Wafer circuit inspection system and automatic inspection machine for wafer circuit

Abstract

The present application provides a wafer circuit detection system and an automatic detection machine for wafer circuits. The wafer circuit detection system includes an automatic loading and unloading machine and an automatic detection machine. The automatic detection machine includes a positioning camera, a machine vision detection component, and a mobile table. The mobile table includes a first moving component, a second moving component, a rotating shaft component, and an adsorption component. The first moving component, the second moving component, and the rotating shaft component are overlapped and connected from top to bottom. The adsorption component connects the first moving component, the second moving component, and the top one of the rotating shaft component, and the adsorption component is arranged toward the positioning camera and the machine vision detection component; the rotating shaft component rotates with the first axis as the axis, the first moving component is movably arranged along the first direction, and the second moving component is movably arranged along the second direction, and the first direction, the second direction, and the first axis are perpendicular to each other. The present application utilizes an automatic loading and unloading machine and an automatic detection machine to improve the efficiency and quality of wafer circuit quality inspection.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a wafer circuit detection system and an automatic detection machine for wafer circuits. Background Art

[0002] As semiconductor materials are widely used in the production of integrated circuits, the technology of processing circuit components based on wafers is becoming more and more mature, and the circuits engraved on wafers are becoming smaller and more sophisticated. After the wafer circuit is produced, it needs to be inspected for quality. Currently, quality inspectors usually inspect the wafer circuit manually. However, since the wafer circuit is very delicate and it is difficult to unify the standards for manual inspection, this method is not only very labor-intensive, but also has low efficiency and quality of quality inspection. Summary of the invention

[0003] The present application mainly provides a wafer circuit detection system and an automatic detection machine for wafer circuits, which can improve the efficiency and quality of wafer circuit quality inspection.

[0004] In order to solve the above technical problems, a technical solution adopted in this application is: to provide a wafer circuit detection system, including an automatic loading and unloading machine and an automatic detection machine. The automatic detection machine includes a positioning camera, a machine vision detection component, and a moving table, the moving table includes a first moving component, a second moving component, a rotating shaft component and an adsorption component, the first moving component, the second moving component, and the rotating shaft component are overlapped and connected from top to bottom, the adsorption component connects the first moving component, the second moving component, and the top one of the rotating shaft component, and the adsorption component is arranged toward the positioning camera and the machine vision detection component; wherein the rotating shaft component rotates with the first axis as the axis, the first moving component is movably arranged along the first direction, the second moving component is movably arranged along the second direction, and the first direction, the second direction, and the first axis are perpendicular to each other.

[0005] In a specific embodiment, the wafer circuit detection system also includes a stable table, which is horizontally arranged; the first movable component includes a first movable table and a first guide rail, the first guide rail extends along the first direction, the second movable component includes a second guide rail and a second movable table, the second guide rail extends along the second direction, the first guide rail is fixed to the stable table, the first movable table is movably connected to the first guide rail, the second guide rail is fixed to the first movable table, the second movable table is movably connected to the second guide rail, the rotating shaft assembly is arranged on the second movable table, and the adsorption assembly is arranged on the side of the rotating shaft assembly away from the second movable table.

[0006] In a specific embodiment, the wafer circuit detection system further includes a cover body, which is arranged on the stable table to form a working space, and the automatic loading and unloading machine and the automatic detection machine are arranged in the working space and are both relatively fixed to the stable table.

[0007] In a specific embodiment, the cover body includes a main body and a purification component, the main body is provided with a first opening, the purification component is relatively fixed to the main body and blocks the first opening, when the wafer circuit detection system is working, the joint between the stable table and the cover body is sealed, and the gas in the working space is connected to the outside through the purification component.

[0008] In a specific embodiment, the wafer circuit detection system also includes a bracket, which includes a support column and an extension beam. The support column is fixed to the stable table and extends upward in parallel with the first axis. The extension beam is arranged at one end of the support column away from the stable table and extends above the adsorption component in parallel with the first direction and the second direction. The positioning camera and the machine vision detection component are arranged on the extension beam.

