Wafer transferring and leveling device

Abstract

The utility model belongs to the technical field of semiconductor manufacturing equipment, and particularly relates to a wafer transferring and leveling device which comprises a transferring module which comprises a bearing platform, a first adsorption assembly and a platform driving assembly. The first adsorption assembly is arranged on the surface of the bearing platform; the platform driving assembly is arranged at the bottom of the bearing platform; the leveling module comprises a leveling assembly, a second adsorption assembly, a vertical driving assembly and a transverse driving assembly; the leveling assembly is arranged above the bearing platform; the second adsorption assembly is arranged on the leveling assembly; the vertical driving assembly is connected with the leveling assembly; the transverse driving assembly is connected with the vertical driving assembly. According to the utility model, the wafer is sucked by arranging the first adsorption assembly and the second adsorption assembly, then the wafer is moved by the platform driving assembly, the vertical driving assembly and the transverse driving assembly, and the surface of the wafer is leveled by the leveling assembly, so that the combination of wafer transfer and leveling is realized, the use is more convenient, and the use requirements of users are met.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor manufacturing equipment, and in particular relates to a wafer transfer and leveling device. Background Art

[0002] In the semiconductor chip manufacturing process, the surface of the wafer needs to be filmed, film peeled off, back thinned, debonded and other production processes. In the traditional method, these processes are completed by separate equipment. In this case, the wafer must be loaded through a multi-layer storage container and transported between separate equipment. However, with the continuous development of the semiconductor industry, the thickness of the wafer is getting smaller and smaller, and the diameter tends to become larger and larger. The ultra-thin wafer may drop in the center and deform due to its own weight in the transport storage container, making it difficult to automatically remove it from the transport storage container. At the same time, during the production process, various reasons such as die deposition, sticking, uneven force, and uneven material inside the wafer can cause the wafer to warp.

[0003] Chinese patent authorization announcement No. CN109273399B discloses a flattening and fixing device for 12-inch wafers, including: a supporting platform; an adsorption and fixing part having a pre-fixing unit and a loading and fixing unit that can move up and down relative to the supporting platform, and a negative pressure unit for providing vacuum negative pressure to the pre-fixing unit and the loading and fixing unit respectively; a pressure fixing part for flattening and fixing the edge area of ​​the warped wafer loaded and fixed on the adsorption and fixing part; and a detection part including a negative pressure detection unit installed on the adsorption and fixing part and a flatness detection unit installed on the pressure fixing part, the pressure fixing part having: a bracket; the pressure unit having a pressure plate and a plurality of pressure heads installed on the pressure plate; a jet unit for spraying a vertical downward airflow; and a pressure motor, the warped wafer is pre-fixed and loaded onto the loading and fixing unit, the jet unit sprays gas to the warped wafer, and at the same time the pressure unit moves downward to flatten the edge area of ​​the pre-fixed warped wafer, and the loading and fixing unit adsorbs and fixes the flattened warped wafer. Although it can achieve the effect of flattening the wafer, its function is relatively single and it is not possible to transport the wafer to each station for processing, and the conventional wafer transfer device does not have the wafer flattening function. Therefore, it is necessary to improve the existing technology to solve the above problems. Utility Model Content

[0004] The utility model aims to provide a wafer transfer and leveling device, aiming to solve the technical problem of single function of the wafer transfer device in the prior art.

[0005] To achieve the above-mentioned purpose, the embodiment of the utility model provides a wafer transfer and leveling device, comprising:

[0006] A transfer module, the transfer module comprising a supporting platform, a first adsorption component and a platform driving component; the first adsorption component is arranged on the surface of the supporting platform for adsorbing the wafer; the platform driving component is arranged at the bottom of the supporting platform for driving the supporting platform and the wafer to move horizontally;

[0007] A leveling module, which is arranged on the side of the transfer module, and includes a leveling component, a second adsorption component, a vertical drive component and a horizontal drive component; the leveling component is arranged above the supporting platform, and is used to abut and level the wafer on the supporting platform; the second adsorption component is arranged on the leveling component; the vertical drive component is connected to the leveling component and is used to drive the leveling component to move vertically; the horizontal drive component is connected to the vertical drive component and is used to drive the leveling component to move horizontally.

