction pipe in a self-cleaning, low-power flow chip bonding structure proposed by the utility model.

[0020] In the figure: 1. Cutter head assembly; 2. Rubber ball sleeve; 3. Lower ring sleeve; 4. Lower pressure ring; 5. Air outlet pipe; 6. Air suction pipe; 7. Ball head interface; 8. Movable pipe; 9. Limiting piece; 10. Pushing slot. DETAILED DESCRIPTION

[0021] The technical solution of the utility model will be described clearly and completely in conjunction with the embodiments below. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] Embodiment 1

[0023] In view of the current flow chip bonding process, during the process of removing the oxide layer, the oxide layer may be sputtered to other positions on the substrate, causing secondary or even multiple contamination. The following technical solutions are proposed:

[0024] Reference Figures 1 to 5 A self-cleaning low-power flow chip bonding structure in this embodiment includes a cutter head assembly 1, a rubber ball sleeve 2 is installed on the lower outer wall of the cutter head assembly 1, a lower ring sleeve 3 is installed at the lower end of the rubber ball sleeve 2, and the lower ring sleeve 3 is slidably connected to the cutter head assembly 1;

[0025] A lower pressure ring 4 is installed at the bottom end of the cutter head assembly 1, and an air outlet pipe 5 and an air suction pipe 6 are arranged in the cutter head assembly 1 in the vertical direction. A movable pipe 8 is arranged at the lower end of the air suction pipe 6, and a ball head interface 7 is arranged between the air suction pipe 6 and the movable pipe 8. The movable pipe 8 is connected to the inside of the air suction pipe 6, and the lower end of the movable pipe 8 is open. A horizontally arranged limit plate 9 is installed on the inner wall position of the lower ring sleeve 3 corresponding to the movable pipe 8. The lower pressure ring 4 is mirror-symmetrically arranged along the vertical plane of the center point of the cutter head assembly 1, and the cross-section of the lower pressure ring 4 is an arc shape facing outward.

[0026] Working Principle: In this embodiment, the bonding process is not described in detail. Figure 2 The relevant structures in Figure 4 To explain: in the initial state, under the elastic effect of the rubber ball sleeve 2, the lower surface of the lower ring sleeve 3 is always located on the lower surface of the cutter head assembly 1, so that when bonding begins, the lower ring sleeve 3 is released to a single point position on the substrate and fully covers it, thereby avoiding contaminants from being sputtered during the bonding process;

[0027] It should be noted that a pressure ring 4 is installed at the bottom of the cutter head assembly 1 to prevent the cutter head assembly 1 from directly contacting the substrate.

[0028] This embodiment is to explain the air outlet pipe and the air intake pipe in the first embodiment:

[0029] The air outlet pipe 5 and the air suction pipe 6 are arranged in a mirror-symmetrical manner along the vertical plane of the center point of the cutter head assembly 1, and the linear direction between the air outlet pipe 5 and the air suction pipe 6 is perpendicular to the linear direction between the two lower pressure ring plates 4. The bottom ends of the movable tube 8 and the air suction pipe 6 are higher than the bottom plane of the cutter head assembly 1. A push groove 10 is opened in the limiting plate 9. The cross-section of the push groove 10 is elliptical, and the short diameter of the push groove 10 matches the outer wall of the movable tube 8.

[0030] Solution description: In combination with the content of the first embodiment, it is explained again that: in the specific operation process, the air outlet pipe 5 continuously blows out the inert protective gas, which can not only cool the bonding wire but also protect it. However, the key technology is to "blow up" the removed pollutants, and finally suck out the "blown up" pollutants through the movable pipe 8 and the west wind pipe 6. In combination with the relevant content of the first embodiment, it is mainly to avoid the pollutants from causing secondary pollution to the substrate;

[0031] The activity tube 8 refers to Figure 5 To explain, in the initial state, the limit plate 9 is located at the bottommost position of the movable tube 8, and then when the lower ring sleeve 3 moves upward relative to the cutter head assembly 1, the push groove 10 changes the inclination angle of the movable tube 8 relative to the vertical direction, specifically, changes the inclination angle of the suction pipe 6 to suck out pollutants. Especially in the process of placing the bonding wire on the substrate, the suction pipe 6 is aligned with the welding point position on the substrate to suck out pollutants and improve the welding quality.

[0032] In summary: by adopting the full-coverage auxiliary method of a single-point local position, the overall process will not actively interfere with the bonding process, but will avoid contamination of other positions on the substrate due to sputtering problems during operation. Based on this, the two steps of air outlet and air suction are added, which are mainly used to timely suck out pollutants such as the removed oxide layer.

[0033] The above contents are merely examples and explanations of the structure of the utility model. The technicians in this technical field may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the structure of the utility model or exceed the scope defined in the claims, they should all fall within the protection scope of the utility model.

[0034] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0035] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is only limited by the claims and their full scope and equivalents.

Claims

1. A self-cleaning low-power flow chip bonding structure, comprising a cutter head assembly (1), characterized in that: A rubber ball sleeve (2) is installed on the lower outer wall of the cutter head assembly (1), a lower ring sleeve (3) is installed on the lower end of the rubber ball sleeve (2), and the lower ring sleeve (3) is slidably connected to the cutter head assembly (1); A lower pressure ring sheet (4) is installed at the bottom end of the cutter head assembly (1), and an air outlet pipe (5) and an air suction pipe (6) arranged in a vertical direction are arranged in the cutter head assembly (1). A movable pipe (8) is arranged at the lower end of the air suction pipe (6), and a ball head interface (7) is arranged between the air suction pipe (6) and the movable pipe (8). The movable pipe (8) is connected to the inside of the air suction pipe (6), and the lower end of the movable pipe (8) is open. A horizontally arranged limit plate (9) is installed on the inner wall position of the lower ring sleeve (3) corresponding to the movable pipe (8).

2. A self-cleaning low power consumption flow chip bonding structure according to claim 1, characterized in that: The lower pressure ring piece (4) is arranged in a mirror-symmetrical manner along a vertical plane of the center point of the cutter head assembly (1), and the cross section of the lower pressure ring piece (4) is in an outwardly facing arc shape.

3. The self-cleaning low power consumption flow chip bonding structure according to claim 1, characterized in that: The air outlet pipe (5) and the air suction pipe (6) are arranged in a mirror-symmetrical manner along a vertical plane of the center point of the cutter head assembly (1), and the linear direction between the air outlet pipe (5) and the air suction pipe (6) is perpendicular to the linear direction between the two lower pressure ring sheets (4).

4. The self-cleaning low power consumption flow chip bonding structure according to claim 1, characterized in that: The bottom ends of the movable tube (8) and the air suction tube (6) are located higher than the bottom plane of the cutter head assembly (1).

5. The self-cleaning low power consumption flow chip bonding structure according to claim 1, characterized in that: The limiting piece (9) is provided with a pushing groove (10), the cross section of the pushing groove (10) is elliptical, and the short diameter of the pushing groove (10) matches the outer wall of the movable tube (8).

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