[0009] In a specific embodiment, the wafer circuit detection system also includes a processor and a fuselage, the stable table is arranged above the fuselage, and an installation space is formed between the fuselage and the stable table; a pipeline space is opened in the stable table, the support column and the extension beam, one end of the pipeline space is connected to the installation space, and the other end is connected to the outside world through the extension beam, the positioning camera and the machine vision detection component also include a signal transmission line, the signal transmission line connects the positioning camera, the machine vision detection component and the processor, and at least part of the signal transmission line is arranged in the pipeline space.

[0010] In a specific embodiment, the adsorption component includes a ceramic suction cup and a first negative pressure component. The ceramic suction cup is provided with at least one adsorption hole. The first negative pressure component is arranged on a side of the ceramic suction cup away from the positioning camera and is connected to the outside through the adsorption hole.

[0011] In a specific embodiment, the automatic loading and unloading machine includes a tray and a second negative pressure component, and the tray is arranged parallel to the surface of the ceramic suction cup on one side facing the positioning camera; wherein, the second negative pressure component and the first negative pressure component work alternately, and when the first negative pressure component is closed, the tray is docked with the ceramic suction cup, and the second negative pressure component outputs toward the surface of the ceramic suction cup.

[0012] In a specific embodiment, the machine vision detection component includes a machine vision processing circuit, a focusing component and a shooting camera, and the machine vision processing circuit is connected to the focusing component, the shooting camera and the positioning camera; the focusing component, the shooting camera and the positioning camera are arranged above the adsorption component parallel to the first direction.

[0013] In order to solve the above technical problems, another technical solution adopted in the present application is: to provide an automatic inspection machine for wafer circuits, including a positioning camera, a machine vision inspection component, and a movable table, wherein the movable table includes a first movable component, a second movable component, a rotating shaft component, and an adsorption component, wherein the first movable component, the second movable component, and the rotating shaft component are overlapped and connected from top to bottom, the adsorption component is connected to the first movable component, the second movable component, and the topmost one of the rotating shaft components, and the adsorption component is arranged toward the positioning camera and the machine vision inspection component; wherein the rotating shaft component rotates with a first axis as the axis, the first movable component is movably arranged along a first direction, the second movable component is movably arranged along a second direction, and the first direction, the second direction, and the first axis are perpendicular to each other.

[0014] The beneficial effects of the present application are as follows: different from the prior art, the implementation method of the present application utilizes a movable table to fix the wafer, and uses a positioning camera to position the wafer circuit. The machine vision inspection component can inspect the wafer circuit, and at the same time, the automatic loading and unloading machine completes automatic loading and unloading to the automatic inspection machine, thereby achieving the effect of automatically and continuously using machine vision means to inspect the wafer circuit, thereby improving the efficiency of wafer circuit quality inspection, and the machine vision means are very sophisticated and can unify the standards for monitoring wafer circuits, thereby improving the quality of wafer circuit quality inspection. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the implementation modes of the present application, the drawings required for use in the description of the implementation modes will be briefly introduced below. Obviously, the drawings described below are only some implementation modes of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0016] Figure 1 It is a structural schematic diagram of a wafer circuit detection system provided by the present application;

[0017] Figure 2 is another structural schematic diagram of the wafer circuit detection system provided by the present application;

[0018] Figure 3 It is a structural schematic diagram of the automatic detection machine provided by the present application;

[0019] Figure 4 yes Figure 3 Schematic diagram of the enlarged structure of the A area in the middle;

[0020] Figure 5 It is another structural schematic diagram of the automatic detection machine provided by this application.