[0008] As a preferred solution, the first adsorption assembly includes a first suction cup and a first suction head; a plurality of first suction holes are arranged on the first suction cup, and the first suction head is arranged below the first suction cup and connected to the first suction holes.

[0009] As a preferred embodiment, the supporting platform includes a mounting frame, a lifting drive mechanism and a first buffer; the mounting frame can be laterally movably arranged on the platform drive assembly; the lifting drive mechanism is arranged on the mounting frame and is located below the first suction cup; the first buffer is arranged on the lifting drive mechanism; a lifting groove is opened at the center position of the first suction cup, so that the lifting drive mechanism drives the first buffer to extend upward from the lifting groove.

[0010] As a preferred embodiment, the first suction cup includes a first adsorption area and a second adsorption area, the first adsorption area is annular and is arranged around the lifting groove, and the second adsorption area is annular and is arranged around the second adsorption area; the first suction hole includes a plurality of inner circle suction holes and a plurality of outer circle suction holes, the plurality of inner circle suction holes are arranged at intervals in the first adsorption area, and the plurality of outer circle suction holes are arranged at intervals in the second adsorption area.

[0011] As a preferred solution, the leveling assembly includes a leveling plate, a connecting rod and a second buffer; one end of the connecting rod is connected to the leveling plate, and the other end is connected to the vertical drive assembly; the second buffer is arranged at the bottom of the leveling plate, for abutting and leveling the wafer placed on the supporting platform.

[0012] As a preferred embodiment, the second adsorption assembly includes a second suction cup and a second suction head; a through groove is provided on the second suction cup, the second buffer member extends downward from the through groove, a plurality of second suction holes are provided on the second suction cup, and the second suction head is provided below the second suction cup and connected to the second suction holes.

[0013] As a preferred solution, the leveling module also includes a support frame, a guide member and a bracket; the support frame can be movably arranged on the transverse driving assembly; the guide member is fixed on the support frame; the bracket is located above the support frame and is movably connected to the guide member, and the bracket is connected to the leveling assembly.

[0014] As a preferred solution, the leveling module also includes a buffer spring, the bottom of the vertical drive component is fixed on the support frame, the output shaft of the vertical drive component passes through the bracket upward, and a limiting member is provided at the front end of the output shaft of the vertical drive component; the buffer spring is sleeved on the output shaft of the vertical drive component, the lower end of the buffer spring abuts the bracket, and the upper end of the buffer spring abuts the limiting member.

[0015] As a preferred solution, the transfer module further includes a heating plate, and the heating plate is arranged at the bottom of the first adsorption component.

[0016] The above one or more technical solutions in the wafer transfer and leveling device provided by the embodiment of the utility model have at least one of the following technical effects:

[0017] The utility model absorbs the wafer by setting a first adsorption component and a second adsorption component, moves the wafer by a platform driving component, a vertical driving component and a horizontal driving component, and levels the surface of the wafer by a leveling component, thereby realizing the combination of wafer transfer and leveling, being more convenient to use and meeting the needs of users. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0019] Figure 1 A schematic diagram of the overall structure of a wafer transfer and leveling device provided in an embodiment of the utility model;

[0020] Figure 2 A schematic diagram of the structure of the transfer module provided by an embodiment of the utility model;

[0021] Figure 3 A schematic diagram of the structure of the transfer module provided by an embodiment of the utility model from another angle;

[0022] Figure 4 A schematic diagram of the structure of a leveling module provided in an embodiment of the utility model;

[0023] Figure 5 A schematic diagram of the structure of the leveling module provided by an embodiment of the utility model from another angle;

[0024] Figure 6 A schematic structural diagram of a transfer module provided in another embodiment of the utility model.