[0021] 1. Wafer circuit detection system; 2. Cover; 21. Main body; 211. First opening; 22. Purification component; 3. Bracket; 31. Support column; 32. Extension beam; 4. Stable table; 5. Body; 6. Automatic loading and unloading machine; 7. Automatic inspection machine; 71. Positioning camera; 72. Machine vision inspection component; 73. Moving table; 731. First moving table; 732. First guide rail; 733. Second moving table; 734. Second guide rail; 735. Rotating shaft assembly; 736. Adsorption assembly; 737. Ceramic suction cup; First direction F; Second direction G; First axis H. DETAILED DESCRIPTION

[0022] The present application is further described in detail below in conjunction with the accompanying drawings and implementation methods. It is particularly noted that the following implementation methods are only used to illustrate the present application, but do not limit the scope of the present application. Similarly, the following implementation methods are only some implementation methods of the present application rather than all implementation methods. All other implementation methods obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0023] The terms "first", "second" and "third" in this application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second" and "third" can explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, and the manner is such as two, three, etc., unless otherwise clearly and specifically defined. All directional indications in the implementation mode of this application (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. The manner, such as a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0024] Reference to "embodiment" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0025] As semiconductor materials are widely used in the production of integrated circuits, the technology of processing circuit components based on wafers is becoming more and more mature, and the circuits engraved on wafers are becoming smaller and more sophisticated. After the wafer circuit is produced, it needs to be inspected for quality. Currently, quality inspectors usually inspect the wafer circuit manually. However, since the wafer circuit is very delicate and it is difficult to unify the standards for manual inspection, this method is not only very labor-intensive, but also has low efficiency and quality of quality inspection.

[0026] In order to improve or solve the above technical problems, the inventors of the present application have proposed at least the following embodiments after long-term research.

[0027] See also Figures 1 to 5 , Figure 1 It is a structural schematic diagram of the wafer circuit detection system provided by this application. Figure 2 It is another structural schematic diagram of the wafer circuit detection system provided by the present application. Figure 3 It is a structural schematic diagram of the automatic detection machine provided in this application. Figure 4 yes Figure 3 Schematic diagram of the enlarged structure of area A in the middle. Figure 5 It is another structural schematic diagram of the automatic detection machine provided by this application.

[0028] The embodiment of the present application provides a wafer circuit detection system (1), including an automatic loading and unloading machine (6) and an automatic detection machine (7). The automatic detection machine (7) includes a positioning camera (71), a machine vision detection component (72), and a movable table (73). The movable table (73) includes a first movable component, a second movable component, a rotating shaft component (735), and an adsorption component (736). The first movable component, the second movable component, and the rotating shaft component (735) are overlapped and connected from top to bottom. The adsorption component (736) is connected to the top of the first movable component, the second movable component, and the rotating shaft component (735), and the adsorption component (736) is arranged toward the positioning camera (71) and the machine vision detection component (72).

[0029] The rotating shaft assembly (735) rotates around the first axis, the first movable assembly is movably arranged along the first direction, and the second movable assembly is movably arranged along the second direction. The first direction, the second direction and the first axis are perpendicular to each other.

[0030] This embodiment uses the first moving component, the second moving component and the rotating shaft component (735) to control the wafer to move along the first direction F and the second direction G shown in the figure, and to rotate around the first axis H. The repair component is used to fix the wafer. The positioning camera (71) is used to position the wafer circuit on the wafer. The machine vision detection component (72) can detect the wafer circuit. At the same time, the automatic loading and unloading machine (6) completes the automatic loading and unloading to the automatic detection machine (7), so as to achieve the effect of automatically and continuously using machine vision to detect the wafer circuit. The characteristics of machine vision detection are to improve the flexibility and automation of production. In some dangerous working environments that are not suitable for manual operation or occasions where artificial vision cannot meet the requirements, machine vision is often used to replace artificial vision. At the same time, in the process of mass industrial production, the efficiency and accuracy of product quality inspection using artificial vision are low. The use of machine vision detection method can greatly improve production efficiency and production automation. In addition, the machine vision method is very sophisticated and easy to realize information integration. It can detect the captured images and convert them into data for system processing and analysis, so that the quality of wafer circuit quality inspection is also improved.

[0031] In one embodiment, the wafer circuit detection system (1) further comprises a stable table (4), which is arranged horizontally. The first moving assembly comprises a first moving table (731) and a first guide rail (732) extending along a first direction, wherein the first guide rail (732) extends along the first direction, and the second moving assembly comprises a second guide rail (734) and a second moving table (733), wherein the second guide rail (734) extends along a second direction. The first guide rail (732) is fixed to the stable table (4), and the first moving table (731) is movably connected to the first guide rail (732). The second guide rail (734) is fixed to the first moving table (731), and the second moving table (733) is movably connected to the second guide rail (734). The rotating shaft assembly (735) is arranged on the second moving table (733), and the adsorption assembly (736) is arranged on a side of the rotating shaft assembly (735) away from the second moving table (733).

[0032] Through the structure provided in this embodiment, the adsorption component (736), the shaft component (735), the second movable component, the first movable component, and the stable table (4) are specifically arranged in sequence from top to bottom. The stable table (4) can fix the movable table (73), thereby reducing the probability of inaccurate wafer circuit detection due to shaking due to external interference, thereby improving the accuracy and stability of the wafer circuit detection system (1).

[0033] In one embodiment, the wafer circuit detection system (1) further comprises a cover body (2). The cover body (2) is covered on the stable table (4) to form a working space, and the automatic loading and unloading machine (6) and the automatic detection machine (7) are arranged in the working space and are relatively fixed to the stable table (4). The cover body (2) and the stable table (4) cooperate to form the working space, and the automatic loading and unloading machine (6) and the automatic detection machine (7) are fixed on the stable table (4). The cover body (2) and the stable table (4) can cooperate to reduce the influence of external interference on the automatic loading and unloading machine (6) and the automatic detection machine (7), thereby improving the accuracy and stability of the wafer circuit detection system (1).

[0034] In one embodiment, the cover body (2) includes a main body (21) and a purification component (22). The main body (21) is provided with a first opening (211), and the purification component (22) is relatively fixed to the main body (21) and blocks the first opening (211). When the wafer circuit detection system (1) is working, the joint between the stable table (4) and the cover body (2) is sealed, and the gas in the working space is connected to the outside through the purification component (22). Therefore, the purification component (22) is used to filter the gas entering or outputting the working space, thereby reducing the probability that impurities such as dust from the outside enter the working space with the gas and affect the wafer circuit detection, thereby improving the accuracy of the wafer circuit detection system (1).

[0035] In one embodiment, the wafer circuit detection system (1) further comprises a support (3). The support (3) comprises a support column (31) and an extension beam (32), wherein the support column (31) is fixed to the stable table (4) and extends upward parallel to the first axis. The extension beam (32) is arranged at one end of the support column (31) away from the stable table (4), and extends above the adsorption component (736) parallel to the first direction and the second direction. The positioning camera (71) and the machine vision detection component (72) are arranged on the extension beam (32).

[0036] The structure provided in this embodiment can use the bracket (3) to set the positioning camera (71) and the machine vision detection component (72) above the movable table (73), and use the stable table (4) to fix the bracket (3) so that the positioning camera (71) and the machine vision detection component (72) can maintain relative stability with the wafer circuit on the movable table (73), which can improve the accuracy of the wafer circuit detection system (1). At the same time, an extension beam (32) for the positioning camera (71) and the machine vision detection component (72) is provided, extending from one end of the support column (31) away from the stable table (4) to the top of the adsorption component (736), which can reduce the probability that the support column (31) affects the movement of the movable table (73), expand the movement range of the movable table (73), and improve the usability of the wafer circuit detection system (1).