[0025] Among them, the reference numerals in the figure are:

[0026] 100-transfer module; 101-first air suction hole; 102-lifting slot; 103-inner ring air suction hole; 104-outer ring air suction hole; 110-supporting platform; 111-mounting frame; 112-lifting drive mechanism; 113-first buffer; 120-first adsorption assembly; 121-first suction cup; 1211 first adsorption area; 1212-second adsorption area; 122-first air suction head; 130-platform drive assembly;

[0027] 200-leveling module; 201-through groove; 202-second suction hole; 210-leveling assembly; 211-leveling plate; 212-connecting rod; 213-second buffer assembly; 220-second adsorption assembly; 221-second suction cup; 222-second suction head; 230-vertical drive assembly; 240-lateral drive assembly; 250-support frame; 260-guide member; 270-bracket; 280-buffer spring; 290-limiting member. DETAILED DESCRIPTION

[0028] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0029] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0031] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0032] In one embodiment of the present invention, Figure 1-Figure 5 As shown, a wafer transfer and leveling device is provided, which is used to move wafers to various workstations for processing and level the surface warping of the wafer caused by processing. The wafer transfer and leveling device includes a transfer module 100 and a leveling module 200, and the leveling module 200 is arranged beside the transfer module 100.

[0033] The transfer module 100 includes a supporting platform 110, a first adsorption component 120, a platform driving component 130 and a heating plate (not shown). The first adsorption component 120 is arranged on the surface of the supporting platform 110 for adsorbing the wafer. The platform driving component 130 is arranged at the bottom of the supporting platform 110 for driving the supporting platform 110 and the wafer to move horizontally. The heating plate is arranged at the bottom of the first adsorption component 120 for heating the wafer.

[0034] The first adsorption assembly 120 includes a first suction cup 121 and a first suction head 122. The first suction cup 121 is provided with a plurality of first suction holes 101, and the first suction head 122 is provided below the first suction cup 121 and communicates with the first suction holes 101.

[0035] Furthermore, a lifting slot 102 is provided at the center of the first suction cup 121, and the first suction cup 121 includes a first suction area 1211 and a second suction area 1212. The first suction area 1211 is annular and is arranged around the lifting slot 102, and the second suction area 1212 is annular and is arranged around the second suction area 1211. In this embodiment, the first suction hole 101 includes a plurality of inner ring suction holes 103 and a plurality of outer ring suction holes 104, and the plurality of inner ring suction holes 103 are arranged at intervals in the first suction area 1211, and the plurality of outer ring suction holes 104 are arranged at intervals in the second suction area 1212. The inner ring suction holes 103 and the outer ring suction holes 104 are respectively connected to different first suction heads 122, so that the first suction area 1211 and the second suction area 1212 can adapt to the suction of wafers of various specifications, especially 8-inch and 12-inch wafers.

[0036] Furthermore, the supporting platform 110 includes a mounting frame 111, a lifting drive mechanism 112 and a first buffer 113. The mounting frame 111 can be laterally movably arranged on the platform drive assembly 130; the lifting drive mechanism 112 is arranged on the mounting frame 111 and is located below the first suction cup 121; the first buffer 113 is arranged on the lifting drive mechanism 112; so that the lifting drive mechanism 112 drives the first buffer 113 to extend upward from the lifting slot 102. In this embodiment, the first buffer 113 is a rubber pad, and a flexible suction cup is arranged at the front end of the rubber pad. The first buffer 113 can also be arranged in multiple groups to accommodate wafers of various specifications.

[0037] The leveling module 200 includes a leveling component 210, a second adsorption component 220, a vertical drive component 230 and a horizontal drive component 240. The leveling component 210 is arranged above the supporting platform 110, and is used to abut and level the wafer on the supporting platform 110. The second adsorption component 220 is arranged on the leveling component 210. The vertical drive component 230 is connected to the leveling component 210 and is used to drive the leveling component 210 to move vertically. The horizontal drive component 240 is connected to the vertical drive component 230 and is used to drive the leveling component 210 to move horizontally. The horizontal drive component 240 is arranged beside the platform drive component 130 and is arranged parallel to it.