[0037] In one embodiment, the wafer circuit detection system (1) further includes a processor and a body (5). The stable table (4) is arranged above the body (5), and an installation space is formed between the body (5) and the stable table (4). A pipeline space is provided in the stable table (4), the support column (31) and the extension beam (32), one end of the pipeline space is connected to the installation space, and the other end is connected to the outside world through the extension beam (32). The positioning camera (71) and the machine vision detection component (72) further include a signal transmission line, the signal transmission line connects the positioning camera (71), the machine vision detection component (72) and the processor, and at least part of the signal transmission line is arranged in the pipeline space.

[0038] In the structure provided in this embodiment, the processor is installed in the installation space formed between the fuselage (5) and the stable table (4), and the fuselage (5) and the stable table (4) can be used to reduce external interference to the processor, so that the wafer circuit detection result is more accurate. The signal transmission line connecting the positioning camera (71), the machine vision detection component (72) and the processor can be arranged in the pipeline space opened in the stable table (4), the support column (31) and the extension beam (32), so as to reduce external interference to the signal transmission line and prevent the signal transmission line from falling near the movable table (73) and affecting its movement.

[0039] In one embodiment, the adsorption component (736) includes a ceramic suction cup (737) and a first negative pressure component. The ceramic suction cup (737) is provided with at least one adsorption hole. The first negative pressure component is disposed on a side of the ceramic suction cup (737) away from the positioning camera (71) and is connected to the outside through the adsorption hole. Thus, the first negative pressure component is used to adsorb the wafer placed on the surface of the ceramic suction cup (737) through the adsorption hole provided on the ceramic suction cup (737), so that the wafer is fixed on the movable table (73) more stably, thereby improving the accuracy and stability of the wafer circuit detection system (1).

[0040] In one embodiment, the automatic loading and unloading machine (6) includes a tray and a second negative pressure component, and the tray is arranged parallel to a surface of a side of the ceramic suction cup (737) facing the positioning camera (71). The second negative pressure component and the first negative pressure component work alternately, and when the first negative pressure component is turned off, the tray and the ceramic suction cup (737) are docked, and the second negative pressure component outputs toward the surface of the ceramic suction cup (737).

[0041] Through the structure provided in this embodiment, the second negative pressure component of the automatic loading and unloading machine (6) can work alternately with the first negative pressure component, and can conveniently transfer the wafer on the ceramic suction cup (737) to the tray, and use the second negative pressure component to fix the wafer and the tray relatively, or transfer the wafer on the tray to the ceramic suction cup (737), and use the first negative pressure component to fix the wafer and the ceramic suction cup (737) relatively, thereby realizing automatic loading and unloading of wafers and improving the degree of automation and efficiency of wafer circuit quality inspection.

[0042] In one embodiment, the machine vision detection component (72) includes a machine vision processing circuit, a focusing component and a shooting camera. The machine vision processing circuit is connected to the focusing component, the shooting camera and the positioning camera (71). The focusing component, the shooting camera and the positioning camera (71) are arranged above the adsorption component (736) in parallel with the first direction.

[0043] Through the structure provided in this embodiment, the machine vision inspection component (72) can use the focusing component to realize automatic focusing of the wafer circuit, and use the shooting camera to shoot the wafer circuit at the designated inspection position, so as to output the photographed wafer circuit image to the machine vision processing circuit for analysis and inspection, thereby realizing automatic quality inspection of the wafer circuit and improving the efficiency of wafer circuit quality inspection.

[0044] Specifically, in the embodiment of the present application, the wafer circuit detection system (1) can detect the wafer circuit in the following manner: the automatic loading and unloading machine (6) transports the wafer to the ceramic suction cup (737), and the first adsorption component (736) vacuum adsorbs and fixes the wafer. The first moving component, the second moving component, and the rotating shaft component (735) move the wafer in a linked manner, so that the positioning camera (71) can be used to find the pre-set positioning point on the wafer, so as to accurately locate the wafer circuit. After that, the processor can calculate the detection position on the wafer with reference to the position of the positioning point, and then use the first moving component, the second moving component, and the rotating shaft component (735) to move the wafer to the first detection position to start detection. During detection, the machine vision detection component (72) can perform high-precision detection, and realize automatic real-time focusing through the focusing component, and the detection accuracy can be specifically 1 micron. After the detection of the first detection position is completed, the processor can automatically control the moving table (73) to move the wafer to the next detection position until the entire wafer is detected. After the test is completed, the wafer is automatically unloaded by the automatic loading and unloading machine (6), and then the wafer circuit on the next wafer is tested by the four-building loading machine.

[0045] The embodiment of the present application also provides an automatic inspection machine (7) for wafer circuits, comprising a positioning camera (71), a machine vision inspection component (72), and a moving table (73). The moving table (73) comprises a first moving component, a second moving component, a rotating shaft component (735), and an adsorption component (736). The first moving component, the second moving component, and the rotating shaft component (735) are overlapped and connected from top to bottom, and the adsorption component (736) is connected to the top of the first moving component, the second moving component, and the rotating shaft component (735). The adsorption component (736) is arranged toward the positioning camera (71) and the machine vision inspection component (72).

[0046] The rotating shaft assembly (735) rotates around the first axis, the first movable assembly is movably arranged along the first direction, and the second movable assembly is movably arranged along the second direction. The first direction, the second direction and the first axis are perpendicular to each other.

[0047] This embodiment uses a movable table (73) to fix the wafer, and uses a positioning camera (71) to position the wafer circuit. The machine vision detection component (72) can detect the wafer circuit, so as to achieve the effect of automatically detecting the wafer circuit by machine vision. The characteristics of machine vision detection are to improve the flexibility and automation of production. In some dangerous working environments that are not suitable for manual work or occasions where artificial vision cannot meet the requirements, machine vision is often used to replace artificial vision; at the same time, in large-scale industrial production processes, the efficiency and accuracy of product quality inspection using artificial vision are low, and the use of machine vision detection methods can greatly improve production efficiency and production automation. In addition, machine vision means are very sophisticated and easy to realize information integration. They can detect the captured images and convert them into data for system processing and analysis, so that the quality of wafer circuit quality inspection is also improved.

[0048] The above description is only part of the implementation methods of the present application, and does not limit the protection scope of the present application. Any equivalent device or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A wafer circuit detection system (1), characterized in that: include: Automatic loading and unloading machine (6), An automatic inspection machine (7) comprises a positioning camera (71), a machine vision inspection component (72), and a movable table (73), wherein the movable table (73) comprises a first movable component, a second movable component, a rotating shaft component (735), and an adsorption component (736), wherein the first movable component, the second movable component, and the rotating shaft component (735) are overlapped and connected from top to bottom, the adsorption component (736) is connected to the topmost one of the first movable component, the second movable component, and the rotating shaft component (735), and the adsorption component (736) is arranged toward the positioning camera (71) and the machine vision inspection component (72); The rotating shaft assembly (735) rotates around a first axis, the first movable assembly is movably arranged along a first direction, the second movable assembly is movably arranged along a second direction, and the first direction, the second direction and the first axis are perpendicular to each other.

2. The wafer circuit detection system (1) according to claim 1, characterized in that: The wafer circuit detection system (1) further comprises a stable table (4), wherein the stable table (4) is arranged horizontally; The first movable component comprises a first movable platform (731) and a first guide rail (732), wherein the first guide rail (732) extends along the first direction; the second movable component comprises a second guide rail (734) and a second movable platform (733), wherein the second guide rail (734) extends along the second direction; the first guide rail (732) is fixed to the stable table (4); the first movable platform (731) is movably connected to the first guide rail (732); the second guide rail (734) is fixed to the first movable platform (731); the second movable platform (733) is movably connected to the second guide rail (734); the rotating shaft component (735) is arranged on the second movable platform (733); and the adsorption component (736) is arranged on a side of the rotating shaft component (735) away from the second movable platform (733).