[0038] The leveling assembly 210 includes a leveling disk 211, a connecting rod 212, and a second buffer 213. One end of the connecting rod 212 is connected to the leveling disk 211, and the other end is connected to the vertical drive assembly 230. The second buffer 213 is arranged at the bottom of the leveling disk 211, and is used to abut and level the wafer placed on the supporting platform 110. In this embodiment, the second buffer 213 is a rubber pad, and a flexible suction cup is arranged at the front end of the rubber pad. The second buffer 213 can also be arranged in multiple groups to accommodate wafers of various specifications.

[0039] The second suction assembly 220 includes a second suction cup 221 and a second suction head 222. A through slot 201 is provided on the second suction cup 221, and the second buffer member 213 extends downward from the through slot 201. A plurality of second suction holes 202 are provided on the second suction cup 221, and the second suction head 222 is provided below the second suction cup 221 and communicates with the second suction holes 202. Corresponding to the second suction cup 221, the second suction holes 202 can also be provided in multiple groups to accommodate wafers of different specifications.

[0040] The leveling module 200 further includes a support frame 250, a guide member 260 and a bracket 270. The support frame 250 is movably disposed on the transverse driving assembly 240. The guide member 260 is fixed on the support frame 250. The bracket 270 is located above the support frame 250 and is movably connected to the guide member 260, and the bracket 270 is connected to the leveling assembly 210.

[0041] Furthermore, the leveling module 200 also includes a buffer spring 280, the bottom of the vertical drive component 230 is fixed on the support frame 250, the output shaft of the vertical drive component 230 vertically passes through the bracket 270, and a limiting member 290 is provided at the front end of the output shaft of the vertical drive component 230. The buffer spring 280 is sleeved on the output shaft of the vertical drive component 230, the lower end of the buffer spring 280 abuts against the bracket 270, and the upper end of the buffer spring 280 abuts against the limiting member 290.

[0042] The platform drive assembly 130 is driven by a motor, the lifting drive mechanism 112 is a cylinder, the vertical drive assembly 230 is driven by a cylinder, and the horizontal drive assembly 240 is driven by a motor. The above drive modes are only the preferred solutions adopted in this solution, including but not limited to drive modes such as motors, cylinders, and hydraulic cylinders.

[0043] When in use, the vertical drive assembly 230 drives the leveling assembly 210 to move downward, and the second adsorption assembly 220 absorbs wafers from other workstations. The horizontal drive assembly 240 drives the leveling assembly 210 to move to the left until it is directly above the supporting platform 110. The vertical drive assembly 230 drives the leveling assembly 210 to move downward until the wafer contacts the supporting platform 110. The second adsorption assembly 220 releases the adsorption of the wafer, and the second buffer 213 flattens the surface of the wafer. The first adsorption assembly 120 absorbs the wafer and fixes it on the supporting platform 110. The platform drive assembly 130 drives the supporting platform 110 to move to the left to a predetermined position. The first adsorption assembly 120 releases the adsorption of the wafer, and the lifting drive mechanism 112 drives the first buffer 113 to extend upward from the lifting slot 102, lifts the wafer, and moves it to the next workstation through other devices.

[0044] In another embodiment of the present invention, Figure 6 As shown, the first adsorption assembly 120 includes a first suction cup 121 and a first suction head 122. A lifting slot 102 is provided at the center of the first suction cup 121, and the first suction cup 121 includes a first adsorption area 1211 and a second adsorption area 1212. The first adsorption area 1211 is circular and arranged around the lifting slot 102, and the second adsorption area 1212 is annular and arranged around the second adsorption area 1211.

[0045] In this embodiment, the first suction cup 121 is a microporous ceramic suction cup, the flatness of the microporous ceramic suction cup is ≤5um, the distance between the outermost micropore and the outermost edge of the wafer is ≤1mm, and the surface of the microporous ceramic suction cup is coated with an antistatic coating. A plurality of first suction holes 101 are arranged on the first adsorption area 1211 and the second adsorption area 1212.

[0046] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer transfer and leveling device, characterized in that: include: A transfer module, the transfer module comprising a supporting platform, a first adsorption component and a platform driving component; The first adsorption component is arranged on the surface of the supporting platform, and is used to adsorb the wafer; the platform driving component is arranged on the bottom of the supporting platform, and is used to drive the supporting platform and the wafer to move horizontally; A leveling module, which is arranged on the side of the transfer module, and includes a leveling component, a second adsorption component, a vertical drive component and a horizontal drive component; the leveling component is arranged above the supporting platform, and is used to abut and level the wafer on the supporting platform; the second adsorption component is arranged on the leveling component; the vertical drive component is connected to the leveling component and is used to drive the leveling component to move vertically; the horizontal drive component is connected to the vertical drive component and is used to drive the leveling component to move horizontally.

2. The wafer transfer and leveling device according to claim 1, characterized in that: The first adsorption component includes a first suction cup and a first suction head; a plurality of first suction holes are arranged on the first suction cup, and the first suction head is arranged below the first suction cup and connected to the first suction holes.

3. The wafer transfer and leveling device according to claim 2, characterized in that: The supporting platform includes a mounting frame, a lifting drive mechanism and a first buffer; the mounting frame can be laterally movably arranged on the platform drive assembly; the lifting drive mechanism is arranged on the mounting frame and is located below the first suction cup; the first buffer is arranged on the lifting drive mechanism; a lifting slot is opened at the center position of the first suction cup so that the lifting drive mechanism drives the first buffer to extend upward from the lifting slot.

4. The wafer transfer and leveling device according to claim 3, characterized in that: The first suction cup includes a first adsorption area and a second adsorption area, the first adsorption area is annular and is arranged around the lifting groove, and the second adsorption area is annular and is arranged around the second adsorption area; the first suction hole includes a plurality of inner circle suction holes and a plurality of outer circle suction holes, the plurality of inner circle suction holes are arranged at intervals in the first adsorption area, and the plurality of outer circle suction holes are arranged at intervals in the second adsorption area.

5. The wafer transfer and leveling device according to any one of claims 1 to 4, characterized in that: The leveling assembly includes a leveling plate, a connecting rod and a second buffer; one end of the connecting rod is connected to the leveling plate, and the other end is connected to the vertical drive assembly; the second buffer is arranged at the bottom of the leveling plate, and is used to abut and level the wafer placed on the supporting platform.

6. The wafer transfer and leveling device according to claim 5, characterized in that: The second adsorption assembly includes a second suction cup and a second suction head; a through groove is provided on the second suction cup, the second buffer member extends downward from the through groove, a plurality of second suction holes are provided on the second suction cup, and the second suction head is provided below the second suction cup and connected to the second suction holes.

7. The wafer transfer and leveling device according to any one of claims 1 to 4, characterized in that: The leveling module also includes a support frame, a guide member and a bracket; the support frame can be movably arranged on the horizontal driving assembly; the guide member is fixed on the support frame; the bracket is located above the support frame and is movably connected to the guide member, and the bracket is connected to the leveling assembly.

8. The wafer transfer and leveling device according to claim 7, characterized in that: The leveling module also includes a buffer spring. The bottom of the vertical drive component is fixed on the support frame. The output shaft of the vertical drive component passes through the bracket upward. A limiting member is provided at the front end of the output shaft of the vertical drive component. The buffer spring is sleeved on the output shaft of the vertical drive component. The lower end of the buffer spring abuts against the bracket, and the upper end of the buffer spring abuts against the limiting member.

9. The wafer transfer and leveling device according to any one of claims 1 to 4, characterized in that: The transfer module also includes a heating plate, and the heating plate is arranged at the bottom of the first adsorption component.

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