3. The wafer circuit detection system (1) according to claim 2, characterized in that: The wafer circuit detection system (1) also includes a cover body (2), wherein the cover body (2) is covered on the stable table (4) to form a working space, and the automatic loading and unloading machine (6) and the automatic detection machine (7) are arranged in the working space and are both relatively fixed to the stable table (4).

4. The wafer circuit detection system (1) according to claim 3, characterized in that: The cover body (2) comprises a main body (21) and a purification component (22); the main body (21) is provided with a first opening (211); the purification component (22) is relatively fixed to the main body (21) and blocks the first opening (211); when the wafer circuit detection system (1) is working, the joint between the stable table (4) and the cover body (2) is sealed, and the gas in the working space is connected to the outside through the purification component (22).

5. The wafer circuit detection system (1) according to claim 2, characterized in that: Also includes a bracket (3), The bracket (3) comprises a support column (31) and an extension beam (32), wherein the support column (31) is fixed to the stable table (4) and extends upward in parallel with the first axis, and the extension beam (32) is arranged at one end of the support column (31) away from the stable table (4), and extends above the adsorption component (736) in parallel with the first direction and the second direction, and the positioning camera (71) and the machine vision detection component (72) are arranged on the extension beam (32).

6. The wafer circuit detection system (1) according to claim 5, characterized in that: It also includes a processor and a body (5), wherein the stable table (4) is arranged above the body (5), and an installation space is formed between the body (5) and the stable table (4); A pipeline space is provided inside the stabilizing table (4), the supporting column (31) and the extending beam (32); one end of the pipeline space is connected to the installation space, and the other end is connected to the outside through the extending beam (32); the positioning camera (71) and the machine vision detection component (72) also include a signal transmission line, and the signal transmission line connects the positioning camera (71), the machine vision detection component (72) and the processor; at least part of the signal transmission line is arranged in the pipeline space.

7. The wafer circuit detection system (1) according to claim 1, characterized in that: The adsorption component (736) includes a ceramic suction cup (737) and a first negative pressure component. The ceramic suction cup (737) is provided with at least one adsorption hole. The first negative pressure component is arranged on a side of the ceramic suction cup (737) away from the positioning camera (71) and is connected to the outside through the adsorption hole.

8. The wafer circuit detection system (1) according to claim 7, characterized in that: The automatic loading and unloading machine (6) comprises a tray and a second negative pressure assembly, wherein the tray and a surface of one side of the ceramic suction cup (737) facing the positioning camera (71) are arranged in parallel; The second negative pressure component works alternately with the first negative pressure component. When the first negative pressure component is closed, the tray is docked with the ceramic suction cup (737), and the second negative pressure component outputs toward the surface of the ceramic suction cup (737).

9. The wafer circuit detection system (1) according to claim 1, characterized in that: The machine vision detection component (72) comprises a machine vision processing circuit, a focusing component and a shooting camera, wherein the machine vision processing circuit is connected to the focusing component, the shooting camera and the positioning camera (71); the focusing component, the shooting camera and the positioning camera (71) are arranged above the adsorption component (736) in parallel with the first direction.

10. An automatic inspection machine (7) for wafer circuits, characterized in that: The invention comprises a positioning camera (71), a machine vision detection component (72), and a movable table (73), wherein the movable table (73) comprises a first movable component, a second movable component, a rotating shaft component (735), and an adsorption component (736), wherein the first movable component, the second movable component, and the rotating shaft component (735) are overlapped and connected from top to bottom, the adsorption component (736) is connected to the topmost one of the first movable component, the second movable component, and the rotating shaft component (735), and the adsorption component (736) is arranged toward the positioning camera (71) and the machine vision detection component (72); The rotating shaft assembly (735) rotates around a first axis, the first movable assembly is movably arranged along a first direction, the second movable assembly is movably arranged along a second direction, and the first direction, the second direction and the first axis are perpendicular to each other.

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